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    SN54HC04, SN74HC04HEX INVERTERS

    SCLS078D DECEMBER 1982 REVISED JULY 2003

    1POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    D Wide Operating Voltage Range of 2 V to 6 V

    D Outputs Can Drive Up To 10 LSTTL Loads

    D

    Low Power Consumption, 20-A Max ICC

    D Typical tpd= 8 ns

    D 4-mA Output Drive at 5 V

    D

    Low Input Current of 1 A Max

    1

    2

    3

    4

    5

    6

    7

    14

    13

    12

    11

    10

    9

    8

    1A

    1Y

    2A

    2Y

    3A

    3Y

    GND

    VCC6A

    6Y

    5A

    5Y

    4A

    4Y

    SN54HC04 . . . J OR W PACKAGE

    SN74HC04 . . . D, N, NS, OR PW PACKAGE

    (TOP VIEW)

    3 2 1 20 19

    9 10 11 12 13

    4

    5

    6

    7

    8

    18

    17

    16

    15

    14

    6Y

    NC

    5A

    NC

    5Y

    2A

    NC

    2Y

    NC

    3A

    1Y

    1A

    NC

    4Y

    4A

    V 6A

    3Y

    GND

    NC

    SN54HC04 . . . FK PACKAGE

    (TOP VIEW)

    CC

    NC No internal connection

    description/ordering information

    The HC04 devices contain six independent inverters. They perform the Boolean functionY = A in positive logic.

    ORDERING INFORMATION

    TA PACKAGE ORDERABLE

    PART NUMBER

    TOP-SIDE

    MARKING

    PDIP N Tube of25 SN74HC04N SN74HC04N

    Tube of 50 SN74HC04D

    SOIC D Reel of 2500 SN74HC04DR HC04

    Reel of 250 SN74HC04DT

    SOP NS Reel of 2000 SN74HC04NSR HC04

    Tube of 90 SN74HC04PW

    TSSOP PW Reel of 2000 SN74HC04PWR HC04

    Reel of 250 SN74HC04PWT

    CDIP J Tube of 25 SNJ54HC04J SNJ54HC04J

    55C to 125C CFP W Tube of 150 SNJ54HC04W SNJ54HC04W

    LCCC FK Tube of 55 SNJ54HC04FK SNJ54HC04FK

    Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are

    available at www.ti.com/sc/package.

    FUNCTION TABLE

    (each inverter)

    INPUTA

    OUTPUTY

    H L

    L H

    Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

    Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

    Copyright 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.

    On products compliant to MIL-PRF-38535, all parameters are testedunless otherwise noted. On all other products, productionprocessing does not necessarily include testing of all parameters.

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    SN54HC04, SN74HC04HEX INVERTERSSCLS078DDECEMBER 1982REVISED JULY 2003

    2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    logic diagram (positive logic)

    A Y

    absolute maximum ratings over operating free-air temperature range (unless otherwise noted)

    Supply voltage range, VCC 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, IO (VO = 0 to VCC) 25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous current through VCC or GND 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Package thermal impedance, JA(see Note 2): D package 86C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    N package 80C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .NS package 76C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    PW package 113C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Storage temperature range, Tstg 65C to 150C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

    Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and

    functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not

    implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.

    2. The package thermal impedance is calculated in accordance with JESD 51-7.

    recommended operating conditions (see Note 3)

    SN54HC04 SN74HC04

    MIN NOM MAX MIN NOM MAX

    VCC Supply voltage 2 5 6 2 5 6 V

    VCC = 2 V 1.5 1.5

    VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V

    VCC = 6 V 4.2 4.2

    VCC = 2 V 0.5 0.5

    VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V

    VCC = 6 V 1.8 1.8

    VI Input voltage 0 VCC 0 VCC V

    VO Output voltage 0 VCC 0 VCC V

    VCC = 2 V 1000 1000

    t/v Input transition rise/fall time VCC = 4.5 V 500 500 ns

    VCC = 6 V 400 400

    TA Operating free-air temperature 55 125 40 85 C

    NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,

    Implications of Slow or Floating CMOS Inputs, literature number SCBA004.

