33.02 0.33 35±0.35 33.02±0.33 35±0.35 Pad 0.86 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 A B C D E F G H J K L M N P R T U V W Y AA AB AC AD AE AF AG BOTTOM VIEW 2.54 0.43 2.97±0.25 2.21 0.51 NOM 1.27 Ceramic Al 2 O 3 SIDE VIEW LID 26 LID 26 LID 35±0.35 17.5 15 15 DIE 1.0x45 PIN A1 LID 3x0.5 TOP VIEW Pb80/Sn20 Cu RIBBON COLUMNS Notes: (Unless Otherwise Specified). 1) DIMENSIONS ARE IN mm. 2) SHOWN WITH Pb80/Sn20 RIBBON COLUMNS. 3) PART NUMBER CCGA717T1.27-DC275D. PART NUMBER OPTIONS PART NUMBER DUMMY DIE SOLDER PIN CCGA717T1.27-DC275D YES Pb80/Sn20 Cu RIBBON CCGA717T1.27A-DC275D YES Pb90/Sn10 CCGA717T1.27M-DC275D YES Micro-Coil CLGA717T1.27-DC275D YES NONE 07/08/15 T.Au DATE CUST MFG ENG REVISED DRAWN A 160100 A SCALE REV DRAWING NO. SIZE TITLE DO NOT SCALE DRAWING APPROVALS QA M. Hart 07/08/15 CCGA717T1.27-DC275D DUMMY COLUMN GRID ARRAY SHEET 1 OF 10 2:1
10
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BOTTOM VIEW SIDE VIEW TOP VIEW · scale 4 : 1 0.86 pad 0.51~0.56 column 0.51 column 0.51 spring solder pin options fillet 0.80 min clga pad 0 ... aa1 ab1 ac1 ad1 ae1 ag3 b2 b3 d2
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33.020.33
35±0.35
33.02±0.33 35±0.35
Pad 0.86
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
27
AB
CD
EF
GH
JK
LM
NP
RT
UV
WY
AAAB
ACAD
AEAF
AG
BOTTOM VIEW
2.54 0.43
2.97±0.25
2.21
0.51NOM
1.27
CeramicAl2O3
SIDE VIEW
LID
26LID
26 LID
35±0.35
17.5
15
15 DIE
1.0x45PIN A1
LID
3x0.5
TOP VIEW
Pb80/Sn20Cu RIBBONCOLUMNS
Notes: (Unless Otherwise Specified). 1) DIMENSIONS ARE IN mm. 2) SHOWN WITH Pb80/Sn20 RIBBON COLUMNS. 3) PART NUMBER CCGA717T1.27-DC275D.PART NUMBER OPTIONS
M. Hart 07/08/15 CCGA717T1.27-DC275DDUMMY COLUMN GRID ARRAY
SHEET 1 OF 10
2:1
33.020.33
35±0.35
33.02±0.33 35±0.35
Pad 0.86
12
34
56
78
910
1112
1314
1516
1718
1920
2122
2324
2526
27
AB
CD
EF
GH
JK
LM
NP
RT
UV
WY
AAAB
ACAD
AEAF
AG
BOTTOM VIEW
26LID
26 LID
35±0.35
17.5
15
15 DIE
1.0x45PIN A1
LID
3x0.5
TOP VIEW
Pb90/Sn10WIRE COLUMNS
2.21
2.54 0.43
2.97±0.25
0.51NOM
1.27 LID
SIDE VIEW
CeramicAl2O3
Notes: (Unless Otherwise Specified). 1) DIMENSIONS ARE IN mm. 2) SHOWN WITH Pb90/Sn10 PLAIN COLUMNS. 3) PART NUMBER CCGA717T1.27A-DC275D.PART NUMBER OPTIONS
Notes: (Unless Otherwise Specified). 1) DIMENSIONS ARE IN mm. 2) SHOWN WITH Micro-Coil Springs. 3) PART NUMBER CCGA717T1.27M-DC275D.PART NUMBER OPTIONS
Notes: (Unless Otherwise Specified). 1) DIMENSIONS ARE IN mm. 2) SHOWN WITHOUT COLUMNS. 3) SHOWN WITH LID COVER ATTACHED. 4) PART NUMBER CLGA717T1.27-DC275D.
NOTES:1. PLATING TOPELECTROLESS Ni 3.20~8.89 μm (125~350 micro-inch).ELECTROLESS Au 2.50 μm Min (100 micro-inch).
2. PLATING BOTTOMELECTROLESS Ni 3.20~8.89 μm (125~350 micro-inch).ELECTROLESS Au 0.25μm Max (10 micro-inch).
PART NUMBER OPTIONSPART NUMBER DUMMY DIE SOLDER PIN LID
NOTES: 1. DIMENSIONS IN mm UNLESS OTHERWISE SPECIFIED. 2. SOLDERABLE SURFACE 0.72 IS THE FUNCTIONAL SURFACE OF Cu PAD. 3. 0.75 IS THE DESIGN DIMENSION OF Cu PAD. 4. PCB BOARD DIMENSIONS ARE PRESENTED ONLY AS A GUIDELINE. DESIGNERS SHOULD USE THEIR OWN EXPERIENCE WHEN DESIGNING PCB.
NOTES: 1. DIMENSIONS IN mm UNLESS OTHERWISE SPECIFIED. 2. SOLDERABLE SURFACE 0.72 IS THE FUNCTIONAL SURFACE OF Cu PAD. 3. 0.75 IS THE DESIGN DIMENSION OF Cu PAD. 4. PCB BOARD DIMENSIONS ARE PRESENTED ONLY AS A GUIDELINE. DESIGNERS SHOULD USE THEIR OWN EXPERIENCE WHEN DESIGNING PCB.
SOLDER PASTE
Sn63/Pb3790% solder by weight50% solids by volumeType T3 Particle Size