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PERIPHERAL EQUIPMENTINTERFACE SPECIFICATIONS

MODEL 360C/SULTRASONIC LARGE/SMALL

WIRE BONDERDOCUMENT P/N: DC05-172000

RE-ISSUE DATE: August, 2002

Orthodyne Electronics Corporation16700 Red Hill AvenueIrvine, California, U.S.A. 92606-4802Telephone (949) 660-0440FAX 949-660-0444

E-mail: [email protected]

All Rights Reserved.

Copyright 2001 by Orthodyne Electronics Corp.

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TABLE OF CONTENTS

CHAPTER 1 Specification 1-1 Revision History 1-1 Objective 1-2 Scope 1-2 Reference Drawings 1-2

General Description 1-3 Emergency Stop Input 1-6

Handler Interface: All Modes 1-7 Operation 1-7 Basic Hardware Implementation 1-7 Extended Hardware Implementation 1-8

Standard Mode Handler Type 1 (Automatic) 1-9 Description 1-9 Standard Mode Handler Type 1- Basic I/O Lines 1-11 Signal Description 1-11 Standard Mode Handler Type 1- Basic I/O Lines 1-14 Run Sequence Signal Timing 1-14

Standard Mode Handler Type 1 - Extended I/O Lines 1-16 Signal Description 1-16

File Change Operation 1-18Standard Mode Handler Type 1 - Extended I/O Lines 1-19

Run Sequence Signal Timing 1-19Remote Mode Handler Type 2 (Remote) 1-22

Description 1-22 Remote Mode Handler Type 2 - Basic I/O Lines 1-24 Signal Description 1-24 Remote Mode Handler Type 2 - Basic I/O Lines 1-28 Run Sequence Signal Timing 1-28

Remote Mode Handler Type 2 - Extended I/O Lines 1-30 Signal Description 1-30 Command Transfer Sequence 1-31 Remote Mode Handler Type 2 - Extended I/O Lines 1-33 Run Sequence Signal Timing 1-33

Command Set 1-34 Single Byte Commands 1-34 Multiple Byte Commands 1-34 Command Errors 1-35

ALC PULLTEST REMOTE SPECIFICATIONS 1-39 Revision History 1-39

General Description 1-39 System Requirements 1-40

Standard Mode Handler Type 1 1-41 Description 1-41 Interface Signal Description - Standard Mode 1-41

Remote Mode Handler Type 2 1-44 Description 1-44 Interface Signal Description - Remote Mode 1-44

MODEL 360C/S PERIPHERAL EQUIPMENT INTERFACE MANUAL TOC-1

C H A P T E R 1

24 Aug. 1992 Created.24 Feb. 1993 Updated to reflect new handler type names.03 June 1993 Added drawing 6 (172071).29 Oct. 1994 Changed min. timing spec., E-stop description.20 Oct. 1994 Correct error in remote mode file change command.

18 Jan. 1999 Updated and corrected manual to reflect changes in I/O board.22 June 1999 Added "Note" recommending the use of opto-isolators.02 July 1999 Added "ALC Pulltest Remote Control Specifications".22 July 1999 Updated drawings 175555, 175557, 172509, 175510, 172071 to latest revisions.6 July 2000 Updated all drawings to latest revision. Updated text on pages 10, 11, 14, 19, 22,

26, 30, 30, and 31 with reformat headings.8 August 2000 Updated Drawings and Schematics section and made text and diagram changes

to reflect drawing updates.1 August 2001 Added the Error Message section to the Standard and Remote Handler sections.11 November 2001 Added information about 5.8C software revision to ALC Pulltest Remote

Specifications.29 April 2002 Added drawings 172530, 172532, 172575, and 172577 older rev. I/O and Dis-

crete I/O schematics for reference use.

PERIPHERAL EQUIPMENT INTERFACE

Specification

Revision History

MODEL 360C/S PERIPHERAL INTERFACE MANUAL 1-1

Objective PERIPHERAL EQUIPMENT INTERFACE

The objective of this document is to provide all relevant informationregarding connecting a handler/host controller to the Model 360C/S

This document covers the physical connections and the electrical signalspecifications of the various peripheral interfaces. The softwareimplementation of the peripheral interface is also covered in this document.

Objective

Scope

Reference Drawings

1. 172071 Workholder Plate, M360C2. 172410 Outline Dimensions, M360C3. 172509 Standard and Remote Handler Interface

Schematic4. 175510 I/O Schematic, M360C

175512 Universal I/O Interface Board with PLC Adapter PCB Assembly, M360C

175555 Handler Interface PLC Adapter Schematic, M360C

7. 175557 Handler Interface PLC Adapter PCB Assembly, M360C

1-2 MODEL 360C/S PERIPHERAL INTERFACE MANUAL

PERIPHERAL EQUIPMENT INTERFACE General Description

The Model 360C provides facilities for connection of several types ofperipheral equipment. All external peripherals are connected to the bonderthrough connectors on the front connector panel located just above theelectronics drawer. These connectors are shown in Figure 1-1 below:

Figure 1-1 Connector Locations

General Description

1. HANDLER The handler interface port providescommunication between the bonder andan automated parts handling systems ora host controller. This port containshandshake lines (minimum require-ments) and data lines (can be used asoptional lines). This port is implement-ed as a DB37S type connector, and ac-cepts signals with voltage levels up to24 V. max (See WARNING note later indocument).

2. PRINTER A Centronics compatible port to con-nect to a parallel printer for printing ofsetup parameters or other relevant datafrom the data terminal screen. This portis standard on all machines. This is im-plemented as a DB25S type connector,similar to one on an IBM style PC.

Handler Interface Connector

Parallel Printer

Handler Power

Emergency Stop

Signal Sample

LVDT Signal

Main Power Switch

ESD GroundKeypad Connector

Keyboard Connector

RS 232 Port


General Description PERIPHERAL EQUIPMENT INTERFACE

NOTE: On some older machines, the HANDLER connector is markedHANDLER(REMOTE), and the RS-232 connector is markedHANDLER(LOCAL) or ORTHODYNE.

WARNING: VOLTAGE LEVELS:

a). If you have an I/O board, P/N 172532, the maximum sig-nal voltage can be up to 24V.

b). If you have the Universal I/O board, P/N 175512 Rev Mor later, the maximum signal voltage can be up to 24V.

c). If you have the universal style I/O board, P/N 175512,Rev L or earlier, you MUST install PLC Adapter board, P/N175557, to operate up to 24V. If you do not install thisAdapter board, your TTL signal cannot exceed 5V.

NOTE: Orthodyne recommends the use of Opto-Isolators for both inputsand outputs. This will prevent line noise and potential differ-ences between the bonder and handling system from interferingwith proper communication. Even with Opto-Isolators, a commonground between the bonder and the interface equipment must beused. Refer to drawing 172509 Standard and Remote HandlerInterface Schematic, sheet 1 of 2.

If non-opto-isolated signal lines are used, Orthodyne recom-mends the use of a signal voltage of 24 volts. The PLC Adapterboard P/N 175557 is required when using the universal style I/Oboard, P/N 175512, Rev L or earlier, and voltages above 5 volts.Refer to drawing 172509 Standard and Remote Handler InterfaceSchematic for the sample interface.

3. HANDLER POWER This connector provides power forOrthodyne designed handlers andshould not be used with handlers de-signed by customers or third party inte-grators.

4.

5. EMERGENCY STOP An EMERGENCY STOP input, imple-mented as a BNC style connector.


PERIPHERAL EQUIPMENT INTERFACE General Description

NOTE: 1) If mounting a workholder/clamp fixture on the table top of theModel 360C that weighs more than 50 kg, install the SupportLegs Kit #172402. This kit will stabilize the table top.

2) Do not physically attach a non-Orthodyne part feeding/loadingmechanism directly to the bonder. External equipment that isphysically attached may cause excessive vibration to the bonder.This could result in bonding problems. However, the part clamp-ing fixture must be firmly attached to the bonder.


Emergency Stop Input PERIPHERAL EQUIPMENT INTERFACE

The EMERGENCY STOP input is provided to connect to a normally openswitch or NPN transistor. A switch closure bringing this signal to groundwill activate the Emergency Stop. This is implemented as a BNC connector,with the case being ground and the conductor being the EMERGENCYSTOP input.

