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SN54HC04, SN74HC04HEX INVERTERS
SCLS078D DECEMBER 1982 REVISED JULY 2003
1POST OFFICE BOX 655303 DALLAS, TEXAS 75265
D Wide Operating Voltage Range of 2 V to 6 V
D Outputs Can Drive Up To 10 LSTTL Loads
D
Low Power Consumption, 20-A Max ICC
D Typical tpd= 8 ns
D 4-mA Output Drive at 5 V
D
Low Input Current of 1 A Max
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1Y
2A
2Y
3A
3Y
GND
VCC6A
6Y
5A
5Y
4A
4Y
SN54HC04 . . . J OR W PACKAGE
SN74HC04 . . . D, N, NS, OR PW PACKAGE
(TOP VIEW)
3 2 1 20 19
9 10 11 12 13
4
5
6
7
8
18
17
16
15
14
6Y
NC
5A
NC
5Y
2A
NC
2Y
NC
3A
1Y
1A
NC
4Y
4A
V 6A
3Y
GND
NC
SN54HC04 . . . FK PACKAGE
(TOP VIEW)
CC
NC No internal connection
description/ordering information
The HC04 devices contain six independent inverters. They perform the Boolean functionY = A in positive logic.
ORDERING INFORMATION
TA PACKAGE ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP N Tube of25 SN74HC04N SN74HC04N
Tube of 50 SN74HC04D
SOIC D Reel of 2500 SN74HC04DR HC04
Reel of 250 SN74HC04DT
SOP NS Reel of 2000 SN74HC04NSR HC04
Tube of 90 SN74HC04PW
TSSOP PW Reel of 2000 SN74HC04PWR HC04
Reel of 250 SN74HC04PWT
CDIP J Tube of 25 SNJ54HC04J SNJ54HC04J
55C to 125C CFP W Tube of 150 SNJ54HC04W SNJ54HC04W
LCCC FK Tube of 55 SNJ54HC04FK SNJ54HC04FK
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each inverter)
INPUTA
OUTPUTY
H L
L H
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2003, Texas Instruments IncorporatedPRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.
On products compliant to MIL-PRF-38535, all parameters are testedunless otherwise noted. On all other products, productionprocessing does not necessarily include testing of all parameters.
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SN54HC04, SN74HC04HEX INVERTERSSCLS078DDECEMBER 1982REVISED JULY 2003
2 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
logic diagram (positive logic)
A Y
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC 0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 1) 20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous output current, IO (VO = 0 to VCC) 25 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Continuous current through VCC or GND 50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Package thermal impedance, JA(see Note 2): D package 86C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .NS package 76C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Storage temperature range, Tstg 65C to 150C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54HC04 SN74HC04
MIN NOM MAX MIN NOM MAX
VCC Supply voltage 2 5 6 2 5 6 V
VCC = 2 V 1.5 1.5
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VCC = 6 V 4.2 4.2
VCC = 2 V 0.5 0.5
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VCC = 6 V 1.8 1.8
VI Input voltage 0 VCC 0 VCC V
VO Output voltage 0 VCC 0 VCC V
VCC = 2 V 1000 1000
t/v Input transition rise/fall time VCC = 4.5 V 500 500 ns
VCC = 6 V 400 400
TA Operating free-air temperature 55 125 40 85 C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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SN54HC04, SN74HC04HEX INVERTERS
SCLS078DDECEMBER 1982REVISED JULY 2003
3POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unlessotherwise noted)
TA = 25C SN54HC04 SN74HC04 CC
MIN TYP MAX MIN MAX MIN MAX
2 V 1.9 1.998 1.9 1.9
IOH =20 A 4.5 V 4.4 4.499 4.4 4.4VOH VI = VIH or VIL 6 V 5.9 5.999 5.9 5.9 V
IOH =4 mA 4.5 V 3.98 4.3 3.7 3.84
IOH =5.2 mA 6 V 5.48 5.8 5.2 5.34
2 V 0.002 0.1 0.1 0.1
IOL = 20 A 4.5 V 0.001 0.1 0.1 0.1
VOL VI = VIH or VIL 6 V 0.001 0.1 0.1 0.1 V
IOL = 4 mA 4.5 V 0.17 0.26 0.4 0.33
