ANSI/J–STD-003 JOINT INDUSTRY STANDARD · 2020. 5. 12. · JOINT INDUSTRY STANDARD Solderability Tests for Printed Boards 1st WORKING DRAFT ANSI/J–STD-003 APRIL 1992 IN D U S

JOINTINDUSTRY

STANDARD

Solderability Testsfor

Printed Boards

1st WORKING DRAFT

ANSI/J–STD-003APRIL 1992

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AMERICAN NATIONALSTANDARD

Notice EIA and IPC Standards and Publications are designed to serve the public interestthrough eliminating misunderstandings between manufacturers and purchasers,facilitating interchangeability and improvement of products, and assisting the pur-chaser in selecting and obtaining with minimum delay the proper product for hisparticular need. Existence of such Standards and Publications shall not in anyrespect preclude any member or nonmember of EIA or IPC from manufacturing orselling products not conforming to such Standards and Publications, nor shall theexistence of such Standards and Publications preclude their voluntary use by thoseother than EIA or IPC members, whether the standard is to be used either domesti-cally or internationally.

Recommended Standards and Publications are adopted by EIA and IPC withoutregard to whether their adoption may involve patents on articles, materials, or pro-cesses. By such action, EIA and IPC do not assume any liability to any patentowner, nor do they assume any obligation whatever to parties adopting the Recom-mended Standard or Publication. Users are also wholly responsible for protectingthemselves against all claims of liabilities for patent infringement.

The material in this joint standard was developed by the EIA Soldering TechnologyCommittee (STC) and the IPC Soldering/Solderability Specifications Task Group(5-23a).

For Technical Information Contact:

Electronic Industries AssociationEngineering Department2500 Wilson BoulevardArlington, VA 22201Phone (703) 907-7500Fax (703) 907-7501

The Institute for Interconnectingand Packaging Electronic Circuits2215 Sanders RoadNorthbrook, IL 60646Phone (847) 509-9700Fax (847) 509-9798

Please use the Standard Improvement Form shown at the end of thisdocument.

Copyright © 1996 by the Electronics Industries Association and the Institute for Interconnecting and Packaging Electronic Circuits. All rightsreserved. Published 1996. Printed in the United States of America.

No part of this publication may be reproduced in any form, in an electronic retrieval system or otherwise, without the prior written permissionof the publisher.

AMERICAN NATIONALSTANDARD

AMERICAN NATIONAL STANDARDS INSTITUTE

APPROVED JUNE 2, 1992 AS AN

J-STD-003

Solderability Tests

for Printed Boards

A joint standard developed by the Joint Soldering/SolderabilitySpecifications Task Group

Users of this standard are encouraged to participate in thedevelopment of future revisions.

Contact:

EIAEngineering Department

2500 Wilson Boulevard

Arlington, VA 22201

Phone (703) 907-7500

Fax (703) 907-7501

IPC2215 Sanders Road

Northbrook, IL 60062-6135

Phone (847) 509-9700

Fax (847) 509-9798

JOINT

INDUSTRY

STANDARD

AcknowledgmentAny Standard involving a complextechnology draws material from avast number of sources. While theprinciple members of the Soldering/

Solerability Specifications TaskGroup of the IPC Joining ProcessesCommittee are shown below, it is notpossible to include all of those who

assisted in the evolution of thisStandard. To each of them, themembers of the IPC extend theirgratitude.

Joining Processes Committee Soldering/SolderabilitySpecifications Task Group

Technical Liaison of theIPC Board of Directors

ChairmanDavid SchoenthalerAT&T

ChairmanJohn DeVoreG.E.

Bonnie FenaHibbing Printed Circuits

Joint Soldering/Solderability Specifications Task Group

L. Abbagnaro, Pace Inc.F.C. Albers, Unisys Corp.P.J. Amick, Mc Donnell DouglasElec. Sys Co.

J.E. Andrews, Hadco Corp.F. Anglade, MetronelecH.R. Armfield, Litton Data SystemsJ. Baker, Repco Inc.G. Bates, Sherwood MedicalA. Beikmohamadi, E I DuPont DeNemours & Co.

J.G. Bernauer, Unisys Corp.D.F. Bernier, Kester Solder DivisionS.T. Bora, Smiths IndustriesC. Bradshaw, Memorex Telex Corp.C. Brill, AMP Inc.Dr. J. Brous, Alpha Metals Inc.S.F. Caci, Raytheon Co.L.W. Canarr, Rockwell InternationalT.A. Carroll, Hughes Aircraft Co.A. Cash, Northrop Corp.K.C. Chao, Lockheed Missiles &Space Co.

W.A. Clark, AT&T Bell LaboratoriesD. Cotosky, Kester Solder DivisionL.A. Crouch,D. Currie, Teledyne Systems Co.G. Cushman, Eptac CorporationG.J. Davy, Westinghouse ElectricCorp.

J.A. DeVore, General Electric Co.M.D. Dillie, MagnavoxR.J. Edgington, National StandardCo.

D.A. Elliott, Electrovert Ltd.G.P. Evans, Indium Corp. of AmericaJ.W. Evans, NASA HQH.S. Feldmesser, Johns HopkinsUniversity

J.R. Felty, Texas Instruments Inc.R. Fields, E I DuPont De Nemours &Co.

A.D. Flaten, AT&T InformationSystems

J. Gamalski, Siemens AGJ. Gechter, Delco Systems OperationsP. Gildehaus, Allied Signal AerospaceC. Gonzalez, SCI Manufacturing Inc.B. Gulati, Parker/Gull Electronic SysDiv

V. Gundotra, Motorola Inc.W.B. Hampshire, Tin Information Ctrof N Amer

S. Herrberg, Magnavox ElectronicSystems Co.

D.D. Hillman, Rockwell InternationalP.E. Hinton, Hinton ‘‘PWB’’Engineering

R.R. Holmes, AT&T MicroelectronicsJ.B. Hoppke, Alliant TechsystemsInc.

L. Hymes, Plexus Corp.R.C. Ihling, Lockheed Missiles &Space Co.

B. Inpyn, Pitney Bowes Inc.M.W. Jawitz, Litton Guidance &Control Sys.

L.G. Johnson, General Electric Co.S.A. Jones, Wilcox Electric Inc.M. Kasilag, Aerojet ElectrosystemsCo.

C. Kemp, General Electric Co.G.W. Kenealey, Control Data Corp.W.G. Kenyon, E I DuPont DeNemours & Co.

K.Kirby, CAE-Link Corp.L.P. Knowles, Librascope Corp.T. Kokocinski, Northrop Corp.

R. Kraszewski, Kester SolderDivision

V. Kumar, Martin-MariettaElectronics

E.J. Kuntz, Alcatel Network SystemsInc.

V. Kuo, EMPFM.A. Kwoka, Harris Corp.L.P. Lambert, Digital EquipmentCorp.

J. P. Langan, Enthone-Omi Inc.R.B. Lomerson, General DynamicsL. Lynch, AT&T MicroelectronicsS.C. Mackzum, Ericsson GEJ.E. Madison, CTS Corp.J.F. Maguire, Boeing Aerospace &Electronics

J.R. Maki, Harris Corp.S. Mansilla, Robisan Laboratory Inc.R. Martinez, Magnavox West CoastOperations

R.E. Mc Lean, Storage TechnologyCorp.

S. Meeks Jr., Lexmark International/IBM Corp.

J.H. Moffitt, U.S. NavyG.C. Munie, AT&T Bell LaboratoriesR.D. Nicholas, London Chemical CoInc.

R.L. Nielsen, Fastman Kodak Co KadR.B. Officer, Lockheed Sanders Inc.R. Parker, Hewlett PackardLaboratories

H.E. Parkinson, Digital EquipmentCorp.

R. Payne, Sundstrand Data ControlInc.

R.J. Phillips, Lorain ProductsP.J. Plonski, Photocircuits Corp.R. Pond, Texas Instruments Inc.