The EMERGENCY STOP input is provided to connect to a normally closedswitch or relay. Opening the switch contacts will disable the D.C. powersupply, cutting off all power to the machine motors and control electronics.This is implemented as a BNC connector, and is shipped with a shorting pluginstalled on machines not factory equipped with an emergency stop switch.

NOTE: If you are not sure which style of emergency stop your machineis equipped with, check the front panel BNC connector. If themachine runs without anything plugged into the emergency stopconnector, then it is the older style.

Emergency Stop Input

Machines Shipped Before October 1993

Machines Shipped After October 1993


PERIPHERAL EQUIPMENT INTERFACE Handler Interface: All Modes

The Model 360C has two modes of operation, manual and automatic.Manual operation includes manual positioning, edit functions, and single/multiple device run modes. Automatic operation is available when thebonder is in auto-run (or Remote auto-run), selected via the RUN MENU.Handler design should provide for locally selectable manual or automaticmodes of operation.

Design of handling equipment should provide for test and manual operationof the handler based on the “ready” status of the bonder. Note that noprovision is made for remote control by the bonder of individual handlerfunctions. Operation under automatic mode shall conform to the protocoldescribed herein. The bonder powers up in a manual mode. Handlingequipment should also come up under handler local or manual control. Resetoperations should also default to manual control.

A manual emergency stop switch should be provided on the handler to haltall mechanical motion if a system malfunction is encountered. Connectionsare provided on the bonder to receive this emergency stop signal, should it bedesired that this signal also halt all bonder activity. These connections are:

� Emergency Stop (BNC connector on Front Panel)

The Model 360C provides eleven (11)TTL compatible CONTROL lines forpart handling equipment interface. Inputs to the bonder are TTL compatibleinputs equipped with pull-up resistors, designed to interface to open collectoroutputs. Outputs from the bonder suitable for drivingTTL compatible loads.

An interface signal is considered to be “ON” when there is a logical “0”(ground) on the interface line. Inputs to the bonder are pulled up to 5 voltsthrough 10k ohm resistors. Outputs from the bonder.

The interface connector at the bonder is a type DB-37S.

Handler Interface: All Modes

Operation

Basic Hardware Implementation


Extended Hardware Implementation PERIPHERAL EQUIPMENT INTERFACE

The Model 360C provides twenty (20) TTL compatible DATA lines forhandling equipment interface. These are made up of 10 inputs and 10outputs. Electrically, the signal lines have the same specifications as thestandard (basic) I/O lines described earlier.

NOTE: M360C’s manufactured prior to January 1997 may be equippedwith an older style I/O board (P/N 172532). In order to use theExtended I/O lines, you will have to install the Discrete I/Ooption kit, P/N 172577. Contact your Orthodyne representativefor more details.

Extended Hardware Implementation


PERIPHERAL EQUIPMENT INTERFACE Standard Mode Handler Type 1 (Automatic)

The Standard Mode handler interface is intended for those handlers with aminimum of on-board intelligence. The bonder controls the index cyclebased on parameters programmed in the bonder HANDLER PARAMETERSscreen. The handler indexes when commanded, and tells the bonder whetheror not there is a device present at the bond station (assembly present line).The bonder then decides whether to continue to cycle based on the numberof successive indexes without seeing a device (see Handler ParameterScreen, Index retries). The bonder can also stop cycling based on the numberof successive PR failures. (See System Parameter Screen, PR fails allowed.)

For Handler type 1:

Handler type selects the handler to be used with the Model 360C. When thecursor highlights the handler type field, the choices of handler types andcorresponding reference numbers appear in a box near the bottom of thescreen. If no handler is used, select Handler 0. If set to 0, AUTOMATIC onthe RUN MENU screen will be unavailable.

Standard Mode Handler Type 1 (Automatic)

Description

File nameLink

HANDLER PARAMETERS Log

Handler type 1

Index delay 0

Handler timeout 4

Index retries 20

File change at index Start

Cache enable Link

F13: Save parameters

ARROWS

F16: Abort edit


Description PERIPHERAL EQUIPMENT INTERFACE

Index delay (Automatic only) occurs after bonding is complete and delaysthe start of the next index by the Index Delay Seconds. Press [START] tobegin the index immediately. This function is only available with handlertype = 1, and is useful with manual load/unload handling systems, (i.e.Rotary Handler.)

Units: seconds Minimum: 0 Maximum: 59

Handler timeout is the number of seconds the bonder will wait for thehandler to index a part. If no parts are indexed within this time, the bonderassumes the handling system has run out of parts. Recommended wait periodis 4 seconds. If timeout is set to 0, the timeout is disabled and the Bonderwill wait an infinite time for parts.


Index retries is the number of consecutive times the bonder will instruct thehandler to index a part if no part is present for bonding. (This is availableonly with the Standard handler.)

Units: devices Minimum: 0 Maximum: 999

File change at index is used when linking files through the Link List option(item B on the Edit Menu). Press [TOGGLE] or [SPACE] to toggle betweenEnd/Off/Start. End means the bonder will load the next file at the end of theindex. Start means the bonder will load the next file at the beginning of theindex. Off disables the file change option. This is available only withHandler type 1.

Cache enable Loads Wire List Files into RAM. This parameter is useful inautomated systems when you need to load files rapidly. Press [TOGGLE] or[SPACE] to toggle between Link/Off. Link loads only the files specified inthe current link list. Off disables the cache load option.

NOTE: The File change at index, Remote extended commands, andCache enabled options are available on all M-360C machinesthat have the new universal I/O board (P/N175512) installed, andonly available on older machines which have I/O board 172532and the Discrete I/O option (P/N 172577) installed.


PERIPHERAL EQUIPMENT INTERFACE Standard Mode Handler Type 1- Basic I/O Lines

Signal Description

The basic I/O implementation is standard on all bonders. It consists of 11hardware signal lines built into the interface board, and provides theminimum capability required to interface a handling system. Figure 1-2shows the directions of signals for the basic handler I/O. Refer to thefollowing sections for signal descriptions.

Figure 1-2 Standard Mode Handler Type 1 - Basic I/O Signal Direction

NOTE: The BONDER STANDBY, DEVICE COMPLETE, PR FAIL,TOUCH-DOWN, CUT-SWITCH, HANDLER READY, andREMOTE STOP signals are functionally the same for both theStandard and Remote Mode handler types.

BONDER READY (Pin 20): (Bonder to handler) This line indicates the “ready”status of the bonder. It is turned ON by the bonder when indexing of thehandler is permitted. In handler manual operation, when this line is OFF thehandler must not be allowed to perform any local operation (such as indexing,clamping, etc.) which might interfere with the bonder.

Standard Mode Handler Type 1- Basic I/O Lines


Signal Description PERIPHERAL EQUIPMENT INTERFACE

On power up this line is undefined until the bonder is initialized. This lineshould be disregarded while the handler is in automatic mode, in which casehandler operation should only be allowed on receipt of an INDEXASSEMBLY command.

BONDER STOPPED (Pin 2): (Bonder to handler) This line, when turned ON,indicates that the bonder has encountered an error condition. It is analogous tothe red status light. It will be turned OFF when the error condition has beencleared.

BONDER STANDBY (Pin 21): (Bonder to handler) This line will be turned ONwhenever the bonder is in manual mode and not in an error condition. It isanalogous to the amber status light. This line will be turned OFF when thebonder either starts bonding or encounters an error condition.

INDEX ASSEMBLY (Pin 3): (Bonder to handler) This line commands thehandler to perform an index cycle. It is turned ON by the bonder when itrequires a part for bonding. This line is meaningful only for automatic modepart processing. The handler automatic mode must respond to this line byturning OFF HANDLER READY. The bonder will then turn OFF INDEXASSEMBLY. If the handler is in manual mode, this line may be disregarded.(Note that when the bonder is in manual mode, pressing the “INDEX” key onthe bonder keypad will cause the bonder to assert the INDEX ASSEMBLY.This provides a means to manually index parts, provided the handler is inautomatic mode.)

DEVICE COMPLETE (Pin 4): (Bonder to handler) The DEVICE COMPLETEoutput indicates the completion of one device and the start of the next inmultiple device assemblies. It will turn ON at the completion of bonding onthe current device and turn OFF at the start of PR (or bonding) on the nextdevice. The duration of this signal is thus dependent on the time it takes totravel from the last bond of one device to the first bond (or PR) of the nextdevice.

