Standard Membrane Construction Inadequate sealing of switch layers is a major cause of failure. Moisture, tempera- ture extremes, and chemicals are typical enemies of standard PSA (pressure- sensitive adhesive) membrane switches. To overcome this issue, Bergquist's exclusive HeatSeal fabrication process thermally bonds switch layers together with heat and pressure.The lamination strength is superior to pressure-sensitive adhesive construction and there is no need to externally vent the spacer layer. The result is a totally sealed switch which protects the electrical integrity of your membrane switch. HEATSEAL ® TECHNICAL DATA U.S. Headquarters Tel: 800.347.4572 Fax: 952.835.0430 Europe Tel: +(31) 35.5380684 Fax: +(31) 35.5380295 Asia Tel: +852.2690.9296 Fax: +852.2690.2344 MECHANICAL Dimensional Tolerances Actuation Force Non-Tactile (NT) / Tactile (T) Switch Thickness Vibration Shock Actuations Non-Tactile / Tactile Embossing Height Pillow / Height Dome ELECTRICAL Contact Material Contact Rating Voltage Contact Rating Current Insulation Resistance Contact Bounce Non-Tactile / Tactile Termination Resistance ESD protection ENVIRONMENTAL Operating Temperature Storage Temperature Humidity Ingress Protection TEST METHOD Bergquist ASTM F 1597-95 Customer Design Customer Design No Closure ASTM F 1578-96 Custom Design ASTM F 1681-96 ASTM F 1689-96 ASTM F 1661-96 Bergquist ASTM F 1596-95 ASTM F 1596-95 ASTM F 1596-95 www.bergquistcompany.com HEATSEAL ® MEMBRANE SWITCH TYPICAL PROPERTIES Total Sealed Integrity In One Single Layer Bergquist MEMBRANE SWITCHES a b c d e f TYPICAL VALUE +/-0,4mm (+/-.015") 1 - 5N +/-0,8N (NT) / 3 - 6N +/-0,8N (T) (4-18 oz (NT) / 10-22 +/-3oz (T)) 0,55 - 1,2mm (.020"-.050") 10G >5,0 Million / >1,0 Million Pillow or Dome 0,2mm / 0,61 - 0,77mm (.012" / .24-.030") Screened Silver Ink 30V DC 100mA 20MN <10ms / <20ms <100N Min. 15kV -40ºC to 75ºC * -40ºC to 75ºC * 95%RH IP68 *Higher temperature application designs available on request GRAPHIC LAYER GRAPHIC ADHESIVE TOP CIRCUIT LAYER HEATSEAL ® SPACER LAYER BOTTOM CIRCUIT LAYER REAR ADHESIVE a b c d e f