ADVANTECH US INC 160 INDUSTRY DRIVE RIDC PARK WEST PITTSBURGH PA 15275 USA Evaporation Printing of Patterned Thin Films May, 2013.

ADVANTECH US INC160 INDUSTRY DRIVERIDC PARK WESTPITTSBURGH PA 15275 USAwww.advantechus.com

Evaporation Printing of Patterned Thin Films

May, 2013

Advantech US, Inc. COPYRIGHT 2013 2

OUTLINE

• Introduction• Company Overview and Key Staff• Evaporation Printing of Patterned Thin Films Technology

– Show mask management– Alignment registration

• Market Applications– Active Matrix Display Backplanes

• ESL• OLED

– Printed Electronics• Fine Lines• Embedded Components

• Facility Description• Technology and Product Roadmap


Overview


INTRODUCTION

1. Fabricate patterned thin films with feature size down to five micron with alignment accuracy better than one micron.

2. Simple approach to printed electronics thin film fabrication using additive manufacturing called evaporation printing

– Utilizes vapor deposition of evaporable metals, oxides and semiconductor materials through a shadow mask

– Nearly any substrate– Roll-to-roll capable

3. Simple, fast, low cost, efficient and green technology

4. Usage of multiple shadow masks combined with precision alignment enables multi-layer fabrication of arrays including embedded TFTs, capacitors and resistors

5. Active matrix backplanes for OLED and ePaper displays have been fabricated and demonstrated

6. Fine line and passive and active component fabrication development ability underway


COMPANY OVERVIEW

• Founded by Dr. Peter Brody– active matrix display backplane pioneer– Winner of numerous awards including Draper Prize in 2012

• Developed alternative to photolithography-based microcircuit manufacturing– Display backplanes matrices – OLED and ePaper– Fine lines for chip packaging– Passive and active components

• Funded by private equity and successful entrepreneur family• Technology has been proven• Scaling up low volume in-line beta tool • Developing production process• Business model

– Sell products to prove process and tool– Sell process equipment; License Technologies


MANAGEMENT & KEY STAFFADVANTECH TALENT BASE IS CONSIDERABLE

Sr. Management: CEO Whit Little, MBA, Edinburgh (Scotland). An experienced financial & operational officer in both technology startups and manufacturing.

VP Blake Brocato, with 30 years in thin film deposition with Seagate Technology and others.

VP Scott Lauer, EE and MBA, University of Pittsburgh 17 years in control systems and automation, with Rockwell Automation and II-IV, Inc. A licensed professional engineer.

Key Technical Staff:Tom Ambrose PhD, material physics (Johns Hopkins). Expert in thin film deposition methodologies.

Brian Bucci, PhD mechanical engineering (Pitt) with precision equipment experience

Prashin Sharma, mechanical eng’g MS degree (Carnegie-Mellon. Former researcher in micro-nano tooling.)

Chuck Harrigal, EE (Penn State). Multiple industry experience in embedded hardware/software development.

John Shelapinsky, ME (CMU), MBA (CMU). Prior electro- and optics-mechanical designer.

Jeff Conrad , Over 30 years experience with vacuum deposition equipment.

Tim Cowen, Over 30 years experience in shadow-mask vacuum deposition.

CONTINUED


MANAGEMENT & KEY STAFFAMAX’S TALENT BASE IS CONSIDERABLE (CONTINUED)

Contracted Senior Staff:

Poohsan Tamura, optical sensing PhD (Arizona). expert in optical sensing, metrology and inspection. Vladimir Brajovic, PhD in Robotics, Carnegie Mellon. Broad research & applications expertise in computational imaging, algorithms and architecture.

Nebojsa Jankovic, PhD Professor University of Nis, Serbia Faculty of Electronic Engineering (EF) Department of Microelectronics

Bud Smith, mechanical engineer with MBA from MIT. Prior Booz-Allen consultant & senior executive/CEO in process control, microprocessing and tool manufacturing. University of Pittsburgh business faculty.

Joshua Ziff, nuclear eng’g (Purdue) &MBA (Carnegie-Mellon). Ex-CEO of Bridge Semiconductor.

Jean Nagy, Accounting (Penn State) and CPA. Prior Arthur Andersen auditor, and financial/operations director at GlaxoSmithKline.


