CONTACT US [email protected]WEBSITE ii-vi.com Rev. 01 APA4301010002 APA4301040002 APA4301120002 850nm 10Gb/s Dual Top Contact Multimode VCSEL Array Features: 850nm multimode emission Low spectral width Low threshold and operation current High reliability High humidity robustness compliant with GR468 Low electrical parasitics Data rates from DC to 10 Gb/s Dual top contact configuration with common cathode electrodes Available as single chip, 4 and 12 channel array RoHS compliant Applications: Single channel and parallel fiber optical communication links at 10Gb/s up to 300m. Smart cables, HDMI Shipment packaging options: Diced wafer on UV tape on metal lead frame Grip ring Gel-Pak
4
Embed
850nm 10Gbs Multimode Dual Top Contact VCSEL Array …...Dual Top Contact Multimode VCSEL Array Features: 850nm multimode emission Low spectral width Low threshold and operation current
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Dual top contact configuration with common cathodeelectrodes
Available as single chip, 4 and 12 channel array
RoHS compliant
Applications:
Single channel and parallel fiber optical communicationlinks at 10Gb/s up to 300m.
Smart cables, HDMI
Shipment packaging options:
Diced wafer on UV tape on metal lead frame
Grip ring
Gel-Pak
Wavelength tuning coefficient
Slope efficiency variation 25°C - 85°C
Thermal impedance
δλ/δT
∆ηT
Zth
-0.5
0.06
-0.3
3.0
-0.1
nm/K
%/K
K/mW
RatingsMin Typ Max
Parameter Symbol Unit
Thermal Characteristics
850nm 10Gb/s Multimode Dual Top Contact VCSEL Array
Threshold current
Slope efficiency
Optical output power
Operating voltage
Differential resistance
Emission wavelength
Spectral width, RMS
Modulation bandwidth
Rise time
Fall time
Capacitance
Beam divergence
Relative Intensity Noise
Threshold uniformity
Slope efficiency uniformity
mA
mW/mA
mW
V
Ω
nm
nm
GHz
ps
ps
pF
°
dB/Hz
mA
mW/mA
0.34
1.4
45
840
9
0.8
0.43
1.8
1.9
60
850
30
40
0.2
24
1.1
0.52
2.2
2.1
75
860
0.4
35
45
0.3
30
-128
0.15
0.05
RatingsMin Typ Max
I=4mA
Iop=5mA
Iop=5mA
Iop=5mA
Iop=5mA, T=-10°C - 85°C
Iop=5mA, T=-10°C - 85°C
Iop=5mA
Iop=5mA, ER=5dB, 20% - 80%
Iop=5mA, ER=5dB, 20% - 80%
Iop=5mA
Iop=5mA, Full width 1/e2
Iop = 5mA, ER=5dB, 7.7GHz bandwidth
Range across 1x4 and
1x12 array chips
Electro-Optical Characteristics
T=25°C unless otherwise noted
Parameter Symbol UnitConditions
Ith
η
Pout
Uop
Rd
λ
∆λ
f3dB
tr
tf
C
Θ
RIN(OMA)
∆Ith
∆η
2/22/4
2/22/4
Optical output power
Peak forward current (max. 10sec)
VCSEL reverse voltage
Operating temperature
Storage temperature
Mounting temperature (max. 10sec)
8
12
5
-10 to +85
-40 to +100
260
mW
mA
V
°C
°C
°C
Parameter Rating Unit
Die length, APA4301010002, APA4301010102, APA4301010202
Die length, APA4301040002, APA4301040102, APA4301040202
Die length, APA4301120002, APA4301120102, APA4301120202
Die width
Die height
210
960
2960
260
135
230
980
2980
280
150
250
1000
3000
300
165
µm
µm
µm
µm
µm
Parameter Min Typ Max Unit
Absolute Maximum Ratings
Chip Outer Dimensions
Chip Layout
N: n-contact (common cathode) P: p-contact (anode)M: mechanical pad
850nm 10Gb/s Multimode Dual Top Contact VCSEL Array
3/4
3/4
RoHS Compliance
II-VI is fully committed to environment protection and sustainable development and has set in place a comprehensive program for removing polluting and hazardous substances from all of its products. The relevant evidence of RoHS compli-ance is held as part of our controlled documentation for each of our compliant products. RoHS compliance parts are available to order, please refer to the ordering information section for further details.
Ordering InformationProduct Code Data Rate Description Shipment Packaging
APA4301010002 10Gb/s 850nm 10G MM DTC VCSEL chip Diced wafer on metal lead frame (1)
APA4301040002 10Gb/s 850nm 10G MM 1x4 DTC VCSEL array Diced wafer on metal lead frame (1)
APA4301120002 10Gb/s 850nm 10G MM 1x12 DTC VCSEL array Diced wafer on metal lead frame (1)
APA4301010102 10Gb/s 850nm 10G MM DTC VCSEL chip Grip ring (2)
APA4301040102 10Gb/s 850nm 10G MM 1x4 DTC VCSEL array Grip ring (2)
APA4301120102 10Gb/s 850nm 10G MM 1x12 DTC VCSEL array Grip ring (2)
APA4301010202 10Gb/s 850nm 10G MM DTC VCSEL chip Gel-Pak (3)
(1) Full diced 3’’ wafer on UV tape on metal lead frame Ø 230mm, electronic wafermap provided (standard high volume)(2) Known Good Dies on UV tape on grip ring Ø 150mm (medium volume)(3) Known Good Dies in 2’’ Gel-Pak (low volume)
Important Notice
Performance figures, data and any illustrative material provided in this data sheet are typical and must be specifically confirmed in writing by II-VI before they become applicable to any particular order or contract. In accordance with the II-VI policy of continuous improvement specifications may change without notice. Further details are available from any II-VI sales representative.
Safety Labels
850nm 10Gb/s Multimode Dual Top Contact VCSEL Array