IOL = 5.2 mA 6 V 0.15 0.26 0.4 0.33
II VI = VCC or 0 6 V 0.1 100 1000 1000 nA
ICC VI = VCC or 0, IO = 0 6 V 2 40 20 A
Ci 2 V to 6 V 3 10 10 10 pF
switching characteristics over recommended operating free-air temperature range, CL = 50 pF(unless otherwise noted) (see Figure 1)
FROM TO TA = 25C SN54HC04 SN74HC04
(INPUT) (OUTPUT) CC MIN TYP MAX MIN MAX MIN MAX
2 V 45 95 145 120
tpd A Y 4.5 V 9 19 29 24 ns
6 V 8 16 25 20
2 V 38 75 110 95
tt Y 4.5 V 8 15 22 19 ns
6 V 6 13 19 16
operating characteristics, TA = 25C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance per inverter No load 20 pF
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SN54HC04, SN74HC04HEX INVERTERSSCLS078DDECEMBER 1982REVISED JULY 2003
4 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
VOLTAGE WAVEFORM
INPUT RISE AND FALL TIMES
50%50%10%10%
90% 90%VCC
0 V
tr tf
Input
VOLTAGE WAVEFORMS
PROPAGATION DELAY AND OUTPUT TRANSITION TIMES
50%
50%50%10%10%
90% 90%
VCC
VOH
VOL
0 V
tr tf
Input
In-PhaseOutput
50%
tPLH tPHL
50% 50%10% 10%
90%90%VOH
VOLtrtf
tPHL tPLH
Out-of-Phase
Output
Test
Point
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
NOTES: A. CL includes probe and test-fixture capacitance.
B. Phase relationships between waveforms were chosen arbitrarily. All input pulses are supplied by generators having the following
characteristics: PRR 1 MHz, ZO = 50 , tr = 6 ns, tf = 6 ns.C. The outputs are measured one at a time with one input transition per measurement.
D. tPLH and tPHL are the same as tpd.
Figure 1. Load Circuit and Voltage Waveforms
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I M P O R T A N T N O T I C E
T e x a s I n s t r u m e n t s I n c o r p o r a t e d a n d i t s s u b s i d i a r i e s ( T I ) r e s e r v e t h e r i g h t t o m a k e c o r r e c t i o n s , m o d i f i c a t i o n s , e n h a n c e m e n t s , i m p r o v e m e n t s , a n d o t h e r c h a n g e s t o i t s p r o d u c t s a n d s e r v i c e s a t a n y t i m e a n d t o d i s c o n t i n u e a n y p r o d u c t o r s e r v i c e w i t h o u t n o t i c e . C u s t o m e r s s h o u l d o b t a i n t h e l a t e s t r e l e v a n t i n f o r m a t i o n b e f o r e p l a c i n g o r d e r s a n d s h o u l d v e r i f y t h a t s u c h i n f o r m a t i o n i s c u r r e n t a n d c o m p l e t e . A l l p r o d u c t s a r e s o l d s u b j e c t t o T I s t e r m s a n d c o n d i t i o n s o f s a l e s u p p l i e d a t t h e t i m e o f o r d e r a c k n o w l e d g m e n t .
T I w a r r a n t s p e r f o r m a n c e o f i t s h a r d w a r e p r o d u c t s t o t h e s p e c i f i c a t i o n s a p p l i c a b l e a t t h e t i m e o f s a l e i n a c c o r d a n c e w i t h T I s
s t a n d a r d w a r r a n t y . T e s t i n g a n d o t h e r q u a l i t y c o n t r o l t e c h n i q u e s a r e u s e d t o t h e e x t e n t T I d e e m s n e c e s s a r y t o s u p p o r t t h i s w a r r a n t y . E x c e p t w h e r e m a n d a t e d b y g o v e r n m e n t r e q u i r e m e n t s , t e s t i n g o f a l l p a r a m e t e r s o f e a c h p r o d u c t i s n o t n e c e s s a r i l y p e r f o r m e d .
T I a s s u m e s n o l i a b i l i t y f o r a p p l i c a t i o n s a s s i s t a n c e o r c u s t o m e r p r o d u c t d e s i g n . C u s t o m e r s a r e r e s p o n s i b l e f o r t h e i r p r o d u c t s a n d a p p l i c a t i o n s u s i n g T I c o m p o n e n t s . T o m i n i m i z e t h e r i s k s a s s o c i a t e d w i t h c u s t o m e r p r o d u c t s a n d a p p l i c a t i o n s , c u s t o m e r s s h o u l d p r o v i d e a d e q u a t e d e s i g n a n d o p e r a t i n g s a f e g u a r d s .