J-STD-003 April 1992

ii

P.J. Quinn, General Electric Co.M. Qurashi, U.S. NavyR. Ramos, Trace Laboratories—EastJ.R. Reed, Texas Instruments Inc.P.M. Rehm, Intel Corp.M. Reithinger, Siemens AGD.E. Robertson, Pace Inc.J.G. Rosser, Hughes Aircraft Co.A.B. Rotman, DCMR Boston (Deptof Defense)

Dr. W. Rubin, Multicore SoldersD. Rudy, AT&T Bell LaboratoriesD.W. Rumps, AT&T TechnologySystems

N. Rusignuolo, Hexacon Electric Co.H.J. Russell, Defense General SupplyCenter

W.R. Russell, Texas Instruments Inc.

D. Scheiner, Kester Solder DivisionA. Schneider, Alpha Metals Inc.D. Schoenthaler, AT&T BellLaboratories

J.T. Slanina, Allied Signal AerospaceE. Small, Multicore SoldersW.A. Smith, General DynamicsN. Socolowski, Alpha Metals Inc.J.R. Sovinsky, Indium Corp. ofAmerica

A. Starosta, Eldec Corp.C.J. Sworin, Kester Solder DivisionG. Theroux, Honeywell Inc.P.A. Thibodeau, Digital EquipmentDr. L.J. Turbini, Georgia Institute/Technology

H. Underwood, U.S. Air Force

D. Varnell, Hercules Inc.D.A. Vaughan, E I DuPont DeNemours & Co.

E. Vollmar, Methode Electronics Inc.B. Waller, Texas Instruments Inc.C.E.T. White, Indium Corp. ofAmerica

R.N. Wild, IBM Corp.D. Wolf, Hadco Corp.M. Wolverton, Texas Instruments Inc.Dr. T. S. Won, Allied SignalAerospace

R. Woodgate, Woodcorp Inc.J.R. Wooldridge, RockwellInternational

R.O. Young, Rockwell InternationalW. Younger, PC World—OrangeCounty

April 1992 J-STD-003

iii

Table of Contents

1.0 SCOPE...................................................................... 11.1 Scope ...................................................................... 1

1.2 Purpose ................................................................... 1

1.3 Objective................................................................. 1

1.4 Performance Classes .............................................. 1

1.5 Method Classification............................................. 1

1.5.1 Tests with Established Accept/RejectCriterion.................................................................. 1

1.5.2 Test(s) without Established Accept/Reject Criterion ...................................................... 1

1.6 Test Method Selection............................................ 1

1.7 Test Specimen Requirements................................. 2

1.8 Coating Durability.................................................. 2

1.9 Limitation ............................................................... 2

2.0 APPLICABLE DOCUMENTS .................................. 22.1 Industry................................................................... 3

2.1.1 IPC.......................................................................... 3

2.2 Government ............................................................ 3

2.2.1 Federal .................................................................... 3

3.0 REQUIREMENTS ..................................................... 33.1 Terms and Definitions ............................................ 3

3.2 Materials ................................................................. 3

3.2.1 Solder...................................................................... 3

3.2.2 Flux......................................................................... 3

3.2.3 Flux Removal Material .......................................... 3

3.3 Equipment............................................................... 3

3.3.1 Steam Aging Apparatus.......................................... 3

3.3.2 Solder Pot/Bath ...................................................... 4

3.3.3 Optical Inspection Equipment................................ 4

3.3.4 Dipping Equipment ................................................ 4

3.3.5 Timing Equipment.................................................. 4

3.4 Preparation for Testing........................................... 4

3.4.1 Specimen Preparation and ConditioningFor Test................................................................... 4

3.4.2 Steam Aging ........................................................... 4

3.4.3 Baking..................................................................... 4

3.5 Solder Bath Requirements ..................................... 4

3.5.1 Solder Temperatures............................................... 4

3.5.2 Solder Contamination Control ............................... 4

4.0 TEST PROCEDURES .............................................. 44.1 Test Procedure Limitations .................................... 4

4.1.1 Application of Flux................................................ 5

4.2 Tests with Established Accept/Reject Criterion .... 5

4.2.1 Test A—Edge Dip Test .......................................... 5

4.2.2 Test B—Rotary Dip Test ....................................... 5

4.2.3 Test C—Solder Float Test...................................... 8

4.2.4 Test D—Wave Solder Test................................... 10

4.3 Test(s) without Established Accept/Reject Criterion .................................................... 11

4.3.1 Test E—Wetting Balance Test ............................. 11

5.0 EVALUATION AIDS .............................................. 125.1 Evaluation Aids—Surface.................................... 12

5.2 Evaluation Aids—For Class 3 PlatedThrough-holes....................................................... 12

6.0 NOTES .................................................................... 126.1 Test Equipment Sources....................................... 14

6.1.1 Edge Dip Solderability Test Apparatus ............... 14

6.1.2 Rotary Dip Test Apparatus................................... 14

6.1.3 Wetting Balance Test Apparatus .......................... 14

6.1.4 Steam Aging Equipment ...................................... 14

6.2 Wetting Times ...................................................... 15

6.3 Correction for Buoyancy...................................... 15

6.4 Preheat .................................................................. 15

6.5 Baking/Testing Time Delay ................................. 15

6.6 Prebaking.............................................................. 15

6.7 Safety Note........................................................... 16

6.8 Use of Non-Activated Flux.................................. 16

6.9 Other Fluxes ......................................................... 16

6.10 Solder Contact ...................................................... 16

6.11 Steam Aging ......................................................... 16

Figures

Figure 1 Contact angle ....................................................... 3

Figure 2 Edge dip solderability test .................................... 6

Figure 3a Suggested test specimen—for platedthrough-holes........................................................ 7

Figure 3b Suggested test specimen—for surface mountfeatures................................................................. 8

Figure 4 Rotary dip test ...................................................... 8

Figure 5 Effectiveness of solder wetting of plated-through holes–Class 3 ......................................... 9

Figure 6 Wetting balance apparatus ................................ 12

Figure 7a Wetting time acceptance criteria........................ 13

Figure 7b Wetting force acceptance criteria....................... 13

Figure 8 Wetting balance curve........................................ 14

Figure 9 Aid to evaluation................................................. 15

Tables

Table 1 Test Method Selection.......................................... 2

Table 2 Accelerated Aging and Test Requirements.......... 2

Table 3 Maximum Limits of Solder Bath Contaminant ..... 3

Table 4 Steam Temperature Requirements ...................... 4

April 1992 IPC-STD-003

iv


Solderability Tests for Printed Boards

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1.0 SCOPE

1.1 Scope This standard prescribes the recommendtest methods, defect definitions and illustrations for asseing the solderability of printed board surface conductoattachment lands, and plated through-holes. This standis intended for use by both vendor and user.

1.2 Purpose The solderability determination is made tverify that the printed board fabrication processes and ssequent storage have had no adverse effect on the soability of those portions of the printed wiring boardintended to be soldered. This is determined by evaluatof the solderability specimen portion of a board or reprsentative coupon which has been processed as part ofpanel of boards and subsequently removed for testingthe method selected.

1.3 Objective The objective of the solderability tesmethods described in this standard is to determine the aity of printed board surface conductors, attachment lanand plated through-holes to wet easily with solder andwithstand the rigors of the printed board assembly prcesses.

1.4 Performance Classes Three general classes havbeen established to reflect progressive increases in soptication, functional performance requirements and testininspection frequency. It should be recognized that themay be an overlap of equipment categories in differeclasses. The user has the responsibility to specify incontract or purchase order the performance class requfor each product and shall indicate any exceptions to scific parameters, where appropriate.

Class 1 General Electronic Products

Includes consumer products, some computer and compperipherals, as well as general military hardware suitafor applications where cosmetic imperfections are nimportant and the major requirement is function of thcompleted printed board.

Class 2 Dedicated Service Electronic Products

Includes communications equipment, sophisticated buness machines, instruments and military equipment whhigh performance and extended life is required and fwhich uninterrupted service is desired but not critical. Cetain cosmetic imperfections are allowed.

Class 3 High Reliability Electronic Products

Includes the equipment for commercial and military proucts where continued performance or performance

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demand is critical. Equipment downtime cannot be toleated and must function when required such as in life suport items or missile systems. Printed boards in this claare suitable for applications where high levels of assuranare required and service is essential.