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    SN54HC04, SN74HC04HEX INVERTERS

    SCLS078DDECEMBER 1982REVISED JULY 2003

    3POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    electrical characteristics over recommended operating free-air temperature range (unlessotherwise noted)

    TA = 25C SN54HC04 SN74HC04 CC

    MIN TYP MAX MIN MAX MIN MAX

    2 V 1.9 1.998 1.9 1.9

    IOH =20 A 4.5 V 4.4 4.499 4.4 4.4VOH VI = VIH or VIL 6 V 5.9 5.999 5.9 5.9 V

    IOH =4 mA 4.5 V 3.98 4.3 3.7 3.84

    IOH =5.2 mA 6 V 5.48 5.8 5.2 5.34

    2 V 0.002 0.1 0.1 0.1

    IOL = 20 A 4.5 V 0.001 0.1 0.1 0.1

    VOL VI = VIH or VIL 6 V 0.001 0.1 0.1 0.1 V

    IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33

    IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33

    II VI = VCC or 0 6 V 0.1 100 1000 1000 nA

    ICC VI = VCC or 0, IO = 0 6 V 2 40 20 A

    Ci 2 V to 6 V 3 10 10 10 pF

    switching characteristics over recommended operating free-air temperature range, CL = 50 pF(unless otherwise noted) (see Figure 1)

    FROM TO TA = 25C SN54HC04 SN74HC04

    (INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX MIN MAX

    2 V 45 95 145 120

    tpd A Y 4.5 V 9 19 29 24 ns

    6 V 8 16 25 20

    2 V 38 75 110 95

    tt Y 4.5 V 8 15 22 19 ns

    6 V 6 13 19 16

    operating characteristics, TA = 25C

    PARAMETER TEST CONDITIONS TYP UNIT

    Cpd Power dissipation capacitance per inverter No load 20 pF

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    SN54HC04, SN74HC04HEX INVERTERSSCLS078DDECEMBER 1982REVISED JULY 2003

    4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    PARAMETER MEASUREMENT INFORMATION

    VOLTAGE WAVEFORM

    INPUT RISE AND FALL TIMES

    50%50%10%10%

    90% 90%VCC

    0 V

    tr tf

    Input

    VOLTAGE WAVEFORMS

    PROPAGATION DELAY AND OUTPUT TRANSITION TIMES

    50%

    50%50%10%10%

    90% 90%

    VCC

    VOH

    VOL

    0 V

    tr tf

    Input

    In-PhaseOutput

    50%

    tPLH tPHL

    50% 50%10% 10%

    90%90%VOH

    VOLtrtf

    tPHL tPLH

    Out-of-Phase

    Output

    Test

    Point

    From Output

    Under Test

    CL = 50 pF

    (see Note A)

    LOAD CIRCUIT

    NOTES: A. CL includes probe and test-fixture capacitance.

    B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following

    characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns.C. The outputs are measured one at a time with one input transition per measurement.

    D. tPLH and tPHL are the same as tpd.

    Figure 1. Load Circuit and Voltage Waveforms

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    I M P O R T A N T N O T I C E

    T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a k e c o r r e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e a n y p r o d u c t o r s e r v i c e w i t h o u t n o t i c e . C u s t o m e r s s h o u l d o b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y t h a t s u c h i n f o r m a t i o n i s c u r r e n t a n d c o m p l e t e . A l l p r o d u c t s a r e s o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c k n o w l e d g m e n t .

    T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c a b l e a t t h e t i m e o f s a l e i n a c c o r d a n c e w i t h T I s

    s t a n d a r d w a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t T I d e e m s n e c e s s a r y t o s u p p o r t t h i s w a r r a n t y . E x c e p t w h e r e m a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d u c t i s n o t n e c e s s a r i l y p e r f o r m e d .

    T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . C u s t o m e r s a r e r e s p o n s i b l e f o r t h e i r p r o d u c t s a n d a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t o m e r p r o d u c t s a n d a p p l i c a t i o n s , c u s t o m e r s s h o u l d p r o v i d e a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .

    T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o r k r i g h t , o r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f o r m a t i o n p u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .

    R e p r o d u c t i o n o f i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p a n i e d b y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n .

    R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e

    v o i d s a l l e x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n d i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .

    T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i f e s u p p o r t ) w h e r e a f a i l u r e o f t h e T I p r o d u c t w o u l d r e a s o n a b l y b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a r t i e s h a v e e x e c u t e d a n a g r e e m e n t s p e c i f i c a l l y g o v e r n i n g s u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t y a n d r e g u l a t o r y r a m i f i c a t i o n s o f t h e i r a p p l i c a t i o n s , a n d a c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r y a n d s a f e t y - r e l a t e d r e q u i r e m e n t s c o n c e r n i n g t h e i r p r o d u c t s a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n g a n y a p p l i c a t i o n s - r e l a t e d i n f o r m a t i o n o r s u p p o r t t h a t m a y b e p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s a g a i n s t a n y d a m a g e s a r i s i n g o u t o f t h e u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .

    T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e T I p r o d u c t s a r e s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r o d u c t s d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e m e e t m i l i t a r y s p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c t s w h i c h T I h a s n o t d e s i g n a t e d a s m i l i t a r y - g r a d e i s s o l e l y a t t h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e g a l a n d r e g u l a t o r y r e q u i r e m e n t s i n c o n n e c t i o n w i t h s u c h u s e .

    T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e s p e c i f i c T I p r o d u c t s a r e d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t , i f t h e y u s e a n y n o n - d e s i g n a t e d p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t o m e e t s u c h r e q u i r e m e n t s .

    F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m e n t s p r o d u c t s a n d a p p l i c a t i o n s o l u t i o n s :

    P r o d u c t s A p p l i c a t i o n s

    A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o

    D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e

    D S P d s p . t i . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d

    I n t e r f a c e i n t e r f a c e . t i . c o m D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r o l

    L o g i c l o g i c . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y

    P o w e r M g m t p o w e r . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w o r k

    M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y

    L o w P o w e r w w w . t i . c o m / l p w T e l e p h o n y w w w . t i . c o m / t e l e p h o n y

    W i r e l e s s V i d e o & I m a g i n g w w w . t i . c o m / v i d e o

    W i r e l e s s w w w . t i . c o m / w i r e l e s s

    M a i l i n g A d d r e s s : T e x a s I n s t r u m e n t s , P o s t O f f i c e B o x 6 5 5 3 0 3 , D a l l a s , T e x a s 7 5 2 6 5 C o p y r i g h t 2 0 0 7 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d

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    PACKAGING INFORMATION

    Orderable Device Status (1) PackageType

    PackageDrawing

    Pins PackageQty

    Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

    5962-8409801VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

    5962-8409801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

    84098012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

    8409801CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

    8409801DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

    JM38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

    JM38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

    JM38510/65701BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

    SN54HC04J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

    SN74HC04D ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DE4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DG4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DR ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DT ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DTE4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04DTG4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04N ACTIVE PDIP N 14 25 Pb-Free(RoHS)

    CU NIPDAU N / A for Pkg Type

    SN74HC04N3 OBSOLETE PDIP N 14 TBD Call TI Call TI

    SN74HC04NE4 ACTIVE PDIP N 14 25 Pb-Free(RoHS)

    CU NIPDAU N / A for Pkg Type

    SN74HC04NSR ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PW ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    PACKAGE OPTION ADDENDUM

    www.ti.com 18-Feb-2009

    Addendum-Page 1

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    Orderable Device Status (1) PackageType

    PackageDrawing

    Pins PackageQty

    Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)

    SN74HC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI

    SN74HC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWT ACTIVE TSSOP PW 14 250 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SN74HC04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &no Sb/Br)

    CU NIPDAU Level-1-260C-UNLIM

    SNJ54HC04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type

    SNJ54HC04J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type

    SNJ54HC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type

    SNV54HC04J ACTIVE CDIP J 14 TBD Call TI Call TI

    SNV54HC04W ACTIVE CFP W 14 TBD Call TI Call TI

    (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.

    (2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

    http://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

    (3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

    temperature.

    Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.

    In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.

    OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :

    Automotive: SN74HC04-Q1

    PACKAGE OPTION ADDENDUM

    www.ti.com 18-Feb-2009

    Addendum-Page 2

    http://www.ti.com/productcontenthttp://focus.ti.com/docs/prod/folders/print/sn74hc04-q1.htmlhttp://focus.ti.com/docs/prod/folders/print/sn74hc04-q1.htmlhttp://www.ti.com/productcontent
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    NOTE: Qualified Version Definitions:

    Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects

    PACKAGE OPTION ADDENDUM

    www.ti.com 18-Feb-2009

    Addendum-Page 3

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    TAPE AND REEL INFORMATION

    *All dimensions are nominal

    Device PackageType

    PackageDrawing

    Pins SPQ ReelDiameter

    (mm)

    ReelWidth

    W1 (mm)

    A0 (mm) B0 (mm) K0 (mm) P1(mm)

