ATLAS: Hardware and Upgrades Liverpool, HEP Christmas Meeting 17 December 2007 Paul Dervan.

ATLAS: Hardware and Upgrades

Liverpool, HEP Christmas Meeting

17 December 2007

Paul Dervan

Contents

SCT ENDCAP-C past year Ashley, Katharine, Dave, George, Helen, Joost, Neil J, Neil T, Nick, Paul D, Paul P, Phil, Sergey, Scott, Tim + many SCT colleagues

General ATLAS

Super-LHC upgrade activitiesAshley, Gianluigi, Joost, Neil, Peter, Phil, Tony +others joining

EC-C assembled in Liverpool.Last Year:• Transported to CERN• Tested and Repaired This year:• Installation into ATLAS• Service connections• Warm tests• Cooling installation

• 4 barrels• 2 endcaps with 9 disks each • ~60 m2 of silicon strip detectors• ~4000 modules• 6.3 Million channels• |η| < 2.5

Sct and Inner Detector

ID-C Status at end of 2006

• SCT integrated into the TRT

• Models tested OK

• Cosmic ray tests carried out

• Waiting for installation into

ATLAS

SCT EC Installation• EC-C was moved to pit on June 18th Plan

was to move the week before (Friday)

but due to rain postponed to Monday

• EC-C stayed the weekend in the

unloading dock of SR1

• The transport went very smoothly

• Only one crane was necessary

to move EC from SR1 to SCX1

EC-C arrived in the pit around 11am

Accelerations measured < 0.2g

SCT EC Installation• Alignment of EC-C (Tuesday morning)

and insertion was completed by 19h

• EC-C was positioned ~3.5mm

away from its nominal position

SCT EC In Position

• Phase 1 – Pre-Installation – June - July 2007 – (Complete)• Phase 2 – LMTs (Connect & DC test) – August 2007 – (Complete)• Phase 3 – Fibres (Connect & DwD) – August 2007 – (Complete)• Phase 4 – Cooling installation – November - December 2007• Phase 5 – Power modules with cooling – January 2007 Sign off the End-cap (Pixel can now connect-up)• Phase 6 – Full module readout with cooling – March 2007

SCT Installation and Commissioning

The rest of the ID

• Has been painful because of a short to LAr ground (insulation failure of the sliding rails).

May 24

May 29

June 25 - June 28 2007

Pixel Installation

VA-A

VA-C

Ion pump

Both Calorimeter beam pipes are now in position and connected to the Be pipe

Calorimeter beam pipe installation

22ndnd June 07 June 07

End-cap Toroids installation

ATLAS Inner Detector Upgrade

• To keep ATLAS running more than 10 years the inner tracker has to be replaced (Current tracker designed to survive up to 730 fb-1 ≈ 10Mrad in strip detectors)

• For the luminosity-upgrade (SLHC) the new tracker will have to cope with >3000 fb-1– much higher occupancy levels

– much higher dose rates 1016neq/cm2 pixel b-layer

9×1014neq/cm2 middle layers

5×1014neq/cm2 outer layers

• For a new tracker by 2015, major international R&D programme already underway. (Current ATLAS Inner Detector TDR CERN/LHCC/97-16 is now 10 years old)

Pixels:Short (2.4 cm) -strips (stereo layers):Long (9.6 cm) -strips (stereo layers):

r=5cm, 12cm, 18cm, 27cmr=38cm, 49cm, 60cmr=75cm, 95cm

z=±40cmz=±100cmz=±190cm

New SLHC Layout

Including disks this leads to:

Pixels: 5 m2, ~300,000,000 channels

Short strips: 60 m2, ~28,000,000 channels

Long strips: 100 m2, ~15,000,000 channels

WP3: Sensors

1 01 4

1 01 5

1 01 6

0

5 0 0 0

1 0 0 0 0

1 5 0 0 0

2 0 0 0 0

2 5 0 0 0

# e

lec

tro

ns

1 M e V n f lu e n c e [c m-2

]