1.5 Method Classification This standard describes testmethods by which both the surface conductors (and attacment lands) and plated through-holes may be evaluatedsolderability.

Provisions are made for this determination to be performeat the time of manufacture, at the receipt of the boards bthe user, or just prior to assembly and soldering. User avendor shall agree to the appropriate method to be usand their correlation.

Standard dwell times are defined in some of the methocalled out in this standard. Variations in board heat capaity may necessitate the use of longer solder dwell time(see paragraph 6.2). Any change in solder dwell shall bagreed upon by user and vendor.

1.5.1 Tests with Established Accept/Reject Criterion

Test A—Edge Dip Test (For surface conductors anattachment lands only)

Test B—Rotary Dip Test (For plated through-holes, surface conductors and attachment lands, soldsource side)

Test C—Solder Float Test (For plated through-holes, suface conductors and attachment lands, soldsource side)

Test D—Wave Solder Test (For plated through-holes, suface conductors and attachment lands, soldsource side)

1.5.2 Test(s) without Established Accept/RejectCriterion

Test E—Wetting Balance Test (For surface conductors anattachment lands only)

Please forward all test data generated using this temethod, including type of board tested (such as Type 212 layer, Type 3), dimensions of coupon tested, and apretreatment, to:IPCWetting Balance Task Group (PWB)2215 Sanders RoadNorthbrook, IL 60062-6135

1.6 Test Method Selection For appropriate test selectionrefer to paragraph 1.5 and Tables 1 & 2. Thetest selection

1


Table 2 Accelerated Aging and Test Requirements

Pretest Conditioning Flux

Durability of Coating Rating*

1 2** 3

Surface Holes Surface Holes Surface Holes

*8 Hours Steam R, see 3.2.2 X

No Aging R, see 3.2.2 X X X X

No Aging Prod. Type X

Applicable Tests A B A B A B

B C B C B C

D D D D D D

E E E

*See Paragraph 1.8**Default Coating Rating

Table 1 Test Method Selection

Test Method Applies to Surface Features Plated Through-holes

Tests with Established Accept/RejectCriteria

A—Edge Dip Test X NA

B—Rotary Dip Test X (Solder Source Side Only) X

C—Solder Float Test X (Solder Source Side Only) X

D—Wave Solder Test X (Solder Source Side Only) X

Test without Established Accept/RejectCriteria

E—Wetting Balance Test X NA

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should consider the final soldering process so thatresults of the test will best represent that process.

1.7 Test Specimen Requirements The test specimenshall be a representative coupon, a portion of the prinwiring board being tested, or a whole board if within sizlimits, such that an immersion depth defined in the indvidual method is possible. The test specimen shall be rresentative of the lot being tested. When this test specimis to be used as a criterion for material acceptance,number of test specimens shall be defined by agreembetween the user and vendor. Test coupons that mayused for rigid board surface solderability and platethrough-hole solderability are detailed in the paragraph stions under the individual test methods. Similar coupomay be used provided they reflect the board circuitry, hoand construction, and have been processed in conjuncwith the printed board being evaluated.

Unless otherwise specified, the land associated withplated through-hole shall be considered part of the plathrough-hole if it is used for through-hole attachment.this case, only tests for hole solderability apply. If the lanis used for surface attachment of parts, then such lashall be tested for both hole and surface solderability.

1.8 Coating Durability The user shall specify to the vendor, as part of the purchase or ordering agreement,

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required coating durability. The following are guidelinesfor determining the needed level of coating durability; noproduct performance classes. Accelerated aging and soldability testing shall be performed per Table 2.

Category 1—Minimum Coating DurabilityIntended for boards which will be soldered within 30 dayfrom the time of manufacture and are likely to experiencminimum thermal exposures.

Category 2—Average Coating DurabilityIntended for boards likely to experience storage up tomonths from the time of manufacture and moderate themal or solder exposures.

Category 3—Maximum Coating DurabilityIntended for boards likely to experience long storage (ov6 months) from the time of manufacture, severe thermalsolder processing steps, etc. It should be recognized ththere may be a cost premium or delivery delay associatwith boards ordered to this durability level.

1.9 Limitation This standard shall not be construed asproduction soldering or tinning procedure for preparing osoldering of printed wiring boards or assemblies.

2.0 APPLICABLE DOCUMENTS

The following documents of the issue currently in effecform a part of this standard to the extent specified herei

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2.1 Industry

2.1.1 IPC1

IPC-T-50 Terms and Definitions

IPC-CS-70 Guidelines for Chemical Handling Safety inPrinted Board Manufacturing

IPC-SF-818 General Requirements for Electronic Soldering Fluxes

2.2 Government2

2.2.1 Federal

QQ-S-571 Solder, Tin Alloy, Lead Tin Alloy, and LeadAlloy

3.0 REQUIREMENTS

3.1 Terms and Definitions The definition of terms shallbe in accordance with IPC-T-50. Terms that have berepeated from IPC-T-50 for convenience are indicatedan asterisk (*).

Contact Angle, Soldering*The angle of a solder fillet thatis enclosed between a plane that is tangent to the soldbasis-metal surface and a plane that is tangent to the soldair interface (see Figure 1).

3.2 Materials

3.2.1 Solder The solder shall be composition Sn60 oSn63 of QQ-S-571. Other alloys may be used upon agrement between user and vendor. The composition of the sder, including contamination levels during testing, shall bmaintained per Table 3 (see section 3.5.2).

3.2.2 Flux A non-activated rosin flux having a nominacomposition of 25% by weight water white gum rosin, typLR3CN per IPC-SF-818, in a solvent of 99% isopropyalcohol shall be used. The specific gravity shall be 0.84±0.005 at 25°C [77°F]. Other fluxes may be used for so

IPC-003-1

Figure 1 Contact angle

1. Institute for Interconnecting and Packaging Electronic Circuits, 2215 Sanders R2. Standardization Documents Order Desk, Building 4D, 700 Robbins Avenue, Ph

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derability testing only upon agreement between user avendor on flux selection (see paragraphs 6.8 & 6.9).

3.2.2.1 Flux Storage Caution should be taken in the storage of fluxes used for solderability testing in order to maitain the solids content per paragraph 3.2.2 and to avcontamination.

3.2.3 Flux Removal Material Material used for cleaningprinted boards prior to solderability evaluations shall bcapable of removing visible flux residues.

3.3 Equipment The following equipment applies to almethods. Equipment that is specific to any of the five sderability test methods is described in the Section 4 pagraphs detailing the method.

3.3.1 Steam Aging Apparatus Specimens to be steamaged shall be exposed to the saturated steam in a contaconstructed from borosilicate glass or stainless steel. Tspecimen holder shall be non-metallic and non-reactwith moisture to prevent galvanic corrosion or holder deradation. The container may be insulated but it should haa heat loss sufficient to allow continuous boiling of thwater. The steam temperature at the aging level shallmaintained per the requirements of Table 4.

A safe means to prevent excessive pressure and a meamaintaining adequate water level shall be provided. Neithshall cause the vapor to cool below the specified tempeture. Condensate shall drip freely back to the water. C

Table 3 Maximum Limits of Solder Bath Contaminant

Contaminant 1Maximum ContaminantWeight Percentage Limit 2

Copper 0.300

Gold 0.200

Cadmium 0.005

Zinc 0 .005

Aluminum 0.006

Antimony 0.500

Iron 0.020

Arsenic 0. 030

Bismuth 0.250

Silver 0.100

Nickel 0.010

Notes:1. The tin content of the solder shall be maintained within ±1%

of the nominal alloy being used. Tin content shall be testedat the same frequency as testing for copper/goldcontamination. The balance of the bath shall be lead and/orthe items listed above.

2. The total of copper, gold, cadmium, zinc, and aluminumcontaminants shall not exceed 0.4%.

oad, Northbrook, IL 60062-6135iladelphia, PA 19111-5094, (215) 697-2667 or 2179

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should be taken to minimize contact between the condesate and the specimens.

