Analyzing Chips in a System Context

May 2, 2012 1

Analyzing Chips in a System Context

May 2, 2012May 2, 2012Srdjan DjordjevicSrdjan DjordjevicSenior Applications EngineerSenior Applications Engineer

[email protected]

May 2, 2012 2

Why Analyze Chips in a System Context?

Red = Chip Only Blue = Includes System-Level PDS

May 2, 2012 3

Voltage Noise TransferSystem-Level Effects Can Dominate

Chip•High impedance•Localized voltage noise

effects

Package•Low impedance•Global voltage noise effects

Chip Alone Chip with Package

Result:The low-loss power distribution system of the package readily

transfers voltage noise effects to other on-chip circuits.

May 2, 2012 4

Necessity of Fully Considering System-Level Noise

(Example – SSO Simulation)

Oversimplification=

Risk

Needed Accuracy=

Risk Avoided

Simulation assuming ideal power delivery network Simulation with partial power delivery effects

Simulation with all power delivery effects

May 2, 2012 5

Chip-Package Co-Simulation Flow

Chip/Package Co-Simulation: Enabling 2.5D IC (including silicon interposers) and 3D IC projects (including TSVs)with a focus on frequency domain power delivery network (PDN) analysis and EMI analysis.

May 2, 2012 6

Frequency Domain Chip / System Co-Simulation

(BGA / SiP / 2.5D IC / 3D IC)Chip Data:

LEF / DEF … GDS … GUI to .SPDPackage / System Data:

Layout Databases to .SPDCircuit Linkage with MCP

.SPD or models

May 2, 2012 7

Multi-Die / Package Floorplanning

Outputs forPhysical

Implementation

Pack

age

Dat

aLEFDEF

LEFDEF

Die

Dat

a

Verilog

Die pads

Verilog

Die pads

Pad-ringdata

Pad-ringdata

AIF

ASCII pin info

UPD

ASCII net list

Die1

Package

Die2

Die1

Device & Connection Planning

Feasibility(ex: Bump, RDL Wirebond)

Hierarchical data preparation with automated

net mapping

GU

I

May 2, 2012 8

IO Planning and Multi-die Floorplanning(2.5 D with Silicon Interposer)

BGA

SiliconInterposer

Die

PCB

Slice 2Slice 1

DeviceData Source

BGABGA.txt from Cadence APD

Si InterposerCreated on-the-fly

Die Slice 1LEF / OrbitIO IOview

Die Slice 2ASCII data

May 2, 2012 9

Chip-Centric Analysis(pre- & post layout-frequency & time domain)

2D/3D TransientWaveforms

S/Y/ZParameters

SPICENetlist

SPICENetlist

SPICENetlist

Power GridExtraction

Time-DomainCo-simulation

Device ParasiticExtraction

Current ProfileExtraction

Frequency-DomainCo-simulation

Power ModelExtraction(inc. TSV)

PowerPlanner

IO ModelExtraction(inc. RDL)

LEF/DEF GDS GUI

May 2, 2012 10

Frequency DomainChip / System Co-Simulation

Assessment of various decap options.

May 2, 2012 11

On-Chip Decoupling Capacitors Case Example

5nF on-chipdecap inserted No on-chip

decap5nF on-chip

decap

May 2, 2012 12

Frequency Domain EMI Analysis(Chip-Level Input for System-Level Results)

Far Field Radiation

Near Field Radiation

May 2, 2012 13

Enabling Chip/System Power Co-simulation

distributed

lumped

Chip PDN models can:

-Be at a range of abstraction levels from lumped to distributed-Vary from 2-node to N-nodes (N = number of physical pins)-Have 1 to M current sources (M can be larger than N)

board

VRM

1 N

1 M

chip

package

May 2, 2012 14

Model Connections to SupportChip / System Simulation

Interposer (or 3DIC) IO/Power SPICE Model

BGA IBIS, SPICE or S-parameter Model

PCB S-parameter or SPICE Model

Chip(s) IO/PowerSPICE Model

Chip(s) IO/PowerSPICE Model

RLCK Network andTransient Current Sources

Spatially DistributedRLCK Network

XcitePI

XtractIM& PowerSI

OptimizePI &other Sigrity

Analysis Products

inc. RDL in IO modelInc. TSV in power model

May 2, 2012 15

Open Model Connection Protocol

Intelligent and automated model connections to save time and reduce errors.

May 2, 2012 16

Thank YouThank You!!