LCD TV SERVICE MANUAL CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS : LP81A MODEL : 32LG30R(A)/32R 32LG30R(A)/32R-TA MODEL : 32LG33R/34R 32LG33R/34R-TC North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com Internal Use Only
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
LCD TVSERVICE MANUAL
CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP81A
MODEL : 32LG30R(A)/32R 32LG30R(A)/32R-TA
MODEL : 32LG33R/34R 32LG33R/34R-TC
North/Latin America http://aic.lgservice.comEurope/Africa http://eic.lgservice.comAsia/Oceania http://biz.lgservice.com
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.
It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electricalshock.
Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phonejacks, etc. If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis thereading must be infinite.An other abnormality exists that must be corrected before thereceiver is returned to the customer.
Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.
CAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE: If unforeseen circumstances create conflict between thefollowing servicing precautions and any of the safety precautions onpage 3 of this publication, always follow the safety precautions.Remember: Safety First.
General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power
source before;a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.CAUTION: A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in anexplosion hazard.
2. Test high voltage only by measuring it with an appropriate highvoltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of itsassemblies.
4. Unless specified otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10% (by volume) Acetone and 90% (byvolume) isopropyl alcohol (90%-99% strength)CAUTION: This is a flammable mixture.Unless specified otherwise in this service manual, lubrication ofcontacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.
7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in thisservice manual.CAUTION: Do not connect the test fixture ground strap to anyheat sink in this receiver.
Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged easilyby static electricity. Such components commonly are calledElectrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some field-effect transistors andsemiconductor "chip" components. The following techniquesshould be used to help reduce the incidence of componentdamage caused by static by static electricity.1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground.Alternatively, obtain and wear a commercially availabledischarging wrist strap device, which should be removed toprevent potential shock reasons prior to applying power to the
unit under test.2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup orexposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.
4. Use only an anti-static type solder removal device. Some solderremoval devices not classified as "anti-static" can generateelectrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generateelectrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leadselectrically shorted together by conductive foam, aluminum foilor comparable conductive material).
7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION: Be sure no power is applied to the chassis or circuit,and observe all other safety precautions.
8. Minimize bodily motions when handling unpackagedreplacement ES devices. (Otherwise harmless motion such asthe brushing together of your clothes fabric or the lifting of yourfoot from a carpeted floor can generate static electricitysufficient to damage an ES device.)
General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within therange or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering techniquea. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it thereonly until the solder flows onto and around both thecomponent lead and the foil.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.
d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.
IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent flat against thecircuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.
Removal1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the soldermelts.
2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removing theIC.
Replacement1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and
solder it.3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete TransistorRemoval/Replacement1. Remove the defective transistor by clipping its leads as close as
possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.
Power Output, Transistor DeviceRemoval/Replacement1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit
board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.
Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as
possible to diode body.2. Bend the two remaining leads perpendicular y to the circuit
board.3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.
Fuse and Conventional ResistorRemoval/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.2. Securely crimp the leads of replacement component around
notch at stake top.3. Solder the connections.
CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.
Circuit Board Foil RepairExcessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.
At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on ICconnections).
1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (ifused) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of the goodcopper pattern. Solder the overlapped area and clip off anyexcess jumper wire.
At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.
1. Remove the defective copper pattern with a sharp knife.Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the patternbreak and locate the nearest component that is directlyconnected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION: Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.
1. Application RangeThis spec. sheet is applied all of the 32/37/42/47/52” LCD TV,LP81A chassis (HURRICANE 5) by manufacturing LG TVPlant all over the world.
2. Specification1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolationtransformer will help protect test instrument.
2) Adjustment must be done in the correct order.3) The adjustment must be performed in the circumstance of
25±5°C of temperature and 65±10% of relative humidity ifthere is no specific designation.
4) The input voltage of the receiver must keep 100-220V,50/60Hz.
5) Before adjustment, execute Heat-Run for 15 minutes at RFno signal.
- Convert to Component in Input-source- Input the Component ( Which has 720p@60Hz YPbPr
signal : 100% Color Bar (MSPG-925F Model: 217/Pattern: 65 ) into Component.
