ShinIchi Esumi f or the high pt u pgrade team collaboration meeting in Nashville, Jun 10-13 2003 1 Aerogel Upgrade Status ShinIchi Esumi for the high pt upgrade team Introduction Design parameters Readout electronics Beam test with prototypes Simulation Plan
Aerogel Upgrade Status ShinIchi Esumi for the high pt upgrade team Introduction Design parameters Readout electronics Beam test with prototypes Simulation Plan. π/ K. K / p. TOF. σ ~ 100ps. 0~2.5. 0~5. RICH. n = 1.00044. 5~17. 17~. ACC. - PowerPoint PPT Presentation
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ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
1
Aerogel Upgrade Status
ShinIchi Esumi for the high pt upgrade team
IntroductionDesign parametersReadout electronicsBeam test with prototypesSimulationPlan
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
2
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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5~9
1~5n ~ 1.01ACC
17~
5~17n = 1.00044RICH
0~50~2.5σ ~ 100psTOF
K / pπ/ K
n=1.0112
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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z (beam) direction
azimuthal anglevertex
parti
cle
track
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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11cm
11cm
22cm
Aerogelair
n=1.0112+- 0.0002
Prototype in run3-pp
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Part name
Para. Kind TypeMaximum workingvoltage
Dielectricwithstanding
voltage
Power rating
R110 k ohm
Coat-InsulateFixed Metal
Film Resistor
MF 1/2 350 V 700 V 1/2 W
R2 -
R11330 k ohm
MF 1/4 250 V 500 V 1/4 W
R12200 k ohm
MF 1/4 250 V 500 V 1/4 W
C1 - C3
10 nF High VoltageCeramic
Condenser
DD1464E103P500
500 V
C4 4.7 nFDEBE33F472ZA3B
3150 V
Design of Bleeder
( Ver. 2 )
Motoi Inaba
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Schedule
Five types of Bleeder Ver.3 will be delivered in June.
We test them and select one for mass-production.
Type
A
B
C
D
E
Divider Resistor
330 k ohm
470 k ohm
560 k ohm
680 k ohm
750 k ohm
Idling current
0.453 mA
0.318 mA
0.267 mA
0.220 mA
0.200 mA
Power consumption
680 mW
478 mW
401 mW
330 mW
300 mW(at 1500 V) (at 1500 V)
Comments
Hamamatsu Standard
Intend to use
New bleeders will be soldered with PMTs at Tsukuba Univ.by Motoi INABA.
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
12
Calibration system using LED
LED200 ohm
TTL
PHENIXTTL (LED)
DRIVER
PPG
Specialcategory-5cable.
1
2
3
8
10
9
8
7
6
5
4
3
2
1
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Gate of ADC
( ~ 11 p. e.)
Output signal of Driver
Gate of ADC
Input signal (100 [Hz])
TTLDRIVER PMT
LED
PMT
50 ohm
Signals on the bench test
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Current design of Aerogel Counter
Aerogel Counter 160 segments of Aerogel Counter are located in Sector 1 at west arm. 160ch of PMT signals are led to North side, and another 160ch are led to South side.PreAmp 20 PreAmp boards are placed both side of Aerogel Counter.FEE & HV rack Racks for FEE and HV modules are located the second floor at west arm.
2.0m
#Preamp:201.2m
1.5m 3.5m
Trig
FEE
LVHV
Aerogel One sector:80 segments160 channels
<4m?
1 DCM channel/ one sectorTo DCM
From GTM
Kyoichiro OzawaNarumi KuriharaTakashi Matsumoto
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Aerogel Box.80 segments.160 channels.
North side of Read out electronics
Preamp8 preamp circuits are on one board.20 boards are in one side.
5 transition cards.Integrate 8 multi coaxial cablesin one board.
Read out module
G Link to DCM
5 AMU/ADCModules have320ch of inputs.
Signal cableRG1741.5~3.5 m
Multi coaxial cable.3 ~ 4 m
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Input to 3ch
25ns
50mV
140mV
3mV
5mV
1mV
4ch output
1ch output
6ch output
3ch input
3ch output
Example: 50mV input pulse to 3ch
•Signal line which is next to 3ch is most affected.•Each signal of cross talk is bipolar signal.•Maximum pulse height of cross talk is 5mV.•When the input was 200mV of pulse height, the •maximum pulse height is 10mV. •For ADC measurement, the cross talk signal carry no charge.
