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Board Assembly TWG
Champion: Assembly Materials: Keith Howell, Nihon Superior Repair & Rework: Jasbir Bath, Bath Consultancy Press-fit: Dennis Willie, Flextronics SMT Placement: Girish Wable, Jabil NPI: Michael Gerner, Plexus Chair & Co-chair: Dr. Paul Wang, Mitac Frank Grano, GE Participant: 51 from 33 companies
Rev.03 Dec. 5th, 2013 SMTA Silicon Valley Chapter Meeting At Cisco Systems, Bldg D, Pacific Pacific Room
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International Electronics Manufacturing Initiative (iNEMI) • Not for profit, highly efficient R&D consortia since 1994
– Funded by Corporate memberships - Staffed globally in US, China, Japan & Ireland
• Membership includes 107 leading industry companies & organizations, representing
a cross section of our electronics manufacturing industry & supply chain
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iNEMI Mission: Forecast and accelerate improvements in the Electronics Manufacturing
Industry for a sustainable future.
We Accomplish This By:
• Being the recognized leader at projecting future technology needs for the global supply
chain (iNEMI Technology Roadmap).
• Guiding and leveraging the strength of the consortium’s industry leading international
membership.
• Driving high impact collaborative R&D Results through constantly improving methodologies.
• Defining and implementing science based sustainable solutions in high impact areas
including the environment and health care.
• Influencing and leveraging key government agencies and labs (iNEMI Research Priorities
Document).
• iNEMI has currently 25 collaborative R&D projects and initiatives that address key
technology gaps
• Projects typically have 10-20 member companies/institutions
Pre-applied FC JEDEC L3 @260 JEDEC L2 @260JEDEC L2A
@260
JEDEC L2A
@260
JEDEC L2A
@260
Large Die 25 mm Low K 25 mm low K 30 mm low K 30 mm low K 30 mm low K
Lead-freeCompatible with
Lead-free residues
Compatible with
Lead-free
residues
Compatible with
Lead-free
residues
Compatible with
Lead-free
residues
Compatible with
Lead-free
residues
VOC-free 5-10%Increasing
Volume
Halogen-free 5-10%Increasing
Volume
Fillers Small Quantiites Small Quantiites Large Quantities Large Quantities Large Quantities
Printed Electronics Available
Imprint
TechnologiesAvailable
Reworkablle ReworkableCSP
Conformal
Coatings
Nano-materials
Pre-applied Lead-
freeReworkable Reworkable
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Assembly Materials R&D Priorities
Solder Paste
• Next generation of solder materials for lower cost and processing temperatures
– Replacement of SAC, modified SnCu, and low silver SAC alloys
• Better characterization of the reliability trade-offs with lower silver SAC alloys and SAC (Sn3-
4Ag0.5Cu) and modified SnCu alloys.
– Silver content increases resistance to thermal cycling, while reducing silver improves
drop shock resistance
– New interconnect technologies deploying nano-materials to support decreased pitch and
increased interconnect frequencies.
• Improvement in printing technology and material development
– 0.3mm pitch CSP, 01005[0402 metric] chip, LGA/QFN/MLF, and Package-on-Package
(PoP) components
• Effect of the percentage of voiding on the thermal and electrical reliability on QFN/MLF
components.
• Process optimization of paste-in-hole or pin-in-paste with or without solder performs on thick
boards as alternatives to wave soldering
• Improved reflow wetting performance with halogen-free fluxes
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Assembly Materials R&D Priorities
Wave Flux
• Halogen-free material which provides good hole-fill on thick boards
• Reduced residue fluxes for thick boards with improved pin testability for ICT
• Development of fluxes with benign residues without heat activation in the solder
• VOC-free (water based) no-clean wave fluxes with good hole-fill on thicker boards for lead-free wave soldering and low solder balling
• Improved flux formulations which exceed the electro-migration requirements in J-STD-004
Repair Flux
• Improvements in tacky fluxes for CSPs
• Development of fluxes with benign residues without heat activation in the solder
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Assembly Materials R&D Priorities
Die Attach Materials
• Thermal and moisture resistant polymers
• Formulation adjustments for new lead-free solder masks
• Low thermal resistance materials
• Alternative fillers and fiber technology to improve thermal performance
• Non silver fillers to reduce cost
• Lower temperature cure to reduce assembly cost and reduce warpage for stress sensitive applications
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Assembly Materials R&D Priorities
Conformal Coatings
• Conformal coating materials / processes which are compatible with lead-free solder materials / processes, to help mitigate lead-free issues such as tin whisker formation
• Need for investigating the compatibility and wetting of conformal coatings with various lead-free materials (mold compounds, solders, solder mask…)
• Development of a halogen-free parylene that can help mitigate tin whisker issues and be compatible with the lead-free, no clean flux systems.
