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Architecting Phase Change Memory as a Scalable DRAM Alternative Benjamin Lee , Engin Ipek , Onur Mutlu , Doug Burger Computer Architecture Group Microsoft Research Computer Architecture Lab Carnegie Mellon University International Symposium on Computer Architecture 22 June 2009 Benjamin C. Lee et al. 1 :: ISCA :: 22 June 09
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Architecting Phase Change Memory as a Scalable DRAM ... · PDF fileArchitecting Phase Change Memory as a Scalable DRAM Alternative Benjamin Leey, Engin Ipeky, Onur Mutluz, Doug Burgery

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Page 1: Architecting Phase Change Memory as a Scalable DRAM ... · PDF fileArchitecting Phase Change Memory as a Scalable DRAM Alternative Benjamin Leey, Engin Ipeky, Onur Mutluz, Doug Burgery

Architecting Phase Change Memory as aScalable DRAM Alternative

Benjamin Lee†, Engin Ipek†, Onur Mutlu‡, Doug Burger†

† Computer Architecture GroupMicrosoft Research

‡ Computer Architecture LabCarnegie Mellon University

International Symposium on Computer Architecture22 June 2009

Benjamin C. Lee et al. 1 :: ISCA :: 22 June 09

Page 2: Architecting Phase Change Memory as a Scalable DRAM ... · PDF fileArchitecting Phase Change Memory as a Scalable DRAM Alternative Benjamin Leey, Engin Ipeky, Onur Mutluz, Doug Burgery

MotivationTechnology

Architecture

Memory ScalingCharge MemoryResistive Memory

Memory in Transition

I Charge MemoryB Write data by capturing charge QB Read data by detecting voltage VB Examples: Flash, DRAM

I Resistive MemoryB Write data by driving current dQ/dtB Read data by detecting resistance RB Examples: PCM, MRAM, memristor

Benjamin C. Lee et al. 2 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Memory ScalingCharge MemoryResistive Memory

Limits of Charge Memory

B Unscalable charge placement and control

B Flash: floating gate charge

B DRAM: capacitor charge, transistor leakage

Benjamin C. Lee et al. 3 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Memory ScalingCharge MemoryResistive Memory

Towards Resistive Memory

I ScalableB Program with current ∝ cell sizeB Map resistance to logical state

I Non-VolatileB Set atomic structure in cellB Incur activation cost

I CompetitiveB Achieve viable delay, energy, enduranceB Scale to further improve metrics

Benjamin C. Lee et al. 4 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Memory ScalingCharge MemoryResistive Memory

PCM Deployment

B Deploy PCM on the memory bus

B Begin by co-locating PCM, DRAM

B Begin by deploying in low-power platforms

Benjamin C. Lee et al. 5 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Outline

I MotivationB Memory ScalingB Charge MemoryB Resistive Memory

I TechnologyB Phase Change MemoryB Technology ParametersB Price of Scalability

I ArchitectureB Design ObjectivesB Buffer OrganizationB Partial Writes

Benjamin C. Lee et al. 6 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Phase Change Memory

B Store data within phase change material [Ovshinsky68]

B Set phase via current pulse

B Detect phase via resistance (amorphous/crystalline)

Benjamin C. Lee et al. 7 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

PCM Scalability

B Program with current pulses, which scale linearly

B PCM roadmap to 30nm [Raoux+08]

B Flash/DRAM roadmap to 40nm [ITRS07]

Benjamin C. Lee et al. 8 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

PCM Non-Volatility

I Atomic StructureB Program with current pulsesB Melt material at 650 ◦CB Cool material to desired phase

I Activation CostB Crystallize with high activation energyB Isolate thermal effects to target cellB Retain data for >10 years at 85 ◦C

Benjamin C. Lee et al. 9 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Technology ParametersB Survey prototypes from 2003-2008 [ISSCC][VLSI][IEDM][ITRS]

B Derive parameters for F=90nm

DensityB 9 - 12F2 using BJT

B 1.5× DRAM

EnduranceB 1E+08 writes

B 1E-08× DRAM

LatencyB 50ns Rd, 150ns Wr

B 4×, 12× DRAM

EnergyB 40µA Rd, 150µA Wr

B 2×, 43× DRAM

Benjamin C. Lee et al. 10 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Technology ParametersB Survey prototypes from 2003-2008 [ISSCC][VLSI][IEDM][ITRS]

B Derive parameters for F=90nm

DensityB 9 - 12F2 using BJT

B 1.5× DRAM

EnduranceB 1E+08 writes

B 1E-08× DRAM

LatencyB 50ns Rd, 150ns Wr

B 4×, 12× DRAM

EnergyB 40µA Rd, 150µA Wr

B 2×, 43× DRAM

Benjamin C. Lee et al. 10 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Technology ParametersB Survey prototypes from 2003-2008 [ISSCC][VLSI][IEDM][ITRS]