Cross talk in Preamp
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Particle selection by TOF(2GeV/c, positive)
Beam test at KEK-ps
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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X
Beam
(0,0)
15cm
15cmPMT1PMT2
Y
Y
X
Beam
(0,0)
11.5cm
21cm
PMT1
PMT2
Y
X
Beam
(0,0)
22cm
12cmPMT1PMT2Aerogel
PMT PMT
BEAM
Air12cm
12cm
12cm
AerogelPMT PMT
BEAM
12cm
12cm
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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λa
bs
λ sct
BEAM
Optical simulation Satoshi Takagi Masahiro Konno
beam datasimulation
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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# of p.e.
Mylar Box + Goretex 2.07
Paper Box + Goretex 2.00
7 Sheets of Mylar 4.45
Aerogel 13.88
cosmic ray test in our lab. Satoshi Takagi
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Magnetic shield test at Lab
Maya Shimomura
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Online monitoring
Shingo Sakai
TDC ADC
TDC
ADC
Run3-pp prototype test
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Offline analysis Hiroshi Masui
~8 p.e.
low gain ADC high gain ADC
~8 p.e.
single pmt hitsingle pmt hitcoincidence hits
to be evaluated with external tracking
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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#of fired cell/ central event
~ 8% occupancy back ground sourcesseen in aerogel detector
z
x
PISA simulation
Satoshi Takagi
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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Hijing simulation + TOF/RICH/ACC response
kaon
effi
cien
cyka
on p
urity
momentum
TOF(p) && ACC
ACC && RICH
PID and trigger simulation Masahiro Konno Maya Shimomura
kaon thresh.in ACC
pion thresh. in RICH
proton thresh. in ACC
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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LVL2 trigger plan for run4-AuAu
(1) select all PC3 hits in aerogel shadow;(2) select all PC1/PC3 tracks with reasonable vertex cut (say BBC+-10cm);(3) cut on momentum (we'll have ~5% resolution);(4) check for a RICH ring;(5) match hit to EMC cluster;(6) match to the hists in aerogel, use both timing and amplitude;(7) use all this information to make a decision;
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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1. Aluminum Box (Dubna) Two Pre-production boxes in BNL $ Construction of 160 boxes + alpha *
2. PMT 2-1 PMT 320 PMTs (R6233-01HA, Hamamatsu) delivered to Univ. of Tsukuba $ Light shield paint for the back of PMT * Bleeder soldering * Calibration (Gain, Noise, Timing response) *
2-2 Bleeder (INABA-original) Some tests needed * Delivery in June *
2-3 Connectors (AMP, Tyco Elec. Corp.) HV x 2, Signal x 2, LED x 1 Delivery ?
2-4 Short cables (~15cm, Bleeder - Connector) HV x 2, Signal x 2 Preparation *
2-5 G-10 board Construction by CI Industry Co.Ltd *
2-6 Black cloth for light shielding (Lid - G10 board) Preparation *
2-7 PMT+Shield holder (A, B) Material ; Unilate (PET). Construction by CI Industry Co.Ltd (Now estimated) *
3. Magnetic shield case Tested by Maya $ ->Cylindrical shape (Length ; 80 mm / Outer diameter ; 80 mm / Thickness ;0.5 mm), Material ; Permalloy. Construction (Now estimated) *
4. Internal Box 4-1 Mylar sheet Cosmic ray test done (0.35 pe per sheet) $ -> Transparent polyester film (100um thick.) Delivery and cutting (Now estimated) *
4-2 Goretex sheet DRP Reflectors (reflectivity > 99%, 500um thick), Japan Goretex Inc. Delivery and cutting (Now estimated, 2 weeks after order.) *
5. Aerogel SP-12M, Matsushita Electric Works, Ltd. Refractive index ; n = 1.0112 +- 0.0002 Tile Size ; 112.5 +-1 mm x 112.5 +- 1 mm x 11.0 +- 0.5 mm Very fragile Already delivered to Univ. of Tsukuba $
Bleeder (Tsukuba) Type: INABA-original Ver. 3 Size: 80 * 75 * 1.6 mm^3 (P. C. Board) 80 * 75 * 14 mm^3 (Including parts) Power consumption: 456 mW (at 1000 V) 685 mW (at 1500 V) Maximum working voltage: 2500 V (Maximum voltage of PMT is 1500 V ! ) Dielectric withstanding voltage: > 3200 V (from long term test.) = 5000 V (from parts specification) (Maximum voltage of PMT is 1500 V ! ) Delivery schedule: In June.
