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Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL) 29-Apr-2015 2015 INFIERI Workshop 1 This work supported by NSF CAREER award 6807134.
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Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

Jan 05, 2016

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Page 1: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 1

Beam Tests of 3D Vertically Interconnected Prototypes

Matthew Jones (Purdue University)Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

29-Apr-2015

This work supported by NSF CAREER award 6807134.

Page 2: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 2

VIPIC ProjectVertically Integrated Photon Imaging Chip

• Targeting X-ray photon correlation spectroscopy:– Current generation of cameras has 1 kHz frame rate– Next generation would like

• Large detector area• Dead-time-less readout• Time resolution of 10 ns• Frame rates approaching 100 kHz

• Collaborating Institutes:– BNL, FNAL (US) and AGH-UST (Krakow Poland)

• Disclaimer:– Grzegorz Deptuch and others are the real experts

29-Apr-2015

Page 3: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 3

INFIERI Demonstrator

• We developed the test beam facility, but not the VIPIC chip– We worked closely with the developers on their integration

• First example of a 3D pixel device read out in a test beam with protons (as opposed to x-rays at Argonne)

• Excellent example of a WP6 demonstrator:– Novel device architecture– General purpose test facility

• Community benefits:– Moving this technology closer to being regarded as mature enough to be

considered for future projects

29-Apr-2015

Page 4: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 4

Technology• Analog and digital circuits fabricated on different layers,

interconnected using through silicon vias, wafer thinning, fusion bonding

• No dead areas at the edges – multiple devices can be butted together

29-Apr-2015

Page 5: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 5

Design• 5120x5120 µm2

• 64x64 pixel array (80 µm pitch)• Readout divided into 16 groups of 256 pixels• Priority encoder selects hit pixels for readout

29-Apr-2015

• Single threshold discriminator

• 2 5-bit counters per pixel• 12-bit configuration

register per pixel• 1-bit mask-off register• 1-bit mask-on register

Page 6: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 6

Analog Section

29-Apr-2015

64x64 pixel array80 µm x 80 µm

Page 7: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 7

Digital Section

• Two 5-bit counters count pulses between TS_Clk edges with no deadtime.

• Counters alternate on rising edge of rstrobe signal.

29-Apr-2015

Page 8: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 8

Digital Section• 16 independent channels of 256 pixels• Sparsification engine selects highest address of pixel

with non-zero counts• rstrobe signal switches counter of current pixel– If new count is zero, then another pixel is selected by the

priority encoder – When all counters are zero, the hit_or signal goes low

• Serial data can be read out at around 100 MBPS:

29-Apr-2015

Page 9: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 9

VIPIC Evolution

29-Apr-2015

VIPIC bump bonded to 300 µm thick sensor, wire bonded to carrier board. Sensor had 32x38 pixel array.

Previous versions

Directly bonded to 500 µm thick sensor and bump bonded to carrier board.

Now…

Page 10: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 10

VIPIC1 Performance

• Calibration charge injection corresponding to 4.5 keV x-ray• Connected pixels see larger input capacitance

29-Apr-2015

Page 11: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 11

VIPIC Performance

• Much lower input capacitance when pixels are directly bonded to sensor Ni-DBI

29-Apr-2015

Page 12: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 12

Electrical Interface

29-Apr-2015

Control signals

VIPIC chip

Power and analog voltages

16 LVDS serial data

Analog voltages, discriminator threshold are configured using National Instruments hardware with a Labview interface.

Page 13: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 13

Electrical Interface

29-Apr-2015

FPGA for configuration, clock generation and readout.

1 GbE network interface

Same FPGA interface used for reading out the strip sensors in the telescope

Page 14: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 14

Telescope

29-Apr-2015

Pixel telescope for PSI46 readout (legacy hardware) Only 3 downstream x-y planes used

to extrapolate tracks into the VIPIC.

Page 15: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 15

Telescope• Readout of the strips is distributed over 3 FPGA’s• TS_clock in the VIPIC readout is distributed to the other

FPGA’s over Cat-5 cable• No trigger – continuous dead-time-less readout of VIPIC and

strips• All hits are tagged with a 48-bit bunch counter with 80 ns

period, common to all FPGA’s• Data is streamed over the network, assembled into events

and analyzed offline

29-Apr-2015

Page 16: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 16

Noisy Pixels

29-Apr-2015

Tracks from cosmic rays.

Occupancy from test beam.• Black pixels are noisy.• White pixels are masked off.

Electron tracks from Sr-90 source

Page 17: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 17

Preliminary Telescope Alignment

29-Apr-2015

December 3rd runs taken with 32 GeV protons – normally prefer 120 GeV.

Intrinsic resolution expected to be = .

Alignment of the telescope is preliminary and some improvement is expected.

Not prepared to quantify efficiency yet – several noisy pixels were masked off and should be skipped in the analysis.

Page 18: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 18

What’s Next

• Would like to understand efficiency:– Continue analysis of data recorded in December– Next opportunity for new data in June

• Next phase of the VIPIC project:– 1 Mpixel VIPIC system is now funded by DOE-BES– Multi-laboratory effort: BNL-FNAL-ANL + AGH-UST– 2017 targeted completion date

• Good example of integrating new hardware into the test beam DAQ system.

29-Apr-2015

Page 19: Beam Tests of 3D Vertically Interconnected Prototypes Matthew Jones (Purdue University) Grzegorz Deptuch, Scott Holm, Ryan Rivera, Lorenzo Uplegger (FNAL)

2015 INFIERI Workshop 19

Summary• Successfully integrated readout of VIPIC with test

beam data acquisition.• Recorded over 108 tracks over several hours of

parasitic running at 32 GeV• Preliminary alignment performed• Remaining studies:– Accurate efficiency measurement– Increase Serial_clk frequency– Timing characteristics

• Successful WP6 demonstration29-Apr-2015