- Adjust by commanding AUTO_COLOR_ADJUST (0xF1)0x00 0x02 instruction
(2) Confirmation- We confirm whether “0xF3 (offset), 0xF4 (gain)”
address of EEPROM “0xBC” is “0xAA” or not.- If “0xF3”, “0xF4” address of EEPROM “0xBC” isn’t
“0xAA”, we adjust once more.- We can confirm the ADC values from “0x06~0x0B”
adresses in a page “0xBC”.* Manual ADC process using Service Remocon. After
enter Service Mode by pushing “ADJ” key, execute“Auto-RGB” by pushing “_” key at “Auto-RGB”.
** TOOL Option, Area Option change and AC offBefore PCBA check, you have to change the Tool option, Areaoption and have to AC off/on (Plug out and in)(If missing this process, set can operate abnormally)
5. TOOL Option, Area Option change(1) Profile : Must be changed the option value because being
different with some setting value depend on module maker,inch and market.
The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.)(If not changed the option, the input menu can differ themodel spec.)* Refer to Job Expression of each main chassis ass’y(EBTxxxxxxxx) for Option value
* Never push the IN-STOP KEY after completing the functioninspection.
- Detail EDID Options are below (A, B, C, D, E, F) A. Product IDB. Serial No: Controlled on production lineC. Month, Year: Controlled on production line:
ex) Monthly: ‘09 ‘09Year: ‘2007 Ë ‘11’
D. Model Name(Hex):
E Checksum: Changeable by total EDID data
6-2. HDCP SETTING(High-Bandwidth Digital Contents Protection)
- Connect D-sub Signal Cable to D-Sub Jack- Input HDCP key with HDCP-key- in-program- HDCP Key value is stored on EEPROM(AT24C64) which is
From “0x80” addresses of 0xA0 page- AC off/ on and on HDCP button of MSPG925 and confirm
whether picture is displayed or not of using MSPG925- HDCP Key value is different among the sets.,
7. Adjustment of White Balance
7-1. Purpose and Principle for adjustmentof the color temperature
- Purpose : Adjust the color temperature to reduce thedeviation of the module color temperature.
- Principle : To adjust the white balance without the saturation,Fix the one of R/G/B gain to C0 and decrease the others.
7-2. Adjustment mode : Two modes of Cooland Warm
(Medium data is automatically calibrated by the Cool data)
* Required Equipment- Remote controller for adjustment - Color Analyzer : CA100+ or CA-210 or same product (ch:9)- Auto W/B adjustment instrument(only for Auto adjustment)
7-3. Connecting diagram of equipment formeasuring (For Automatic Adjustment)
Item
Manufacturer ID
Version
Revision
Condition
GSM
Digital : 1
Digital :3
Data
1E6D
01
03
For HDMI EDIDFor RGB EDID
AC
D
ED
B
A BC
D
F
D
E
Model name Model Name(HEX)
LG TV 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20
(1) Enter the adjustment mode of DDC- Set command delay time : 50ms- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key- Maintain the DDC adjustment mode with same condition
of Heat-run (Maintain after AC off/on in status of Heat-runpattern display)
(2) Release the DDC adjustment mode- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment- Need to transmit the aging off command to TV set after
finishing the adjustment.- Check DDC adjust mode release by exit key and release
DDC adjust mode
(3) Enter the adjust mode of white balance- Enter the white balance adjustment mode with aging
command(F3, 00, FF)
* Luminance min value is 200cd/m2≥ in the cool mode (For LCD)
7-4. Adjustment of White Balance(for Manual adjustment)
(1) Adjustment mode : Two modes (Cool and Warm)(Medium data is automatically calibrated by the Cool data)
(2) Color analyzer(CA100+, CA210) should be used in thecalibrated ch by CS-1000(LCD : CH9, PDP : CH10)
(3) Operate the zero-calibration of the CA100+ or CA-210,then stick sensor to the module when adjusting.
(4) For manual adjustment, it is also possible by the followingsequence.1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operateheat run longer than 15 minutes. (If not executed thisstep, the condition for W/B may be different.)
2) Push “Exit” key.3) Change to the AV mode by remote control.(Push front-
AV or Input key)4) Input external pattern(85% white pattern)5) Push the ADJ key two times (entering White Balance
mode)6) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) usingD/E(CH +/-) key on R/C.
7) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.8) Adjust two modes (Cool and Warm)
(Fix the one of R/G/B and change the others)9) When adjustment is completed, Exit adjustment mode
using EXIT key on R/C.