PR FAIL (Pin 23): (Bonder to handler) This line indicates that PR failed on thedevice currently at the bond station. The PR FAIL output is turned ON whenthe PR fail occurs, and is turned OFF at the start of the first PR on the nextdevice. The PR FAIL output will, in addition to the operation describedabove, turn ON again at the start of the index cycle if there was a PR failureon any device in the assembly. The duration of the PR FAIL between devicesis dependent on the distance the XY stage has to move from the failed PRarea to the first PR area on the next device. It is only active in bonderautomatic mode, remaining OFF at all other times. If the operator manuallyassists the PR (via the PR ASSISTANCE screen), including the [F14]: SkipFailures command, then the PR is considered to be valid and this line will notbe turned ON. It will be turned ON only if the bonder aborts bonding of thedevice due to PR failure, [F16]: Abort PR scan (via the PR ASSISTANCEscreen), or PR fails allowed ≠ 0 (via SYSTEM PARAMETER screen).


PERIPHERAL EQUIPMENT INTERFACE

TOUCH-DOWN (Pin 5): (Bonder to handler) This line will be turned ON whenthe bond head LVDT senses that the bond head has touched the surfaceduring bonding. It will be turned OFF when the bond head LVDT no longersenses the surface while lifting up from the bond. It is serviced only duringbonding, and will not reflect the status of the bond head LVDT at any othertime. Note that the duration of the TOUCH-DOWN output is not guaranteed.It will last as long as the bond time plus overtravel time plus touch up tosurface time plus any pre-bond delays.

CUT-SWITCH (Pin 24): (Bonder to handler) This line will be turned ON whenthe cut switch makes contact during bonding. It will be turned OFF when thecut switch breaks contact while lifting up after the cut. It is serviced onlyduring bonding, and will not reflect the status of the cut switch at any othertime. Note that the duration of the CUT-SWITCH output is not guaranteed. Itwill last only as long as the switch contacts are actually closed. When LVDTis used for the cut sensor, this line is turned ON by the software to simulate aCut Switch.

HANDLER READY (Pin 25): (Handler to bonder) This line indicates the“ready” status of the handler. It should be turned ON when the handler is in ahome condition and it is safe for the bond head to move. This line must beturned OFF when the handler is not home, during indexing, and at any othertime that may not be safe for the bonder to operate. In handler automaticmode, this line is turned OFF to signal the receipt of an INDEXASSEMBLY command and turned back ON to signal the end of the indexcycle.

ASSEMBLY PRESENT (Pin 7): (Handler to bonder) This line indicateswhether or not an assembly is present at the bond station. It should be turnedON when there is an assembly present and ready for bonding, and turnedOFF when the bond station is empty. In handler automatic mode,ASSEMBLY PRESENT must precede HANDLER READY by at least 10milliseconds or more. It must not be turned ON after the HANDLERREADY line is turned ON in handler automatic mode. A transition of theASSEMBLY PRESENT signal after the HANDLER READY is turned ONmay not be recognized. Bonding will not take place unless both ASSEMBLYPRESENT and HANDLER READY are turned ON.

REMOTE STOP (Pin 26): (Handler to bonder) This line duplicates the bonderoperator panel stop switch. When turned ON, it will cause the bonder to stopbonding at the end of the current wire.


Standard Mode Handler Type 1- Basic I/O Lines PERIPHERAL EQUIPMENT INTERFACE

Run Sequence Signal Timing

Refer to Figure 1-3 for basic signal timing in the standard operating mode.

Figure 1-3 Basic Signal Timing Diagram For Standard Mode

The handler must be ready (HANDLER READY ON) before the bonder willallow auto-run. If the handler is not ready (HANDLER READY OFF), thebonder will remain in, or return to, manual mode. Note that the BONDERREADY signal is undefined in auto-run, and the handler should disregardBONDER READY while in handler automatic mode. There are a minimumnumber of “hand-shake” lines required for Standard Mode interface. Theseare: Handler Ready, Index Assembly, and Assembly Present.

Standard Mode Handler Type 1- Basic I/O Lines

Next Cycle


PERIPHERAL EQUIPMENT INTERFACE Run Sequence Signal Timing

1. Handler is ready and HANDLER READY is turned ON.

2. Bonder is placed in Automatic-Run via the RUN MENU.

3. The bonder turns ON INDEX ASSEMBLY.

4. The handler responds to the INDEX ASSEMBLY command by turningOFF HANDLER READY. This tells the bonder that the handler hasreceived the INDEX ASSEMBLY command.

5. The bonder responds to HANDLER READY signal by turning OFFINDEX ASSEMBLY.

This completes the handshake and the handler may now proceed withthe index cycle.

If the handler does not respond to INDEX ASSEMBLY within a presettime (Handler Timeout in the HANDLER PARAMETER screen), thebonder will enter a “Handler Timeout Error” condition.

6. When the handler has completed the index cycle, the ASSEMBLYPRESENT signal should have been updated. ASSEMBLY PRESENTshould be turned ON if an assembly is present, and turned OFF if anassembly is not present.

7. After the ASSEMBLY PRESENT line has been updated, the handlerturns ON the HANDLER READY signal.

NOTE: The ASSEMBLY PRESENT must precede the HANDLERREADY by at least 10 milliseconds

8. On detection that HANDLER READY has come back ON, the bonderchecks the ASSEMBLY PRESENT signal. If an assembly is notpresent, the bonder loops back to the start of the Automatic RunSequence and commands another index of the handler. This will con-tinue until the bonder sees ASSEMBLY PRESENT ON or until it hasre-tried the number of times specified by the operator in the HandlerParameters screen (Index retries).

9. If an assembly is present, the bonder begins the bond cycle.

10. After the bond cycle is successfully completed and after INDEXDELAY (if programmed), the bonder loops back to Step 3 of the Auto-matic Run Sequence.


Standard Mode Handler Type 1 - Extended I/O Lines PERIPHERAL EQUIPMENT INTERFACE

s

EERAX

Vx

HANDLER

Signal Description

The extended I/O configuration adds eight (8) additional signal lines to thebasic configuration. See Figure 1-4. These additional lines are available toimplement remote file change and are in addition to the eleven (11) standardhandler I/O lines previously described. The following figure shows thedirections of signals for the Extended Handler I/O lines. Refer to thefollowing sections for signal descriptions.

Figure 1-4 Standard Handler Type Extended I/O Signal Direction

DATA IN 0 THROUGH 7. (Handler to bonder) These lines are used tosend the bonder a binary coded number representing the next wire list to bebonded. The eight lines allow a wire list to be selected from a table of 256wire lists. The binary file number is formed by selectively turning these linesON and OFF, with bit 0 being the least significant and bit 7 being the mostsignificant. (Note that due to the interface lines being negative true (ON islogical “0”), the byte as read directly on the interface lines will be a one'scomplement of the actual file number.)

Standard Mode Handler Type 1 - Extended I/O Line

19

37

18

36

17

35

16

34

15

33

14

32

13

31

12

30

11

29

10

28

9

27

O

O

O

O

I

I

I

I

I

I

I

I

I

O

O

DATA-IN-0

DATA-IN-1

DATA-IN-2

DATA-IN-3

DATA-IN-4

DATA-IN-5

DATA-IN-6

DATA-IN-7

PULLTEST

COMMAND-ACKNOWLEDGE

DATA-OUT-0

DATA-OUT-1

DATA-OUT-2

DATA-OUT-3

DATA-OUT-4

DATA-IN-0

DATA-IN-1

DATA-IN-2

DATA-IN-3

DATA-IN-4

DATA-IN-5

DATA-IN-6

DATA-IN-7

COMMAND-PRESENT

COMMAND-ACKNOWLEDGE

DATA-OUT-0

DATA-OUT-1

DATA-OUT-2

DATA-OUT-3

DATA-OUT-4

DATA-OUT-5

DATA-OUT-6

DATA-OUT-7

DATA-PRESENT

DATA-ACKNOWLEDGE

O

O

O

O

I

DATA-OUT-5

DATA-OUT-6

PULLTEST-FAIL

DATA PRESENT

PROCEED

GND

GND

INPUT VOLTAGFROM HANDLUP TO 24V M(OPTIONAL)

BONDER


PERIPHERAL EQUIPMENT INTERFACE Signal Description

NOTE: Data-In lines must be stable prior to changing HANDLERREADY by at least 10 milliseconds.

COMMAND PRESENT (Pin 31) (Handler to bonder) This line is usedwith Remote Mode Handler Type 2 only.

