21 rue la Noue Bras de Fer 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr Bosch IMU in iPhone X IMU Sensor MEMS report by Audrey LAHRACH January 2018
©2018 by System Plus Consulting | IMU Bosch in iPhone X 1
21 rue la Noue Bras de Fer44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
Bosch IMU in iPhone XIMU SensorMEMS report by Audrey LAHRACHJanuary 2018
©2018 by System Plus Consulting | IMU Bosch in iPhone X 2
Table of Contents
Overview / Introduction 3
o Executive Summary
o Reverse Costing Methodology
Company Profile 6
o Bosch Sensortec
o Apple iPhone X, iPhone 8, and Watch Series 3 Teardown
Physical Analysis 16
o Synthesis of the Physical Analysis 17
o Package 19
View & Dimensions
Opening
Wire Bonding Process
Cross-Section
o ASIC Die 32
ASIC Die View & Dimensions
ASIC Delayering & Main Blocs
ASIC Die Process
ASIC Die Cross-Section
ASIC Die Process Characteristic
o MEMS Accelerometer Die 47
MEMS Die View & Dimensions
MEMS Die Cross-Section
MEMS Accelerometer Process
MEMS Accelerometer Characteristics
o MEMS Gyroscope Die 83
MEMS Die View & Dimensions
MEMS Die Cross-Section
MEMS Gyroscope Process
MEMS Gyroscope Characteristics
o Physical Comparison 115
Bosch IMU Sensor Evolution
Comparison with InvenSense and STMicroelectronics’ 6-Axis IMUs
Sensor Manufacturing Process 118
o ASIC Die Front-End Process & Fabrication Unit
o MEMS Accelerometer Process & Fabrication Unit
o MEMS Gyroscope Process & Fabrication Unit
o Final Test & Packaging Fabrication unit
Cost Analysis 142
o Synthesis of the cost analysis 143
o Yields Explanation & Hypotheses 145
o ASIC Component 147
Die Front-End Cost/Probe Test, Thinning & Dicing
ASIC Component Cost
o MEMS Accelerometer Die 151
Die Front-End Cost/Probe Test, Thinning & Dicing
Sensor Die Cost
o MEMS Gyroscope Die 159
Die Front-End Cost/Probe Test, Thinning & Dicing
Sensor Die Cost
o LGA Packaged Component 167
LGA Packaging Cost
Back End: Final Test
Component Cost
Selling Price 172
Company services 177
©2018 by System Plus Consulting | IMU Bosch in iPhone X 3
Overview / Introductiono Executive Summaryo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Executive Summary
This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Bosch Accelerometer.
This new Bosch Sensortec component is likely a custom 6-axis IMU made specifically for Apple. It is exactly the samecomponent found inside the iPhone 8, iPhone X, and Apple Watch Series 3. One major improvement is the incredibly thinprofile achieved by Bosch, with a total thickness of only 0.6mm compared to 0.9mm for the industry standard. This thicknesswas probably an Apple request in order to fit with the small form factor of the Apple Watch Series 3’s cellular functionality. Toachieve this low profile, Bosch changed the packaging structure used for its preceding product, the BMI160.
On the design side, Bosch Sensortec made significant changes - particularly for the accelerometer, where the old single-massstructure was abandoned for a new structure achieving better sensing properties. The micromachining manufacturing process,unchanged by Bosch Sensortec for many years, was also revised, with a new process for both accelerometer and gyroscope.Finally, a new ASIC die was designed to fuse the data from the accelerometer and gyroscope, and probably to deliver evenlower current consumption and other functionalities.
This report includes a detailed physical analysis, with process description and manufacturing cost analysis. A completecomparison with Bosch Sensortec’s BMI160 is also provided, along with a comparison with InvenSense and STMicroelectronics’latest 6-axis IMUs.
