Ascenx_Executive_Summary 3

Executive Summary

January, 2016

Established and proven – a service focus company with resources and capabilities to support the following core business since 2004: Manufacturing services – build to order manufacturing, cables and harnesses, electro-mechanical

assembly, and power distribution units

Legacy equipment licensing - manufacturing, refurbishment, repair, and engineering support

Engineering services – product sustaining, obsolescence, field service engineering

32% year over year growth with multiple customer spread allowed for long term stability

Service oriented company key resource capabilities in cable manufacturing, assemblies box build, technician support, engineering support

Facilities in California and Vietnam

# o

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yees

Year

Headcount Growth

0%

10%

20%

30%

40%

50%

60%

70%

80%

90%

100%

FY '08 FY '09 FY '10 FY '11 FY '12 FY '13 FY'14 FY'15

Re

ven

ue

(%)

Fiscal Year

Engineering Services

Legacy System Mfg

CM

Repair

Ascenx Executive Summary

Ascenx Confidential

SERVICES

MANUFACTURINGENGINEERING

SERVICES

• CAD / Design

• Documentation

• Sustaining

engineering

• Obsolescence eng

• Legacy System Mfg

• Contract Repair

• Power Supplies

• Cables Mfg

• Electrical-

mechanical box mfg

• Power Distribution

Unit / Controllers

Ascenx Technologies Products

Ascenx Confidential

CONFIDENTIALCONFIDENTIAL

Ascenx Leadership

Management Leadership Engineering Leadership

Ascenx managers have combine 50 years experience at major OEM technology companies

Core background in: Mechanical and electrical design and

manufacturing engineering Field service management and world-

wide technical support services Cables and harnesses manufacturing

30+ yrs experience in electrical and mechanical design for Semi Equip

6+ yrs experience in components obsolescence

10+ yrs experience in field service engineering

20+ yrs experience in cables and harnesses contract mfg

Specialized Manufacturing ServicesQuality Build to Print

Available in-house engineering team – EE, ME, Mfg Eng, to support control build to customer’s specification

Available test support for power distribution unit assembly

Specialized layout support from schematic drawing - AC / DC power distribution

Semiconductor equipment power distribution

Hi-power Electrical Distribution Panel Layout

Specialized Power Distribution Cabinet

Specialized Manufacturing ServicesQuality Build to Print

Available in-house engineering team – EE, ME, Mfg Eng, to support control build to customer’s specification

Available test support for power distribution unit assembly

Specialized layout support from schematic drawing - AC / DC power distribution

Semiconductor equipment power distribution

Hi-power Electrical Distribution Panel Layout

Specialized Power Distribution Cabinet

Aspen 2 Remanufacturing

Aspen 2 ICP Remanufacturing

Worldwide installed-base with more than 1100 systems

Ascenx is a licensed remanufacturer of Aspen 2 products

Ascenx has shipped and more than 20 systems worldwide

Ascenx engineering team manages all product obsolescence for long term extendibility

Upgrades, product CIP

Ascenx complete service team provides technical support for customer installed-base

Equipment Remanufacturing

Remanufactured under strict quality control

All components and products are sourced through to Mattson’s approved vendor

Aspen 2 subassemblies are built in USA under strict quality control

Ascenx procurement team manages all critical suppliers for product extendibility

Systems are tested to comply to Mattson’s stringent requirements

Ascenx provides 6-months warranty from ship date

Mattson Aspen 2 System

Ascenx has shipped more than 18 systems since 2014

Ascenx Confidential

Aspen 2 ICP Source

Proven and patented Faraday Shield delivers non-intrusive “Soft ICP Plasma”

Patented Faraday Shield

“Soft ICP plasma” is generated by magnetic field not RF field

With Faraday shield, average electron energy in the plasma is 6-9

electron volts

The spacing control of Faraday shield ensures optimal magnetic field

O2 disassociation for P2 and P3 O2 orbital requires 6 to 8.4 eV

Low RF energy means low ionization

Purple plasma color demonstrates the highly efficient use of energy

to generate the oxygen radicals

Photoresist ash rate is highly dependent on oxygen radicals and

temperature

Extendable to future design rules.