3.3.2 Solder Pot/Bath A thermostatically controlledstatic solder bath shall be used of adequate dimensionsaccommodate the specimens and containing enough solto maintain the temperature during testing within the specfied temperature limits (paragraph 3.5.1) and to prevenexceeding the contamination levels (paragraph 3.5.2). Thexception to this is test method D which uses a wave soder system.

3.3.3 Optical Inspection Equipment Inspection is gener-ally by the unaided eye (corrected vision glasses permittebut on occasion either a direct or projection lens systemwith a maximum of 10X magnification may be used.

3.3.4 Dipping Equipment Solder dipping devices shallbe mechanical/electromechanical and capable of controling the immersion/emersion rates, dwell time and immersion depth as specified in Sections 4.2 to 4.3.

3.3.5 Timing Equipment Timing equipment shall beautomated, where applicable, and accurate to the limitsthe test method.

3.4 Preparation for Testing

3.4.1 Specimen Preparation and Conditioning ForTest The printed boards in the ‘‘as-received’’ conditionshall be prepared for testing in accordance with the usspecified conditioning of paragraph 3.4.2. Care shall bexercised to prevent contamination (by grease, perspirtion, etc.) of the surface to be tested. When other pretreament is agreed upon between user and vendor, the pretrements in paragraph 3.4.1.1 may be used.

3.4.1.1 Pretreatments When agreed upon between userand vendor, the specimen to be tested may undergo othtypes of pretreatments such as degreasing, aqueous cleing, copper and solder brightening, or baking.

Table 4 Steam Temperature Requirements

AltitudeAverage Local BP

°C [F]

SteamTemperatureLimits °C [F]

0–305 m[0–1000 ft]

100 [212] 93 ±3 [200±5]

305–610 m[1000–2000 ft]

99 [210] 92 ±3 [198 ±5]

610–914 m[2000–3000 ft]

98 [208] 91 ±3 [196 ±5]

914–1219 m[3000–4000 ft]

97 [207] 90 ±3 [194 ±5]

1219–1524 m[4000–5000 ft]

96 [205] 89 ±3 [192 ±5]

1524–1829 m[5000–6000 ft]

95 [203] 88 ±3 [190 ±5]

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The prescribed pretreatments should reproduce actual prcessing of the printed wiring boards up to the time oassembly soldering. (See paragraph 6.6). If steam agingperformed, prebaking is not recommended.

3.4.2 Steam Aging The aging is intended for tin and tin/lead coatings only. All specimens identified as requiringsteam aging shall be subjected to accelerated aging priorsolderability testing, by exposure of the surfaces to btested to steam in the equipment specified in paragrap3.3.1, immediately followed by a bake per paragraph 3.4.3The specimens shall be suspended so that no portion of tspecimen is less than 38.0 mm [1.5 in] above the boilindistilled or deionized water. The specimens shall bexposed to steam per Table 4 for 8 hours ±15 minutes. Thnon-metallic holders shall support the specimens betweevertical to 45° angle during exposure. If water must beadded to maintain the level required, add hot water gradually, in small quantities, such that boiling does not ceasand temperature remains essentially constant. Care shalltaken to not exceed the capacity of the aging equipmenExcessive or improper loading will cause condensation ovapor on the surface of the specimens.

3.4.3 Baking Immediately after steam aging and prior tosolderability testing, all boards shall be baked at 105 ±5°C[221 ±9°F] for 1 +1/–0 hours to remove surface moistureand other volatiles. Test specimens shall be cooled to rootemperature prior to fluxing and testing.

3.5 Solder Bath Requirements

3.5.1 Solder Temperatures The bulk temperature of thesolder bath shall be maintained at 245 ±5°C [473 ±9°Funless another temperature is agreed to by vendor and us

3.5.2 Solder Contamination Control The solder in sol-der baths used for solderability testing shall be chemicallor spectrographically analyzed or replaced each 30 operaing days as a minimum. An operating day consists of an8 hour period, or any portion thereof, during which the solder is liquefied and used. The levels of contamination anSn content must be within those shown in Table 3. Thinterval between analysis may be lengthened if the teresults, documented to the user’s satisfaction, indicate ththe contamination limits are not being approached.

If contamination exceeds the limits specified in Table 3then the solder shall be changed and the intervals betweanalysis shall be shortened.

4.0 TEST PROCEDURES

4.1 Test Procedure Limitations The test procedures ofthis specification are applicable to most printed board constructions typical of the industry. It is recognized that thick

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printed wiring boards will not act the same as thin printewiring boards due to their increased thermal mass, aspratio, number of ground planes and weight of the soldcolumn within the hole. These factors greatly reduce tlikelihood that all holes will display completely wettedknees with top side caps.

The test procedures of this specification shall be followeIf it is demonstrated to the user’s satisfaction that changare necessary due to the physical characteristics of a spmen and not the solderability of the specimen surfacenew procedure shall be documented and used only forapplicable specimen. Changes in test procedures and(see paragraph 3.2.2) shall take into account the wetttime and flux issues of paragraphs 6.2, 6.8, and 6.9.

4.1.1 Application of Flux The test specimens are to bdipped in the flux to the full depth to be soldered for 5–1seconds. The flux shall be maintained at the prescribcomposition defined in paragraph 3.2.2. After withdrawfrom the flux, the specimen shall be allowed to drain vetically for a maximum of 60 seconds. For rotary dip ansolder float tests excess flux may be removed by blottithe surface to be tested. The solderability test shall thenperformed not less than one minute, and not more than fminutes, after blotting.

4.2 Tests with Established Accept/Reject Criterion

4.2.1 Test A—Edge Dip Test This test is for edge diptesting of surface conductors and attachment lands.

4.2.1.1 Apparatus

4.2.1.1.1 Solder Pot/Bath A solder vessel that meets therequirements of 3.3.2 shall be used. The solder shall mthe requirements of 3.2.1. Solder bath temperaturessolder contamination control shall be in accordance w3.5.1 and 3.5.2.

4.2.1.1.2 Dipping Device A dipping device as shown inFigure 2 shall be used. A similar device may be used pviding: the rate of immersion, dwell time, and rate of withdrawal are within the test limits; perpendicularity of boarand solder surface are maintained; wobble, vibration, aother extraneous movements are eliminated.

4.2.1.2 Test Specimen The test specimen shall be a representative portion of the board, or a full board, whichevis smaller, not to exceed 50.8 x 50.8 mm [2.0 x 2.0 in]a coupon that is representative of the common board ftures. Figures 3a and 3b are suggested coupon styles.

4.2.1.3 Preparation Specimen preparation shall be inaccordance with 3.4.

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4.2.1.4 Procedure

4.2.1.4.1 Dross and burned/residual flux shall be completely removed from the surface of the molten soldimmediately prior to dipping.

4.2.1.4.2 After fluxing and draining per paragraph 4.1the specimen shall be immersed into the molten soldedgewise to a depth of 25.0 ±2.0 mm [1.0 ±0.08 in]. Thdwell time in the molten solder shall be 3.0 ±0.3 secondminimum. Immersion and emersion rates shall be 25.0 ±mm [1.0 ±0.08 in] per second.

4.2.1.4.3 After withdrawal, the solder shall be allowed tsolidify by air cooling while the board is maintained invertical position.

4.2.1.4.4 Prior to examination, all specimens shall havthe flux removed using a cleaning agent in accordance wparagraph 3.2.3.

4.2.1.5 Evaluation

4.2.1.5.1 Magnification Visual inspection shall be withthe unaided eye, corrected to 20/20. Lighting shall be suable for proper inspection. To aid the evaluation of bordeline cases, or when vendor and user agree that more ccal viewing conditions are appropriate, the set up describin paragraph 3.3.3 is recommended.

4.2.1.5.2 Surface Evaluation

4.2.1.5.2.1 Accept/Reject Criterion A minimum of95% of each of the surfaces being tested shall exhibit gowetting. The balance of the surface may contain only smpin holes, dewetted areas, and rough spots provided sdefects are not concentrated in one area. For less critapplications, a smaller percent coverage may be demined between vendor and user. There shall be no nwetting or exposed base metal within the evaluated a(see paragraph 6.10). An area of 3.2 mm [0.125 in] widfrom the bottom edge of each test specimen shall notevaluated. Areas contacted by fixtures shall not be evaated.