©2018 by System Plus Consulting | IMU Bosch in iPhone X 4
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
iPhone X Teardown
iPhone X Main Board (Front Side) (2 PCB Assembled)©2018 by System Plus Consulting
iPhone X Main Board (Disassembly)©2018 by System Plus Consulting
1
2
IMU 6-Axis Bosch©2018 by System Plus Consulting
©2018 by System Plus Consulting | IMU Bosch in iPhone X 5
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Views & Dimensions
Package:
o Type: 16-pin LGA
o Dimensions: 3.0 x 3.0 x 0.6mm
o Pitch: 0.5mm
Package Top View (Watch 3, iPhone 8, iPhone X)©2018 by System Plus Consulting
Package Side View©2018 by System Plus Consulting
Package Bottom View©2018 by System Plus Consulting
3.0
mm
3.0 mm
0.6
mm
Marking: (Watch 3) (iPhone 8) (iPhone X)
.FY .FY .FY
LEH LEF LEE
E3E ETJ EEX
©2018 by System Plus Consulting | IMU Bosch in iPhone X 6
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Opening
Package Opening Overview – SEM View©2018 by System Plus Consulting
o Wire Bonding number: xx
o Material: xxxxx
o Diameter: xxµm
o Wire Bonding number: xx (xxxx)
Bonding nb between ASIC & Package: xx
Bonding nb between ASIC & MEMS Gyro xx
Bonding nb between ASIC & MEMS Accelero xx
©2018 by System Plus Consulting | IMU Bosch in iPhone X 7
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
Package Cross-Section – Accelerometer Overview
Cross-Section Plane
Package total thickness: xxx mm
o Package Molding thickness above MEMS: xxxx mm
o MEMS Accelerometer thickness (with adhesive): xxxx mm
o ASIC thickness (with adhesive): xxxx mm
o PCB Substrate thickness: xxxx mm
Wire Bonding
Package Cross-Section Overview – SEM View©2018 by System Plus Consulting
MEMS(Accelerometer sensor)
ASIC
xxxµm
PCB Substrate (xxx)
©2018 by System Plus Consulting | IMU Bosch in iPhone X 8
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
xxxmm
ASIC View & Dimensions
ASIC Die Overview - Optical View©2018 by System Plus Consulting
o Pad number: xx
o Connected: xx
o Die Area: xxx mm²(xxx x xxxmm)
o Nb of PGDW per x-inch wafer: xxxxxxm
m
©2018 by System Plus Consulting | IMU Bosch in iPhone X 9
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
ASIC Process – Technology Node
o The process uses CMOS transistors
o MOS transistor gate length: xxxµm
o Technology node: xxxµm
MOS Gate Length Measurement - SEM View©2018 by System Plus Consulting
CMOS Transistors - SEM View©2018 by System Plus Consulting
xxxµm
ASIC Die Main Blocks©2018 by System Plus Consulting
©2018 by System Plus Consulting | IMU Bosch in iPhone X 10
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Accelerometer View & Dimensions
xxxm
m
xxxmm
MEMS Die Overview – Optical View©2018 by System Plus Consulting
o Die Area: xxxmm²(xxx x xxxmm)
o Nb of PGDW per x-inch wafer: xxxxx
o Pad number: x- Connected: x
©2018 by System Plus Consulting | IMU Bosch in iPhone X 11
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Accelerometer Cap Removed
Cap Removed – Optical View©2018 by System Plus Consulting
MEMS Cap
©2018 by System Plus Consulting | IMU Bosch in iPhone X 12
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Accelerometer Sensing Area
MEMS Sensing Area – Overview©2018 by System Plus Consulting
Proof mass
Movable Electrodes
Fixed Electrode
Movable Electrodes
Fixed Electrode
Proof mass
MEMS Sensing Area Details – Overview©2018 by System Plus Consulting
MEMS Sensing Area Details – Overview©2018 by System Plus Consulting
©2018 by System Plus Consulting | IMU Bosch in iPhone X 13
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Gyroscope View & Dimensions
xxxm
m
xxxmm
MEMS Die Overview – Optical View©2018 by System Plus Consulting
o Die Area: xxxmm²(xxx x xxxmm)
o Nb of PGDW per x-inch wafer: xxxx
o Pad number: xx- Connected: xx
©2018 by System Plus Consulting | IMU Bosch in iPhone X 14
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Gyroscope Cap Removed
Cap Removed – SEM View©2018 by System Plus Consulting
MEMS SensorMEMS Cap
Cavity
©2018 by System Plus Consulting | IMU Bosch in iPhone X 15
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis o Synthesiso Packageo Package Cross-Sectiono ASICo MEMS Accelerometero MEMS Gyroo MEMS Comparison
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Gyroscope Cross-Section
MEMS Cap Cross-Section Overview – Optical View©2018 by System Plus Consulting
MEMS Cap
Xxxx
Cavity
MEMS Sensor
xxxµm
MEMS Cross-Section Overview©2018 by System Plus Consulting
xxxxxxxx
The sealant between MEMS cap andsensor is an xxxxxxx.