COMMAND ACKNOWLEDGE (Pin 13) (Bonder to handler) This line isused with Remote Mode Handler Type 2 only.

NOTE: The DATA PRESENT, DATA ACKNOWLEDGE, and DATAOUT lines are for future expansion and are not used at this time.


File Change Operation PERIPHERAL EQUIPMENT INTERFACE

The bonder will read the DATA IN lines during the index cycle and load thefile specified by the binary number on the DATA IN lines. The file load mayoccur at the beginning of the index cycle, or after the index cycle iscomplete. This is software selectable in the “File change at index” field ofthe HANDLER PARAMETERS screen.

The binary file number is linked to the file name by which the file is storedon disk via the LINK LIST EDIT function. If a file number is input that isnot referenced to a file name, an error message is displayed, auto run isaborted, and the current file is deselected. (See Run Mode Screen in theM360C User’s Manual for further explanation.)

If file change at START of index is selected, then the DATA IN lines may bechanged at any time HANDLER READY is ON. The DATA IN lines mustbe stable at least 10 milliseconds before HANDLER READY is turned OFFat the start of the next index cycle, and should remain stable for the durationof the index cycle. When the HANDLER READY line turns OFF at thebeginning of the index cycle, the bonder then reads the DATA IN lines andstarts the file load.

If file change at END of index is selected, then the DATA IN lines may bechanged at any time HANDLER READY is OFF. The DATA IN lines mustbe stable at least 10 milliseconds before HANDLER READY is turned backON at the end of the index cycle, and should remain stable for the duration ofthe bond cycle.

When the HANDLER READY line turns back on at the end of the indexcycle, the bonder then reads the DATA IN lines and starts the file load.

Bonding will not take place until after the new file is loaded.

File Change Operation


PERIPHERAL EQUIPMENT INTERFACE Standard Mode Handler Type 1 - Extended I/O Lines

St


The following signal diagram, Figure 1-5, illustrates the proper sequence forfile change operation in Standard Mode.

Figure 1-5 Signal Sequence For File Change In Standard Mode

andard Mode Handler Type 1 - Extended I/O Lines


Error Messages PERIPHERAL EQUIPMENT INTERFACE

Error Messages

[23] ASSEMBLY NOT PRESENTNo part was indexed into the bonding station. This error appears only onbonders equipped with a standard handling system.

[29] HANDLER NOT READYThis message appears when bonder attempts an operation requiring handlerinterface and the handler does not respond. This usually indicates that thehandler was in the NOT READY state or is not connected properly. It isalso possible that the incorrect handler type was specified on the HAN-DLER PARAMETERS screen.

[30] HANDLER TIMEOUT EXCEEDEDNo parts were indexed within the time specified on the HANDLER PA-RAMETERS screen. Standard handler only.

[36] LINK FILE ENTRY (#) IS EMPTYThis error occurs when the discrete I/O lines refer to an undefined entry inthe current link list.

[37] NO WIRE LIST FILE SELECTEDThis message appears in automatic mode if a file could not be loaded as in-dicated by the discrete I/O lines and an attempt was made to bond.

[205] FILE "filename": ERROR CONDITION PREVENTS BONDING

A file loaded through the link list has errors. Bonding cannot continue.

[212] UNABLE TO LOAD FILE REFERENCED BY LINK LIST

During an index operation, the discrete I/O lines specify the wire list to beloaded for the next assembly. This message indicates that a file error oc-curred while attempting to load the referenced wire list file.

To enable wire list selection through the link list, the discrete I/O optionmust be installed. Further, in the HANDLER PARAMETERS screen, theHandler type must set to 1 (Standard) and the File change at index set toStart or End, or the Handler type must be set to 2 (Remote) and the Remoteextended commands must be set to Yes.


PERIPHERAL EQUIPMENT INTERFACE Error Messages

[313] CACHE ERRORWhen cache mode in HANDLER PARAMETERS screen is set to Link, thefiles whose names are listed in the currently selected link list are loaded intomain memory. This organized collection of files in memory is referred toas a file cache. This error will occur if there is not enough memory to holdall the required files in the file cache.

[371] File “filename” is in link list. Delete anyway?An attempt was made to delete a file which is referenced in the currently se-lected link list. Later attempt to select this file via the handler interface willresult in an error if this file is deleted.

[444] No files in link listAn attempt was made to load the cache through the link list but there are nofiles specified in the link list and there is no wire list currently selected.

[453] NO LINK FILE SELECTED. CACHE WILL NOT BE LOADED

This message appears when cache is enabled, but no link list file is currentlyselected. The system will load the cache after you select a link list file.


Remote Mode Handler Type 2 (Remote) PERIPHERAL EQUIPMENT INTERFACE

Remote Mode Handler interface allows the bonder to be controlled by thehandler via the basic and extended I/O lines. The hardware implementationuses the eleven (11) basic I/O interface lines and (optionally) the extended I/Olines. The 11 basic I/O lines are handshaking lines, while the extended I/Olines are used for parallel inputs to the bonder and outputs from the bonder.

A subset of the Remote Mode interface is still available using only theexisting 11 basic I/O lines (basic configuration), but does not support theextended command set.

Figure 1-6 Screen for Handler Type 2

Handler type 2 selects the Remote Mode handler interface. See Figure 1-6.

Remote Mode Handler Type 2 (Remote)

Description

File nameLink

HANDLER PARAMETERS Log

Handler type 2

Handler timeout 4

Remote extended commands Yes

Cache enable Link

F13: Save parameters

ARROWS

F16: Abort edit


PERIPHERAL EQUIPMENT INTERFACE Description

Handler timeout During periods when the Bonder is idle (in Remote Modewaiting for commands from the Handler), the Bonder monitors the HandlerReady line. If the Handler Ready turns OFF for longer than the HandlerTimeout duration, the Bonder will assume there is a problem with theHandler and will turn on the red status light (if equipped). This can serve toalert the Operator that there is a problem on the Handler when the Handler isnot equipped with status lights.


Remote extended commands Set Remote extended commands to No whenthe handler will operate in the basic remote mode. Press [TOGGLE] or[SPACE] to toggle to Yes. When set to Yes, the bonder will operate in fullremote mode handler interface.

Cache enable Loads Wire List Files into RAM. This parameter is useful inautomated systems when you need to load files rapidly. Press [TOGGLE] or[SPACE] to toggle between Link/Off. Link loads only the files specified inthe current link list. Off disables the cache load option. Note the followingrules apply when set to link:

NOTE: The File change at index, Remote extended commands, andCache enabled options are available on all M-360C machinesthat have the new universal I/O board (P/N175512) installed, andonly available on older machines which have I/O board 172532and the Discrete I/O option (P/N 172577) installed.


Remote Mode Handler Type 2 - Basic I/O Lines PERIPHERAL EQUIPMENT INTERFACE

Signal Description

The basic I/O implementation of the Remote Mode handler type consists of thesame eleven (11) basic interface lines as the Standard Mode handler type,although the functionality of some of these lines changes due to the requirementsof Remote Mode. Figure 1-7 shows the directions of signals for the basicRemote Mode handler I/O. Refer to the following sections for signaldescriptions.

Figure 1-7 Remote Mode Handler Type 2 - Basic I/O Signal Direction

NOTE: The BONDER STANDBY, DEVICE COMPLETE, PR FAIL,TOUCH-DOWN, CUT-SWITCH, HANDLER READY, andREMOTE STOP signals are functionally the same for both theStandard and Remote Mode handler types.

Remote Mode Handler Type 2 - Basic I/O Lines



BONDER READY (Pin 20): (Bonder to handler) This line indicates the“ready” status of the bonder. It is turned ON by the bonder when indexing of thehandler is permitted. In bonder manual operation, when this line is OFF thehandler should not be allowed to perform any local operation (such as indexing,clamping, etc.) which might interfere with the bonder. On power up, this line isundefined until the bonder is initialized. While in Remote Mode Run, this line isused to indicate that the bonder has completed all operations and is ready toaccept further commands.

BONDER STOPPED (Pin 2): (Bonder to handler) This line is a dualfunction signal:

� During bonding, this line (when turned ON) indicates that thebonder has encountered an error condition. It is analogous to thered status light and will be turned OFF when the error conditionhas been cleared.

� During command transfer on the extended I/O lines, BONDERSTOPPED being turned ON indicates an error in the commanddata (see EXTENDED I/O - COMMAND ERRORS for details).

