Additive Circuit Technology Roadmap for HDD Suspension

DISKON-08001P 2008.03.10 CISFLEXCISFLEX TMTM

Additive Circuit Technology Additive Circuit Technology Roadmap for HDD SuspensionRoadmap for HDD Suspension

Speaker:

Hitoki KANAGAWA

Prepared by Y.OoyabuApproved by T.Visit (PhD)

NOTE; The contents of this data sheet are the exclusive property of NITTO DENKO Corp. Prior permission must be obtained for any use of these contents for purposes outside of that intend by NITTO DENKO Corp. Any question on this should be addressed to Product Development section, Printed Circuits Div., Electronic Materials Business Sector, of NITTO DENKO Corp. or local NITTO DENKO office


NITTO Product portfolioNITTO Product portfolio

Protect Products Electrical Insulating Tape Double Coated Tape Sealing Materials Fibre Reinforced Plastics

Flexible Printed CircuitsCircuit technologyCircuit technology

TEMISH® Products

Medical Products

Wafer Tapes

DURATACK® labels

Moulding Compounds

Bandoliering Tapes Corrosion Protection

NITOFLON® TapesPolarising Films

With more than 4,000 products, Nitto is available to support EleWith more than 4,000 products, Nitto is available to support Electronics ctronics business with our products. In Flexible Printed Circuit divisionbusiness with our products. In Flexible Printed Circuit division we can we can support using Subtractive technology and Additive technology.support using Subtractive technology and Additive technology.


LineLine--upup

Additive Circuit Technology

Additive Circuit Technology v.s HDD Roadmap

Capability of additive technology

Next challenges of additive technology







Process comparison of both technologyProcess comparison of both technology

CuCu

CuCu

CuCu

CuCu

CuCu

CuCu

Important point is Additive is stack up, Subtractive is etch out.

PhotoPhoto--resist resist RemovingRemoving

PhotoPhoto--resist resist imagingimaging

PhotoPhoto--resist resist LaminationLamination

Copper PlatingCopper Plating

Copper PlatingCopper PlatingAdditive technologyAdditive technology Subtractive technologySubtractive technology

Photo resistPhoto resist

Copper PlatingCopper Plating

CuCu

Etching of Etching of Sputtered Seed Sputtered Seed LayerLayer

Polyimide filmPolyimide film

Sputter Seed Layer (submicron level)

SSTSSTPhotoPhoto--resist resist LaminationLamination

Etching of Etching of Plated Copper Plated Copper

PhotoPhoto--resist resist RemovingRemoving

PhotoPhoto--resist resist ImagingImaging

Plated CopperPlated CopperPolyimide filmPolyimide film

Sputter Seed Layer (submicron level)

SSTSST

CuCuPhoto resistPhoto resist

Etching of Etching of Sputtered Seed Sputtered Seed LayerLayer


Advantages of additive ConductorsAdvantages of additive ConductorsAdditive Conductors

PolyimidePolyimide

CopperCopper

Subtractive Conductors

CrossCrosssectionsection

PolyimidePolyimide

CopperCopper

Top widthTop width

05

101520253035404550

Subtractive methodSubtractive methodCon

duct

orW

idth

(um

)

05

101520253035404550


duct

orW

idth

(um

)

Additive methodAdditive method

05

101520253035404550


duct

orW

idth

(um

)

05

101520253035404550


duct

orW

idth

(um

)

Additive methodAdditive method

P r o d u c t L o t #

Subtractive technology leads to irregular conductor geometry at Subtractive technology leads to irregular conductor geometry at fine conductor line fine conductor line / spacing. This impacts:/ spacing. This impacts:

1)1) Impedance ControlImpedance Control2)2) Ability to achieve conductor lines with < 35 um pitch.Ability to achieve conductor lines with < 35 um pitch.







HDD TrendHDD Trend

0.0

0.5

1.0

1.5

2.0

2.5

3.0

2005 2006 2007 2008 2009 2010

Tran

smis

sion

Freq

uenc

y[G

Hz]

Server Frequency[GHz] 3.5" Frequency[GHz]2.5" Frequency[GHz]

Transmission FrequencyTransmission Frequency

Signal Grounding Required Signal Grounding Required RoadmapRoadmap-- ArealAreal Density Continues to be Density Continues to be

enabled by PMR !enabled by PMR !-- Lower flyLower fly--height require low height require low gimbalgimbal

stiffness stiffness -- High frequency transmission circuitHigh frequency transmission circuit

Additive is a Must!!Additive is a Must!!

