ANSYS Icepak R18新功能register.ansys.com.cn/ansyschina/2017/ansys18roadshow... · 2017. 3. 28. · • ANSYS SpaceClaim is the new de facto CAD Cleanup Tool for all ANSYS products

ANSYS Icepak R18新功能

马世虎，Lead Support EngineerANSYS China

Icepak R18 概览

• Enhancements to SIwave <-> Icepak solution– Added automated iterative loop

• SpaceClaim Direct Modeler incorporates DME “Simplify Functions”

• RedHawk CTM import with back annotation of Temps into RH

• Meshing Improvements• Solver Improvments

– Vacuum -> enable radiation control in fluid zones– Support for Streamwise Periodicity

• Inputs for Mass Flow or Pressure Gradient • ECXML support for data exchange• Improved HPC performance• Arbitrary Board Outline Imports using IDF• Improved Via handling capabilities

– Individually modeling vias – no K averaging– Via Drill holes imported

• Improved Krylov ROM for efficient network modeling• Post Processing

– LED – Efficiency as a function of temp.– Solar Heat Flux reporting– Improved Surface Probing– Smooth 3D Contours– Optimized Manhattan displays– Transient option for “Full Reports”– Node-weighted interpolation for accurate facet-based

post-processing

Cu-brass

SIwave-Icepak 工作流程改进

Joule Heating

Thermal Cut-Planes• From ANSYS SIwave:

− Conduction only analysis− Natural convection analysis− Forced convection (fan) analysis− Multi-phase VRM design support− IDF boundary conditions & Heat Sink

creation − Geometry pre-processing for stand-

alone Icepak− Component power (Watts) allocation

during setup− Joule heating power mapping into

Icepak & Mechanical− Cut plane temperature monitoring in

XY-, XZ-, and YZ-planes − Ability to “Open” and perform more

detailed analysis & reporting in stand-alone Icepak!

SIwave-Icepak 工作流程改进Siwave中的Icepak设置

• ANSYS Icepak is solved directly in SIwave for ‘conduction only’ and basic convection models

• After setting up in SIwave, an Icepak project is built and run in the background and the temperatures are post-processed in the SIwave GUI

• Automation of iterative loop until DC convergence

• Filter added to delete all RLC components below a certain power

• Helps reduce number of components in Icepak

SIwave-Icepak 工作流程改进Siwave中的Icepak设置

• Button added for convection to auto-size the Cabinet in the ANSYS Icepak project

SIwave-Icepak 工作流程改进Siwave中的Icepak设置

• Updated Mesh settings for improved robustness

• Spatial Profile implementation for the power dissipation map has resulted in major improvements in overall turnaround time and robustness

• If available, most generic setups (old Automatic setup in ANSYS Icepak) can be run directly in the SIwave project setup

SIwave-Icepak 工作流程改进Siwave中的Icepak设置

• Improved usability and robustness– Spatial Profile implementation

(using PCB primitive in Icepak) for the power dissipation map has resulted in major improvements in overall turnaround time and robustness

– Boards can be offset or rotated from their original location

SIwave-Icepak 工作流程改进Icepak的改进

• Support for Multiple Boards– Boards of same setup can

point to the same initial SIwave project

– The macro will launch the initial run, create the individual sitemp files and then queue the individual launches of new SIwave projects

– Each board/substrate must have a separate SIwave project

SIwave-Icepak 工作流程改进Icepak的改进

• Improved Usability– Macro now only requires pointing to the board in Icepak and the project file

for the SIwave project

SIwave-Icepak 工作流程改进Icepak的改进

CPS工作流程改进

CTM View in Icepak

• ANSYS Redhawk CTM Import into Icepak

• Back annotation from Icepak to Redhawk− Main Menu/Report/Export/RedHawk Back Annotation− Export the temperature at each tile to RedHawk

Select the die block.

