ANSYS Workbench enhances electronics design flows with CAD integration and simulation automation SIwave and Icepak two-way coupling provides electrical and thermal co-design for PCB design HFSS one-way coupling with Mechanical for medical device MRI compliance DesignXplorer integration with Ansoft Designer enables comprehensive design space exploration for a complete system Thermal-stress analysis of a computer graphics card, temperatures imported to ANSYS Mechanical from ANSYS Icepak Workbench CAD Integration for HFSS, Maxwell, and Q3D Extractor New ANSYS Workbench for Electronics Jim DeLap and Steve Scampoli PCB Board Model Pad Ball PCI Connector Package 1 Socket Tline Vias Vias TLines Package 2 PCI Board PCIe Gen 3 DOE Channel Simulation TX RX 0 0 0 0 0 0 0 0 P2_Pad1_p P2_Pad1_n P2_Pad2_p2 P2_Pad2_n2 P2_Pad3_n P2_Pad3_p Pad3_n Pad3_p Pad2_p Pad2_n Pad1_n Pad1_p Ball1_n Ball1_p Ball2_n Ball2_p Ball3_n Ball3_p Pin1 Pin2 Pin3 Pin4 Pin5 Pin6 Pin7 Pin8 Pin9 Pin10 Pin11 Pin12 p1 p3 p5 p7 p9 p11 Die_1n Die_1p Die_2n Die_2p Die_3n Die_3p Pin1 Pin3 Pin5 Pin7 Pin9 Pin11 Pin2 Pin4 Pin6 Pin8 Pin10 Pin12 Pin1 Pin2 Pin3 Pin4 Pin1 Pin2 Pin3 Pin4 Pin1 Pin2 Pin3 Pin4 1 2 3 4 5 6 W103 Pin1 Pin2 Pin3 Pin4 Pin1 Pin2 Pin3 Pin4 Pin1 Pin2 Pin3 Pin4 p1 p3 p5 p7 p9 p11 Die_1n Die_1p Die_2n Die_2p Die_3n Die_3p ID=156 ID=157 ID=158 ID=164 ID=165 1 2 3 4 5 6 W176 1 2 3 4 5 6 W177 Pad3_n Pad3_p Pad2_p Pad2_n Pad1_n Pad1_p Ball1_n Ball1_p Ball2_n Ball2_p Ball3_n Ball3_p ID=187 1 2 3 4 5 6 W190 Multi-Domain Coupling – SIwave and HFSS one-way coupling exchange field data to simulate the system level EMI/EMC of a PCB mounted in a case IcePak: Thermal SIwave as EMI Source 3D HFSS SIwave Hybrid Field Solver Full PCB/Package S-Parameters Fields HFSS Arbitrary 3D FEM Solver Adaptive Meshing Industry Standard Advanced High Performance Computing Icepak Mechanical Power Map Temperature SIwave Icepak CATIA Parameterized HFSS Geometry HFSS MRI Cage Steady-State and Transient Thermal Temperature vs. Position ANSYS DesignModeler for geometry simplification Icepak: Avionics Case B Field Magnetic Forces Displacements of mesh nodes Stress Calculation Field Calculation Force Distribution Displacements Updated Mesh Maxwell two-way coupling with Mechanical enables structural displacements to update the mesh in Magnetostatic simulations GbX model courtesy of RF Power Temperature Deformation HFSS and Mechanical two-way coupling