BONDER STANDBY (Pin 21): (Bonder to handler) This line will beturned ON whenever the bonder is in manual mode and not in an errorcondition. It is analogous to the amber status light. This line will be turnedOFF when the bonder either starts bonding or encounters an error condition.

BONDER REMOTE AUTO-RUN (Pin 3): (Bonder to handler) This linewill be turned ON whenever the bonder is in Remote Mode selected from theRUN MENU. Note that the bonder will not accept Remote Mode Runcommands unless Remote Mode has been selected from the RUN MENU.

DEVICE COMPLETE (Pin 4): (Bonder to handler) The DEVICECOMPLETE output indicates the completion of one device and the start ofthe next in multiple device assemblies. It will turn ON at the completion ofbonding on the current device and turn OFF at the start of PR (or bonding)on the next device. The duration of this signal is thus dependent on the timeit takes to travel from the last bond of one device to the first bond (or PR) ofthe next device.

PR FAIL (Pin 23): (Bonder to handler) This line indicates that the PRfailed on the device currently at the bond station. The PR FAIL output isturned ON when the PR fail occurs, and is turned OFF at the start of the firstPR on the next device. The PR FAIL output will, in addition to the operationdescribed above, turn ON again on completion of the assembly if there was aPR failure on any device in the assembly. The duration of the PR FAILbetween devices is dependent on the distance the XY stage has to move fromthe failed PR area to the first PR area on the next device. It is only activewhen Remote Mode Run has been selected, remaining OFF at all othertimes.


Signal Description PERIPHERAL EQUIPMENT INTERFACE

If the operator manually assists the PR (PR ASSISTANCE screen), includingthe [F14]: Skip PR failures command, then the PR is considered to be validand this line will NOT be turned ON. It will be turned ON only if the bonderaborts bonding of the device due to PR failure: "[F16]: Abort PR scan" (PRASSISTANCE screen) , o r Skip PR ass is t in Remote (SYSTEMPARAMETER screen).

Note that, unlike the Standard Mode handler interface, excessive PR failureswill not stop the bonder if Skip PR assist in Remote is selected. The bonderstops at the end of the assembly to wait for further commands, at which timeit is up to the host controller (handler) to decide whether or not there havebeen excessive PR failures.

TOUCH-DOWN (Pin 5): (Bonder to handler) This line will be turned ONwhen the bond head LVDT senses that the bond head has touched the surfaceduring bonding. It will be turned OFF when the bond head LVDT no longersenses the surface while lifting up from the bond. It is serviced only duringbonding, and will not reflect the status of the bond head LVDT at any othertime. Note that the duration of the TOUCH-DOWN output is not guaranteed.It will last only as long as the bond time plus overtravel time plus touch up tosurface time plus any pre-bond delays.

CUT-SWITCH (Pin 24): (Bonder to handler) This line will be turned ONwhen the cut switch makes contact during bonding. It will be turned OFF whenthe cut switch breaks contact while lifting up after the cut. It is serviced onlyduring bonding, and will not reflect the status of the cut switch at any other time.Note that the duration of the CUT-SWITCH output is not guaranteed. It will lastonly as long as the switch contacts are actually closed.When LVDT is used forthe cut sensor, this line is turned ON by the software to simulate a CutSwitch.

HANDLER READY (Pin 25): (Handler to bonder) This line indicates the“ready” status of the handler. It should be turned ON when the handler is in ahome condition and it is safe for the bond head to move. This line should beturned OFF when the handler is not home, during indexing, and at any othertime that may not be safe for the bonder to operate. HANDLER READY willonly be monitored in manual mode, and prior to selecting Remote ModeRun. During Remote Mode, it is monitored to implement the HandlerTimeout Feature, but is not used in any other way.

BOND COMMAND (Pin 7): (Handler to bonder) This line commands thebonder to bond the current device list.This line commands the bonder tobond the current device list. After recieving the BOND COMMAND, thebonder will turn OFF the BONDER READY line and bonding will start. TheHandler will monitor the BONDER READY line at this time and turn theBOND COMMAND line OFF (use the BONDER READY line as ahandshake). After bonding is complete, BONDER READY will turn backON.



NOTE: The bonder will bond all the devices on the assembly by default.All devices are elected by default when the file is loaded.

REMOTE STOP (Pin 26): (Handler to bonder) This line duplicates thebonder operator panel stop switch. When turned ON, it will cause the bonderto stop bonding at the end of the current wire.


Remote Mode Handler Type 2 - Basic I/O Lines PERIPHERAL EQUIPMENT INTERFACE


Refer to Figure 1-8 for the basic signal timing for remote mode.

Figure 1-8 Basic Signal Timing Diagram for Remote Mode

The handler must be ready (HANDLER READY ON) before the bonder willenter Remote Mode Run via the RUN MENU. If the handler is not ready(HANDLER READY OFF), the bonder will remain in, or return to, manualmode. There are a minimum number of "hand-shake" lines required forRemote Mode interface. These are: Handler Ready, Bonder Remote Mode,Bonder Ready, and Bond Command.

1. Handler is ready and HANDLER READY is turned ON.

2. Bonder is placed in Remote Mode - Run via the RUN MENU (bonderRemote Mode turns ON).

3. Bonder Ready turns ON.

4. The handler turns on BOND COMMAND.

5. The bonder responds to BOND COMMAND by turning OFF BONDERREADY.

Remote Mode Handler Type 2 - Basic I/O Lines


PERIPHERAL EQUIPMENT INTERFACE Run Sequence Signal Timing

6. The bonder bonds the current device list.

7. When the bonder has completed bonding and at Home/Park, it turns ONthe BONDER READY line. The bonder is now ready to accept furthercommands. (Note, however, that if BOND COMMAND is still ON, itmust be turned OFF and back ON before the bonder will accept itagain).


Remote Mode Handler Type 2 - Extended I/O Lines PERIPHERAL EQUIPMENT INTERFACE

Vx

NDLER

Signal Description

The extended configuration consists of the basic configuration plus ten (10)additional signal lines. This allows implementation of the full remotecommand set, remote file selection, and are in addition to the eleven (11)basic I/O lines. Figure 1-9 shows the directions of the signals for theExtended Remote Mode Run handler I/O.

Figure 1-9 Remote Handler - Extended I/O Lines Signal Direction

COMMAND BITS 0 THROUGH 7: (Handler to bonder) These lines areused to send commands to the bonder, specify device number, and specify filenumber. The bit pattern is formed by selectively turning these lines ON andOFF, with bit 0 being the least significant and bit 7 being the most significant.When the COMMAND PRESENT line is turned ON, the bit pattern on theselines will be read as a command byte. Some commands require multiple bytesto be transferred. See COMMAND SET section. (Note that due to the interfacelines being negative true (ON is logical “0”), the byte as read directly on theinterface lines will be a one's complement of the actual command byte).

Remote Mode Handler Type 2 - Extended I/O Lines

36

17

18

19

37

35

16

34

15

33

14

32

13

31

12

30

11

29

10

28

9

27

O

O

O

O

I

I

I

I

I

I

I

I

I

O

O

G

N

D

DATA-IN-0

DATA-IN-1

DATA-IN-2

DATA-IN-3

DATA-IN-4

O

DATA-IN-5

DATA-IN-6

DATA-IN-0

DATA-IN-1

DATA-IN-2

DATA-IN-3

DATA-IN-4

DATA-IN-7

COMMAND-PRESENT

COMMAND-ACKNOWLEDGE

DATA-OUT-0

DATA-OUT-1

DATA-OUT-2

DATA-OUT-3

DATA-OUT-4

DATA-IN-5

DATA-IN-6

DATA-IN-7

COMMAND-PRESENT

COMMAND-ACKNOWLEDGE

DATA-OUT-0

DATA-OUT-1

DATA-OUT-2

DATA-OUT-3

DATA-OUT-4

DATA-OUT-5

DATA-OUT-6

DATA-OUT-7

O

O

O

I

DATA-PRESENT

DATA-ACKNOWLEDGE

DATA-OUT-5

DATA-OUT-6

PULLTEST-FAIL

DATA-PRESENT

DATA-ACKNOWLEDGE

G

N

D

Vx

BONDER HA


PERIPHERAL EQUIPMENT INTERFACE Command Transfer Sequence

COMMAND PRESENT (Pin 31): (Handler to bonder) This line indicatesto the bonder that a command byte is present on the eight parallelCOMMAND lines (bits 0 through 7). It prompts the bonder to read thecommand, and it should not be turned ON until the COMMAND lines are setto the desired command and are stable. It should not be turned OFF (norshould the COMMAND lines be changed) until the bonder responds byasserting the COMMAND ACKNOWLEDGE line. See “Command TransferSequence”, on page 1-31.

