22 bd Benoni Goullin 44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected]www.systemplus.fr ASE/Deca M - Series Fan - Out Process Qualcomm PM1850 PMIC with advanced Wafer Level Packaging SP19486 - PACKAGING report by Stéphane ELISABETH Laboratory Analysis by Nicolas RADUFFE September 2019 – Sample REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
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ASE/Deca M-Series Fan-Out Process...ASE in partnership with Deca technologies has developed a FO technology targeting the core market. Formerly user of eWLB, ASE has decided to move
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This full reverse costing study has been conducted to provide insight on technology data, manufacturing cost and selling priceof the Qualcomm PM8150 PMIC with Deca M-Series.
Back in 2015, Outsourced Semiconductor Assembly and Test (OSATs) were the only players who were involved in Fan-Out (FO)packaging. But in 2016, TSMC has led the entry of foundries on this market. By proposing its integrated FO (inFO) packagingtechnology, TSMC and Apple introduced the first high Density Fan-Out packaging in mobile segment.
Now, Integrated Device Manufacturers (IDM) like Samsung have joined the race with a new in-house technology at panel level.The result is that in 2019, OSATs gained only a third part of the market. Even with this reduce share, they still develop andenhanced their portfolio on this segment. ASE in partnership with Deca technologies has developed a FO technology targetingthe core market. Formerly user of eWLB, ASE has decided to move to M-series packaging technology for its advanced Waferlevel packaging (aWLP).
With production maturity, fabless company like Qualcomm are seeking for yield loss improvement in dicing. In the past,Qualcomm has used enhanced Wafer Level Ball grid array (eWLB) for side wall protection for this purpose.
But now with the maturity of the M-series technology from Deca Technologies , ASE, who is the current OSAT supplier forQualcomm, switch the packaging production.
One of the main advantages of the technology is that at a similar price to the eWLB technology, the M-series offers betterquality and board level reliability (BLR). Indeed, one of the key enablers is the use of epoxy molding compound (EMC) betweenthe die and the redistribution layers (RDLs).
This report includes a full investigation of the component, featuring a detailed study of the PMIC including packaging, diedesign and cross-sections. It contains a complete cost analysis and a selling price estimation of the component. Finally, itfeatures a comparison with the Qualcomm WCD9335 Audio Codec, featuring eWLB packaging.
MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
ADVANCED PACKAGING• Fan-Out Packaging: Technologies and Market Trends 2019• Equipment and Materials for Fan-Out Packaging 2019• Status of Advanced Substrates 2019
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
PACKAGING• Advanced packaging technology in the Apple Watch
Series 4’s SiP• Samsung Exynos 9110 with ePLP: First Generation of
REVERSE COSTING® – STRUCTURE, PROCESS & COST REPORTASE/DECA M-SERIES FAN-OUT PROCESS
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