External Use Applied TechEdge ™ Prizm ™
External Use 2
Achieve Metrology Integrity
Metrology Challenges
CD-SEM issue diagnosis can be difficult and time consuming.
Fab managers rely upon accurate CD-SEM measurements and data to meet industry challenges.
Quick issue detection can dramatically minimize production yield loss
External Use 3
Extract and Analyze All That Data
TechEdge Prizm Masters Data Management
Browser-enabled
CD SEM tool reporting
Interactive analysis
Recipe, Process issue identification and diagnosis
Fleet matching
Applied TechEdge Prizm
4External Use
Why Choose TechEdge Prizm?
Increases Productivity
• Reduce process development time by months
• Minimizes lot hold time and lithography re-work
Improves Cost of Ownership
• Enables faster improvement of Cpkof CD-SEMs
• Reduces time to market
• Reduces product scrap and re-work
• ROI in Year 1 of 200% - 500%
Accelerates Yield Ramp
Quick Problem Identification
Current Methods EstimateWith TechEdge Prizm
External Use 5
Make Informative Data-Driven Decisions
Key Features
Real-time data analysis
Fast retrieval of SEM images and wafer maps to speed diagnosis
Long term storage for data and images (≤10 yrs.)
Software, hardware, integration to the CD-SEMs, and support service
Identify abnormal data, get more information, and quickly take action
External Use 6
Prizm Drives Rapid Analysis and Response
Select data type and range for analysis and populate chart.
Analyze image for cause. This shows a process excursion.
Roll cursor over wafer map measurementsites to show SEM images.
1
Click onabnormal CD data to get wafer map.
5
SEM image displayed.
2
3
4
Excursion | Target CD
Data and images are key!
External Use 7
CHALLENGES
• New Applied VeritySEM 4i CD-SEM systems• New techniques being introduced (e.g. Design Based
Metrology)• Introduction of new processes (<35nm) • Diagnosing CD issues was difficult and time consuming,
taking up to 8 hours per report
CUSTOMER TYPE 300mm Leading Logic/Foundry
Customer Experienced 500% ROI
RESULTS
• Prizm accelerated qualification of CD-SEM recipes by >10X
• Lithography and etch process engineers accelerated their development cycle by 2 months
• The estimated customer value exceeds $10M, with an ROI > 500% with a payback of < 1 year