NOTE: COMMAND BITS must be set at least 10 milliseconds beforeCOMMAND PRESENT is turned on.

COMMAND ACKNOWLEDGE (Pin 13): (Bonder to handler) This lineindicates that the bonder has read the command on the eight parallelCOMMAND lines. It will be turned ON after the bonder has read thecommand byte from the COMMAND lines, and will be turned OFF after theCOMMAND PRESENT line is turned OFF. See “Command TransferSequence”, on page 1-31.

NOTE: It is recommended that the handler has provisions for monitoringthe BONDER STOPPED line during COMMAND transfersequence. The BONDER STOPPED line is used to indicate to thebonder that an unrecognizable command has been received (see“Command Errors”, on page 1-35).

NOTE: The DATA PRESENT, DATA ACKNOWLEDGE, and DATAOUT lines are for future expansion and are not used at this time.

Following is the sequence of events which takes place when transferring acommand from the handler to the bonder via the COMMAND lines using theextended I/O lines.

1. Initial conditions: COMMAND PRESENT, COMMANDACKNOWLEDGE lines are OFF. Bonder has been placed in RemoteMode Run from the RUN MENU. HANDLER READY, BONDERREMOTE AUTO-RUN l ines are on . HANDLER READY isdisregarded after selecting Remote Mode Run, but is required to be ONin order to select Remote Mode Run.

Command Transfer Sequence


Command Transfer Sequence PERIPHERAL EQUIPMENT INTERFACE

2. Handler places a command byte on the COMMAND parallel lines.

3. Handler turns ON COMMAND PRESENT line.

4. Bonder senses COMMAND PRESENT line and reads command byteon COMMAND lines.

5. Bonder turns ON COMMAND ACKNOWLEDGE line after it has readcommand byte.

6. Handler senses COMMAND ACKNOWLEDGE line and turns OFFCOMMAND PRESENT line. COMMAND lines may be cleared at thistime, but this is not required. Bonder s enses COMMAND PRESENT l ine and tu rns OFFCOMMAND ACKNOWLEDGE line. Multiple byte commands loopback to step 2 and repeat steps 2 through 6.

7. Some multiple byte commands may require a NULL terminator (seeCOMMAND SET section). The NULL terminator follows the samesequence as other command bytes (steps 2 through 6).

8. Bonder responds by turning OFF BONDER READY and executing thecommand. When the command is complete, the bonder loops back tostep 1.

NOTE: When using a programmed PARK position (Park during run = yes in System Parameters) along with Remote ModeExtended Commands, the PARK command (HEX 50) must beexplicitly sent to the bonder in order for the bonder to move tothe programmed PARK position. If not, the bonder will remain atthe last bond position and will move only to the Z PROGRAM-MABLE HOME position before turning ON the BONDERREADY signal.


PERIPHERAL EQUIPMENT INTERFACE Remote Mode Handler Type 2 - Extended I/O Lines


Figure 1-10 illustrates the proper sequence for file change operation inRemote Mode. (For other commands, see “Command Set”, on page 1-34.)

Figure 1-10 Signal Sequence For Command Transfer In Remote Mode

Remote Mode Handler Type 2 - Extended I/O Lines

**

** Extended Command "BOND COMMAND" takes the place of the Discrete Bond Command Signal.

1 second max.


Command Set PERIPHERAL EQUIPMENT INTERFACE

NOTE: All single byte commands are terminated at the end of the hand-shake.

BOND. Hex 42 (ASCII “B”). Commands the bonder to bond the currentdevice list (see DEVICE LIST command). (This command duplicates theBOND COMMAND input line).

PARK. Hex 50 (ASCII “P”). Commands the bonder to go to the parkposition. If park is not enabled, (in System Parameters), the bonder willignore this command. At the completion of bonding, the bonder turns ON theBONDER READY, even though it is not at the PARK position. It turns OFFthe BONDER READY and turns it back ON again at the completion of thePARK move.

HOME. Hex 48 (ASCII “H”). Commands the bonder to go to home.

NOTE: A hex 00 (ASCII NULL) is used as the terminator for some mul-tiple byte commands.

DEVICE LIST. Hex 44 (ASCII “D”). Allows the handler to send the bondera list of devices to bond on the current assembly. Consists of a hexadecimal44, followed by one or more binary device numbers. Each byte must conformto the transfer sequence outlined earlier. Device numbers must be within therange of device numbers on the current assembly. List is terminated with aNULL command. Device list command byte followed immediately by aNULL byte clears the current device list and selects all devices in theassembly.

CHANGE FILE. Hex 43 (ASCII “C”). Allows the handler to send a new filenumber to the bonder. This file number must be referenced in the currentLink List, previously selected by the operator before placing bonder inRemote Mode Run via the RUN MENU. Consists of a hexadecimal 43,followed by a one byte binary number, which terminates the command. Bothbytes must conform to the transfer sequence outlined earlier.

A new file load will take place immediately on completion of this command.

Command Set

Single Byte Commands

Multiple Byte Commands


PERIPHERAL EQUIPMENT INTERFACE Command Errors

The file number must follow the "change file" command within one second.If not, a "file request timeout" will occur.

UNRECOGNIZED COMMAND. An unrecognized command is anycommand byte other than those listed above. The bonder will turn ONBONDER STOPPED instead of COMMAND ACKNOWLEDGE afterreading the command and determining that it is invalid. The bonder will turnOFF BONDER STOPPED after the handler turns OFF COMMANDPRESENT, which will terminate the command transfer handshake. Note thatCOMMAND ACKNOWLEDGE will not be turned ON in the event of anunrecognized command, so the handler must have provisions for monitoringBONDER STOPPED during the command transfer sequence. The bonderwill not perform any action on receipt of an unrecognized command, and willremain in Remote Mode Run.

INVALID FILE NUMBER. When the bonder receives a file number, itlooks in the link list to determine the file name associated with that filenumber. If there is no file name for that number, then the file number will beconsidered invalid. The bonder will turn ON BONDER STOPPED instead ofCOMMAND ACKNOWLEDGE (the bonder checks the link list for valid filenumbers before terminating the file number byte transfer). The bonder willturn OFF BONDER STOPPED after the handler turns OFF COMMANDPRESENT, which will terminate the file number byte transfer. Note thatCOMMAND ACKNOWLEDGE will not be turned ON in the event of aninvalid file number, so the handler must have provisions for monitoringBONDER STOPPED during the file number byte transfer sequence. Sendingthe bonder an invalid file number leaves the bonder with no file selected,which results in the bonder aborting Remote Mode Run. An error messagewill be displayed on the bonder data terminal, requiring the operator to pressany key. The bonder then returns to the RUN MENU.

INVALID DEVICE NUMBER. When the bonder receives a device number,it looks in the device list to determine if that device is defined in the currentdevice list. The bonder will turn ON BONDER STOPPED instead ofCOMMAND ACKNOWLEDGE on receipt of an invalid device number. Thebonder will turn OFF BONDER STOPPED after the handler turns OFFCOMMAND PRESENT, which will terminate the device list transfersequence. No further device numbers will be accepted. Note thatCOMMAND ACKNOWLEDGE will not be turned ON in the event of aninvalid device number, so the handler must have provisions for monitoringBONDER STOPPED during the device list transfer sequence. Sending thebonder an invalid device number leaves the bonder with an invalid device list,which will cause the bonder to abort Remote Mode Run. An error messagewill be displayed on the bonder data terminal, requiring the operator to pressany key. The bonder then returns to the RUN MENU.

Command Errors



Error Messages

[29] HANDLER NOT READYThis message appears when bonder attempts an operation requiring handlerinterface and the handler does not respond. This usually indicates that thehandler was in the NOT READY state or is not connected properly. It isalso possible that the incorrect handler type was specified on the HAN-DLER PARAMETERS screen.

[30] HANDLER TIMEOUT EXCEEDEDNo parts were indexed within the time specified on the HANDLER PA-RAMETERS screen. Standard handler only.