B Derive parameters for F=90nm

DensityB 9 - 12F2 using BJT

B 1.5× DRAM

EnduranceB 1E+08 writes

B 1E-08× DRAM

LatencyB 50ns Rd, 150ns Wr

B 4×, 12× DRAM

EnergyB 40µA Rd, 150µA Wr

B 2×, 43× DRAM

Benjamin C. Lee et al. 10 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Technology ParametersB Survey prototypes from 2003-2008 [ISSCC][VLSI][IEDM][ITRS]

B Derive parameters for F=90nm

DensityB 9 - 12F2 using BJT

B 1.5× DRAM

EnduranceB 1E+08 writes

B 1E-08× DRAM

LatencyB 50ns Rd, 150ns Wr

B 4×, 12× DRAM

EnergyB 40µA Rd, 150µA Wr

B 2×, 43× DRAM

Benjamin C. Lee et al. 10 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Phase Change MemoryTechnology ParametersPrice of Scalability

Price of ScalabilityB 1.6× delay, 2.2× energy, 500-hour lifetime

B Implement PCM in typical DRAM architecture

Benjamin C. Lee et al. 11 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Outline

I MotivationB Memory ScalingB Charge MemoryB Resistive Memory

I TechnologyB Phase Change MemoryB Technology ParametersB Price of Scalability

I ArchitectureB Design ObjectivesB Buffer OrganizationB Partial Writes

Benjamin C. Lee et al. 12 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Design Objectives

I DRAM-CompetitiveB Reorganize row buffer to mitigate delay, energyB Implement partial writes to mitigate wear mechanism

I Area-EfficientB Minimize disruption to density trendsB Impacts row buffer organization

I Complexity-EffectiveB Encourage adoption with modest mechanismsB Impacts partial writes

Benjamin C. Lee et al. 13 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Buffer Organization

I On-Chip BuffersB Use DRAM-like buffer and interfaceB Evict modified rows into array

I Narrow RowsB Reduce write energy ∝ buffer widthB Reduce peripheral circuitry, associated area

I Multiple RowsB Reduce eviction frequencyB Improve locality, write coalescing

Benjamin C. Lee et al. 14 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Buffer Area StrategyB Narrow rows :: fewer expensive S/A’s (44T)

B Multiple rows :: more inexpensive latches (8T)

Benjamin C. Lee et al. 15 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Buffer Design SpaceB Explore area-neutral buffer designs

B Identify DRAM-competitive buffer design

Benjamin C. Lee et al. 16 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Wear Reduction

I Wear MechanismB Writes induce phase change at 650 ◦CB Contacts degrade from thermal expansion/contractionB Current injection is less reliable after 1E+08 writes

I Partial WritesB Reduce writes to PCM arrayB Write only stored lines (64B), words (4B)B Add cache line state with 0.2%, 3.1% overhead

Benjamin C. Lee et al. 17 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Partial WritesB Derive PCM lifetime model

B Quantify eliminated writes during buffer eviction

Benjamin C. Lee et al. 18 :: ISCA :: 22 June 09

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MotivationTechnology

Architecture

Design ObjectivesBuffer OrganizationPartial Writes

Scalable PerformanceB 1.2× delay, 1.0× energy, >5-year lifetime

B Scaling improves energy, endurance

Benjamin C. Lee et al. 19 :: ISCA :: 22 June 09

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ConclusionPaper DetailsConclusionFuture Directions

Also in the paper...

I Technology SurveyB Survey of circuit/device prototypesB PCM architectural timing, energy modelsB Scaling analysis, implications

I Buffer OrganizationB Transistor-level area modelB Buffer sensitivity analysis

I Partial WritesB Endurance modelB Bus activity analysis

Benjamin C. Lee et al. 20 :: ISCA :: 22 June 09

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ConclusionPaper DetailsConclusionFuture Directions

Conclusion & Future Directions

I Memory ScalingB Fundamental limits in charge memoryB Transition towards resistive memory

I Phase Change MemoryB Scalability and non-volatilityB Competitive delay, energy, enduranceB DRAM alternative on the memory bus

I Applied Non-VolatilityB Instant start, hibernateB Inexpensive checkpointingB Safe file systems

Benjamin C. Lee et al. 21 :: ISCA :: 22 June 09

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ConclusionPaper DetailsConclusionFuture Directions

PCM File System (PFS)

J.Condit et al. “Better I/O through byte-addressable, persistentmemory.” SOSP-22: Symposium on Operating System Principles,October 2009. (To Appear)

I File System PropertiesB Consistency :: COW with atomicity, orderingB Safety :: Reflect writes to PCM in O(ms), not O(s)B Performance :: Outperform NTFS on RAM disk

I Architectural SupportB Atomic 8B writes with capacitive supportB Ordered writes with barrier-delimited epochs

Benjamin C. Lee et al. 22 :: ISCA :: 22 June 09

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Architecting Phase Change Memory as aScalable DRAM Alternative

Benjamin Lee†, Engin Ipek†, Onur Mutlu‡, Doug Burger†

† Computer Architecture GroupMicrosoft Research

‡ Computer Architecture LabCarnegie Mellon University

International Symposium on Computer Architecture22 June 2009

Benjamin C. Lee et al. 23 :: ISCA :: 22 June 09