Technology Overview


ADVANTECH US TECHNOLOGY

Evaporation PrintingAdditive process

Vacuum Deposition (thermal and/or e-beam)

Fine Metal Foil Shadow Masks

Depo

sition+ =

Sub 1 mil aperture Masks 1 mm Alignment Multiple Steps

+

High and Low temperature materials


MATERIALS

• The range of materials is extensive, including pure metals, precious metals, standard alloys, oxides, nitrides, and fluorides. “Anything Evaporable”

Sample Evaporable Materials*Metals Oxides Semiconductor

Copper Nichrome Aluminum Oxide Tellurium

Nickel Nickel/Vanadium Silicon Dioxide IGZO

Aluminum Titanium ITO CdSe

Gold Silver ZnO

Indium Tin

* non-exhaustive list. Contact us about your specific material


Fine metal foil (electro-formed) with distinct aperture features (cut outs) Nearly any shape imaginable: squares, circles, etc.

Current Mask Design specs:All feature sizes less than 1 mil (25 microns)

• Shadow mask thickness: 10 - 20 mm• Feature trace size: <10 mm• Feature spacing : ~20 mm • Mask fixed to rigid frame (held taut) • Mask cleaning: wet etch process• Mask lifetimes (> 2 years)

Proprietary Shadow Mask Management


Proprietary Precision Alignment

Test Procedure: Align, Deposit, Remove sample and document alignment 10 timesGoal: Prove repeatable alignment

10th Deposition1st Deposition

Results: Independent alignments repeatable to within 1 micron


SMALL METAL LINE FEATURES

15 mm

Minimum feature size : <10 mm

Minimum feature spacing: ~20 mm

Any type of substrate(rigid glass or flexible plastic)

30 mm

Advantech US Amax Evaporation Printing™

Position Accuracy +/- 1 micron

Feature Tolerance +/- 2 microns

Smallest Feature Size < 10 microns

Mask Size 370mmx470mm (G2.5) - currently

Evaporation Precision

Advantech US, Inc. COPYRIGHT 2013

Masks and deposited materials can be configured for specific end-user requirements

Masks

Sem

icon

duct

or

Exi

t L

oadl

ock

Masks Masks

Ent

ran

ce

Loa

dloc

k

Oxi

des

Met

als

Etc

h C

lea

n

ConceptFlexible Multi-Chamber In-Line Manufacturing

•Modular

•Loadlocks to eliminate particles

•Reduce material cross contamination

•Improve substrate cleanliness

•Quick change product by changing masks

•Low volume production runs

•Add chambers = increase throughput

•Can make many configurations of passive and active components


AMAX MINILINE™


Build Examples

E-PaperShadow Mask Steps

6 total process build steps

PROPRIETARY AND CONFIDENTIAL

miniLineTM ESL Backplane Build

pre-patterned substratesemiconductorSource/Drain LeadsGate OxideCap/Cross Over OxideGate /Top Cap metalCrossover Straps

50 mmOptical Micrograph

Pixel Layout

TFT BuildShadow Mask Steps



AM-OLED TFT Circuit Build Example

V Trigger

V Data

V DD

Output Pad

T1

T2

C

D

SG

D

S

G

Glass substrate

Oxide

Semiconductor

DrainGate Oxide

Metal Gate

DrainSource

2 transistor - 1 capacitor (2T/1C) active matrix array

Array specs: 960 x 240 pixels - 115 mm diagonal

Feature size is ~ 15 um with a better than 1 um alignment

Field Effect Transistor Cross Section TFT CircuitPROPRIETARY AND CONFIDENTIAL

Pre-Patterned Substrate

1

2

1 2 3 4 5 6 7

VDD

VTrigger

VData


Oxide Deposition

1

2

1 2 3 4 5 6 7 1


Oxide and Semiconductor

1

2

1 2 3 4 5 6 7 2


Al and Ni contacts

1

2

1 2 3 4 5 6 7 3


Gate Oxide

1

2

1 2 3 4 5 6 7 4


Ni and Al strap

1

2

1 2 3 4 5 6 7 5


Cap Oxide

1

2

1 2 3 4 5 6 7 6


Top Gate

1

2

1 2 3 4 5 6 7 7


1

2

1 2 3 4 5 6 7

Output Pad

T2

T1

CapVDD

VTrigger

VDataSub Pixel

RED GREEN BLUE25

0 um

83.3 um


Chip CarrierShadow Mask Steps




CARRIER WITH DIE

Start Finish


Mask 1

MASK 1


Mask 1

LAYER 1


Mask 2

MASK 2


Mask 2

LAYER 2


Mask 3

MASK 3


Mask 3

LAYER 3: BUILD COMPLETE


Markets


MARKET APPLICATIONS

• End-user target markets– Active Matrix backplanes

• ePaper displays• OLED displays

– Printed Electronics• Electronic shelf labels (ESL) - segmented• Fine lines• Embedded active and passive components