* CASEFirst adjust the coordinate far away from the target value(x, y).
(1) x, y > target1) Decrease the R, G.
(2) x, y < target1) First decrease the B gain, 2) Decrease the one of the others.
- In case of decreasing the x, decreasing the R : fix G- In case of decreasing the y, decreasing the G : fix R
(3) x > target , y < target1) First decrease B, so make y a little more than the
target.2) Adjust x value by decreasing the R
(4) x < target , y > target1) First decrease B, so make x a little more than the
target.2) Adjust x value by decreasing the G
- Standard color coordinate and temperature when using theCA100+ or CA210 equipment
- 20 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes
300
200
200T
200N
510
121
500
120
122
400
401
800
801
802
804
803
530
521
540
821
805
550
910
904
902
901
905
903
900
830
EXPLODED VIEW
Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW. It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer.
IMPORTANT SAFETY NOTICE
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2008 LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
220K
R133
75
R121
75
R111
SD05
D105
220K
R108
COMP1_R
COMP1_Pb
PC_AUD_RCDS3C05GTA5.6V
D122
COMP1_Y
SD0530VD117
75
R123
5.6V
D103
COMP2_Pr
CDS3C05GTA
5.6V
D123
PPJ209-02
JK100
4A[GN]CONTACT
2A [GN]1P_CAN
3A [GN]O_SPRING
2B [BL]1P_CAN
5B [BL]C_LUG_L
2C [RD]1P_CAN1
5C [RD]C_LUG_L
2D [WH]1P_CAN
5D[WH]C_LUG_L
2E [RD]1P_CAN2
4E[RD]CONTACT
3E [RD]O_SPRING
SD05
D106
5.6V
D104
COMP2_L
220KR119
COMP1_Pr
COMP1_L
75
R12275R110
220KR106
220K
R120
COMP2_Pb
PPJ209-02
JK101
4A
[GN]CONTACT
2A
[GN]1P_CAN
3A
[GN]O_SPRING
2B
[BL]1P_CAN
5B
[BL]C_LUG_L
2C
[RD]1P_CAN1
5C
[RD]C_LUG_L
2D
[WH]1P_CAN
5D
[WH]C_LUG_L
2E
[RD]1P_CAN2
4E
[RD]CONTACT
3E
[RD]O_SPRING
30VD119
SD05
1000-ohm
L100
PC_AUD_L
COMP2_R
220K
R132
SD0530VD118
1000-ohm
L101
SD05
D107
COMP2_Y
75R109
5.6VD115
5.6V
D116
10KR136
10KR143
10KR144
12K
R142
12K
R145
12K
R137
10KR134
12KR135
10KR138
10KR140
12KR139
12K
R141
68R114
DSUB_SCL
75R116
CDS3C30GTH
30VD112
DSUB_SDA
+5V_STCDS3C30GTH
30V
D110
100R125
+5V_MULTI
75R117
DSUB_SDA
DSUB_SCL
0.1uFC100
PC_G
CDS3C30GTH
30V
D114
0.1uFC102
75
R118
4.7K
R112
68R115
0.1uFC101
PC_R
PC_B
PC_VS
68pF
C103
PC_HS
0.1uFC105
4.7KR113
68pF
C104
CDS3C30GTH
30V
D113
100R124
100
R128
4.7KR150
READY
+5V_ST
100
R129
100R130
0.1uF
C110
0.1uFC106
100R131
OPTC111
TXD
0.1uF
C108
0.1uF
C109
OPTC112
RXD
CDS3C30GTH30V
D121
0.1uF
C107
4.7KR151
READY
+3.3V_MST
CDS3C30GTH30V
D120
+5V_ST
EN
KM
C2837-T
112
D1