050

100150200250300350400450

2004 2005 2006 2007 2008 2009 2010

Are

al D

ensi

ty[G

b/in

2]

0

5

10

15

Fly

heig

ht[n

m]

Areal Density[Gb/in2] Flyheight[nm]

Fly height and Fly height and ArealAreal densitydensity

1.00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

ADGR:60%

ADGR:100%

LongitudinalLongitudinalMediaMedia

GMR HeadGMR Head

AdvancedAdvancedGMR HeadGMR Head

PerpendicularPerpendicularMediaMedia

TMR/PMRTMR/PMRHeadHead

ADGR:30%

Thin Film HeadThin Film Head

MR HeadMR Head

1.00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

1 .00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

1 .00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

ADGR:60%ADGR:60%

ADGR:100%ADGR:100%


GMR HeadGMR Head




ADGR:30%ADGR:30%ADGR:30%


MR HeadMR Head

1.00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

ADGR:60%

ADGR:100%


GMR HeadGMR Head




ADGR:30%


MR HeadMR Head

1.00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

1 .00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

1 .00E+07

1 .00E+08

1 .00E+09

1 .00E+10

1 .00E+11

1 .00E+12

1 .00E+13

1985 1990 1995 2000 2005 2010 2015

Year

Are

al D

ensi

ty [

bit/

inch

1010MM

11TT

100100GG

1010GG

11GG

100100MM

Are

al

Are

al D

ensi

ty[b

it/in

chD

ensi

ty[b

it/in

ch22 ]]

ADGR:60%ADGR:60%

ADGR:100%ADGR:100%


GMR HeadGMR Head




ADGR:30%ADGR:30%ADGR:30%


MR HeadMR Head

ArealAreal Density TrendsDensity Trends


Roadmap CircuitRoadmap Circuit

1 5 0 Gb/in2 3 0 0 Gb/in2 6 0 0 Gb/in2 1 2 0 0 Gb/in2 2 4 0 0 Gb/in2

R e a d

W r i t e

7 5 Gb/in2

Low Fly height, High Speed Data TransmissionLow Fly height, High Speed Data Transmission

Perpendicular Perpendicular recordingrecording

Patterned Patterned media recodingmedia recoding Heat assisted magnetic Heat assisted magnetic

recordingrecordingTFCTFC Dual Stage ActuatorDual Stage Actuator

TMR HeadTMR Head CPP HeadCPP Head

1 5 0 Gb/in2 3 0 0 Gb/in2 6 0 0 Gb/in2 1 2 0 0 Gb/in2 2 4 0 0 Gb/in2

R e a d

W r i t e

7 5 Gb/in2

Low Fly height, High Speed Data TransmissionLow Fly height, High Speed Data Transmission

Perpendicular Perpendicular recordingrecording

Patterned Patterned media recodingmedia recoding Heat assisted magnetic Heat assisted magnetic

recordingrecordingTFCTFC Dual Stage ActuatorDual Stage Actuator

TMR HeadTMR Head CPP HeadCPP Head

1. Miniaturization(4 6 8~11trace)Finer Line and Space by Additive technology

2. High Frequency signal(Electrical performance)Ground Plane by Additive technology

Write and Read technologyWrite and Read technology

Requirement for CircuitRequirement for Circuit


Nitto RoadmapNitto Roadmap

Mass Production levelMass Production levelPrototypes levelPrototypes levelSample production levelSample production level

CQ1 CQ2 CQ3 CQ4 CQ1 CQ2 CQ3 CQ4 CQ1 CQ2 CQ3 CQ420092007 2008

SST thickness18 um

15 um

Items

Grounding Pad

Grounding Plane

Trace Widthand

Spacing

20 /20 um

15 /15 um

Min. 8um

Conductorthickness

Min. 12um

Min. 10um







Nitto Additive capabilityNitto Additive capability

2007 2008 200920062005

30/30um30/30um30/30um20/20um20/20um20/20um

15/15um15/15um15/15um

1999 2000 2001 2002 2003 2004

Hair(100um)Hair(100um)

Line/Space40/40um

Line/SpaceLine/Space40/40um40/40um

Trace width history of SUSPENSION

Pitch 30um 25um 20umLine 15um 12um 12um 10um

Space 15um 18um 13um 10um

Cross section

Nitto Technology

NittoNitto’’s finer trace capability using Additive technology covers entires finer trace capability using Additive technology covers entireSUSPENSION trace width requirement!!!SUSPENSION trace width requirement!!!


Cu Ground PlaneCu Ground Plane

SSTSST

Cu GND PlaneCu GND Plane

CuCu

Field coupling to the ground plane.Field coupling to the ground plane.

Ground Plane(SST)

CuCu

PolyimidePolyimide

++ --

Electric Field CouplingElectric Field CouplingSSTSST

CuCu

SST Ground Plane

Cu Ground Plane

SST Cu

Conductivity(S/m)

1.1*106 5.8*108

-- Ground Plane has current due to electric field coupling. These Ground Plane has current due to electric field coupling. These current current leads to power loss.leads to power loss.

