Application of Six Sigma Methodology to Optimize the Performance
of the Inter-Metal Dielectric Process
Application of Six Sigma Methodology to Optimize the Performance
of the Inter-Metal Dielectric ProcessAuthors: Chao-Ton Su, Chia-Jen
Chou, and Li-Fei ChenSources: IEEE Transactions on Semiconductor
Manufacturing, Vol. 22, No. 2, pp. 297-304Date:
12/27/20101OutlineIntroductionCase
studyConclusionsIntroductionBackground
(inter-metal dielectric, IMD)(step coverage)
(integrated circuit, IC)
IntroductionMotivation
4IntroductionIMD
(line resistance, R)(parasitic capacitance, C)R/C
(open circuit)
5IntroductionObjective
IMD
Case study
IMD(IMD performance improvement project)
IMDIMDCase studyDefine Phase
(thin film module)(quality assurance)(product engineering
integration engineers)(process owners)
IMD
(CTQs)
Case study(dies)(defects per unit, DPU)
DPU0.045(cost of poor quality, COPQ)DPU0.03
IMD(gap-fill ability) (VRDB)(fluorine contained)
CTQs9Case study
(A/R)3:15:1
3:1
Case study(voltage-ramping stress test, VRDB)
VRDB
VRDBCase studyIMD(Fluorosilicate glass, FSG)FSG(dielectric
constant)3.93.5
12Case studyIMD(silicon rich oxide, SRO liner)(Fluorosilicate
glass, FSG)1(Fluorosilicate glass, FSG)2(undoped silicon glass,
USG)
CMPCMP12 &(Chemical Mechanical Polishing, CMP)(Global
Planarization)SRO liner FSG113Case studyMeasure Phase
CTQVRDB
Case studyGauge R&R7.02%8.54%
VRDBIndividuals and Moving Range chart (I-MR)VRDB8.33
30 (P-Value: 0.895)Cpk0.79(VRDB)Cpk0.76Cpk0.86
Cpk05%GRR