xxxxxxx
©2018 by System Plus Consulting | IMU Bosch in iPhone X 16
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flowo Overviewo ASIC Processo MEMS Accelero Processo MEMS Gyro Processo Packaging Process
Cost Analysis
Selling Price Analysis
About System Plus
MEMS Accelerometer – Sensor Process Flow (1/3)
©2018 by System Plus Consulting | IMU Bosch in iPhone X 17
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
ASIC Front-End Cost
• The unprobed wafer cost is estimated at $xxx for mediumyield hypothesis.
• The main part of the wafer cost is due to the xxxxx with xx%.
©2018 by System Plus Consulting | IMU Bosch in iPhone X 18
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
ASIC Die Cost
• The number of good dies per wafer is estimated toranges from xxxx to xxxx according to yield variations,which results in a die cost of $xxxx for medium yield.
Cost Breakdown Cost Breakdown Cost Breakdown
Low Yield Medium Yield High Yield
©2018 by System Plus Consulting | IMU Bosch in iPhone X 19
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
MEMS Accelerometer FE Cost per Process Steps (MEMS Sensor 1/2)
©2018 by System Plus Consulting | IMU Bosch in iPhone X 20
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
MEMS Accelerometer Die Cost
The number of good dies per wafer is estimated to rangesfrom xxxxx to xxxxx according to yield variations, whichresults in a die cost ranging from $xxxx to $xxxx accordingto yield variations.
Cost Breakdown Cost Breakdown Cost Breakdown
Low Yield Medium Yield High Yield
©2018 by System Plus Consulting | IMU Bosch in iPhone X 21
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
MEMS Gyroscope Front-End Cost
The front-end cost for the MEMS Gyroscope ranges from $xxxto $xxx according to yield variations.
The largest portion of the manufacturing cost is due to thexxxxxx at xx%.
©2018 by System Plus Consulting | IMU Bosch in iPhone X 22
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
MEMS Gyroscope Die Cost
The number of good dies per wafer is estimated to rangesfrom xxxx to xxxx according to yield variations, whichresults in a die cost ranging from $xxxx to $xxx accordingto yield variations.
Cost Breakdown Cost Breakdown Cost Breakdown
Low Yield Medium Yield High Yield
©2018 by System Plus Consulting | IMU Bosch in iPhone X 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
Package Cost
The packaging cost is estimated to $xxxx accordingto yield variations.
The largest portion of the manufacturing cost isdue to xxxxxxx cost at xx%.
©2018 by System Plus Consulting | IMU Bosch in iPhone X 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Summaryo Supply Chaino Yieldso ASIC Die Costo MEMS Accelero Die Costo MEMS Gyro Die Costo Packaging Costo Back-end Costo Component Cost
Selling Price Analysis
About System Plus
Bosch IMU Component Cost
The component cost ranges from $xxx to $xxx according to yieldvariations.
The ASIC die manufacturing represents xx% of the module cost.
The MEMS Accelerometer die represents xx% of the module cost.
The MEMS Gyroscope die represents xx% of the module cost.
The package assembly represent xx% of the module cost.
Final test and yield losses account for xx% of the module cost.
©2018 by System Plus Consulting | IMU Bosch in iPhone X 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysiso Definitions of Priceo Manufacturer Financial
Ratioso Manufacturer Price
About System Plus
Bosch IMU Estimated Selling Price Evolution
• We estimate that Bosch Sensortecrealizes a gross margin of xx% on thecomponent, which results in a finalcomponent price ranging from $xxxx to$xxxx.
• This corresponds to the selling price forlarge volume to OEMs.
Low Yield Medium YieldHigh Yield #REF! #REF!
Cost Breakdown Cost Breakdown Cost Breakdown
Component cost $0.544 $0.534 $0.525
Bosch Gross Profit $0.362 +40% $0.356 +40% $0.350 +40%
Component price $0.906 $0.891 $0.876
Low Yield Medium Yield High Yield
©2018 by System Plus Consulting | IMU Bosch in iPhone X 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
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©2018 by System Plus Consulting | IMU Bosch in iPhone X 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
About System Pluso Company serviceso Related reportso Feedbackso Contacto Legal
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