Big Science Projects Finnish approach on in-kind packages and future co-operation with GSI/FAIR Antti Heikkilä, Finpro GSI/FAIR, 20 th April 2007 [email protected] +41 76 48 74 825
Jan 05, 2016
Big Science Projects
Finnish approach on in-kind packages and future co-operation with GSI/FAIR
Antti Heikkilä, FinproGSI/FAIR, 20th April 2007
[email protected] +41 76 48 74 825
Common approach for Big Science
National coordination
Focus on joint R&D
• Knowledge transfer, learning
• National and international networking
• Market pull
Idea/need at
GSI/FAIRProject
Industry
Funding
Finpro Big Science framework
R&D funding in FIN - Tekes Funding for
R&D and development projects Feasibility studies for launching, finding
opportunities and utilising the results of R&D projects Starting a new technology-based business
Tekes Funding alternatives Tekes R&D -funding
Funding for product or technology R&D with market potential, 15 – 50% of project budget
TULI -funding For defining the business idea, 10k€
VARA -funding For preparing the project, partnering, business and
R&D plans, 15k€ TUPAS -funding
Funding makes it easier for SME’s to purchase research services, 15k€
Detector development co-operation?
• Silicon strip detectors
• Double sided
• Rad hard
• Thinned low mass
Might be a fruitfull project to pursue for!
Industry
Patria Aerostructures • Advanced composite structures• [email protected]
Exel•composite structures to CMS tracker•[email protected]
Modulight•Transmitter lasers for optical communication 1310 nm, 1490 nm, 1550 nm•[email protected]
VTI Technologies•High performance acceleration, inclination and pressure measurement based on MEMS technology, 3-axis measurement•[email protected]
Detectors and Sensors
Oxford Instruments Analytical • X-ray fluorescence analyzers• Si and GaAs x-ray detectors for space• [email protected]
Detection Technology• Detector solutions and subsystems to Medical
Imaging and Security and Safety Imaging• [email protected]
Aboa Space Research (ASRO)• Particle instruments – ESA’s BepiColombo • Energetic particle measurements in space and data analysis• [email protected]
More companies: http://www.avaruus.info/dyn/file.php?file=26
VTT• Detectors on 6” wafers, rad hard, thinned detectors,
bump bonding of pixel detectors (e.g. Medipix)• [email protected]
P1P2P3D1D2D3D4D5PDAC2AC1
13.5 o
35.0 oG = 0.023 cm sr + 6 x 0.019 cm sr
2
2
77,0 mm
Conclusions
• In-kind packages not yet decided• Preferably not just HW deliveries – R&D
component must be found
• Industry involved a long time at CERN - the experience can be transfered to GSI/FAIR
• Finland is very interested in GSI/FAIR R&D projects even outside in-kind packages
Thanks!
Please contact me if you think the project of yours might need
external funding and industry!
Antti Heikkila
[email protected]+41 76 48 74 825