09A
AC
C
EN
KM
C2837-T
112
D1
11
AA
C
C
EN
KM
C2837-T
112
D1
08A
AC
C
MAX3232CDR
IC101
RS232C
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7DOUT2
8RIN2
9ROUT2
10DIN2
11DIN1
12ROUT1
13RIN1
14DOUT1
15GND
16VCC
PEJ024-01
JK102
6B T_TERMINAL2
8 SHIELD_PLATE
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
IR_OUT
4.7KR127
4.7KR126
6630TGA004K
KCN-DS-1-0089
JK104
1RED
2GREEN
3BLUE
4GND_1
5DDC_GND
6 RED_GND
7GREEN_GND
8 BLUE_GND
9 NC
10 SYNC_GND
11GND_2
12DDC_DATA
13H_SYNC
14V_SYNC
15DDC_CLOCK
16 SHILED
KCN-DS-1-0088
JK103
1
2
3
4
5
6
7
8
9
10
AT24C02BN-10SU-1.8
IC100
3A2
2A1
4GND
1A0
5SDA
6SCL
7WP
8VCC
1000pFREADY
C113
0R146
1000pFREADY
C114
0R147
1000pFREADY
C115
0R148
1000pFREADY
C116
0R149
COMPONENT2
SDC 15 apply ing check
PC SOUND
COMPONENT1
INPUT1 : COMP1/2,RS232C,PC
PC
RS-232C*ONLY LG30
1.24C02-SUB:0IMMRAL014D
**MULTI ITEM
2.ENKMC2837-SUB:0DS226009AA (KDS226)
SUB : 0IMCRSG010A(STM) MAIN : EAN41348201(TI)
*RS232C TX
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
5.6VD216
220KR244
SIDE_RIN
75R241
SD05D214
SIDE_V
220KR242
SIDE_LIN
5.6VD215
75R245
SIDE_Y
75R246
SIDE_C
SD05D217
SD05D218
S_VIDEO_DET
SD05D219
12K
R248
12K
R250
10KR247
10KR249
OPTC210
READY
PPJ218-01
JK204
5C [RD]CONTACT
2C [RD]U_CAN
4C [RD]O_SPRING
2B [WH]U_CAN
3B [WH]C_LUG
2A [YL]U_CAN
5A [YL]CONTACT
4A [YL]O_SPRING
PSJ015-02
JK205
5 O_SPRING
4A C_LUG_L_1
4B C_LUG_S_1
4C C_LUG_L_2
4D C_LUG_S_2
3 GROUND
7SHIELD
0.1uF16V
READY C213
0R252
0R251
100pF50VREADY
C214
100pF50VREADY
C215
75R208
100pF50V
C212
OPT
0R210
470K
R229OPT
RT1C3904-T112
Q203OPT
E
B
C
SD05D201
SPK_R-_HOTEL
5.6V
D208OPT
470K
R230OPT
100pF50V
C211
OPT
PPJ148-10
JK200
4A [RD]O_SPRING
2A [RD]1P_CAN
5A [RD]CONTACT
2 [WH]1P_CAN
3 [WH]C_LUG_L
2B [YL]1P_CAN
4B [YL]O_SPRING
5B [YL]CONTACT
12K
R219
220KR212
0R214
10KR2180R222
100pF50V
C216OPT
5.6V
D209OPT
MNT_ROUT
MNT_LOUT
0R211
OPTC207
CVBS_RIN
12K
R221
1KR236OPT
CVBS_LIN
AUDIO_R
10KR220
10uF
16V
C209
MUTE_LINE
PPJ200-01
JK201
2
1
3
4
5
1KR237OPT
220KR209
SPK_R+_HOTEL
100pF50V
C217OPT
10uF
16V
C208OPT
CVBS_VIN
0R213
5.6VD202
RT1C3904-T112
Q202OPT
E
B
C
5.6VD204
0R223
INPUT2 : CVBS,SIDE AV
SIDE AV
POP NOISE
CVBS
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2008 LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
100R507READY
+5V_TUNER
0.027uFC512
4.7uF35V
C510READY
AM_AUDIO
27pFC502
4.7KR503
0.01uFC503
+5V_TUNER
0.1uFC520
+5V_TUNER
0R545
220R522
270pFC513
READY
1KR513
27pFC501
MAIN_SIF 1KR515
TV_MAIN
0.01uFC507
READY
OPTREADY R553