[36] LINK FILE ENTRY (#) IS EMPTYThis error occurs when the discrete I/O lines refer to an undefined entry inthe current link list.

[37] NO WIRE LIST FILE SELECTEDThis message appears in automatic mode if a file could not be loaded as in-dicated by the discrete I/O lines and an attempt was made to bond.

[201] Remote handler command acknowledge time-outThis error indicates that the remote handler initiated the transfer of a com-mand but did not complete the handshake. Check the connections betweenthe bonder and the remote handler.

[202] Device acknowledge time-out

Remote handler: A handshake time-out occurred while receiving a devicenumber from the handler. This may occur when the remote handler is trans-ferring a device list to the bonder.

[203] Device request time-outRemote handler: a handshake time-out has occurred while receiving a de-vice number from the handler. This may occur when the remote handler istransferring a device list to the bonder.

[204] File acknowledge time-outDuring the transfer of the file reference number, the remote handler did notconclude the handshake protocol with the bonder.

[205] FILE "filename": ERROR CONDITION PREVENTS BONDING

A file loaded through the link list has errors. Bonding cannot continue.


PERIPHERAL EQUIPMENT INTERFACE Error Messages

[206] Invalid file number # requested by remote handler

The remote handler sent a file index for which there is no entry in the currentlink list.

[207] File request time-outDuring the transfer of the file reference number, the remote handler did notconclude the handshake protocol with the bonder.

[208] Invalid device number # requested by remote handler

The remote handler commanded the bonder to bond a device whose devicenumber exceeds the number of devices programmed for the current wire list.

[209] Link file not definedThis error occurs if the remote handler sends a file select command but thereis no currently selected link list.

[210] No file selected for BOND COMMANDThe remote handler has issued a bond command but there is no currently se-lected file. This may result if the remote handler attempted to load a filethrough the link list but the file was not in the link list or there was an errorloading the file.

[211] Bad command received, "command", stop acknowledge time-out

Remote handler: the handler has sent an undefined command. The bondernotified the handler of the illegal command by turning on the bonderstopped line, but the handler did not respond by turning off the handler com-mand present line.

[212] UNABLE TO LOAD FILE REFERENCED BY LINK LIST

During an index operation, the discrete I/O lines specify the wire list to beloaded for the next assembly. This message indicates that a file error oc-curred while attempting to load the referenced wire list file.

To enable wire list selection through the link list, the discrete I/O optionmust be installed. Further, in the HANDLER PARAMETERS screen, theHandler type must set to 1 (Standard) and the File change at index set toStart or End, or the Handler type must be set to 2 (Remote) and the Remoteextended commands must be set to Yes.



[313] CACHE ERRORWhen cache mode in HANDLER PARAMETERS screen is set to Link, thefiles whose names are listed in the currently selected link list are loaded intomain memory. This organized collection of files in memory is referred toas a file cache. This error will occur if there is not enough memory to holdall the required files in the file cache.

[371] File “filename” is in link list. Delete anyway?An attempt was made to delete a file which is referenced in the currently se-lected link list. Later attempt to select this file via the handler interface willresult in an error if this file is deleted.

[444] No files in link listAn attempt was made to load the cache through the link list but there are nofiles specified in the link list and there is no wire list currently selected.

[453] NO LINK FILE SELECTED. CACHE WILL NOT BE LOADED

This message appears when cache is enabled, but no link list file is currentlyselected. The system will load the cache after you select a link list file.


PERIPHERAL EQUIPMENT INTERFACE ALC PULLTEST REMOTE SPECIFICATIONS

23 Dec. 1998 Created based on EWO 3127 proposal.04 May 1999 Give PULLTEST command priority over PROCEED command.06 June 1999 Clarify description of interface commands.11/12/2001 Added Software Version 5.8 and 5.8C informantion.

Software Version 5.7j

This modification to the M360C software adds the capability to control theALC bond head's pulltest feature through the handler interface. When thisfeature is enabled, the bonder will stop after each bond and wait for acommand from the handler. The handler may command the bonder to eitherpulltest this bond, or to continue bonding without performing the pulltest.This feature is optional, and may be selectively enabled/disabled at the user'sdiscretion. Both the standard mode and remote mode handler interfaces aresupported.

Software Version 5.8

A new function is added to the DIAGNOSTICS MENU that allows you tosee LVDT values corresponding to pull displacements. These values aredisplayed in a new screen.

Software Version 5.8C

The software version features the addition of “No Pulltest” feature to theRemote ALC Pulltest. It allows for two commands, “Pulltest” or “Proceed.”These commands are issued remotely during bonding to allow for a remotehandler to specify if a bond should be pulltested.

A particular bond can be set to either Always pulltest, or to Remote pulltest.If set to Remote pulltest, the bonder will wait for the “Pulltest” or “Proceed”command.

The enhanced feature in Version 5.8C adds a third command option, ofNever Pulltest. The Never Pulltest option allows the user to specify thatcertain bonds should never be pulltested regardless of the commandsreceived during bonding.

ALC PULLTEST REMOTE SPECIFICATIONS

Revision History

General Description


System Requirements PERIPHERAL EQUIPMENT INTERFACE

System RequirementsThe pulltest remote control feature is available only on model M360Cmachines equipped with the ALC bond head. It is implemented in softwareversion 5.8, so version 5.8 or later is required to access this feature.


PERIPHERAL EQUIPMENT INTERFACE Standard Mode Handler Type 1

When bonding with the Pulltest remote control enabled, the bonder will pauseat the twist height (hop height for the last bond in the wire) and wait for instruc-tions from the handler. The handler will have the option of commanding thebonder to either pulltest the bond or proceed to the next bond without pulltest-ing. Note the following changes to bonder operation when Pulltest remote con-trol is enabled:

� Because the bonder must pause at the twist (hop) height until itreceives instructions from the handler, all moves to twist (hop) willbe made at constant velocity.

� Bonds marked in the wire list (Wire List Edit) to be pulltested willalways be pulltested, and the bonder will disregard the PULLTESTand PROCEED interface lines.

� If the bonder remains paused at twist (hop) without seeing a signalfrom the handler for more than Handler timeout seconds, a "Handlertimeout" error will occur.

� If the pulltest fails, the bonder will enter a "Pulltest failed" errorcondition.

The existing handler interface signals do not change. The new interface sig-nals are accommodated via currently unused interface lines. (Note thatmachines equipped with the 172532 I/O board will need the discrete I/O kit tomake use of the additional interface signals. Machines equipped with the175512 I/O board have these lines available as standard, and do not requireany further hardware upgrades.) Electrically, the signal lines used for thePulltest remote control are the same as for the existing interface lines. Refer tothe Handler Interface: “Basic Hardware Implementation”, on page 1-7 forelectrical characteristics.

When the bonder has completed the bond and has moved up to twist (hop)height, it will turn on the BONDER STANDBY interface signal. This indicatesto the handler that the bonder is paused waiting for a command from the handler.BONDER STANDBY will turn off when the bonder has received either thePULLTEST or the PROCEED command, and has resumed processing thedevice. (BONDER STANDBY also turns off in the event of a handler timeout.)

Standard Mode Handler Type 1

Description

Interface Signal Description - Standard Mode


Interface Signal Description - Standard Mode PERIPHERAL EQUIPMENT INTERFACE

BONDER STANDBY will not turn on if the bond is marked for pulltesting inthe wire list (bonder does not wait for handler commands in this circumstance).

Two new signals are required to implement the Pulltest remote control. Thedesignations of these two signals are PULLTEST and PROCEED. Both arenecessary for operation of the Pulltest remote control.

� PULLTEST is an active low input to the bonder from the handler(handler interface connector, pin 31). The bonder monitors thissignal only when it is in a paused condition (after the bond, waitingfor instructions from the handler). When the bonder receives thePULLTEST signal it will perform the pulltest and continue to thenext bond.

� PROCEED is an active low input to the bonder from the handler(handler interface connector, pin 37). The bonder monitors thissignal only when it is in a paused condition (after the bond, waitingfor instructions from the handler). When the bonder receives thePROCEED signal it will continue on to the next bond without per-forming the pulltest.

Note that if either PULLTEST or PROCEED is turned on when the bonderturns on BONDER STANDBY, the bonder will respond immediately andperform the designated action. Also, PULLTEST takes precedence overPROCEED. That is, if both PROCEED and PULLTEST are turned on at thesame time, the bonder will act on PULLTEST and disregard PROCEED. It isthe responsibility of the handler to insure that both these signals are in theirdesired states before the bonder enters the paused condition.