Select the CTM file

Select location for output

CPS工作流程改进

MCAD 导入 Icepak 的改进

• ANSYS SpaceClaim is the new de facto CAD Cleanup Tool for all ANSYS products

• Geometry simplification, repair, and modification is significantly streamlined compared to ANSYS DesignModeler

• At v18, several of the “DesignModeler Electronics Utility” capabilities have been incorporated into ANSYS SpaceClaim.

SpaceClaim Icepak

Auto-Identify Simple Icepak Shapes in SpaceClaim• After initial geometry cleanup is complete, the Identify

Objects command can automatically create simple Icepak shapes

Input Geometry Structure Tree Icons are Updated

Before After

Icepak block icon

MCAD 导入 Icepak 的改进

Icepak Simplification Levels in SpaceClaim

Level 0 Level 1

Level 2 Level 3

• Level 0: Converts geometry to a bounding box prism

• Level 1: Converts geometry to a collection of prisms and cylinders

• Level 2: Converts geometry to a polygonal approximation

• Level 3: Keeps the geometry as-is (use only when needed)

MCAD 导入 Icepak 的改进

Modify Icepak Object Type in SpaceClaim• Sometimes it makes sense to change the object type,

some examples are− Icepak Plate → Source, Wall, Opening− Icepak Block → PCB

Icepak Block Icepak PCB

The geometry remains the same, but the object options

are different in Icepak

Structure tree icon is updatedLevel 2 simplification already done

MCAD 导入 Icepak 的改进

• Supported Features:• Cabinet, Plates, Blocks, Walls, Sources, PCBs,

Grilles, Resistances, Enclosures, Heatsinks, 2R Network Blocks, 2D & 3D Fans

• Materials: Solid• Assemblies• Monitor Points

• Implemented cross-platform encryption algorithm

• Joint testing effort with Mentor

ECXML: Icepak和Flotherm的数据交换

• Icepak Model highlights: MCAD, ECAD, Non-conformal Assemblies, 734 objects

• Icepak Mesh highlights: ~11 M cells using unstructured, non-conformal, multi-level, hex-dominant meshing scheme

• Icepak Solution highlights: Steady state, Turbulent Flow, Conjugate Heat Transfer, Double Precision.

求解器改进– HPC性能改善

Desktop Server Setup in Icepak

• System Information– Intel Xeon CPU E5-4650L 2.6 GHz processors, 512 GB RAM– 4 processors, 32 cores– Running Windows Server 2012 R2 Standard.

• HPC Test Summary– Trials were run using ANSYS Icepak v18.0 and ANSYS Icepak v17.0.– Each trial was run for 250 iterations.– Solution time tracking:

• Overall Run Time: Includes Case Setup and Computational Effort.

求解器改进– HPC性能改善

Icepak R17 vs R18

• Overall Run Time vs Number of Cores

求解器改进– HPC性能改善

• Speed-up vs Number of Cores

• Overall run time for 1 core taken as reference to calculate Speed-up

Icepak R17 vs R18

求解器改进– HPC性能改善

• Enable facet-based post processing for object face contours• Temperature, Heat flux, Heat transfer coefficient variables available• Export values to profile files• Option to display contours on wall and wall-shadow

后处理改进：Facet-based数值处理

Icepak 展望 -> R18.1 & 未来

Create an Automated, Streamlined Electro-Thermal Multi-Physics Solution that utilizes Native MCAD/ECAD for First Pass Mesh/Solve Success

Key Drivers/Mandates• Modern UI, Ease-of-Use• Integration into AEDT• Rapid Release Cycles

R18.1 First release • Initial exposure with most

common feature set• CPS with Enclosure• Steady-state thermal

Improved Workflow• Native MCAD Modeler• ECAD-MCAD Assembly• Integrated Electro-Thermal

Workflow• Geometry Clean Up & Simplification

ANSYS Electronics Desktop (AEDT)• AEDT-Icepak

感谢聆听