Achieve Your Best Design In digital standards, every generational change puts new risks in your path. We see it firsthand when creating our products and working with engineers like you. Agilent‟s solution set for high- speed digital test is a combination of instrumentation and broad expertise built on our ongoing involvement with industry experts. By sharing our latest experiences, we can help anticipate challenges and accelerate your ability to create products you‟ll be proud of. Agilent – achieve your best design.
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Achieve Your Best Design
In digital standards, every generational change puts new risks in
your path. We see it firsthand when creating our products and
working with engineers like you. Agilent‟s solution set for high-
speed digital test is a combination of instrumentation and broad
expertise built on our ongoing involvement with industry experts.
By sharing our latest experiences, we can help anticipate
challenges and accelerate your ability to create products you‟ll
– Memory technology has hit a wall because of physics limitations- understand what
these limitations mean for your designs
2) New Logic Analyzer capable of capturing DDR4 data
– Is your equipment moving as fast as your designs? The Agilent U4154A AXIe-based
logic analyzer module provides the highest accuracy measurements on high-speed
digital systems operating up to 4 Gb/s with eye openings as small as 100 ps by 100
mV. Don’t let your designs be limited by the equipment you use to test them.
3) DDR Probing and Analysis Tool
– Memory system designers have huge concerns on probing meeting the high
bandwidth requirement for best signal fidelity. Understand the Agilent solutions
offered to make this as easy as possible for you so you can concentrate on solving
problems, not wondering where the problems are.
Hottest Memory Applications Computer System
Mobile and Wireless Applications
Servers-email, web,
database
DDR3
Notebooks, Desktops
DDR2/3
SD UHS-I slot
Smart phone
Consumer products
Graphics card
GDDR5 DRAMs
LPDDR2 DRAM
SD UHS-I card
- max storage
LPDDR1/2, DDR2, DDR3
Industry Roadmap
DDR3 1867 & 2133Mt/s - 2011
DDR4 (up to 3.2Gb/s, 1.2V) - 2012
Industry Roadmap
• DDR4
• LPDDR3
• Wide I/O (~12Gb/s)
•Faster data rate
•Lower DRAM cost
•Higher density
•Lower power
Current Memory Technology Types
Memory Technology Where Used?
Standard
DDR Double Data Rate
• Desktop Computing
• Servers
JESD79E, JESD79-2E,
JESD208, JESD79-3C
GDDR Graphics Double Data Rate
• Graphics Boards
• Embedded Systems (future)
JESD212
LPDDR Low Power Double Data Rate
• Mobile
• Embedded
JESD209A, JESD209-2
QDR Quad Data Rate
• Specialty QDR Consortium
Nand/Nor • Flash Memory JESD79-2, JESD79-3
e-MMC™/SD Embedded Multimedia Card
Secure Digital
• Managed Flash
• Mass Storage Devices
JESD84-B45
SD Card Association
Memory Technology Types
Memory Technology Where Used?
DDR Double Data Rate
• Desktop Computing
• Servers
DDR3
• Current speed = 2133 Mb/s
• May increase to 2.3 Gb/s
• Vdd options = 1.5, 1.35, 1.25
• First “3DStack”
DDR4 (2012)
• Current speed = 2.4 Gb/s
• Goal is to increase to 3.2 Gb/s
Big push to lower power
Memory Technology Types
Memory Technology Where Used?
GDDR Graphics Double Data Rate
• Graphics Boards
• Embedded Systems (future)
GDDR: Graphics boards for desktop computers
• Very high speeds
• Current speed = 6 Gb/s
• May increase to 8 Gb/s in 2012
• GDDR5:
• Point to point connection to help with signal integrity
• 1st to implement error feedback
Memory Technology Types
Memory Technology Where Used?
LPDDR Low Power Double Data Rate
• Mobile
• Embedded
LPDDR2
• Current speed = 800 Mb/s
• Fully specified to 1067 Mb/s
LPDDR3 (~Dec 2011)
• Goal = 1600 Mb/s
• Pin out compatible with LPDDR2
LLI (Low Latency Interface)
• Serial ASIC to ASIC low overhead memory bus
(MIPI alliance)
Memory Technology Where Used?
QDR Quad Data Rate
• Specialty
Nand/Nor • Flash Memory
Memory Technology Types
QDR (Quad Data Rate):
• Static memory, read/write to simultaneously
Nand: 100-1,000+ writes before failure
• Toggle
• ONFI –speed 400MT/s, BGA packages
Nor: ~100,000+ writes before failure
As memory size increases the number of writes before failure decreases
Memory Technology Types
Memory Technology Where Used?
