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Visit Our Website www.addisonengineering.comSilicon Wafer
ProcessingAddison Engineering has an extensive array of processing
capabilities. On our silicon or yours, we can provide virtually any
processing service you may need, from a simple oxide layer to
completely patterned wafers. Thermal oxide Ion implant Epitaxial
deposition Plasma nitride Photoresist Wafer bumping
Visit Our Website www.addisonengineering.comAbout Wafers:In
electronics, a wafer (also called a slice or substrate) is a thin
slice of semiconductor material, such as a silicon crystal, used in
the fabrication of integrated circuits and other microdevices. The
wafer serves as the substrate for microelectronic devices built in
and over the wafer and undergoes many microfabrication process
steps such as doping or ion implantation, etching, deposition of
various materials, and photolithographic patterning.
Silicon Wafer Processing
Silicon Wafer ProcessingVisit Our Website
www.addisonengineering.comFormation: Wafers are formed of highly
pure (99.9999999% purity) nearly defect free single crystal
material. One process for forming crystalline wafers is known as
Czochralski growth invented by the Polish chemist Jan Czochralski.
In this process, a cylindrical ingot of high purity monocrystalline
semiconductor, such as silicon or germanium, is formed by pulling a
seed crystal from a 'melt'.
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Donor impurity atoms, such as boron or phosphorus in the case of
silicon, can be added to the molten intrinsic material in precise
amounts in order to dope the crystal, thus changing it into n-type
or p-type extrinsic semiconductor.
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Thermal oxide: OxideTEOS/PETEOS oxide Gate oxide Low temperature
oxide PSG glass Silicon Nitride LPCVD Low Stress Ultra-low Stress
Polysilicon (undoped)
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Metal deposition Evaporation Sputter Epitaxial deposition Ion
implantation SOI oxidation wafer bonding Photolithography
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Clean RCA clean Mechanical Ingot slicing Lap & etch Wafer
thinning Wafer downsize (diameter cut-down) Wafer dicing
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Wafer reclaim Laser marking Wafer bumping MEMS - Silicon
machining
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Thin Film Processing:LOW kBlack DiamondCoralSpin Onand
moreOXIDE: CVD and ThermalThick Photoresist & PolymideHigh
Energy Deep Ion ImplantNitrides (Si- and O-)
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Low Stress Silicon NitrideBPSG, PSG, USGAmorphous SiliconDiamond
Like CarbonPolysilicon (Doped and Undoped)METALS: PVD, CVD,
ElectroplateAi, Cu, Au, Cr, Ta, Ti, TiNTiW, TaN, WN, Ni, RuCo,
NiSi, TiO2, Pt
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Czochralski Growth:
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Grinding and Slicing:
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Lapping and Etching:
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Polishing and Cleaning:
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Sizes Available:Silicon wafers are available in several sizes
(diameters)
1 (25mm) 2 (50mm) 3 (75 mm) 4 (100mm) 5 (125mm) 6 (150mm) 8
(200mm) 12 (300mm) 18 (450mm)
Silicon Wafer ProcessingVisit Our Website
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Addison Engineering provides Silicon wafers that are available
with a wide range of characteristics (specifications) to select
from.Thank You