4.2.2 Test B—Rotary Dip Test This test is for rotary diptesting of plated through-holes, surface conductors aattachment lands.

4.2.2.1 Apparatus A device shall be used to move thtest specimen in a circular path so that the flat surfacethe specimen will contact the solder at a constant spewithout stopping. The distance between the center of rotion and the center of the test specimen shall be 100.0 ±

5


IPC-003-2

Figure 2 Edge dip solderability test

Component Carrier

FluxStation

SolderStation

245°C [473°F]± 5°

Stop

Start

▼

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mm [4.0 ±0.2 in]. An example of a specimen holdershown in Figure 4.

4.2.2.1.1 Those parts of the holder including the retaininspring (if fitted) which come into contact with the specmen and/or the solder should have low thermal capaand conductivity.

4.2.2.1.2 The time of contact between any point of thtest face of the specimen and the molten solder shalldetermined by a timer activated by the electrical contacthe sensor with the molten solder. The tip of the senshall be located adjacent to the specimen and it shall bethe same axis and radius of rotation as the center of theface of the specimen. The sensor shall be kept cleanshall be electrically insulated from the specimen holdwhich carries it.

4.2.2.1.3 A strip of 50.0 mm [2.0 in] wide polytetrafluo-roethylene (PTFE) or equivalent shall precede the tspecimen in the test cycle in order to remove oxide or flresidue from the solder surface immediately beforespecimen is introduced.

4.2.2.2 Test Specimen The specimen shall be in accodance with paragraph 1.7. The test specimen shall eithea full board, a section of a board, or a suggested cou

6

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ben

(see Figures 3a and 3b). The specimen shall be of suchwidth as to allow 13.0 mm [0.5 in] clearance from the solder pot sides. If plated through-holes are to be tested, ththe minimum number of holes to be tested is 30 per test loThe minimum number of terminations (plated throughholes or attachment lands) per test specimen shall be sThe test specimen shall be representative of the product

The exposed length of specimen test face in the directioof travel shall be 25.0 ±5.0 mm [1.0 ±0.2 in].


4.2.2.4 Procedure

4.2.2.4.1 Dross and burned/residual flux shall be completely removed from the surface of the molten soldeimmediately prior to dipping.

4.2.2.4.2 After fluxing and draining, per paragraph 4.1,mount the specimen to be tested in the test equipmespecimen holder.

4.2.2.4.3 Adjust the test equipment to immerse the specmen 0.75–1.0 mm [0.03–0.04 in] into the solder unlesotherwise specified. Activate the test equipment to expothe specimen to solder. After the specimen has cleared


IPC-003-3a

Figure 3a Suggested test specimen—for plated through-holes

▼

▼

▼

27.5[1.10]

22.5{0.90]

7.5[0.30]

2.5 [0.10]

40 Plated-through Holes 0.8 ±0.013 [0.032 ± 0.005]

Land Size 1.5 [0.060]

▼

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solder bath, allow all the solder to solidify in the positionin which the machine stops before removing from thspecimen holder. Care must be taken so that solder donot flow over the upper face of the specimen. This may bimpacted by the width of the specimen.

4.2.2.4.4 Dwell time at the maximum depth shall be 3.0±0.5 seconds, minimum.

4.2.2.4.5 Prior to examination, all specimens shall havethe flux removed using a cleaning agent in accordance wiparagraph 3.2.3.

4.2.2.5 Evaluation

4.2.2.5.1 Magnification Visual inspection shall be withthe unaided eye, corrected to 20/20. Lighting shall be suable for proper inspection. To aid the evaluation of bordeline cases, or when vendor and user agree that more crcal viewing conditions are appropriate, the set up describin paragraph 3.3.3 is recommended.


4.2.2.5.2.1 Incoming Acceptance An area of 3.2 mm[0.125 in] width from the trailing edge of each test specimen shall not be evaluated. Areas contacted by fixturshall not be evaluated.

4.2.2.5.2.2 Accept/Reject Criterion A minimum of95% of each of the surfaces being tested shall exhibit goowetting. The balance of the surface may contain only smapin holes, dewetted areas, and rough spots provided su

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defects are not concentrated in one area. For less critiapplications, a smaller percent coverage may be detmined between vendor and user. There shall be no nowetting or exposed base metal within the evaluated ar(see paragraph 6.10).

4.2.2.5.3 Plated Through-hole Evaluation

4.2.2.5.3.1 Incoming Acceptance Only plated holes thatare at least 5.0 mm [0.2 in] from any surface or fixturingstructure supporting the specimen during the test will bevaluated. An area of 3.2 mm [0.125 in] width from thetrailing edge of each test specimen shall not be evaluateAreas contacted by fixtures shall not be evaluated.

4.2.2.5.3.2 Accept/Reject Criterion—Class 1 and 2Product Solder shall fully wet the wall area of the platedthrough-holes, and plug holes less than 1.5 mm [0.06 idiameter (complete filling is not necessary).

4.2.2.5.3.3 Accept/Reject Criterion—Class 3 ProductThe specimen has soldered successfully if solder has risin all plated holes. The solder shall have fully wetted thwalls of the hole. There shall be no non-wetting or exposebase metal on any plated through-hole.

Accept/reject criterion for boards


IPC-003-3b

Figure 3b Suggested test specimen—for surface mount features

32.0mm [1.275"]

25.4mm [1.00"]

2.5mm [0.10"]

7.0mm[0.275"]

2.5mm [0.10"]

12.5mm[0.50"]

6.0mm[0.350"]

2 Pl.

1.9mm[0.075"]

2 PL

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through-hole and wetting over the knee of the hole and oonto the land area around the top of the hole.

4.2.3 Test C—Solder Float Test This test is for solderfloat testing of plated through-holes, surface conductoand attachment lands.

4.2.3.1 Apparatus

4.2.3.1.1 Solder Pot The solder pot shall meet therequirements of paragraph 3.3.2. In addition, the surfa

IPC-003-4

Figure 4 Rotary dip test

1) Dwell timer set at 3.0 ± .5 seconds2) Adjustable speed control on 100.0mm [4.0"] R on solder station

3) Dwell at end of 100.0mm [4.0"] radius swing to allow solder to solidify

Solder245°C [473°F]

± 5°

Coupon

DrossWiper

▼

▼

8

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area of the pot shall be great enough to float the test spemen without it touching the sides of the pot.

4.2.3.1.2 Specimen Handling Tool Stainless steel for-ceps, or other specially designed tools of stainless steshall be used to handle the specimen only by the edges

4.2.3.2 Test Specimen The test specimen shall be inaccordance with paragraph 1.7. The test specimen shalla portion of the printed board not greater than 50.0 x 50mm [2.0 x 2.0 in], the suggested coupon, or the compleboard if it is smaller than this size. The minimum numbeof holes to be tested is 30 per test lot. If there are notleast 30 holes in the test specimen, additional specimeshall be tested until at least 30 holes have been tested. (SFigure 3a—Through-hole coupon).


4.2.3.4 Procedure

4.2.3.4.1 Dross and burned/residual flux shall be completely removed from the surface of the molten soldeimmediately prior to floating.

4.2.3.4.2 After fluxing and draining per paragraph 4.1,slide the coupon gently on molten solder. Allow coupon tfloat on solder for 5 seconds maximum. The coupon mabe depressed into the solder bath to a maximum of 50%the coupon thickness after it has been initially floated othe solder bath (extreme care must be taken with boar


Figure 5 Effectiveness of solder wetting of plated-through holes–Class 3

IPC-003-5-a IPC-003-5-c

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that are less than 0.8 mm [0.032 in] thick). After thelapsed time, slide the coupon off molten solder. Hold copon still and horizontal until solder solidifies.


4.2.3.5 Evaluation

4.2.3.5.1 Magnification Visual inspection shall be withthe unaided eye, corrected to 20/20. Lighting shall be suable for proper inspection. To aid the evaluation of bordeline cases, or when vendor and user agree that more ccal viewing conditions are appropriate, the set up describin paragraph 3.3.3 is recommended.