T I d o e s n o t w a r r a n t o r r e p r e s e n t t h a t a n y l i c e n s e , e i t h e r e x p r e s s o r i m p l i e d , i s g r a n t e d u n d e r a n y T I p a t e n t r i g h t , c o p y r i g h t , m a s k w o r k r i g h t , o r o t h e r T I i n t e l l e c t u a l p r o p e r t y r i g h t r e l a t i n g t o a n y c o m b i n a t i o n , m a c h i n e , o r p r o c e s s i n w h i c h T I p r o d u c t s o r s e r v i c e s a r e u s e d . I n f o r m a t i o n p u b l i s h e d b y T I r e g a r d i n g t h i r d - p a r t y p r o d u c t s o r s e r v i c e s d o e s n o t c o n s t i t u t e a l i c e n s e f r o m T I t o u s e s u c h p r o d u c t s o r s e r v i c e s o r a w a r r a n t y o r e n d o r s e m e n t t h e r e o f . U s e o f s u c h i n f o r m a t i o n m a y r e q u i r e a l i c e n s e f r o m a t h i r d p a r t y u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f t h e t h i r d p a r t y , o r a l i c e n s e f r o m T I u n d e r t h e p a t e n t s o r o t h e r i n t e l l e c t u a l p r o p e r t y o f T I .
R e p r o d u c t i o n o f i n f o r m a t i o n i n T I d a t a b o o k s o r d a t a s h e e t s i s p e r m i s s i b l e o n l y i f r e p r o d u c t i o n i s w i t h o u t a l t e r a t i o n a n d i s a c c o m p a n i e d b y a l l a s s o c i a t e d w a r r a n t i e s , c o n d i t i o n s , l i m i t a t i o n s , a n d n o t i c e s . R e p r o d u c t i o n o f t h i s i n f o r m a t i o n w i t h a l t e r a t i o n i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r s u c h a l t e r e d d o c u m e n t a t i o n .
R e s a l e o f T I p r o d u c t s o r s e r v i c e s w i t h s t a t e m e n t s d i f f e r e n t f r o m o r b e y o n d t h e p a r a m e t e r s s t a t e d b y T I f o r t h a t p r o d u c t o r s e r v i c e
v o i d s a l l e x p r e s s a n d a n y i m p l i e d w a r r a n t i e s f o r t h e a s s o c i a t e d T I p r o d u c t o r s e r v i c e a n d i s a n u n f a i r a n d d e c e p t i v e b u s i n e s s p r a c t i c e . T I i s n o t r e s p o n s i b l e o r l i a b l e f o r a n y s u c h s t a t e m e n t s .
T I p r o d u c t s a r e n o t a u t h o r i z e d f o r u s e i n s a f e t y - c r i t i c a l a p p l i c a t i o n s ( s u c h a s l i f e s u p p o r t ) w h e r e a f a i l u r e o f t h e T I p r o d u c t w o u l d r e a s o n a b l y b e e x p e c t e d t o c a u s e s e v e r e p e r s o n a l i n j u r y o r d e a t h , u n l e s s o f f i c e r s o f t h e p a r t i e s h a v e e x e c u t e d a n a g r e e m e n t s p e c i f i c a l l y g o v e r n i n g s u c h u s e . B u y e r s r e p r e s e n t t h a t t h e y h a v e a l l n e c e s s a r y e x p e r t i s e i n t h e s a f e t y a n d r e g u l a t o r y r a m i f i c a t i o n s o f t h e i r a p p l i c a t i o n s , a n d a c k n o w l e d g e a n d a g r e e t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r a l l l e g a l , r e g u l a t o r y a n d s a f e t y - r e l a t e d r e q u i r e m e n t s c o n c e r n i n g t h e i r p r o d u c t s a n d a n y u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s , n o t w i t h s t a n d i n g a n y a p p l i c a t i o n s - r e l a t e d i n f o r m a t i o n o r s u p p o r t t h a t m a y b e p r o v i d e d b y T I . F u r t h e r , B u y e r s m u s t f u l l y i n d e m n i f y T I a n d i t s r e p r e s e n t a t i v e s a g a i n s t a n y d a m a g e s a r i s i n g o u t o f t h e u s e o f T I p r o d u c t s i n s u c h s a f e t y - c r i t i c a l a p p l i c a t i o n s .