    W(mm) Q

    SN74HC04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0

    SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

    SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0

    SN74HC04NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0

    SN74HC04PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0

    PACKAGE MATERIALS INFORMATION

    www.ti.com 19-Mar-2008

    Pack Materials-Page 1

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    *All dimensions are nominal

    Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

    SN74HC04DBR SSOP DB 14 2000 346.0 346.0 33.0

    SN74HC04DR SOIC D 14 2500 333.2 345.9 28.6

    SN74HC04DR SOIC D 14 2500 346.0 346.0 33.0

    SN74HC04NSR SO NS 14 2000 346.0 346.0 33.0

    SN74HC04PWR TSSOP PW 14 2000 346.0 346.0 29.0

    PACKAGE MATERIALS INFORMATION

    www.ti.com 19-Mar-2008

    Pack Materials-Page 2

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    MECHANICAL DATA

    MSSO002E JANUARY 1995 REVISED DECEMBER 2001

    POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE

    4040065 /E 12/01

    28 PINS SHOWN

    Gage Plane

    8,20

    7,40

    0,55

    0,95

    0,25

    38

    12,90

    12,30

    28

    10,50

    24

    8,50

    Seating Plane

    9,907,90

    30

    10,50

    9,90

    0,38

    5,60

    5,00

    15

    0,22

    14

    A

    28

    1

    2016

    6,506,50

    14

    0,05 MIN

    5,905,90

    DIM

    A MAX

    A MIN

    PINS **

    2,00 MAX

    6,90

    7,50

    0,65 M0,15

    08

    0,10

    0,09

    0,25

    NOTES: A. All linear dimensions are in millimeters.

    B. This drawing is subject to change without notice.

    C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

    D. Falls within JEDEC MO-150

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    MECHANICAL DATA

    MLCC006B OCTOBER 1996

    POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER

    4040140/ D 10/96

    28 TERMINAL SHOWN

    B

    0.358

    (9,09)

    MAX

    (11,63)

    0.560

    (14,22)

    0.560

    0.458

    0.858

    (21,8)

    1.063

    (27,0)

    (14,22)

    ANO. OF

    MINMAX

    0.358

    0.660

    0.761

    0.458

    0.342

    (8,69)

    MIN

    (11,23)

    (16,26)

    0.640

    0.739

    0.442

    (9,09)

    (11,63)

    (16,76)

    0.962

    1.165

    (23,83)

    0.938

    (28,99)

    1.141

    (24,43)

    (29,59)

    (19,32)(18,78)

    **

    20

    28

    52

    44

    68

    84

    0.020 (0,51)

    TERMINALS

    0.080 (2,03)

    0.064 (1,63)

    (7,80)

    0.307

    (10,31)

    0.406

    (12,58)

    0.495

    (12,58)

    0.495

    (21,6)

    0.850

    (26,6)

    1.047

    0.045 (1,14)

    0.045 (1,14)

    0.035 (0,89)

    0.035 (0,89)

    0.010 (0,25)

    121314151618 17

    11

    10

    8

    9

    7

    5

    432

    0.020 (0,51)

    0.010 (0,25)

    6

    12826 27

    19

    21

    B SQ

    A SQ

    22

    23

    24

    25

    20

    0.055 (1,40)

    0.045 (1,14)

    0.028 (0,71)

    0.022 (0,54)

    0.050 (1,27)

    NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.

    C. This package can be hermetically sealed with a metal lid.

    D. The terminals are gold plated.

    E. Falls within JEDEC MS-004

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    MECHANICAL DATA

    MTSS001C JANUARY 1995 REVISED FEBRUARY 1999

    POST OFFICE BOX 655303 DALLAS, TEXAS 75265

    PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE

    14 PINS SHOWN

    0,65 M0,10

    0,10

    0,25

    0,50

    0,75

    0,15 NOM

    Gage Plane

    28

    9,80

    9,60

    24

    7,90

    7,70

    2016

    6,60

    6,40

    4040064/F 01/97

    0,30

    6,60

    6,20

    8

    0,19

    4,30

    4,50

    7

    0,15

    14

    A

    1

    1,20 MAX

    14

    5,10

    4,90

    8

    3,10

    2,90

    A MAX

    A MIN

    DIM

    PINS **

    0,05

    4,90

    5,10

    Seating Plane

    08

    NOTES: A. All linear dimensions are in millimeters.

    B. This drawing is subject to change without notice.

    C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

    D. Falls within JEDEC MO-153

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