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Advanced LPP Architecture for an EUVL SoCoMo Giovanni Bianucci, Natale M. Ceglio, Giuseppe Valsecchi, Fabio Zocchi 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium October 2, 2012
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Advanced LPP Architecture for an EUVL SoCoMo

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Page 1: Advanced LPP Architecture for an EUVL SoCoMo

Page 1 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Advanced LPP Architecture for an EUVL SoCoMo Giovanni Bianucci, Natale M. Ceglio, Giuseppe Valsecchi, Fabio Zocchi

2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium

October 2, 2012

Page 2: Advanced LPP Architecture for an EUVL SoCoMo

Page 2 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Executive summary

With proven optical, lifetime and thermal management performances, the Grazing Incidence Collector (GIC) reduces the EUVL Source Collector Module challenge and risk for HVM

In its current embodiment, the LPP architecture is overly constrained by the use of an “elegant” optical design

The multilayer coated collector creates a “double pass source” requirement that limits the spectrum of usable debris mitigation technologies

In this configuration, the need to protect the multilayer has constrained the plasma within the debris mitigation strategy

The multilayer lifetime challenge will be harder at HVM because it needs a debris-control that is 99.9999% effective

EUVL adoption in HVM needs a new SoCoMo paradigm that eliminates the multilayer driven challenges and enables the full potential of LPP

Prioritize collector robustness over optical design elegance by integrating GIC into LPP as the low tech, least demanding, most reliable collector technology

Use the “unconstrained” LPP knobs to maximize EUV power and mitigate the reflected IR problem

Our customers’ requirements have guided the development of GIC which has become the field proven enabler of DPP EUVL sources

With tailored optical designs and customized ruthenium coatings, our GIC’s have maximized the efficiency of diverse DPP and LDP sources

Media Lario’s manufacturing processes meet the optical performance requirements for HVM grazing incidence collectors

GIC >1-year lifetime has been field proven for the LDP source architecture

We have demonstrated GIC thermal management over to the full span of the source power roadmap, up to 500 WIF peak power

With the Advanced Cooling Architecture, we have further increased and homogenized the heat transfer capability from optical surface to coolant

Tests on shell prototypes operated at 500 WIF equivalent power demonstrate that ACA effectively minimizes thermal gradients across the shell to < 5 °C

We have also proven that ACA maintains this low-thermal-gradient performance also on larger shells

Low thermal gradients result in superior optical stability performance up to an equivalent 500 WIF operation power (15 kW absorbed by GIC)

Page 3: Advanced LPP Architecture for an EUVL SoCoMo

Page 3 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Contents

The LPP challenge

The LPP-GIC solution

Proven GIC features

Page 4: Advanced LPP Architecture for an EUVL SoCoMo

Page 4 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

v CO2 laser

Sn droplets

Multilayer coated

collector

IF aperture

Plasma

DMT SPF

The multilayer coated collector creates the “double pass source” requirement that limits the choice of usable DMT options

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

Multilayer Reflector LPP SoCoMo

Only “soft” DMT options based on • Gas • Magnetic field

“Double pass” of the EUV radiation through the source region

Requirement

Page 5: Advanced LPP Architecture for an EUVL SoCoMo

Page 5 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

In this configuration, the need to protect the multilayer has constrained the plasma within the debris mitigation strategy

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

v

Multilayer Reflector LPP SoCoMo

CO2 laser

Multilayer coated

collector

IF aperture

Plasma

DMT SPF

Resulting architectural complexity

• Droplet generator for mass limited targets (< 30 µm droplets)

• Synchronizations of two lasers with 30 µm droplets at very high rep rate (104 Hz for HVM)

• Complex and demanding debris mitigation systems

• SPF and/or other “innovative” developments to “disperse” reflected IR radiation

Sn droplets

In order to minimize Sn debris, plasma has to be generated from mass limited targets

Constraint

Page 6: Advanced LPP Architecture for an EUVL SoCoMo

Page 6 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

The multilayer lifetime challenge will be harder at HVM because it needs a debris-control that is 99.9999% effective

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

v

Multilayer Reflector LPP SoCoMo at HVM

Assuming a 2-month collector lifetime requirement

Multilayer coated collector

Plasma CO2 laser

Sn droplets

• 50% reflectivity drop caused by 5 nm Sn deposition

• 6 seconds to deposit 5 nm Sn

Multilayer lifetime challenge at HVM

DMT

20 cm

DMT must be 99.9999% effective

Page 7: Advanced LPP Architecture for an EUVL SoCoMo

Page 7 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

EUVL adoption in HVM needs a new SoCoMo paradigm that eliminates the multilayer driven challenges and enables the full potential of LPP

