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© MASSTART
MASSTART Consortium
Data Center Interconnects - Towards Mass Manufacturing, 6th
October 2020
ioNext, a glass-based platform complementing Silicon
Photonics
Adrien BILLATSales and Application Manager, Teem Photonics SA,
France
www.masstart.eu
virtual conference session:Data Center Interconnects – Towards
Mass Manufacturing
online / October 6th 2020 / 4 – 7pm
http://www.masstart.eu/
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ioNext, a glass-based platform complementing Silicon
Photonics
Adrien BILLAT – Sales and Application ManagerOctober 5th,
2020
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CONFIDENTIELConfidential2
Teem Photonics – Corporate background
1998
Pioneer in erbium-dopedwaveguide amplifiers
2005
2000 2012
Introduction of glass-based components and sub-systems for
telrcommunications
Acquisition of the Q–switch microchip laser portfolio
from Lumentum
10,000 lasers shipped worldwide
2016
Introduction of WAFT –interposers for SiPh
coupling
Established in 1998Spin-off from Schneider ElectricEnters the
telecommunication
market for FTTH applicationsStrong R&D team, several
patents
2020
First PDK release
2018
ioNext product line
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CONFIDENTIELConfidential3
ioNext, a unique photonics process on glass
Value proposal
Glass technology• Large optical bandwidth: 400 – 2000 nm•
Ultra-low propagation loss: 0.05 – 0.12 dB/cm• Low PDL: < 0.1dB•
Low temperature dependence: 0.01 nm/K
ioNext specific• Low fiber coupling loss : < 0.2dB•
Compactness : radius of curvature 800µm• 2.5D waveguide
engineering
ioNext Process flow dB
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CONFIDENTIELConfidential4
ioNext, a complete photonics platform
Splitters 1xN (up to 512)
Taps
Couplers
Taper/Mode converters
MUX/DEMUX
Interferometers (MZ, MMI, Michelson)
Waveguide crossing
Design
Manufacturing
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CONFIDENTIELConfidential5
2.5D building blocks
Spot size converter Extended optical library
Spot size converter
Surface interactionDepth modulation
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CONFIDENTIELConfidential6
WAFT: three coupling solutions
Edge coupling Top coupling Evanescent coupling
Low loss solutionCompatible with WDM
Wafer level incompatibleAlignment accuracy
Compatible with grating couplersWafer level compatibility
Grating coupler lossWDM-limited
Low loss solutionCompatible with WDMAlignment tolerantWafer
level compatibility
BEOL constraint
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CONFIDENTIELConfidential7
Large pitch adaptation
High channel count uniformityMFD matching to PIC edge
couplers
EC-WAFT series for facet coupling
FAU
EC-WAFTPIC
Insertion loss (incl. fiber-array) < 0.7 dBPIC side MFD 4x3
μm (1/e²)PIC-side pitch >25 μmSM and PM fiber-compatible
127
µm
25 µ
m
64 channels
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CONFIDENTIELConfidential8
Low profile solution for grating couplers
TC-WAFT series for top coupling
• Packaging
• Wafer-level PIC testing(edge-coupling)
FAU
TC-WAFT
PIC
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CONFIDENTIELConfidential9
EV-WAFT series for evanescent coupling
Evanescent coupling to SiN-on-Si waveguide layer:• Broadband and
single-mode in O-band and C-band• Low loss (< 1.5 dB from fiber
to SiN)• Low PDL (< 0.2 dB)• Alignment tolerant
From Binda et al, EMPC 2019
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CONFIDENTIELConfidential10
EV-WAFT: a broadband and alignment-tolerant solutionMinimum
Insertion Loss and Polarization
Dependent Loss over a broad spectral bandAn alignment-tolerant
solution:
-tolerant to lateral offset
-tolerant to proximity error
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CONFIDENTIELConfidential11
Fiber to chip assembly services
Fiber Array (FA)SMF or PM fiber250µm or 127µm pitch
ioNext chipPolarization maintaining waveguides250µm or 127µm
pitch
Fiber to chip assemblyUp to 64 fibers per FA Insertion loss
uniformity
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CONFIDENTIELConfidential12
ioNext building blocksBuilding block Key spec VIS NIRStraight
waveguide
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CONFIDENTIELConfidential13
Advanced PICs and hybrid modules• Er-doped lasers and amplifier
modules• E-O modulation• AWGs• …
PassiveMUX
DFB laser
amplifier
Amplified 1550nm laser
VIS interferometric combiner
From E. Huby et al, 2019
Integrated Er-waveguide amplifier
-40
-35
-30
-25
-20
-15
-10
-5
0
193000 193500 194000 194500 195000
Tran
smis
sion
(dB
)
Frequency (GHz)
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Thank you for your [email protected]
CONFIDENTIALThis document contains proprietary information and
is the property of teem PHOTONICS and is transmitted in
confidence. Neither receipt nor possession confers or transfers
any right to reproduce, use or disclose in whole or in part, data
contained herein for any purpose, without the prior written consent
of an officer of teem PHOTONICS.
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© MASSTART
MASSTART Consortium
Data Center Interconnects - Towards Mass Manufacturing, 6th
October 2020
Acknowledgement
Co-funded by the Horizon 2020Framework Programme of the European
Union
MASSTART project is co-funded by the Horizon 2020 Framework
Programme of the European Union with Grant Agreement Nr. 825109.
https://cordis.europa.eu/project/rcn/219912/factsheet/enMASSTART
project is an initiative of the Photonics Public Private
Partnership
www.photonics21.org#Photonics@Photonics21@PhotonicsEU#H2020
www.masstart.eu
#MASSTART
Disclaimer: The information, documentation and figures available
in this deliverable are written by the MASSTART Consortium Partners
under co-funding by Horizon 2020 Framework Programme of the
European Union (Grant agreement ID: 825109) and do not necessarily
reflect the view of the European Commission. The information in
this document is provided “as is”, and no guarantee or warranty is
given that the information is fit for any particular purpose. The
reader uses the information at his/her sole risk and liability.
Copyright © 2020 the MASSTART Consortium. All rights reserved.
This document may not be copied, reproduced or modified in whole or
in part for any purpose without written permission from the
MASSTART Consortium. In addition to such written permission to
copy, reproduce or modify this document in whole or part, an
acknowledgement of the authors of the document and all applicable
portions of the copyright notice must be clearly referenced.
https://cordis.europa.eu/project/rcn/219912/factsheet/enhttp://www.photonics21.org/http://www.masstart.eu/
ioNext, a glass-based platform complementing Silicon
PhotonicsTeem Photonics – Corporate backgroundioNext, a unique
photonics process on glassioNext, a complete photonics platform2.5D
building blocksWAFT: three coupling solutionsEC-WAFT series for
facet couplingTC-WAFT series for top couplingEV-WAFT series for
evanescent couplingEV-WAFT: a broadband and alignment-tolerant
solutionFiber to chip assembly servicesioNext building
blocksAdvanced PICs and hybrid modulesThank you for your
attention�[email protected]
09.pdfioNext, a glass-based platform complementing Silicon
Photonics