High Voltage Cable (Tsukuba ? BNL ?) Type: Not yet (GX03173-01 ? The same as TOF ?) Production company: OTTO SUHNER AG. Delivery schedule: 3 weeks after ordered.
Signal Cable PMT-to-PreAMP (CNS, Tokyo-Univ.)(BNL)(Tsukuba) Type: RG-58A/U or RG-122/U or RG-174/U. (50-ohm coaxial cable). Now testing at CNS. Production company: Cabling pattern: Not yet. Number of cables: 320. (160 for Run-4). Delivery schedule:
PreAMP-to-FEE (CNS, Tokyo-Univ.)(BNL) Type: UL8233. (50-ohm multi-coaxial cable). Number of channels per cable: 8. Production company: Cabling pattern: Not yet. Number of cables: 40. (20 for Run-4). Delivery schedule: A test cable on May 20th.
ShinIchi Esumi for the high pt upgrade team
collaboration meeting in Nashville, Jun 10-13 2003
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PreAMP (Pre-amplifier) (CNS, Tokyo-Univ.) OPAMP chip: AD 8009 (Analog Devices, Inc.) (1 GHz, 5,500 V/μs low distortion amplifier.) Type: Voltage sensitive non-reverse amplifier. Design: Circuit diagram. Photograph. Gain: 2.25 Number of channels per board: 8. Number of boards: 40 (20 for Run-4). Power regulator chip: TA7805 (positive), TA79005 (negative). Operating voltage: +8.5 V & -8.5 V (more than 300 mA) (Minimum voltages for stable operation.) Size: 90 * 70 mm^2 Output impedance: 50 ohm Cooling: Required. ESD protection: Yes. Crate: Design by CNS (10 boards / crate). Delivery schedule: Protp-type has delivered. Now testing at CNS. Mass production will be completed in July.
FEE (Front-End Electronics) (CNS, Tokyo-Univ.) Design: The same as RICH FEE. Production company: Kindai Denshi Co.Ltd. (Japan). Dynamic range of charge: 0 - 160 p. e. Components: 10 AMU/ADC boards 2 readout board. 1(or 2) conrtol board. 10 transition card. Crate: One is ready in CNS. Another one is ordered. Transition card: Prototype on May 26th. Power supply: Delivery schedule: In July, and then, testing.
Trigger module (CNS, Tokyo-Univ.) Type: Aerogel LVL-1 trigger. Design: Not fixed yet. Delivery schedule: Not installed in Run-4. (Use LVL-2 trigger for Run-4 Au-Au.)
LED driver (BNL)(Tsukuba) Type: A TTL driver for PHENIX. Production: PHENIX, BNL. Number of output channels: 10. Drivability: 80 LEDs. (10 LEDs / channel). Crate: Standard NIM module. LED: E1L33-3B. (Toyoda Gosei Co., Ltd.) Peak wavelength is 468 nm (Blue). Low voltage: +6 V, -6 V, +24 V, -24V. Cooling: Required. Delivery schedule: Testing at Tsukuba in April and in May.
High voltage module (BNL) Type: Production company: Number of output channels: 320 or 160. (160 or 80 for Run-4.) Number of output channels per module: Crate: Delivery schedule: Unknown.
Low voltage module (BNL) Type: Production company: Output voltage: Not fixed yet. (+6 V, -6 V, +9 V, -9V, +12 V, -12 V, +24 V, -24 V. ?) Number of output channels per module: Crate: Delivery schedule: Unknown.