A Low Mass On-chip Readout Scheme for Double-sided Silicon Strip Detectors 13th February 2013 C. Irmler, T. Bergauer, A. Frankenberger, M. Friedl, I. Gfall, A. Ishikawa, C. Joo, D.H. Kah, R. Kameswara, K.H. Kang, E. Kato, G. Mohanty, K. Negishi, Y. Onuki, N. Shimizu, T. Tsuboyama, S. Schmid, M. Valentan VCI 2013, 13 th Vienna Conference on Instrumentation
37
Embed
A Low Mass On-chip Readout Scheme for Double-sided Silicon Strip Detectors 13th February 2013 C. Irmler, T. Bergauer, A. Frankenberger, M. Friedl, I. Gfall,
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
A Low Mass On-chip Readout Scheme for Double-sided Silicon
Strip Detectors
13th February 2013
C. Irmler, T. Bergauer, A. Frankenberger, M. Friedl, I. Gfall, A. Ishikawa, C. Joo, D.H. Kah, R. Kameswara, K.H. Kang,
E. Kato, G. Mohanty, K. Negishi, Y. Onuki, N. Shimizu, T. Tsuboyama, S. Schmid, M. Valentan
VCI 2013, 13th Vienna Conference on Instrumentation
VCI 2013, C. Irmler (HEPHY Vienna)
Outline
• Introduction• Assembly• Cooling• Summary
213th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
Motivation
313th February 2013
~1 km in diameter
Super KEKB Belle II
Linac
About 60km northeast of Tokyo
• Super KEKB– Electron-positron collider– 7 GeV e- on 4 GeV e+
– Center of mass energy: Y(4S) (10.58 GeV)
– Target luminosity: ~81035 cm-2s-1
• Belle II detector– Refurbishment of all sub-
detectors– 40 times higher luminosity– Faster readout
VCI 2013, C. Irmler (HEPHY Vienna)
Silicon vertex detector
413th February 2013
Belle II SVD:• 4 layers of 6 inch DSSDs• Radii 38 to 135 mm• Readout: APV25
– 40 MHz / Tp= 50 ns– 192 cells analog pipeline– ENC = 250 e + 36 e/pF
• Minimize capacitive load!• Chips closest to sensors
strips chip-on-sensor• Keep material budget low
Belle (SVD2):• 4 layers of 4 inch DSSDs• Radii: 20 to 88 mm• Readout: VA1TA
– 5 MHz / Tp = 800 ns– no pipeline– ENC = 180 e + 7.5 e/pF
• Read out from edge of ladders– long pitch adapters– up to 3 ganged sensors
• Exploded drawing of a L6 ladder• 3 different Origami flex designs
– backward (-z), short tail– center (ce), for central sensor, long tail– forward (+z), routed along slanted sensor, complex shape
613th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
Outline
• Introduction• Assembly• Cooling• Summary
713th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
445 mm
125 mm
The evolution of Origami modules
• 2008: Introduction of concept• 2009: Feasibility shown with 4” DSSD module• 2010: First full-size module with 6” DSSD• 2011: Re-design to fit mechanical requirements of
Belle II SVD ladders
813th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
• How to assemble ladder withtwo or more Origami flexes?
• Not possible sensor by sensor• Combined procedure required• 2-DSSD Origami module
– 2 HPK DSSDs– Two types of Origami flexes (-z and ce)– Single-layer PA0/PA1/PA2
Assembly of a 2-DSSD Origami module
913th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
Attaching of pitch adapters (PA1 & PA2)
1013th February 2013
• Align PAs to p-side of sensor • Picked up with a vacuum jig• Apply mask and glue
•Temperature measured at 4 locations of the 2-DSSD module•Stable operation for ~18 hours•Nominal temperature: -20°C•All temperatures within precision of probes no warming of coolant•Efficient heat transfer between chips and pipe (coolant)
Tem
pera
tur
[°C
]
Time
Module InletModule OutletOrigami –zOrigami ce
VCI 2013, C. Irmler (HEPHY Vienna)
Beam test performance• Beam test performed @ CERN SPS in October 2012• 120 GeV/c (mainly pions)• Module operated with CO2 cooling at -20 °C• Signal-to-noise ratio:
2313th February 2013
CLW Origami -z Origami ce
p n p n
1 15.0 29.7 16.7 19.4
2 11.5 15.6 12.8 10.1
3+ 11.3 14.6 12.4 11.7
weighted avg. 12.6 21.7 13.7 14.2
• Many noisy channels due to wire bonding problems (new wire bonder)• Origami –z performed well (compared to single-sensor modules)• Origami ce suffered from noisy channels
VCI 2013, C. Irmler (HEPHY Vienna)
Outline
• Introduction• Assembly• Cooling• Summary
2413th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
Summary
• Origami chip-on-sensor concept– A low mass on-chip readout for 6” DSSD (0.55 X0 avg.)
– Feasibility proven by several prototypes– Will be utilized for the Belle II SVD– Assembly procedure shown for a 2-DSSD module
• Two-phase CO2 Cooling:– Single tube for several ladders– Design and prototypes of tube clamp available
• Beam test @ CERN in October 2012• Ladder production scheduled for autumn 2013!
2513th February 2013
26VCI 2013, C. Irmler (HEPHY Vienna)
Thank You
13th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
Backup Slides
2713th February 2013
VCI 2013, C. Irmler (HEPHY Vienna)
Belle II SVD
2813th February 2013
APV25 chips
Cooling pipe
Origami ladder
Sensor underneath flex circuit
Pitch adapter bentaround sensor edge
End ring (support)
VCI 2013, C. Irmler (HEPHY Vienna)
Team
K. Kamesh (TIFR), C. Irmler (HEPHY), Y. Onuki (Tokyo U.), K. Negishi (Tohoku U.)
2913th February 2013
E. Kato(Tohoku U.)
N. Shimizu(Tokyo U.)
VCI 2013, C. Irmler (HEPHY Vienna)
Origami PCBs
3 types of 3-layer Origami PCBs:– backward (-z), short tail– center (ce), for central sensor, long tail– forward (+z), routed along slanted sensor, complex shape
3013th February 2013
-z
ce
+z
VCI 2013, C. Irmler (HEPHY Vienna)
Pitch Adapters
• All available in single- and double-layer designs
• PA0: short, n-side, glued onto Origami PCB
• PA1: first half of p-side strips
• PA2: second half of p-side strips
3113th February 2013
Bond pads of single-layer PAs
VCI 2013, C. Irmler (HEPHY Vienna)
Attaching Airex
• We used one piece per sensor• Later we will use a single sheet per ladder