eMMC/SD Embedded Multimedia Card
Secure Digital
• Managed Flash
• Mass Storage Devices
eMMC / SD (Managed): Can be embedded or removable
• eMMC = embedded multimedia card
• SD = removable flash
• Next generation = UFS, SDA UHS-II
Mb/s
ec p
er
Pin
Speed Doubles With Each Generation
Year
28
Gb
/se
c/c
hip
1.6
4.3
4.8
N
N+
1
N+
2
N+
3
N+
4
N+
5
N+
6
Generation
Gb
/s p
er
Pin
Memory is Finally “Boxed In” by Physics
# I/O Pins
Channel
Throughput
(GBytes/sec)
Signal Propagation
Physics
Faste
r
Signal Integrity Problems
Crosstalk
Loss
Reflection
Gb
/s p
er
Pin
Memory is Finally “Boxed In” by Physics
# I/O Pins
Channel
Throughput
(GBytes/sec)
Materials and Process
Physics
Wider
MFG issues
Materials
Reliability
Higher density
Solution? Go Faster & Go Wider
Gb
/s p
er
Pin
# I/O Pins
„06 „04
„02
Faster
&
Wider
Current Memory
Technology
Key Memory Design Challenges Solutions
Challenges
o Increased system failures
o Compliance to new standards
o Signal Integrity verification
o Margin testing
o Probing issues
o Probe load reduces system margin
o Signal accessibility is limited
o Conventional probing limits signal
insights
o Probing can cause signal reflection
and other SI issues
Solutions
o Follow the signal flow
o Accurate captures
o Capture high data rates with
small eyes
o Precise triggering
o Bus level signal integrity insight
o Minimize signal integrity issues
caused by BGA probing
o Verify adherence to standards
Analysis Tool Data Acquisition
2 Gb/s High Speed Logic Analysis Module
Probing
BGA Probes
Mid-Bus Probing
SoftTouch
Decoder
Protocol Compliance
Performance Analysis
Trigger
Signal Integrity
Oscilloscope
Logic Analyzer
4 Gb/s 2.5Gb/s Ultra High Speed Logic Analysis
Module
Connect Acquire View & Analyze
Interposers
Agilent Memory Solutions-> Follow the Signal Flow
Analysis Tool Data Acquisition
2 Gb/s High Speed Logic Analysis Module
Probing
BGA Probes
Mid-Bus Probing
SoftTouch
Decoder
Protocol Compliance
Performance Analysis
Trigger
Signal Integrity
Oscilloscope
Logic Analyzer
4 Gb/s 2.5Gb/s Ultra High Speed Logic Analysis
Module
Connect Acquire View & Analyze
Interposers
Agilent Memory Solutions-> Follow the Signal Flow
Capture High Data
Rate Signals
with small eyes
Precise Triggering
Accurate
capture
Memory Depth up to 200M per Channel Channels/Width 136 channels per module up to 3 modules in a set Timing Speed 5 GHz 68 Channels 2.5 GHz 136 Channels Timing Zoom 12.5 GHz Full Channel x 256K
Trigger Highlights
Sequence Rate 2.5GHz
Sequencer Levels 8
Burst recognizers
Burst of 8 x 4
Burst of 4 x 8
Burst of 2 x 16
U4154A Key Characteristics State Speed 4Gb/s on 68 Channels
2.5Gb/s on 136 Channels
Data valid window ≤100ps x 100mV
Sampling Resolution 5ps by 5mv
EyeScan Colorized all signals
HW Accelerate (>x10 speed)
New – Qualified Colorized Scan Display all Signals
Earlier generation
Colorized
Scalable
Qualified
HW accelerated
10x faster
hours to minutes
5psx5MVresolution
DDR EyeScan customized views
• Group signals on tabs
• Qualified DDR scan examples:
Read / Write separation
Byte Lanes
Burst Scans
Analysis Tool Data Acquisition
2 Gb/s High Speed Logic Analysis Module
Probing
BGA Probes
Mid-Bus Probing
SoftTouch
Decoder
Protocol Compliance
Performance Analysis
Trigger
Signal Integrity
Oscilloscope
Logic Analyzer
4 Gb/s 2.5Gb/s Ultra High Speed Logic Analysis
Module
Connect Acquire View & Analyze
Interposers
Agilent Memory Solutions-> Follow the Signal Flow
SI Measurement with Oscilloscope
•Read and write data parametric testing
•Identify cross talk and ISI failures
•Track infrequent events
•Jitter characterization
•Compliance as per JEDEC standard
Memory Design Phases that requires SI testing
Prototyping (alpha and beta)
•SI characterization to
compare results with design
simulation and specification
•Margin testing – varying
temperature and voltage levels
Post Production
• Margin testing for checking
compatibility issues
SI Validation Tasks requires Highest Measurement Accuracy Tools
Memory Oscilloscope Measurement Tool
DDR/SD Compliance
Software Packages
DDR/SD Fixtures
and Probes
9000/90000 series Oscilloscope
InfiniiScan+ InfiniiSim Serial Data Package
DRAM
Most Complete Memory Test Tools
DDR Probing and Analysis Tool When Vias Are Not Accessible
For embedded system with tight board spaces and fully populated DIMM configuration, BGA probes
provides signal access
Example 1: Scope optimized
BGA probe on DIMM
configuration
High BW for accurate
compliance measurements.
Example 2: Flex wing BGA probe
access for most signals
Quick connection for either logic
analyzer or scope
De-embedding is used for parametric
measurements
BGA probe and Via probing Comparison
Skew caused
by delay
Channel 1: Probing at VIA
Channel 2: Probing at scope pad point on adapter board
Decrease in amplitude
Before de-embedding
Not acceptable for SI check:
Signal performance is affected using the
BGA probe for SI check. How do I simulate
an ideal probe?
Channel 1: At VIA (DQS strobe)
Channel 2: At scope adapter board
Turn on Bandwidth Limit to 4G on the
channel to reduce the ringing effect due to
high frequency content.
After de-embedding
InfiniiScan+ demo
2 distinctive bursts pattern
for read & write commands
read/write data
• Signal Integrity
• Basic Compliance (i.e.
clock, voltages)
• Read/write timing
Customer Measurement Experience / Sequence
Power On Test • LA training
• Bus Timing / Power management
• Memory training/initialization
• Bus-wide SI scan
• FA- Subsystem / signal Isolation
• System Functionality
• LL SW Integration
• Cross-bus traffic
• Performance tuning
• Root cause parametric failure analysis
• Detailed parametric characterization
• Compliance / Vendor qualification
Boots may be unstable OS boots up Live application/stress