4.2.3.5.2.1 Incoming Acceptance An area of 3.2 mm[0.125 in] width from the trailing edge of each test specmen shall not be evaluated. Areas contacted by fixtushall not be evaluated.

4.2.3.5.2.2 Accept/Reject Criterion A minimum of95% of each of the surfaces being tested shall exhibit gowetting. The balance of the surface may contain only smpin holes, dewetted areas, and rough spots provided sdefects are not concentrated in one area. For less critapplications, a smaller percent coverage may be demined between vendor and user. There shall be no nwetting or exposed base metal within the evaluated a(see paragraph 6.10). An area of 3.2 mm [0.125 in] widfrom the trailing edge of each test specimen shall notevaluated. Areas contacted by fixtures shall not be evaated.

4.2.3.5.2.3 Plated Through-hole Evaluation

4.2.3.5.2.3.1 Incoming Acceptance Only plated holesthat are at least 5.0 mm [0.2 in] from any surface or fixtuing structure supporting the specimen during the test wbe evaluated.

4.2.3.5.2.3.2 Accept/Reject Criterion—Class 1 and 2

Product Solder shall fully wet the wall area of the platethrough-holes, and plug holes less than 1.5 mm [0.06diameter (complete filling is not necessary).

4.2.3.5.2.3.3 Accept/Reject Criterion—Class 3 Prod-

uct The specimen has soldered successfully if solder hrisen in all plated holes. The solder shall have fully wettethe walls of the hole. There shall be no non-wettingexposed base metal on any plated through-hole.

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4.2.4.5.2.1 Incoming Acceptance An area of 3.2 mm[0.125 in] width from the trailing edge of each test specmen shall not be evaluated. Areas contacted by fixturshall not be evaluated.

4.2.4.5.2.2 Accept/Reject Criterion A minimum of95% of each of the surfaces being tested shall exhibit gowetting. The balance of the surface may contain only smpin holes, dewetted areas, and rough spots provided sdefects are not concentrated in one area. For less critiapplications, a smaller percent coverage may be detmined between vendor and user. There shall be no nowetting or exposed base metal within the evaluated ar(see paragraph 6.10). An area of 3.2 mm [0.125 in] widfrom the trailing edge of each test specimen shall notevaluated. Areas contacted by fixtures shall not be evaated.

4.2.4.5.3 Plated Through-hole Evaluation

4.2.4.5.3.1 Incoming Acceptance Only plated holes thatare at least 5.0 mm [0.2 in] from any surface or fixturinstructure supporting the specimen during the test will bevaluated.

4.2.4.5.3.2 Accept/Reject Criterion—Class 1 and 2

Product Solder shall fully wet the wall area of the platedthrough-holes, and plug holes less than 1.5 mm [0.06 idiameter (complete filling is not necessary).

4.2.4.5.3.3 Accept/Reject Criterion—Class 3 Product

The specimen has soldered successfully if solder has risin all plated holes. The solder shall have fully wetted thwalls of the hole. There shall be no non-wetting or exposebase metal on any plated through-hole.



IPC-003-6

Figure 6 Wetting balance apparatus

▼

▼ ChartRecorder

SignalConditioner

Controls

SolderBath

Heater

Clamp

CopperCoupon

RelativeMotion

LVDT(Transducer)

▼

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4.3.1.5 Evaluation

4.3.1.5.1 Magnification Visual inspection shall be withthe unaided eye, corrected to 20/20. Lighting shall be suable for proper inspection. To aid the evaluation of bordeline cases, or when vendor and user agree that more ccal viewing con-ditions are appropriate, the set udescribed in paragraph 3.3.3 is recommended.

4.3.1.5.2 Acceptance Using the coupon specified inparagraph 4.3.1.2, the acceptable solderability shalldefined as those specimens which exhibit the following:

• A wetting time for the wetting curve to cross the corected zero axis after the start of the test (see Figureless than the maximum wetting time as described in Fure 7a (see paragraph 6.2).

• A maximum wetting force taken after correction fobuoyancy (see Figure 8 and paragraph 6.3) greater tthe minimum acceptable force shown in Figure 7b.

• Dewetting less than 5% of the wettable surface arwhich had been immersed in solder during test.

5.0 EVALUATION AIDS

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5.1 Evaluation Aids—Surface As an aid to evaluation ofthe test results, see Figure 9. This aid is to be used primrily to illustrate types of defects rather than percentagearea covered.

5.2 Evaluation Aids—For Class 3 Plated Through-holes Profile views of acceptable conditions are presentin Figure 5 for aid in visualizing all the common conditions. The following are also acceptable conditions for spcific cases.

5.2.1 Solderability acceptance for plated through-holewith aspect ratios greater than 5:1 (board thickness:hdiameter) shall be agreed to between user and vendor.

5.2.2 Depressed fillets in holes are acceptable underfollowing condition: the solder in partially filled holes musexhibit a contact angle less than 90° relative to the howall (see Figure 5).

5.2.3 All holes less than 1.5 mm [0.06 in] diameter sharetain a solder plug after solidification. Holes greater th1.5 mm [0.06 in] shall not be rejected for failure to retaia full solder plug provided that the entire barrel of the hoand the surface of the top land have been wetted with sder (see Figure 5).

6.0 NOTES


IPC-003-7a

Figure 7a Wetting time acceptance criteria

IPC-003-7b

Figure 7b Wetting force acceptance criteria

Total Coupon Thickness (mils)

Wetting Time Acceptance CriteriaPWB Wetting Balance Coupons

4.50

4.00

3.50

3.00

2.50

2.00

1.50

1.0030 40 60 80 100 120

Wet

tin

g T

ime

(sec

)W

etti

ng

For

ce (

N

/mm

)

Wetting Force Acceptance CriteriaPWB Wetting Balance Coupons

400

300

200

100

0

-100

-200

-25030 40 60 80 100 120

µ

Total Coupon Thickness (mils)

13


IPC-003-8

Figure 8 Wetting balance curve

TIME▼

FO

RC

E (

µN

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0 ▼ ▼

▼Instrument Zero

Corrected Zero

Fmax

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6.1 Test Equipment Sources The equipment sourcedescribed below represent those currently known toindustry. Users of this document are urged to submit adtional source names as they become available, so thatlist can be kept as current as possible.

6.1.1 Edge Dip Solderability Test Apparatus HMP/Soldermatics, P.O. Box 948, Canon City, CO 81215, (71275-1531.

Multicore Solders, Cantiague Rock Road, Westbury, N11590, (516) 334-7997.

Robotic Process Systems, 4420 Shopping Lane, Simi Vley, CA 93063, (805) 583-5805.

Williams Machine, 2092 W. Main St., Norristown, PA19403, (215) 539-1123.

6.1.2 Rotary Dip Test Apparatus Robotic Process Systems, 4420 Shopping Lane, Simi Valley, CA 93063, (80583-5805.

6.1.3 Wetting Balance Test Apparatus Convey AT3,Harpsundsv 113, 12440 Baudhalen, Sweden

14

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G.E.C., Hirst Research Centre, U.K.

Hollis Automation Inc., 15 Charron Avenue, Nashua, NH03063, (603) 889-1121.

Kester Solder, 515 E. Touhy Ave., Des Plaines, IL 6001(708) 286-1600.

Metronelec, 67 Boulevard National 92500 Rueil Malmaison, France (USA Distributor-Paradigm Electronics,Crown Ridge Rd., Westborough, MA 01581, (508) 8700091.)

Multicore Solders, Cantiague Rock Road, Westbury, N11590, (516) 334-7997.

6.1.4 Steam Aging Equipment

Express Test Corporation, 977 Benecia Avenue, SunnyvaCA 94086, (805) 583-5805.

Mark X Systems, 30872 Huntwood Ave., Unit 2, HaywardCA 94544, (415) 487-1345.

MountainGate Engineering, 540 Division Street, CampbeCA 95008, (408) 866-5100.

Robotic Process Systems, 4420 Shopping Lane, Simi Vley, CA 93063, (805) 583-5805.