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

3. Use the “unconstrained” LPP knobs to maximize EUV power and mitigate the reflected IR problem

2. GIC places virtually no demands on source, which can be as simple as it needs to be for enhanced reliability

1. Prioritize collector robustness over optical design elegance by integrating GIC into LPP as the low tech, least demanding, most reliable collector technology

Page 8: Advanced LPP Architecture for an EUVL SoCoMo

Page 8 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

v

Grazing Incidence Collector LPP SoCoMo

Prioritize collector robustness over optical design elegance by integrating GIC into LPP as the low tech, least demanding, most reliable technology

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

IF aperture CO2 laser

Plasma

Sn droplets

Mechanical DMT

Grazing Incidence Collector

Architectural solution features

• Simple and robust grazing incidence reflection mechanism

• Thermally managed GIC up to 500 WIF

• Unidirectional light path (no “double-pass source” requirement) allows utilization of mechanical DMT

• GIC places virtually no demands on source, which can be made as simple as it needs to be for enhanced reliability

GIC is the low tech, least demanding, most reliable collector technology

Figure of merit: Survival

Page 9: Advanced LPP Architecture for an EUVL SoCoMo

Page 9 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Use the “unconstrained” LPP knobs to maximize EUV power and mitigate the reflected IR problem

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

v

LPP sweet spot for the elimination of reflected IR and maximization of EUV efficiency*

Laser-target initial conditions

• Under dense: Nion ≈ 0.05 ncritical

• Plasma = 2 mm

• Long scale length: IR absorption > 98%

• Ilaser ≈ 6·109 W/cm2

EUV Performance

• Conversion Efficiency ≈ 5%

• EUV source ≈ 500 µm

• EUV opacity ≈ 10% (i.e. 90% transmission)

• IR reflection ≈ small (ne < ncritical)

Ilaser ≈ 6·109 W/cm2

500 µm

EUVCE ~ 5%

2 mm

* Simulated results of sub-critical mass plasma target

Page 10: Advanced LPP Architecture for an EUVL SoCoMo

Page 10 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Our customers’ requirements have guided the development of GIC which has become the field proven enabler of DPP EUVL sources

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

2005

Collector proto PVD Ru 15 kW cooling (500WIF)

PVD Ru 1 kW cooling Sn-DPP source ADT (ASML)

PVD Ru 3 kW cooling Xe-DPP source EUV1 (Nikon)

PVD Ru 6 kW cooling Sn-DPP source NXE3100 (ASML)

Galvanic PVD Ru 500 W cooling Sn-DPP source proto

Galvanic Ru Xe-DPP source SFET (Canon)

2008 2010 2012

2006 2007

2012 2010 2008

Page 11: Advanced LPP Architecture for an EUVL SoCoMo

Page 11 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

With tailored optical designs and customized ruthenium coatings, our GIC’s have maximized the efficiency of diverse DPP and LDP sources

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

SFET

ADT

EUV1

NXE:3100

Collection solid angle Collection efficiency

1.7 sr

1.6 sr

2 sr

3.7 sr 25%

17%

14%

13%

Page 12: Advanced LPP Architecture for an EUVL SoCoMo

Page 12 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Media Lario’s manufacturing processes meet the optical performance requirements for HVM grazing incidence collectors

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

Image at intermediate focal plane Image at far-field plane (1 m past IF)

v

Spot-Size = 1.2 mm

0%

20%

40%

60%

80%

100%

0 0.2 0.4 0.6 0.8 1 1.2 1.4Radius at IF [mm]

Enclosed energy

Spot size = 2x radius enclosing 90% energy

v

0

1

60 90 120 150

Inte

nsi

ty [

a.u.

]

Radius at far-field [mm]

Far-field intensity plot

Experimental visible light optical measurements of a 2-shell HVM collector prototype

Page 13: Advanced LPP Architecture for an EUVL SoCoMo

Page 13 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

GIC >1-year lifetime has been field proven for the LDP source architecture

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

Grazing Incidence Collector LDP SoCoMo

v

IF aperture

Grazing Incidence Collector

Plasma

Capacitor bank

Sn coated electrodes

Mechanical DMT

0%

20%

40%

60%

80%

100%

0% 20% 40% 60% 80% 100%

No

rmal

ize

d r

esid

ual

ref

lect

ivit

y

Percentage of erosion

• Areas of high erosion maintain original reflectivity

• Stable optical performance throughout 1-year lifetime

Reflectivity / lifetime measurements

Tolerance of Ruthenium layer to erosion experimentally characterized on Sn-LDP source prototype

