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Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon ship. i) batch to batch variations? Storage problem? Surface contamination? ii)check bonder settings. Difficult to determine source + history of ASDICS (in waffle packs) On 2nd hybrid, patterned glass ASICs cleaned with alcohol. Back to basics with bonder settings; test on 2 nd hybrid 1st two rows used to test/set up; rows 3+ 4 bonded well. With same settings, return to attempt rows 3 and 4 of “bad” 1 st hybrid Again very poor results on first ASIC WP3,.16 July 2015.
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Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon.

Dec 13, 2015

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Harvey Haynes
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Page 1: Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon.

WP3,.16 July 2015.

Birmingham Update

Module bonding (Sam and Simon)• Great difficulty bonding on to patterned glass ASICs. (OK on sensor).• After 1st two rows of bonds, abandon ship.

i) batch to batch variations? Storage problem? Surface contamination?

ii) check bonder settings.

Difficult to determine source + history of ASDICS (in waffle packs)

On 2nd hybrid, patterned glass ASICs cleaned with alcohol.

Back to basics with bonder settings; test on 2nd hybrid

1st two rows used to test/set up; rows 3+ 4 bonded well.

With same settings, return to attempt rows 3 and 4

of “bad” 1st hybrid• Again very poor results on first ASIC• Try to clean other ASICs, then repeat.

Page 2: Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon.

Atlys+ABCN250-Hybrid at B'ham (1) (Juergen, AndyC, SimonH)

John Wilson, Phil Allport, Simon Pyatt, Sam Edwards, Juergen Thomas, James Broughton, Kostas Nikolopoulos, Andy Chisholm, Simon Head16th July 2015, WP3 Meeting

Now updated s/w on clean-room PC: We should be ok now ! - NMASK (sawtooth) works for

whole hybrid (Birmingham-assembled Stave09, ‘B1_H6’) (see screenshot from 'ScanData')

- Can do 'StrobeDelay(0.25) then 3PointGain(1fC)' test withall 20 chips ok (results on next slides)

(Note: On Monday, we showed setup with second PC, outside clean-room, Liverpool hybrid ‘L1’, there can access one row with NMASK (10 chips) and run tests with 9 chips. One only partially responding chip (row 0 chip 6) marked by Liverpool)

Page 3: Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon.

Atlys+ABCN250-Hybrid at B'ham (2) (Juergen, AndyC, SimonH)

John Wilson, Phil Allport, Simon Pyatt, Sam Edwards, Juergen Thomas, James Broughton, Kostas Nikolopoulos, Andy Chisholm, Simon Head16th July 2015, WP3 Meeting

Main changes since last time:1)Updated ITSDAQ s/w version to

r3315 (built in MS VisualStudio10Pro/Express)

2)Atlys ethernet connection: Clean-room PC has 2-ethernet PCI card fitted (one to HSIO, one to Atlys). Other PC changed to USB3.0-Ethernet dongle ('StarTech USB31000S‘, tip from RichardT), before was 2nd ethernet plug on PC mainboard.

3)No LVDS driver board4)Short (15-30cm) cables used

(some fitted with 3M connectors)5)Always run ‘NoBCCSetup’6)Atlys f/w has been for a while

the recommended: va056

Page 4: Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon.

Atlys+ABCN250-Hybrid at B'ham (3) (Juergen, AndyC, SimonH)

John Wilson, Phil Allport, Simon Pyatt, Sam Edwards, Juergen Thomas, James Broughton, Kostas Nikolopoulos, Andy Chisholm, Simon Head16th July 2015, WP3 Meeting

Should be all-good with clean-room test system Could run ABC130 hybrid when they become available

(only 2 chips needed initially ?) Second PC (outside clean-room, can access one row on L’pool hybrid): For testing

s/w developments: 'Install very latest ITSDAQ version ('trunk') direct from SVN' What happens with the s/w in Windows 10 (ie after OS support end for Win7) ? No worries about second row of chips (broken wire ?) Also: back-up machine.

Some notes written during set-up, trying to prepare a Twiki page

Page 5: Birmingham Update Module bonding (Sam and Simon) Great difficulty bonding on to patterned glass ASICs. (OK on sensor). After 1 st two rows of bonds, abandon.

• ASICs

Plain glass = 198; Patterned glass = 13• Glue

UV : all sent to Glasgow

Traduct (ASIC/hybrid) = 9

Epolite (Hybrid/Sensor) = 7 (+1 in freezer currently being reused)• Sensors

Plain glass = 7

Mechanicals = 1• Hybrids

Brown (12 over 2 panels; 7 RH sided + 5 left hand sided);

Green (2 full; one is the standard calibration measure – so not usable?)• ASIC boxes : 21 empty.

Stocktaking