T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n m i l i t a r y / a e r o s p a c e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e T I p r o d u c t s a r e s p e c i f i c a l l y d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e o r " e n h a n c e d p l a s t i c . " O n l y p r o d u c t s d e s i g n a t e d b y T I a s m i l i t a r y - g r a d e m e e t m i l i t a r y s p e c i f i c a t i o n s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t a n y s u c h u s e o f T I p r o d u c t s w h i c h T I h a s n o t d e s i g n a t e d a s m i l i t a r y - g r a d e i s s o l e l y a t t h e B u y e r ' s r i s k , a n d t h a t t h e y a r e s o l e l y r e s p o n s i b l e f o r c o m p l i a n c e w i t h a l l l e g a l a n d r e g u l a t o r y r e q u i r e m e n t s i n c o n n e c t i o n w i t h s u c h u s e .
T I p r o d u c t s a r e n e i t h e r d e s i g n e d n o r i n t e n d e d f o r u s e i n a u t o m o t i v e a p p l i c a t i o n s o r e n v i r o n m e n t s u n l e s s t h e s p e c i f i c T I p r o d u c t s a r e d e s i g n a t e d b y T I a s c o m p l i a n t w i t h I S O / T S 1 6 9 4 9 r e q u i r e m e n t s . B u y e r s a c k n o w l e d g e a n d a g r e e t h a t , i f t h e y u s e a n y n o n - d e s i g n a t e d p r o d u c t s i n a u t o m o t i v e a p p l i c a t i o n s , T I w i l l n o t b e r e s p o n s i b l e f o r a n y f a i l u r e t o m e e t s u c h r e q u i r e m e n t s .
F o l l o w i n g a r e U R L s w h e r e y o u c a n o b t a i n i n f o r m a t i o n o n o t h e r T e x a s I n s t r u m e n t s p r o d u c t s a n d a p p l i c a t i o n s o l u t i o n s :
P r o d u c t s A p p l i c a t i o n s
A m p l i f i e r s a m p l i f i e r . t i . c o m A u d i o w w w . t i . c o m / a u d i o
D a t a C o n v e r t e r s d a t a c o n v e r t e r . t i . c o m A u t o m o t i v e w w w . t i . c o m / a u t o m o t i v e
D S P d s p . t i . c o m B r o a d b a n d w w w . t i . c o m / b r o a d b a n d
I n t e r f a c e i n t e r f a c e . t i . c o m D i g i t a l C o n t r o l w w w . t i . c o m / d i g i t a l c o n t r o l
L o g i c l o g i c . t i . c o m M i l i t a r y w w w . t i . c o m / m i l i t a r y
P o w e r M g m t p o w e r . t i . c o m O p t i c a l N e t w o r k i n g w w w . t i . c o m / o p t i c a l n e t w o r k
M i c r o c o n t r o l l e r s m i c r o c o n t r o l l e r . t i . c o m S e c u r i t y w w w . t i . c o m / s e c u r i t y
L o w P o w e r w w w . t i . c o m / l p w T e l e p h o n y w w w . t i . c o m / t e l e p h o n y
W i r e l e s s V i d e o & I m a g i n g w w w . t i . c o m / v i d e o
W i r e l e s s w w w . t i . c o m / w i r e l e s s
M a i l i n g A d d r e s s : T e x a s I n s t r u m e n t s , P o s t O f f i c e B o x 6 5 5 3 0 3 , D a l l a s , T e x a s 7 5 2 6 5 C o p y r i g h t 2 0 0 7 , T e x a s I n s t r u m e n t s I n c o r p o r a t e d
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PACKAGING INFORMATION
Orderable Device Status (1) PackageType
PackageDrawing
Pins PackageQty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
5962-8409801VCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
5962-8409801VDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
84098012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
8409801CA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
8409801DA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
JM38510/65701B2A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
JM38510/65701BCA ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
JM38510/65701BDA ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SN54HC04J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SN74HC04D ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DBR ACTIVE SSOP DB 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DBRE4 ACTIVE SSOP DB 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DBRG4 ACTIVE SSOP DB 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DE4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DG4 ACTIVE SOIC D 14 50 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DR ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DRE4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DRG4 ACTIVE SOIC D 14 2500 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DT ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DTE4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04DTG4 ACTIVE SOIC D 14 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04N ACTIVE PDIP N 14 25 Pb-Free(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC04N3 OBSOLETE PDIP N 14 TBD Call TI Call TI
SN74HC04NE4 ACTIVE PDIP N 14 25 Pb-Free(RoHS)
CU NIPDAU N / A for Pkg Type