Several GICs operated in ADT at IMEC and Albany since 2007 with >1-year lifetime

GICs operated in NXE:3100 at IMEC since 2010

1-year projected lifetime at HVM operation

Page 14: Advanced LPP Architecture for an EUVL SoCoMo

Page 14 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

We have demonstrated GIC thermal management over to the full span of the source power roadmap, up to 500 WIF peak power

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

v

<1 125 150 180 Productivity (WPH)

Power at IF (W)

10 600

100 6,000

250 8,000

15,000 500

350 11,000

Advanced Cooling Architecture (ACA) prototype • 6% far-field stability (RMS) at 500 WIF power

Collector cooling (W)

60

Mirror Cooling Assembly (MCA) installed in NXE:3100 • Shell integrated cooling lines • 6% far-field stability (RMS) at 100 WIF power

Collector cooling as a function of source power and scanner throughput (illustrative)

Page 15: Advanced LPP Architecture for an EUVL SoCoMo

Page 15 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

v

v

From the source

Mirror

Coolant

To heat exchanger

Heat transfer mechanism

With the Advanced Cooling Architecture, we have further increased and homogenized the heat transfer capability from optical surface to coolant

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

Heat transfer concept in a cooled mirror

Heat transfer coefficient *

0 4000 8000

Advanced Cooling Architecture (ACA)

Mirror Cooling Assembly (MCA)

W/m2K

* Experimental measurement on ACA cooling

sample

Page 16: Advanced LPP Architecture for an EUVL SoCoMo

Page 16 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Tests on shell prototype operated at > 500 WIF equivalent power prove that ACA effectively minimizes thermal gradients across the shell to <5°C

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

* Test conditions

• ACA shell prototype ( 140 mm x L 180 mm) with IR lamp mounted on optical axis

• Water flow = 12 l/min; ΔTWATER = 2.5 °C; Absorbed power = 2 kW (equivalent to > 500 WIF operation)

Thermal image of optical surface of the shell operated at > 500 WIF equivalent power *

• Temperature gradient across shell < 5 °C

• No print-through of cooling structure

Temperature profile of optical surface of shell

v

25

26

27

28

29

30

0 20 40 60 80 100 120 140 160 180

T (°C.)

Axial coordinate (mm)

Page 17: Advanced LPP Architecture for an EUVL SoCoMo

Page 17 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

We have also proven that ACA maintains this low-thermal-gradient performance also on larger shells

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

* Test conditions

• ACA shell prototype ( 330 mm x L 140 mm) with IR lamp mounted on optical axis

• Water flow = 14 l/min; ΔTWATER = 1.8 °C; Absorbed power = 1.8 kW (equivalent to 500 WIF operation)

Thermal image of optical surface of the shell operated at 500 WIF equivalent power *

• Temperature profile gradient across shell < 5 °C

• Temperature gradient in azimuth direction < 1°C

• No print-through of cooling structure

Temperature profiles of the optical surface of the shell at 120° apart azimuthal positions

v

23

24

25

26

27

28

29

0 20 40 60 80 100 120 140

T (°C.)

Axial coordinate (mm)

Page 18: Advanced LPP Architecture for an EUVL SoCoMo

Page 18 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Low thermal gradients result in superior optical stability performance up to an equivalent 500 WIF operation power (15 kW absorbed by GIC)

The LPP challenge

The LPP-GIC solution

Proven GIC features

Optical performance

Lifetime

Thermal management

v

6% (RMS)

* Test conditions

• ACA shell prototype ( 140 mm x L 140 mm) with IR lamp mounted on optical axis

• Water flow = 15 l/min; ΔTWATER = 0.8 °C; Absorbed power = 0.8 kW (equivalent to 500 WIF operation)

Experimental setup of thermo-optical tests on ACA prototype operated at 500 WIF equivalent power * Far-field optical stability

Far field screen

IF aperture

• 6% optical stability (RMS) at far-field

Page 19: Advanced LPP Architecture for an EUVL SoCoMo

Page 19 2012 International Symposium on Extreme Ultraviolet Lithography, Brussels, Belgium – October 2, 2012

Summary

2. The LPP-GIC architecture eliminates the multilayer driven challenges and enables the full potential of LPP, thus reducing the risk towards EUVL adoption at HVM

1. In its current embodiment, the LPP architecture is overly constrained by the need to protect the multilayer

3. GIC is the low tech, least demanding, most reliable collector technology with proven optical, lifetime, and thermal management performance for HVM