Note: Device fabrication in a single vacuum chamber (6 different deposition steps)

Vgate

V data

T1 T2

VddVdd

C

Vcom

Active Matrix backplanes

2T/1C circuit Mask layout Final device


DISPLAY EXAMPLES – AMOLED

250 microns

83 microns

R G B


EPAPER EXAMPLES: ACTIVE MATRIX ESL


PRINTED ELECTRONICS

Beyond Backplanes• Fine Lines• Embedded Components

44


FINE LINES – MICROLINES™

• New opportunity beyond display backplanes• Exploit ability to manufacture small feature sizes on

a variety of substrates• Chip Carriers need finer lines

– Miniaturization – space, weight and power– High speed transfer rates– Reduce number of PCB layers


SEM OF MICROLINES CONNECTED TO VIAS

standard 10 mil via pads with 100 micron and 70 micron traces and a 50 micron space.


SEM OF MICROLINES CONNECTED TO VIAS

4 mil pads with 2 mil vias connected with 1 mil lines


MICROLINES

8 mm


MICROLINES (CONT’D)

5 micron lines


ACTIVE AND PASSIVE COMPONENTS

• Discrete components fabricated on substrates:– Resistors– Capacitors– Transistors– Diodes– Antennas

Technology Comparison for Active Matrix TFTsa-Si Poly-Si Organic ADV Technology

Circuit Type n-type n-type or p-type

n-type or p-type n-type, p-type possible

Stability (ΔVT) Issue More stable than a-Si

More stable than a-Si

More stable than poly-Si

VT (uniformity) High Low Low High

Mobility (cm2/Vs) 0.5 – 1.0 30-100 1 - 5 50-100

Process Annealing Temperature

No anneal T > 650C No anneal T < 450C

Manufacturability Mature New Not yet New

Cost Low High Maybe low Low

Flexible substrate Possible Uncertain Possible Promising

Shadow Mask Capable

Drive Capacity (Ion)

No

Large W/L to reduce VG

No

Small W/L at small VG

No

Large W/L to reduce VG

Yes

Small W/L atsmall VG



ACTIVE COMPONENTS – TFT (ESL)

Panel Summary Average St. Dev.Vth (V) 1.52 1.03

Mobility (cm2/Vs) 69 29.19Leakage Current (A) 2.97E-11 1.41E-11

Hysteresis (V) 4.79 1.05


STEP COVERAGE


CHARACTERISTIC IMPEDANCE (ZO) DATA

Minimum Maximum Average

4 mil 31.4 33.1 32.7

3 mil 39.6 41.4 40.3

2 mil 49.4 53.1 51.1

1.5 mil 58.4 63.9 61.5

1.0 mil 65.1 70.5 67.9

Line Parameters: 5000 Å Copper, 300 micron pitchSubstrate: 25 micron Kapton ESample Size: 10 sample lines measured per widthTest parameters: 1 MHz, Values in Ohms

Test Measurements compare well with Wheeler Formulations for Microstrips


THICKNESS REQUIREMENTS

0 101,000

100,000

10,000,000

1,000,000,000

100,000,000,0000.01

0.1

1

10

100

1000

10000

100000

Skin Effect

CopperAluminumGoldSilverNickel

Frequency (Hz)

Mat

eria

l Thi

ckne

ss (m

icron

s)


PASSIVE COMPONENTS - RESISTORS

25 microns (1 mil)

• Shown: test panel of resistors that are 1 mil wide connected to 1 mil lines.

• By changing the resistive material and thickness, virtually any resistance from fractional ohms to several megohms per resistor is possible


PRELIMINARY RESISTOR DATA (0.5 MIL WIDE)

0 100 200 300 400 500 60025

26

27

28

29

30

31

32

33

34

35

Cu & NiCr Resistors on Kapton™

RESISTANCE

Resistor #

RESI

STAN

CE (O

hms)

30.0 target29.543 average

0.628 stdev

2.13% tolerance


PASSIVE COMPONENTS - CAPACITORS

Average Measured Capacitance(pF) Tolerance

2.31pF 2%2.76pF 3%2.08pF 1%

• Parallel Plate Capacitors made with the process. • Devices were 100 square micron area with and a

dielectric layer of 3000 Å of Al2O3 with pad layers of 1000Å Al.

