ALPHA ® POWERBOND ® SOLDER PREFORMS FOR AUTOMOTIVE & POWER SEMICONDUCTOR APPLICATIONS ALPHA ® PowerBond ® is particularly suited for large area and high-CTE mismatch interfaces (baseplate and heat sink) Baseplate Heat Sink DBC Ambient Clip Attach Die Attach Baseplate Attach Heat Sink Attach Conduction Die ALPHA ® PowerBond ® Solder Preforms are based on a family of lead-free, high-reliability alloys with antimony (Sb) content ranging from 5-10%. Antimony addition results in increased strength, thermal fatigue resistance and higher liquidus temperatures, compared to traditional tin/silver/ copper based lead-free systems. In addition, ALPHA ® PowerBond ® Solder Preforms comply with applicable environmental standards, including RoHS for use in products requiring lead-free materials. They are manufactured with 99.99% purity (4N alloy) ensuring highest performance. The preforms can be customized with ALPHA ® TrueHeight ® Preforms technology (for bond- line thickness and tilt control) and pre-coated with ALPHA ® AccuFlux ™ series for difficult-to-solder surfaces. Key Attributes • Lead-Free • High Creep Resistance with High Tensile Strength • Improved Thermal Conductivity (over standard high-Pb and SnSb alloys) • Improved Wetting (compared to standard SnSb alloys) APPLICATIONS
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ALPHA® POWERBOND® SOLDER PREFORMS FOR AUTOMOTIVE & POWER SEMICONDUCTOR APPLICATIONS
ALPHA® PowerBond® is particularly suited for large area and high-CTE mismatch interfaces (baseplate and heat sink)
Baseplate
Heat Sink
DBC
Ambient
Clip Attach
Die Attach
Baseplate Attach
Heat Sink Attach
Conduction
Die
ALPHA® PowerBond® Solder Preforms are based on a family of lead-free, high-reliability alloys with antimony (Sb) content ranging from 5-10%. Antimony addition results in increased strength, thermal fatigue resistance and higher liquidus temperatures, compared to traditional tin/silver/copper based lead-free systems.
In addition, ALPHA® PowerBond® Solder Preforms comply with applicable environmental standards, including RoHS for use in products requiring lead-free materials. They are manufactured with 99.99% purity (4N alloy) ensuring highest performance. The preforms can be customized with ALPHA® TrueHeight® Preforms technology (for bond-line thickness and tilt control) and pre-coated with ALPHA® AccuFlux™ series for difficult-to-solder surfaces.
Key Attributes• Lead-Free
• High Creep Resistance with High Tensile Strength
• Improved Thermal Conductivity (over standard high-Pb and SnSb alloys)
• Improved Wetting (compared to standard SnSb alloys)
APPLICATIONS
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For more information about ALPHA® PowerBond® Preforms, please contact your Alpha Representative.
©2018 AlphaIssued 08/18SM1477
MLF 100 VOIDS SUMMARY CHART
ALPHA® POWERBOND® SOLDER PREFORMS FOR AUTOMOTIVE & POWER SEMICONDUCTOR APPLICATIONS
ALPHA® PowerBond® 2110 Preforms balance high creep resistance of Sn90Sb10 system with high thermal conductivity required for the power semiconductor devices operating at high junction temperatures (150-175°C). The alloy composition has been particularly tailored to enable easy wetting and low voiding.
ALPHA® PowerBond® 2100 Preforms provide highest creep resistance and tensile strength for high operating temperature applications. Alloy material properties result in superior thermal fatigue performance than traditional SAC and SnAg alloys.
ALPHA® PowerBond® 2050 Preforms expand upon industry standard Sn95Sb5 alloy to provide improved wetting characteristics. The superior soldering characteristics combined with good thermal conductivity make it a viable option for heat sink applications.
a
bc
DIMENSION (mm) MIN (mm) MAX (mm)
a ±0.05mm 1.50 58.0
b ±0.05mm 1.50 58.0
c ±10% 0.10 0.50
Both tape and reel and waffle pack packaging available
Preform Sizes and Packaging
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