• Conformal coatings for high temperature electronics and components
• Evaluation of vapor phase thin conformal coatings for various MEMS applications
• Development of composite conformal coatings materials for better barrier properties and mitigation of tin whiskers
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Assembly Materials R&D Priorities
Nanotechnology • As the electronics industry moves forward with miniaturization and
increasing functionality, there is an escalating demand on materials performance used in the manufacture of materials used in electronics assembly
– One such method of improving the performance of some materials is the use of nanomaterials and nano-structured materials
• The US National Nanotechnology Initiative is now 11 years old; initiatives in Europe and Asia started at about the same time when the benefits of nanotechnology for a wide range of applications was recognized
• Bearing in mind the fact that it takes 7-10 years from invention for a non-disruptive new product to gain market, we are just starting to see the first applications of non-semiconductor nanotechnology reaching the market and can expect considerable growth in this sector in the next few years
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At least one dimension in the range 1-100nm
(US National Nanotechnology Initiative, www.nano.gov)
• One of the most rapid areas of nanoparticle adoption is printed electronics
– Paste with nano-sized silver particles is used for solar panel interconnects, RFID and antennas as well as a range of other applications
• Next evolution beyond fillers is in commercial nano and near nano coatings
– High-release stencil coatings
– High-performance waterproofing of consumer electronics
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Assembly Materials Concerns
• The unpredictability of the effect of potential regulations regarding conflict minerals from the Democratic Republic of the Congo (DRC) to meet Section 1502 of the Dodd-Frank Act
– The burden and cost of compliance as well as its impact on the supply and pricing of tin, the major constituent in lead-free solders
• Possible regulations affecting soldering materials, the European Commission’s REACH (Registration, Evaluation, Authorization, and Restriction of Chemical substances) law
– Technology need for higher fluxing power or activity to address the need for lead-free wetting improvement
– The possibility of additional substances being included in the REACH restriction may limit formulators
• Further understanding of lead-free solder material metallurgy, processability, and long term reliability
– Impact on the long term reliability
– Alloys with Increased reliability
Summary/Next Steps
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Strategic Concerns
• Restructuring from vertically integrated OEMs to multi-firm supply
chains
– Resulted in a disparity in R&D Needs vs. available resources
• Critical needs for R&D
– Middle part of the Supply Chain is least capable of providing resources
• Industry collaboration
– Gain traction at University R&D centers, Industry consortia, “ad-hoc”
cross-company R&D teams
• The mechanisms for cooperation throughout the supply chain must
be strengthened.
– Cooperation among OEMs, ODMs, EMS firms and component
suppliers is needed to focus on the right technology and to find a way
to deploy it in a timely manner
• Collaboration is iNEMI’s Strength; We play an important role
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Paradigm Shifts
• Need for continuous introduction of complex multifunctional products to address converging markets favors modular components or SiP (2-D & 3-D):
– Increases flexibility
– Shortens design cycle
• Cloud connected digital devices have the potential to enable major disruptions across the industry:
– Major transition in business models
– New Power Distribution Systems for Data Centers
– Huge data centers operating more like utilities (selling data services)
– Local compute and storage growth may slow (as data moves to the cloud)
– “Rent vs. buy” for software (monthly usage fee model)
• Rapid evolution and new challenges in energy consuming products such as SSL, Automotive and more
• Sensors everywhere – MEMS and wireless traffic!
• “More Moore” (scaling of pitch) has reached its forecast limit and must transition to heterogeneous integration - “More Than Moore”.
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The Next iNEMI Deliverables Are Key:
Addressing the Gaps
• Technology continues to move at a faster rate of change
• Driven in many cases by short life cycle low cost yet high volume
product
• Many of these “cool new things” don’t port well or quickly to high
reliability markets such as automotive, medical, or high end
networking
• The next key deliverables from iNEMI are the 2013 Technical Plan
(available only to members) and the 2013 Research Priorities
• Effective usage and coordination behind both these documents will
be key to continued industry progress and growth
• Look for them in late 2013
– The iNEMI TIG’s, Technical and Research Committees are actively