IPC-003-9

Figure 9 Aid to evaluation

PreferredWetting

Small Amountof Dewetting

CompleteDewetting Nonwetting

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Zentek Scientific Systems, 3520 Yale Way, Fremont, C94538, (415) 651-1581.

Additional drawings are available from IPC.

6.2 Wetting Times (See paragraph 4.3.1.5.2) Figureshows that as the board thickness and/or thermal mincreases, the maximum acceptable wetting time aincreases as demonstrated for the wetting balance testthe board heat capacity increases, the time to bringsample up to soldering temperature increases. This effecdue to the low thermal conductivity of PWB laminatmaterials. Acceptance criteria for boards with high hecapacity shall be agreed upon by user and vendor.

6.3 Correction for Buoyancy For the wetting balance toobtain wetting force values that are relatable to oanother, it is necessary to correct for the variabilityspecimen sizes, in particular width and thickness. Thisdone by correcting for the volume of the sample immersin the solder. The following formula may be used to calclate the buoyant force correction:

Fb = ρ gVWhere:

ρ= Density of solder @245°C (8.15g/cm3)*g= Acceleration of gravity (9810 mm/s2)V= Immersed volume of coupon (cm3)= width x thickness x immersion depth

*For Sn60/Pb40 Alloy

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When the buoyancy force is calculated, it should be usto correct the zero axis. This correction is requiredobtain both the proper measurement of wetting times,well as wetting forces. All measurements of wetting timand wetting forces must be made from the corrected zaxis. In the case of an upright curve, the new corrected zaxis will be below the instrument zero.

6.4 Preheat If the board specimen or coupon does npass the standard solderability test then a uniform prehof a second specimen may be used to determine if desconstruction has impacted the solderability test (i.e., a thboard with heavy internal ground planes). If this referspecimen passes, then testing with preheat shall bemethod of choice for future testing of specimens havithat design/construction.

6.5 Baking/Testing Time Delay The time between bak-ing and solderability testing should be kept to a minimuin order to prevent re-absorption of water vapor into thlaminate structure. The actual time is dependent upambient temperature and humidity levels.

6.6 Prebaking The occurrence of outgassing, which maresult in blowholes, measling, blisters or delamination, mbe reduced by baking the printed board prior to solderito eliminate moisture or solvents. Other factors, suchconveyor speed (for wave solder testing), solder tempeture, contamination content, etc., may also be involved

15

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producing defects and, therefore, should be analyzedproblems occur. Specimens should be baked in a suitaoven to remove any absorbed moisture. Time between baand testing should not exceed 24 hours. Temperature atime of baking is to be determined on an individual basi

Printed boards should be prebaked only if prebakingnormally used as a production procedure. Baking shouldkept to a minimum, but at least be equal to the productioprocedure, to prevent excessive oxidation and intermetalgrowth.

6.7 Safety Note Isopropyl alcohol used in paragraph3.2.2 is flammable. Care must be taken in both usage astorage to keep the isopropyl alcohol from sparks oflames. See the Material Safety Data Sheets (MSDS) forsolvents. All chemicals shall be handled per appropriadata sheets, and disposed of per local regulations. Also sIPC-CS-70.

6.8 Use of Non-Activated Flux Non-activated, pure rosinfluxes are specified for solderability testing for two mainreasons. These are to provide maximum sensitivity durinthe test and to provide a consistent base flux for testinActivated rosin materials have different performance chaacteristics both within a manufacturer and between man

16

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.

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facturers. Therefore, they do not provide as stable a bmaterial as do the non-activated rosin materials for tespurposes.

6.9 Other Fluxes In certain cases it may be necessaryuse other than a Type R flux. It must be rememberedwithin other generic types, different formulations may gidifferent results. Therefore, it is important that if testingbeing done at both vendor and user locations, the samemulation be used by both.

6.10 Solder Contact The solder applied during the soderability test must contact a feature in order for that feture to be considered for evaluation. Small features srounded by a thick solder mask are one type which cprevent solder contact.

6.11 Steam Aging Steam aging of the test specimeprior to solderability testing provides an indication of thdurability of the solderable coating. This durability may bneeded to withstand inventory storage and/or sevesequential soldering operations. All PWB fabrication prcesses may not be capable of providing a high durabsolderable finish, in which case a minimum requirememust be specified.

Standard Improvement Form J-STD-003The purpose of this form is to provide theTechnical Committee of IPC with inputfrom the industry regarding usage ofthe subject standard.

Individuals or companies are invited tosubmit comments to IPC. All commentswill be collected and dispersed to theappropriate committee(s).

If you can provide input, please completethis form and return to:IPC2215 Sanders RoadNorthbrook, IL 60062-6135Fax 847 509.9798

1. I recommend changes to the following:

Requirement, paragraph number

Test Method number , paragraph number

The referenced paragraph number has proven to be:

Unclear Too Rigid In Error

Other

2. Recommendations for correction:

3. Other suggestions for document improvement:

Submitted by:

Name Telephone

Company

Address

City/State/Zip Date

Technical QuestionsThe IPC staff will research your technical question and attempt to find an appropriate specification interpretation ortechnica

tel 847/5http://ww

IPC TeIPC techOver 2,5provided

TechNeTechNetinquiries

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[email protected] is for discussion of flip chip and related chip scale sred by the National Electronics Manufacturing Initiative (N

[email protected] forum covers environmental, safety and related reg

[email protected] Council forum covers information on upcoming IPC De, and feedback on current design issues,local chapter mee

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IPC World Wide Web Page http://www.ipc.orgOur home page provides access to information about upcoming events, publications and videos, membership, andindustry activities and services. Visit soon and often.

at ng B me workshop

ss

i

R

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g,

rS he PWBng available to

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ibition in North America devoted to the PWB industry. Over 90hnical conference.

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arch 16-18, 1999ong Beach, California

Education and TrainingIPC conducts local educational workshops and ntechnologies. National conferences have coveredtopics include:

Printed Wiring Board FundamentalsTroubleshooting the PWB Manufacturing ProceChoosing the Right Base Material LaminateAcceptability of Printed BoardsNew Design Standards

IPC video tapes and CD-ROMs can increase your

For more information on programs, contact Johntel 847/509-9700 ext. 308 fax 847/509-9798e-mail: [email protected] http://www.ipc.or

For more information on IPC Video/CD Trainintel 505/758-7937 ext. 202 fax 505/758-7938e-mail: [email protected]://www.ipc.org

Training and CertificationIPC-A-610 Training and Certification Prog“The Acceptability of Electronic Assemblies” (ANassembly industry. An industry consensus Trainiyour company.

For more information, contact John Rileytel 847/509-9700 ext. 308 fax 847/509-9798e-mail: [email protected] http://www.ipc.or

IPC Printed Circuits ExpoIPC Printed Circuits Expo is the largest trade exhtechnical presentations make up this superior tec

For more information, contact Kim Behrtel 847/509-9700 ext. 319 fax 847/509-9798e-mail: [email protected] http://www.ipc.or

ML

April 28-30, 1998Long Beach, California

How to Get InvolvedThe first step is to join IPC. An application for memOnce you become a member, the opportunities to andlearn from our industry’s best while you help deveprograms which forecast the future of our industrySenators for better industry support. Pick from a wconferences. More up-to-date details on IPC oppo

For information on how to get involved, contact:Jeanette Ferdman, Membership Managertel 847/509-9700 ext. 309 fax 847/509-9798e-mail: [email protected] http://www.

ional conferences to help you better understand emergiall Grid Array and Flip Chip/Chip Scale Packaging. So

High Speed DesignDesign for ManufacturabilityDesign for AssemblyDesigners Certification Preparation

ndustry know-how and on the job effectiveness.

iley

contact Mark Pritchard

amI/IPC-A-610) is the most widely used specification for t and Certification program based on the IPC-A-610 is

/html/610.htm

bership can be found on page 74.enhance your competitiveness are vast. Join a technical committee

lop the standards for our industry. Participate in market research. Participate in Capitol Hill Day and lobby your Congressmen andide variety of educational opportunities: workshops, tutorials, and

rtunities can be found on our web page: http:/www.ipc.org.