• Random sample of 100 capacitors on panels containing over 14,000 capacitors.


“BALLPARK” PRICING ESTIMATES

• Mask NRE: $1,500 to $35,000 per layer– Dependent upon: Feature size, design complexity,

Overall dimensions• Set-up/prep: $500• Approx. $100/layer (affected by depo. time)

– Does not include substrate nor materials• Testing Requirements –as required


Advantech US FacilityPittsburgh PA


Description:21000 sqft Build Space

9000 sqft Clean Space (class 1000 and 10000)5000 sqft test and development space (non-cleanroom)7000 sqft office space

UtilitiesElectric: 500kva, 480v - 208/120vacWater/Sewage: PublicDI Water: Filtered in-houseLiquid Nitrogen: 1000 gallon external tankNatural Gas: available (currently minor usage)Chilled Water: In house

NEW FACILITY


DEPOSITION EQUIPMENTPilot Production ManufacturerminiLine in-line process system custom

5 Chamber In-Line ProcessCapable of up to 370x470mm substrates (currently 200mmx200mm)Sputter/Etch Cleaning, Thermal, 4 e-beamExpected TACT: 10 minutesCustom sub-micron alignment stages (x,y,z, theta)

Research And Development Acquired from Kodak in-line Deposition System Plasmatron

5 Process ChambersE-Beam, Thermal, Sputter sourcesCapable of 6” square substrates

Balzers-Kurdex Box Coater Deposition System customSingle Chamber deposition, 8 inch substrate, 4 inch maskCapable of 6 masks e-beam , thermal, etch

Orion 3000 High Vacuum Deposition System customSingle Chamber Deposition, 8 inch substrate, 4 inch maskCapable of 8 masks: e-beam, thermal, etch


PROCESS EQUIPMENT

Equipment ManufacturerRapid Thermal Annealer Modular Process Technology Corp.RGA on SCT Series Orion 3000 Deposition SystemCVC Model 601 High Vacuum Sputtering Deposition System CustomizedNeslab Model HX-750 Refrigerated Circulation ChillerAnnealerTemptronic RP350/TP2TD Hybrid EconoscopeSub-micron alignment stage(s) CustomFOG/AGF Bonding SystemUltratech Spin Rinse DryerSemi-tool Spin Rinse DryerRite Trak Developer/coaterLaminatorEnvironmental OvensSpin CoaterSub 40c Freezer ScienTemp


TESTING EQUIPMENT

Equipment ManufacturerParameter Analyzer Value TronicsAutomatic Wafer Prober Texas InstrumentsCurve TracerManual ProberMeters for testing VariousOscilloscope TDS 3054 TecktronixOscilloscope TDS 3055 TektronixLCR Meter HP 4284A HPmicroscopes VariousSeiwa Optical PS-888 YAG Laser StationFinescan 120L CMMHitachi S520 Scanning Electron Microscope HitachiSUSS PA 300 Probe StationIntegral Vision Sharpeye Optical test stationDektak 8 Profilometer


AUXILIARY EQUIPMENT

Equipment Manufacturer

Glove Box Controller/Sensor for OLED processing General Eastern

Dual Chamber Glove Box w/load lock for OLED processing

Equipment for Technology & Science Inc.

Vacuum Leak Detector

Laminar Flow Hood Ultrapure Technology

Milling machine Enco Manufacturing, Co.

Fisher Hamilton Safeaire flow hood 6' x 2'

Reynoldstech Wet bench


Roadmap


COMPANY ROADMAP

• Phase I – Proof of Concept - Completed– Demonstrated 60x80 mm (100 dpi) color OLED displays and

25x35 mm (70 dpi) dot matrix ePaper displays using active matrix backplanes fabricated using evaporation printing in R&D Fab

• Phase II – Characterize In-line Manufacturability – Underway– Active matrix backplanes now being fabricated– Scale-up process– Validate performance, throughput, yield and cost assumptions– Identify modifications needed for production level equipment

• Phase III – Manufacturing - Future– Design and build manufacturing tool for production


• Flexible substrates• Large area substrates• Higher resolution • Roll to roll manufacturing

LONG TERM VISION

ADVANTECH US INC 160 INDUSTRY DRIVE RIDC PARK WEST PITTSBURGH PA 15275 USA Evaporation Printing of Patterned Thin Films May, 2013.

Documents

advantech us

films technology

overview slide

active matrix backplanes

active components

green technology

technology startups

seagate technology