SN74HC04NSR ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04NSRG4 ACTIVE SO NS 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PW ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWE4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWG4 ACTIVE TSSOP PW 14 90 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Orderable Device Status (1) PackageType
PackageDrawing
Pins PackageQty
Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
SN74HC04PWLE OBSOLETE TSSOP PW 14 TBD Call TI Call TI
SN74HC04PWR ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWRE4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWRG4 ACTIVE TSSOP PW 14 2000 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWT ACTIVE TSSOP PW 14 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWTE4 ACTIVE TSSOP PW 14 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SN74HC04PWTG4 ACTIVE TSSOP PW 14 250 Green (RoHS &no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
SNJ54HC04FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54HC04J ACTIVE CDIP J 14 1 TBD A42 SNPB N / A for Pkg Type
SNJ54HC04W ACTIVE CFP W 14 1 TBD A42 N / A for Pkg Type
SNV54HC04J ACTIVE CDIP J 14 TBD Call TI Call TI
SNV54HC04W ACTIVE CFP W 14 TBD Call TI Call TI
(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part ina new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.
(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirementsfor all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be solderedat high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die andpackage, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHScompatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flameretardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isprovided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to theaccuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to takereasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis onincoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limitedinformation may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TIto Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54HC04, SN54HC04-SP, SN74HC04 :
Automotive: SN74HC04-Q1
PACKAGE OPTION ADDENDUM
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NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
PACKAGE OPTION ADDENDUM
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TAPE AND REEL INFORMATION
*All dimensions are nominal
Device PackageType
PackageDrawing
Pins SPQ ReelDiameter
(mm)
ReelWidth
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1(mm)
W(mm) Q
SN74HC04DBR SSOP DB 14 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0
SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0
SN74HC04DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0
SN74HC04NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0
SN74HC04PWR TSSOP PW 14 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0
PACKAGE MATERIALS INFORMATION
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*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74HC04DBR SSOP DB 14 2000 346.0 346.0 33.0
SN74HC04DR SOIC D 14 2500 333.2 345.9 28.6
SN74HC04DR SOIC D 14 2500 346.0 346.0 33.0
SN74HC04NSR SO NS 14 2000 346.0 346.0 33.0
SN74HC04PWR TSSOP PW 14 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
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MECHANICAL DATA
MSSO002E JANUARY 1995 REVISED DECEMBER 2001
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,506,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M0,15
08
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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MECHANICAL DATA
MLCC006B OCTOBER 1996
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FK (S-CQCC-N**) LEADLESS CERAMIC CHIP CARRIER
4040140/ D 10/96
28 TERMINAL SHOWN
B
0.358
(9,09)
MAX
(11,63)
0.560
(14,22)
0.560
0.458
0.858
(21,8)
1.063
(27,0)
(14,22)
ANO. OF
MINMAX
0.358
0.660
0.761
0.458
0.342
(8,69)
MIN
(11,23)
(16,26)
0.640
0.739
0.442
(9,09)
(11,63)
(16,76)
0.962
1.165
(23,83)
0.938
(28,99)
1.141
(24,43)
(29,59)
(19,32)(18,78)
**
20
28
52
44
68
84
0.020 (0,51)
TERMINALS
0.080 (2,03)
0.064 (1,63)
(7,80)
0.307
(10,31)
0.406
(12,58)
0.495
(12,58)
0.495
(21,6)
0.850
(26,6)
1.047
0.045 (1,14)
0.045 (1,14)
0.035 (0,89)
0.035 (0,89)
0.010 (0,25)
121314151618 17
11
10
8
9
7
5
432
0.020 (0,51)
0.010 (0,25)
6
12826 27
19
21
B SQ
A SQ
22
23
24
25
20
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)
0.022 (0,54)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a metal lid.
D. The terminals are gold plated.
E. Falls within JEDEC MS-004
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MECHANICAL DATA
MTSS001C JANUARY 1995 REVISED FEBRUARY 1999
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
8
0,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM
PINS **
0,05
4,90
5,10
Seating Plane
08
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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