520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 1 520/530/580.495 Microfabrication Laboratory and 520.773 Advanced Topics In Fabrication and Microengineering (VLSI) Very Large Scale Integrated Circuits and (MEMS) Microelectromechanical Systems
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 1
520/530/580.495Microfabrication Laboratory
and
520.773Advanced Topics
In Fabrication and Microengineering
(VLSI) Very Large Scale Integrated Circuits
and
(MEMS) Microelectromechanical Systems
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 2
VLSI and MOSIS (Metal Oxide Semiconductor
Implementation System)• AMI 0.5 and 1.5 micron CMOS• TSMC 0.35 and 0.25 micron CMOS• IBM SiGe 0.25, 0.18 micron BiCMOS• Peregrine 0.5 micron SOS CMOS
520.216, 520.491, 520.492 will teach you you how to analyze and design analog and digital integrated circuits.
Key idea: Use a number of different manufacturers to contribute manufacturing capacity to multiuserprojects.
http://www.mosis.org/
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 3
NMOS Fabrication (I)
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 4
NMOS Fabrication (II)
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 5
CMOS Inverter
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 6
DRAM
A 1-Gb DRAM that contains over 2 billion components. (Photograph courtesy of IBM/Siemens, 1999 IEEE Int. Solid State Circuit Conference.)
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 7
Non-volatile MEMORY (Floating Gate)
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 8
MUMP(MultiUser MEMS Process)
• PolyMUMP: 3 layer polysilicon surface micromachining
• SOIMUMP: 3 mask Silicon On Insulator bulk micromachining
• MetalMUMP: electroplated nickel process.
520/530.487 next semester will teach you you how to analyze and design microsystems in MUMP process.
Key idea: Use a series of functional layers combined with sacrificial layers to produced desired structures
http://www.memscap.com/memsrus/crmumps.html
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 9
Poly MUMPs
PSG: Sacrificial, Polysilicon: Functional
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 10
Spinning Gear
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 11
What did we learn?
• Process Architecture• Mask Design • Photolithography• Silicon Oxidation• Wet Etching• Thin Film Deposition (evaporation)• Photoresist and Photoepoxy (SU-8)
processing• Packaging• Testing
520/530/580.495 Fall 2003 © A.G. Andreou and J. Wang 12
Microfabrication Laboratory and Her Friends
MicrofabricationLaboratory
Introduction to MEMS
520/580.487Analog
IntegratedCircuits520.494
Mixed SignalVLSI
520.492
ElectronicsDesign Lab
520.448
AdvancedTopics in
Fabrication520.773
Introductionto VLSI520.216
BioMEMSand
Biosensors57x.yyy
Chemical Eng. for
Micro and Nano540.440/640
CAD of Digital VLSI
520.491