1 01 4

1 01 5

1 01 6

0

5 0 0 0

1 0 0 0 0

1 5 0 0 0

2 0 0 0 0

2 5 0 0 0

# e

lec

tro

ns

F lu e n c e [c m-2

]

p F Z S i 2 8 0 m ; 2 5 n s ; -3 0 ° C [1 ]

p -M C z S i 3 0 0 m ;0 .2 -2 .5 s ; -3 0 ° C [2 ]

n E P I S i 7 5 m ; 2 5 n s ; -3 0 ° C [3 ]

n E P I S i 1 5 0 m ; 2 5 n s ; -3 0 °C [3 ]

s C V D D ia m 7 7 0 m ; 2 5 n s ; + 2 0 °C [4 ]

p C V D D ia m 3 0 0 m ; 2 5 n s ; + 2 0 °C [4 ]

n E P I S iC 5 5 m ; 2 .5 s ; + 2 0 °C [5 ]

3 D F Z S i 2 3 5 m [6 ]

Comparison of measured collected charge on different radiation-hard materials and devices (M. Bruzzi, H. F.-W. Sadrozinski, A. Seiden, NIM A 579 (2007) 754–761)

Sign

al (

elec

tron

s)

Signal vs Dose +

++

Latest n-in-p datafrom Liverpool (1000V) Micron

Semiconductor UK Ltd

Liverpool are pushing the n-in-p sensor designs (Gianluigi)

WP3: Irradiated Microstrip CCE(V)

140mm and 300mm thickness(Micron)Doses up to 1016neq/cm2 (Ljubljana reactor neutrons )

Short microstrip layers to withstand 9×1014neq/cm2 (50% neutrons) at 500V with 750e- noise, → can expect S/N ≈12

Tony Affolder, Gianluigi Case

1.6E15 cm-2

0

5

10

15

20

300 500 700 900 1100

Bias Voltage (V)

Co

llecte

d C

harg

e (

ke-)

300 microns

140 microns

3.0E15 cm-2

0

5

10

15

20

300 500 700 900 1100Bias Voltage (V)

Co

llecte

d C

harg

e (

ke

- )

300 microns

140 microns

1.0E16 cm-2

0.0

5.0

10.0

15.0

20.0

300 500 700 900 1100Bias Voltage (V)

Co

llecte

d C

harg

e (

ke

-)300 microns

140 microns

5.0E14 cm-2

0

2

4

6

8

10

12

14

16

18

20

100 150 200 250 300 350 400 450 500 550

Bias Voltage (V)

Co

lle

cte

d C

ha

rg

e (

ke

-)

300 microns140 microns

WP4: SLHC Hybrid conceptual layout

Digital I/O

Power/Aux Bus

99mm

99mm

MCC

Power Regulation

24mm

74mm

SE

NS

OR

Readout ASICs

Ashley (provisional)

• 2 ‘fingers’ per hybrid populated with 2 columns of 10 ASICs (40 ASICs total)

• Electrically one item?

• 4 Cu Layers with Kapton dielectric (example from LHCb VELO)

• Working closely with chip designers

• Working on how to layout the redundancy (various ways)

HV

MCC: Module Controller Chip

WP7: Single-sided Module Concept

Results Single-sided 1W/sensor Cooling -30 @8000W/m2

1W/Sensor0.38W/ChipMax Chip temp: -10CMax Si Temp: -19.46CTemp Gradient over Si: 1.17C

Thermal Runaway - Temperature

NB. Conductivity of air = 0 for ease of comparison!

SSM Thermal Runaway(25mm fingers, 0.5mm thk TPG, 0.75mm thk C-C bridge, 2mm dia. tube, 8000W/mK)

No Step, Eg=1.1

0.0

1.0

2.0

3.0

4.0

5.0

6.0

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5

Power Density (mW/mm2 @ 0 deg C)

To

tal

Sil

ico

n P

ow

er

(W)

0.25 W per ASIC

0.30 W per ASIC

0.35 W per ASIC

0.40 W per ASIC

ANSYS - 0.38

Summary

• SCT: SCT End-cap C installed in ATLAS Awaiting final tests with the cooling

• Upgrade: Liverpool is involved (and leading) in quite a few areas The Upgrade effect is increasing all the time

Merry Christmas