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A P P L I C A T I O N F O R S I T E M E M B E R S H I P

Our facility purchases, uses and/or manufactures printed wiring boards or other electronic interconnection products for our ownuse in a final product. Also known as original equipment manufacturers (OEM).

We are representatives of a government agency, university, college, technical institute who are directly concerned with design,research, and utilization of electronic interconnection devices. (Must be a non-profit or not-for-profit organization.)

n One-sided and two-sided rigid printedboards

n Multilayer printed boards

n Flexible printed boardsn Flat cablen Hybrid circuits

n Discrete wiring devicesn Other interconnections

IS YOUR INTEREST IN:

n purchasing/manufacture of printed circuit boards

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What is your company’s main product line? __________________________________________________________________

WHAT PRODUCTS DO YOUMAKE FOR SALE?

n Turnkeyn SMTn Chip Scale Technology

n Through-holen Mixed Technology

n Consignmentn BGA

Our facility assembles printed wiring boards on a contract basis and/or offers other electronic interconnection products for sale.

Our facility supplies raw materials, machinery, equipment or services used in the manufacture or assembly of electronic inter-connection products.

Thank you for your decision to join IPC members on the “Intelligent Path to Competitiveness”! IPC Membership issite specific, which means that IPC member benefits are available to all individuals employed at the site designat-ed on the other side of this application.

To help IPC serve your member site in the most efficient manner possible, please tell us what your facility does bychoosing the most appropriate member category.

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CATEGORY

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INDEPENDENTPRINTED BOARDMANUFACTURERS

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INDEPENDENTPRINTED BOARDASSEMBLERSEMSI COMPANIES

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OEM –MANUFACTURERSOF ANY ENDPRODUCTUSINGPCB/PCASOR CAPTIVEMANUFACTURERSOF PCBS/PCAS

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INDUSTRYSUPPLIERS

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GOVERNMENTAGENCIES/ACADEMICTECHNICALLIAISONS

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PLEASE ATTACH BUSINESS CARDOF OFFICIAL REPRESENTATIVE HERE

Please check one:

❏ $1,000.00 Annual dues for Primary Site Membership (Twelve months of IPC membership begins from the time the applicationand payment are received)

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RETURN TO TOCRETURN TO CONTENTSCONTENTS1.0 SCOPE1.1 Scope1.2 Purpose1.3 Objective1.4 Performance Classes1.5 Method Classification1.5.1 TestswithEstablishedAccept/RejectCriterion1.5.2 Test(s)withoutEstablishedAccept/Reject Criterion

1.6 TestMethodSelection1.7 Test Specimen Requirements1.8 CoatingDurability1.9 Limitation2.0 APPLICABLEDOCUMENTS2.1 Industry2.1.1 IPC

2.2 Government2.2.1 Federal

3.0 REQUIREMENTS3.1 TermsandDefinitions3.2.1 Solder3.2.2 Flux3.2.2.1 FluxStorage

3.2.3 FluxRemovalMaterial

3.3 Equipment3.3.1 Steam Aging Apparatus 3.2 Materials3.3.2 Solder Pot/Bath3.3.3 OpticalInspectionEquipment3.3.5 Timing Equipment

3.4 PreparationforTesting3.4.1 Specimen Preparation and Conditioning For Test3.4.2 SteamAging3.4.3 Baking

3.5 SolderBathRequirements3.5.1 SolderTemperatures 3.3.4 Dipping Equipment3.5.2 SolderContaminationControl

4.0 TESTPROCEDURES 3.4.1.1 Pretreatments 4.1 TestProcedureLimitations4.1.1 Application of Flux

4.2 TestswithEstablishedAccept/RejectCriterion4.2.1 Test A Edge Dip Test4.2.1.1 Apparatus 4.2.1.5.2.1 Accept/Reject Criterion4.2.1.1.1 SolderPot/Bath4.2.1.1.2 DippingDevice

4.2.1.2 TestSpecimen4.2.1.3 Preparation4.2.1.4 Procedure4.2.1.5 Evaluation4.2.1.5.1 Magnification4.2.1.5.2 SurfaceEvaluation

4.2.2 TestB RotaryDipTest4.2.2.1 Apparatus4.2.2.3 Preparation4.2.2.4 Procedure4.2.2.4.3 4.2.2.2 TestSpecimen

4.2.2.5 Evaluation 4.2.2.5.3.2 Accept/Reject Criterion Class 1 and 2 Product 4.2.2.5.1 Magnification4.2.2.5.2 SurfaceEvaluation4.2.2.5.2.1 Incoming Acceptance4.2.2.5.2.2 Accept/Reject Criterion

4.2.2.5.3 PlatedThrough-holeEvaluation 4.2.2.4.44.2.2.5.3.1 IncomingAcceptance4.2.2.5.3.3 Accept/RejectCriterion Class3Product

4.2.3 TestC SolderFloatTest4.2.3.1 Apparatus4.2.3.1.1 Solder Pot4.2.3.1.2 Specimen Handling Tool

4.2.3.2 Test Specimen4.2.3.3 Preparation4.2.3.4 Procedure4.2.3.5 Evaluation4.2.3.5.1 Magnification4.2.3.5.2 SurfaceEvaluation 4.2.4.2 Test Specimen4.2.3.5.2.1 Incoming Acceptance4.2.3.5.2.3 PlatedThrough-holeEvaluation

4.2.4 Test D Wave Solder Test4.2.4.1 Apparatus4.2.4.3 Preparation4.2.4.4 Procedure 4.2.3.5.2.2 Accept/Reject Criterion 4.2.4.4.14.2.4.4.3 4.2.3.5.2.3.1 Incoming Acceptance4.2.4.4.4 4.2.3.5.2.3.2 Accept/Reject Criterion Class 1 and 2

4.2.4.5 Evaluation4.2.4.5.1 Magnification - 4.2.3.5.2.3.3 Accept/Reject Criterion Class 3 Prod uct4.2.4.5.2 SurfaceEvaluation 4.3.1.1 Apparatus4.2.4.5.2.1 Incoming Acceptance

4.2.4.5.3 PlatedThrough-holeEvaluation4.2.4.5.3.1 IncomingAcceptance4.2.4.5.3.2 Accept/Reject Criterion Class 1 and 2

4.3 Test(s)withoutEstablishedAccept/RejectCriterion4.3.1 TestE WettingBalanceTestUNKNOWN4.3.1.1.1 Dipping Device 4.2.4.5.2.2 Accept/Reject Criterion

4.3.1.2 TestSpecimen4.3.1.3 Preparation 4.2.4.5.3.3 Accept/RejectCriterion Class3Product4.3.1.4 ProcedureUNKNOWN4.3.1.4.35.1 EvaluationAids„Surface

4.3.1.5 Evaluation 5.2 Evaluation Aids For Class 3 Plated Through- 4.3.1.5.1 Magnification holes4.3.1.5.2 Acceptance

6.0 NOTES 5.0 EVALUATIONAIDS6.1 Test Equipment Sources6.1.1 Edge Dip Solderability Test Apparatus6.1.2 RotaryDipTestApparatus6.1.3 Wetting Balance Test Apparatus6.1.4 SteamAgingEquipment

6.2 Wetting Times6.3 CorrectionforBuoyancy6.4 Preheat6.5 Baking/TestingTimeDelay6.6 Prebaking6.8 UseofNon-ActivatedFlux6.9 OtherFluxes6.10 SolderContact 6.7 Safety Note6.11 Steam Aging

TABLESTable1 TestMethodSelectionTable2 AcceleratedAgingandTestRequirementsTable3 MaximumLimitsofSolderBathContaminantTable4 SteamTemperatureRequirements

FIGURESFigure1 ContactangleFigure2 EdgedipsolderabilitytestFigure3a Suggestedtestspecimen forplatedthrough-holesFigure3b Suggestedtestspecimen forsurfacemountfeaturesFigure4 RotarydiptestFigure5 Effectivenessofsolderwettingofplated-throughholesÅClass3Figure6 WettingbalanceapparatusFigure7a WettingtimeacceptancecriteriaFigure7b WettingforceacceptancecriteriaFigure8 WettingbalancecurveFigure9 Aidtoevaluation