-- Power loss is reduced if conductivity of ground layer is high.Power loss is reduced if conductivity of ground layer is high.Cu Ground Plane is most feasible solution for minimizing LOSSES.Cu Ground Plane is most feasible solution for minimizing LOSSES.


Cross section of actual sampleCross section of actual sample

SST

Cu Ground Plane

Trace

Cu Ground Plane

Trace(15um)

Space(15um)

Base PISkin PI

SSTSSTPolyimidePolyimide

TraceTrace

Cu Ground Plane

TraceTrace

Skin Polyimide

Basic structureBasic structure--11 Basic structureBasic structure--22

SST etching is available SST etching is available due to Skin PIdue to Skin PI

Nitto has PI coating technology which enable us to make SST holeNitto has PI coating technology which enable us to make SST hole under the under the Cu Ground Plane. It is a Must for efficient Impedance control.Cu Ground Plane. It is a Must for efficient Impedance control.


Sample : Nitto Test CouponLine and Space :30/30umEquipment :VNA, TDR

Sample : Nitto Test CouponLine and Space :30/30umEquipment :VNA, TDR

Measurement result(transmission characteristic)Measurement result(transmission characteristic)

0

20

40

60

80

100

120

140

160

180

200

-10 0 10 20 30 40 50 60 70Distance from Probing Point [mm]

Diff

eren

tial I

mpe

danc

e [Ω

]

w/o GND planeGND Plane-Sample1GND Plane-Sample2GND Plane-Sample3


w/o Cu GND Planew/o Cu GND Plane

Time Domain Time Domain ReflectmetoryReflectmetory

-14

-12

-10

-8

-6

-4

-2

0

0 2 4 6 8 10

Frequency [GHz]

Sdd2

1(T

rans

mis

sion

Cha

ract

eris

tic) [

dB]

w/o GND-Plane GND-Plane-Sample-1GND-Plane-Sample2 GND Plane-Sample3


w/o Cu GND Planew/o Cu GND Plane

SS--ParameterParameter

Cu Ground Plane shows Cu Ground Plane shows 1)1) Improved signal transmission.Improved signal transmission.2)2) Better impedance control.Better impedance control.







Next challenges of additive technology Next challenges of additive technology

Better

SubtractiveSubtractive

AdditiveAdditive

High conductivity by pure Copper platingHigh conductivity by pure Copper platingFiner Line and SpacingFiner Line and Spacing

Better mechanical propertyBetter mechanical property

Rob

ustn

ess

Rob

ustn

ess

Product Design

Product Design

flexibilityflexibility

Better

Product PerformanceProduct Performance


Stress Relaxation of Copper Foil Stress Relaxation of Copper Foil

Rolled Annealed

Electrodeposited

It has been well established that Electrodeposited Copper is not as strong as Rolled Annealed Copper due to the difference in grain structure and defect concentrations

H.D. Merchant, Gould Electronics, 1997


Nitto Denko High strength CopperNitto Denko High strength Copper

Nitto Denko has been developing new process technology to produce high strength high performance electrodeposited copper to meet the Fine Line / Spacing of HDD roadmap and the robustness requirement

ConventionalED Cu

High StrengthED Cu

Stra

in R

elax

atio

n (%

)


Nitto Denko High strength CopperNitto Denko High strength Copper

Conventional ED copper w/o Conventional ED copper w/o Cover PI after 30 Cover PI after 30 minsmins TestTest

High Strength ED copper w/o High Strength ED copper w/o Cover PI after 30 Cover PI after 30 minsmins TestTest

0.0%

2.5%

5.0%

7.5%

10.0%

Trac

e D

amag

e [%

]

10min 20min 30min 10min 20min 30min

Conventional ED Cu High strength ED Cu

ConditionConditionSample: Conventional ED Copper,

High Strength ED CopperTime: 10min/20min/30minFrequency: 132kHz

By exposing copper trace to ultrasonic DI water cleaning, conventional ED copper begins to show cavitation damages after 20 mins while high strength ED copper shows no damages even after 30 mins.


ConclusionConclusion

• Nitto Denko 30 um fine line / spacing Additive Technology is ready to enable the most demanding HDD roadmap in the market. We are the only supplier of multi-layer conductor line to serve high frequency transmission rate.

• Higher robustness is required for additive technology associated with electrodeposited copper. Nitto Denko believes that our recent development of high strength copper will meet the most demanding mechanical requirement needed to continuously support the HDD roadmap.


Thank you very much for your attention.Thank you very much for your attention.

Additive Circuit Technology Roadmap for HDD Suspension

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