Instrumentation is becoming ever more important in automotive vehicles, so the technology should therefore continue to grow over the next few years. However, we still do not know which providers will be the long-term winners. To meet the demands of the market and its users, it is important to consider various conditions and specifications. Information such as speed, vehicle condition and rear view camera displays must be readable under driving conditions characterized by variable lighting, and that readability must be continuously improved. With the FPK cluster, Audi-Bosch, provides the possibility to display and use GPS and rear cameras. Its advanced technology allows safer and easier mobility. The FPK cluster offered by Audi-Bosch is competitive despite the proposed features. That enables its use in vehicles entered by a wide range of manufacturers. This cost-performance ratio is made possible by production in low-cost manufacturing countries and the experience Audi-Bosch has acquired in the automotive market. This report presents a complete analysis of the dismantling of Audi- Bosch modules, taken from the latest Audi Q3 model. On this basis, it provides the bill of materials and manufacturing cost of the FPK Cluster. The report also provides a complete physical analysis and manufacturing cost estimate for each part, including the display, electronic boards and various mechanical frames. COMPLETE TEARDOWN WITH • Teardown with detailed photos • Component identification • Printed circuit board cross- section and cost analysis • Complete and priced bill-of- materials • Manufacturing process flow • Manufacturing cost analysis • Estimated sales price Latest Audi Q3 instrument cluster with immobilizer: Structural and cost analysis REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT Title: Audi-Bosch FPK Generation 2 Instrument Cluster Pages: 115 Date: February 2020 Format: PDF & Excel file Price: EUR 3,990 Reference: SP20511 Audi-Bosch FPK Generation 2 Instrument Cluster IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
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Transcript
Instrumentation is becoming ever
more important in automotive
vehicles, so the technology should
therefore continue to grow over the
next few years.
However, we still do not know which
providers will be the long-term
winners. To meet the demands of the
market and its users, it is important to
consider various conditions and
specifications.
Information such as speed, vehicle
condition and rear view camera
displays must be readable under
driving conditions characterized by
variable lighting, and that readability
must be continuously improved.
With the FPK cluster, Audi-Bosch,
provides the possibility to display and
use GPS and rear cameras. Its
advanced technology allows safer and
easier mobility.
The FPK cluster offered by Audi-Bosch
is competitive despite the proposed
features. That enables its use in
vehicles entered by a wide range of
manufacturers. This cost-performance
ratio is made possible by production in
low-cost manufacturing countries and
the experience Audi-Bosch has
acquired in the automotive market.
This report presents a complete
analysis of the dismantling of Audi-
Bosch modules, taken from the latest
Audi Q3 model. On this basis, it
provides the bill of materials and
manufacturing cost of the FPK Cluster.
The report also provides a complete
physical analysis and manufacturing
cost estimate for each part, including
the display, electronic boards and
various mechanical frames.
COMPLETE TEARDOWN WITH
• Teardown with detailed photos
• Component identification
• Printed circuit board cross-
section and cost analysis
• Complete and priced bill-of-
materials
• Manufacturing process flow
• Manufacturing cost analysis
• Estimated sales price
Latest Audi Q3 instrument cluster with immobilizer: Structural and cost
analysis
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
IC – LED – RF – MEMS – IMAGING – PACKAGING – SYSTEM – POWER - DISPLAY
TABLE OF CONTENTS
Overview/Introduction
• Executive Summary• Main Chipset• Block Diagram• Reverse Costing Methodology
Company Profile
Teardown Analysis
• Views and Dimensions of the System
• System Opening• Display Module• Main Electronic Board
• Top side – Overview, high definition photo, PCB markings, main and IC component markings and identification, discrete component markings and identification, passive component markings and identification
• Bottom side
• LED Right Board• LED Middle Board• LED Left Board• NVIDIA T124XA-P1-A1
Cost Analysis
• Assessing the BOM• Display Cost• PCB Cost• Component Cost• BOM Cost – Electronic Board• Housing Parts – Estimation• BOM Cost – Housing• Material Cost Breakdown by
Sub-Assembly• Material Cost Breakdown by
Component Categories• Assessing the Added Value
(AV) Cost• Main Board Manufacturing
Flow• Details of the Main Electronic
Board AV Cost
• Details of the System Assembly AV Cost
• Added-Value Cost Breakdown • Manufacturing Cost
Breakdown
Manufacturer Price
• Financial Ratios• Estimation of the
Manufacturer Price
AUDI-BOSCH FPK GENERATION 2 INSTRUMENT CLUSTER
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LG Electronics Cluster and Infotainment Display Module in the Mercedes-Benz A-ClassPhysical and cost analysis of the instrument cluster and infotainment display module available in the latest Mercedes A-Class Style Line.May 2019 - EUR 3,990*
LG LA080WV3 – 8-inch Display with Touch Panel for Car NavigationAn inside look at the reasons why LG Display is one of the top players in the automotive display market.June 2017 - EUR 2,490*
AUTHORS
Guillaume Robichon has joined
System Plus Consulting as a cost
technician in 2019. He is in charge of
reverse costing with a focus on
electronic boards and systems. He
holds a Technological Degree in
Electrical Engineering and Industrial
Computing from the University of
Nantes.
Audrey Lahrach is in
charge of costing analyses
for IC, LCD & OLED Displays
and Sensor Devices. She
holds a Master degree in
Microelectronics from the
University of Nantes.
COSTING TOOLS
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORT
Process-BasedCosting Tools
ParametricCosting Tools
WHAT IS A REVERSE COSTING®?
Reverse Costing® is the process of disassembling a device (or asystem) in order to identify its technology and calculate itsmanufacturing cost, using in-house models and tools.
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