ICP and Microwave Source Comparison

Aspen ICP Source

Plasma maintained in area of magnetic field

Very low ionization (Dissoc:Ionization = 2000:1)

Low power density (1 W/cm3)

Power into heat = 17%

Compatible with fluorine

Process flexibility (auto-tuning)

Typical Microwave Source

₋ Plasma must be physically separated from the wafer

₋ High ionization (Dissoc:Ionization = 20:1)

₋ High power density (30 W/cm3)

₋ Power into heat = 46%

₋ Not compatible with fluorine

₋ Process inflexibility (fixed tuning)

PMD

Gate

STI

Via Plug

IMD 1Cu 1

Cu 3

Cu 6

Cu 2IMD 2

IMD 3

IMD 4

IMD 6

IMD 5Cu 5

Cu 4

• Bulk Strip

• Post Implant Strip – HDIS (>5E15 dosage)

– High energy implant strip

• Organic residue cleaning– STI etch residue clean

– Poly gate residue clean

– Contact residue clean

– Via residue clean

– Metal residue clean

• Photo-sensitive polyimide rework

• Photo-lithography rework

• Descum

• Passivation

Advanced Logic Process

Aspen II Strip ICP Applications

Bulk Strip

Post Implant Strip

– HDIS (>5E15 dosage)

– High energy implant strip

Organic residue cleaning

– STI etch residue clean

– Poly gate residue clean

– Contact residue clean

– Via residue clean

– Metal residue clean

Photo-sensitive polyimide

rework

Photo-lithography rework

Descum

Substrate

PMD

Gate

STI

IMD 1

IMD 2

Passivation

Metal 1

W Interconnect

Metal 2

ILDCapacitor

Advanced DRAM Process

Aspen II Strip ICP Applications

Specifications

Standard Strip Process

Ash Rate: 4.5/min

Non Unif Across Wafer: +/- 5%

based on 1.2 PR and 6 mm edge exclusion

Non Unif WtW, Head to Head: +/- 5%

Particles: 0.04 Particles/cm2 @size

Uptime: > 95%

MTBF: > 350 hrs

MTTR: < 4 hrs

Wafer Breakage: < 1 in 20Kwfrs

Average Install Time: < 2weeks (Up to Tier 1)

Productivity

Productivity

Aspen II Standard ICP Throughput

Layer Single Chamber (WPH)

Dual Chamber (WPH)

Comments

Standard Strip 130 130* 1.2um, 50% overstrip

High Dose Implant

55 100* Dose > 1E15, UV heat treatment

Poly 90 130* Resist and polymer removal

Metal 90 130* Resist and polymer removal

Via 80 130* Resist and complete polymerremoval

Descum 90 130* O2 / Forming Gas (N2H2)Recipe

* Throughput is limited to 130 WPH if cooling is required

System Footprint

Aspen II 200mm Strip Footprint

System Footprint – 30.2 sq. ft. (dual chamber system)

Wetbench and Chemical Delivery SystemCustom Built to Spec

All design and materials are built to customer specification

Chemical baths, tanks design with pumps and drains

All accessibility can be custom design to customer requirements

Manual or auto lids as required

Available software engineering development to specs

Portable chemical cabinet specifically designed for customer

Wetbench and Chemical Delivery System

Large bath chemical storage for high volume delivery

Fully enclosed cabinet design for medium volume delivery

Contract Manufacturing

Products

Custom ribbon cables

Custom harnesses assemblies build and design

Coaxial and high power cables

Overmolded Assemblies

Quality wire harnesses and looms

Prints, drawings, schematics, bill of materials, and harness boards design

Harness

Coaxial Cable

Ribbon Cables

Custom CablesCustom Harness

Contract Manufacturing

Products

Custom ribbon cables

Custom harnesses assemblies build and design

Coaxial and high power cables

Overmolded Assemblies

Quality wire harnesses and looms

Prints, drawings, schematics, bill of materials, and harness boards design

Harness

Coaxial Cable

Ribbon Cables

Custom CablesCustom Harness

Contract Manufacturing

Quality build to customer specifications

Electrical – mechanical design and build to spec

High power electrical conduit build

Cables, harnesses design and prototype build

ECO Documentation Support

Low-volume High Mix MFG Support

Test and verification

Electrical – mechanical custom box Prototyping and custom design

Power Distribution Box

THANK YOU

ASCENX Technologies

1905 Tarob Court

Milpitas, CA 95035

Tel. 408-945-1997

www.ascenx.com

Email. [email protected]