PERIPHERAL EQUIPMENT INTERFACE Bond Cycle Sequence

Bond Cycle SequenceRefer to Figure 1-11 the bond cycle sequence in standard mode.

Figure 1-11 Standard Mode

1. Bonding. At the end of the bond, the bond head moves up to twistheight. (For the last bond in the wire, the bond head moves up to hopheight.)

2. Bonder arrives at twist (hop) height. If the bond is not marked for pulltest-ing in the wire list, the bonder will turn on BONDER STANDBY andwait here for instructions from the handler. If the bond is marked for pullt-esting in the wire list, the bonder will perform the pulltest as in step 4.

3. If the handler turns on the PULLTEST signal, the bonder will proceedwith the pulltest cycle. If the handler turns on the PROCEED signal, thebonder will skip pulltesting and proceed immediately to the next bond.In either case, the BONDER STANDBY signal is turned off.

4. Pulltesting. If the pulltest fails, the bonder will stop with an error. If thepulltest passes, the bonder will proceed to the next bond.

Handler Parameters Changes An additional parameter has been added tothe Handler Parameters Edit screen to support selective enable/disable of thisfeature, Pulltest remote control. It is only available on ALC bond headequipped machines. Possible values are "Yes" and "No". When set to "Yes",the feature is enabled. When set to "No", the feature is disabled. There are noother changes to the handler parameters.

Bonding

Move up to twist

Bond complete

Wait for commandfrom handler

Arrive at twist/BONDER STANDBY on

[bond not marked for pulltest]

Pulltesting

PULLTEST signal/BONDER STANDBY off

Bonder stoppedwith error Fail pulltest

Proceed to nextbond

Pass pulltest

PROCEED signal/BONDER STANDBY off

Arrive at twist/[bond is marked for pulltest]


Remote Mode Handler Type 2 PERIPHERAL EQUIPMENT INTERFACE

When bonding with the Pulltest remote control enabled, the bonder will pause atthe twist height (hop height for the last bond in the wire) and wait for instruc-tions from the handler. The handler will have the option of commanding thebonder to either pulltest the bond or proceed to the next bond without pulltest-ing. Note the following changes to bonder operation when Pulltest remote con-trol is enabled:

� Because the bonder must pause at the twist (hop) height until itreceives instructions from the handler, all moves to twist (hop) willbe made at constant velocity.

� Bonds marked in the wire list (Wire List Edit) to be pulltested willalways be pulltested, and the bonder will disregard the remoteextended command interface lines while bonding.

� If the bonder remains paused at twist (hop) without receiving acommand from the handler for more than Handler timeout seconds,a "Handler timeout" error will occur.

� If the pulltest fails, the bonder will enter a "Pulltest failed" errorcondition.

The existing handler interface signals do not change. The new interface func-tionality is accommodated by extensions to the remote extended command set.(Note that machines equipped with the 172532 I/O board will need the discreteI/O kit to make use of the remote extended commands. Machines equipped withthe 175512 I/O board have the necessary signal lines available as standard, anddo not require any further hardware upgrades.) Refer to the Handler Interface:“Basic Hardware Implementation”, on page 1-7 for electrical characteristics ofthe handler interface.

When the bonder has completed the bond and has moved up to twist (hop) height,it will turn on the BONDER STANDBY interface signal. This indicates to thehandler that the bonder is paused waiting for a command from the handler.BONDER STANDBY will turn off when the bonder has received either thePULLTEST or the BOND command, and has resumed processing the device.(BONDER STANDBY also turns off in the event of a handler timeout.)BONDER STANDBY will not turn on if the bond is marked for pulltesting in thewire list (bonder does not wait for handler commands in this circumstance).

Remote Mode Handler Type 2

Description

Interface Signal Description - Remote Mode


PERIPHERAL EQUIPMENT INTERFACE Interface Signal Description - Remote Mode

Since implementation of the Pulltest remote control feature is accomplishedvia the existing remote extended commands interface, no additional interfacesignals are required. However, a new command (PULLTEST) is added to theremote extended commands, as described below.

� PULLTEST. Hex 54 (ASCII "T"). When the bonder is paused attwist (hop) height, it monitors the remote extended command lines.If it receives the PULLTEST command, it will perform the pulltestand continue bonding.

� BOND. Hex 42 (ASCII "B"). This is an existing command,normally used to initiate bonding in remote mode after index-ing. It is used here to command the bonder to proceed to thenext bond without performing the pulltest.


Bond Cycle Sequence PERIPHERAL EQUIPMENT INTERFACE

Bond Cycle SequenceRefer to Figure 1-12 the bond cycle sequence in remote mode.

Figure 1-12 Remote Mode

1. Bonding. At the end of the bond, the bond head moves up to twistheight. For the last bond in the wire, the bond head moves up to hopheight.

2. Bonder arrives at twist (hop) height. If the bond is not marked for pulltest-ing in the wire list, the bonder waits here for instructions from the han-dler. If the bond is marked for pulltesting in the wire list, the bonder willperform the pulltest as in step 4.

3. If the handler sends the PULLTEST command, the bonder will proceedwith the pulltest cycle. If the handler sends the BOND command, thebonder will skip pulltesting and proceed immediately to the next bond.In either case, the BONDER STANDBY signal is turned off.

4. Pulltesting. If the pulltest fails, the bonder will stop with an error. If thepulltest passes, the bonder will proceed to the next bond.

Bonding

Move up to twist

Bond complete

Wait for commandfrom handler

Arrive at twist/BONDER STANDBY on

[bond not marked for pulltest]

Pulltesting

PULLTEST command/BONDER STANDBY off

Bonder stoppedwith error Fail pulltest

Proceed to nextbond

Pass pulltest

BOND command/BONDER STANDBY off

Arrive at twist/[bond is marked for pulltest]


PERIPHERAL EQUIPMENT INTERFACE Notation

Handler Parameters Changes An additional parameter has been added tothe Handler Parameters Edit screen to support selective enable/disable of thisfeature, Pulltest remote control. It is only available on ALC bond headequipped machines. Possible values are "Yes" and "No". When set to "Yes",the feature is enabled. When set to "No", the feature is disabled. There are noother changes to the handler parameters.

Notation� The ellipse indicates a unique machine state. States are terminated

by events, which cause the machine to transition to the next state.

� The event which terminates a state is listed first, and may result in anaction. The action will be separated from the event by a slash (/).

� Transitions between states may also depend on a condition. Conditions follow events and actions and are indicated by beingenclosed in brackets ([]).

� From the above explanations, we see that the notation "Arrive attwist/BONDER STANDBY on [bond not marked for pulltest]"indicates that this transition was triggered by the bond head'sarrival at twist height, the BONDER STANDBY line was turnedon in response to this event, and that this transition will be takenonly if the bond is not marked for pulltest.


PERIPHERAL EQUIPMENTDRAWINGS AND SCHEMATICS

MODEL 360C/S

ULTRASONIC LARGE/SMALLWIRE BONDER

DOCUMENT P/N: DC05-172000

RE-ISSUE DATE: August, 2002

Orthodyne Electronics Corporation

16700 Red Hill Avenue

Irvine, California, U.S.A. 926060-4802

Telephone (949) 660-0440

FAX 949-660-0444

E-mail: [email protected]

All Rights Reserved.

Copyright 2000 by Orthodyne Electronics Corp.

Products described in this publication are covered by one or more Orthodyne US and foreign patents.

ASSEMBLY DRAWINGS AND SCHEMATICS

ASSEMBLY DRAWINGS AND SCHEMATICS

MODEL 360C/S PEI DRAWINGS AND SCHEMATICS

Workholder Plate, M360C 172071

Outline Dimensions, M360C 172410

Standard and Remote Handler Interface Schematic 172509

I/O Schematic, M360C 175510

Universal I/O Interface Board with PLC Adapter PCB Assembly, M360C 175512

Handler Interface PLC Adapter Schematic, M360C 175555

Handler Interface PLC Adapter PCB Assembly, M360C 175557

I/O Board, Schematic 172530

I/O Board, Schematic 172532

Discrete I/O, Schematic 172575

Discrete I/O, Schematic 172577

360 c s_pei

Engineering

remote mode handler

standard mode handler

page command

signal description

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information page

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