SCL_TUNER
SDA_TUNER
+5V_TUNER
4.7KR504
4.7KR508
0R514
330R506
330R505
4700pFC506
220R521
2SA1530A-T112-1RQ502
E
BC
RT1C3904-T112Q501
E
BC
0R519
0R518
TAFT-Z703DTU500
NON EU TUNER
14 AFT
13 V-OUT
5 RF_AGC
12 NC_4
11 AS
2 GND_1
19 NC_7
18 NC_6
10 CLOCK
4 NC_2
1 NC_1
17 NC_5
9 DATA
8 GND_2
3 +B[5V]
16 SIF-OUT
7 NC_3
6 TP[33V_OPTION]
15 A-OUT
21
SHIELD
20 NC_8
BLM18BD102SN1DL502
READY
TAFT-H703F
TU500-*1 NTSC TUNER
14AFT
13V-OUT
5RF_AGC
12NC_4
11AS
2GND_1
19NC_7
18NC_6
10CLOCK
4NC_2
1NC_1
17NC_5
9DATA
8GND_2
3+B[5V]
16SIF-OUT
7NC_3
6TP[33V_OPTION]
15A-OUT
21
SHIELD
20NC_8UBW2012-121F
120OHM
L501
10uF16V
C521
N e a r t h e p i n
TUNER
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
0.1uFC641
+5V_MULTI+12V
+12V
SW_R
0.1uFC633680K
R637
+5V_MULTI
SPK_R-
+5V_MULTI
2.2uFC662
+5V_MULTI
680KR640
4.7KR633
SW_L
4.7KR634
4.7KR649
MNT_ROUT
MNT_L_AMP
SPK_R-_HOTEL
SPK_L-
5.6KR615
MC74HC4066ADR2GIC602
3YB
2YA
4XB
1XA
6CONTROL_C
5CONTROL_B
7GND
8XC
9YC
10YD
11XD
12CONTROL_D
13CONTROL_A
14VCC
COMP1_R
680KR638
680KR639
680KR629
2.2uFC665
+12V
1KR645
680KR630
0.1
uF
HOTEL_OPT
C6
46
680KR612
680KR611
AUDIO_SW
SPK_R+
MNT_LOUT
33pFC627
1KR646
+16V_NTP
+5V_MULTI
33pFC628
SIDE_RIN2.2uFC664
MNT_R_AMP
+5V_MULTI
5.6KR614COMP1_L
+5V_MULTI
SIDE_LIN
6800pFC650
SPK_R+_HOTEL
AUDIO_SW
6800pFC649
2.2uFC663
4.7KR647
SPK_L+
LM324D
IC601
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
AUDIO_R
SW_RESET
10KR641
+1.8V_DVDD
SPK_L+
0.1uFC605
0.1uFC617
10uF 16VC604
+1.8V_DVDD
0.1uFC636
4.7KR623
1uFC608
1000pFC630
3 . 3R635
0.1uFC602
1000pFC620
I2S_
SDO
0 .01uFC648
0.1uFC629
+16V_NTPNTP3000AIC600
1BST1A
2VDR1A
3/RESET
4AD
5VSS_IO
6CLK_I
7CLK_O
8VDD_IO
9DGNDPLL
10AGNDPLL
11LFM
12AVDDPLL
13DVDDPLL
14NC_1
15DV
SS
16DV
DD
17SD
ATA
18W
CK
19BC
K
20SD
A
21SC
L
22PW
M_3
B/PW
M_H
P2
23PW
M_3
A/PW
M_H
P1
24PR
OTEC
T
25FA
ULT
26VD
R2B
27BS
T2B
28PG
ND2B
_1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC_2
43VD
R1B
44BS
T1B
45PG
ND1B
_1
46PG
ND1B
_2
47OU
T1B_
1
48OU
T1B_
2
49PV
DD1B
_1
50PV
DD1B
_2
51PV
DD1A
_1
52PV
DD1A
_2
53OU
T1A_
1
54OU
T1A_
2
55PG
ND1A
_1
56PG
ND1A
_2
0 .47uFC640
22000pFC623
0.1uFC637
1uFC624
10uF 16VC600
+3.3V
100pFC601
SCL_
Part
1000pFC635
1000pFC634
SPK_L-
330uF35VC612
1000pFC631
0
HOTE
L_OP
T
R642
SPK_R-
100R601
+16V_NTP
1000pFC606
0.01uFC638
+16V_NTP
4.7KR627
+16V_NTP
SPK_R+
100R602
I2S_MCLK
0.01uFC647
+1.8V_AVDD
0.01uFC613
10uF16VC609
100pFREADY
C642
DA-8580
EAP38319001
L6032S
1S 1F
2F
22000pFC616
0.1uFC607
3.3KR600
1000pFC603
+16V_NTP
3 . 3R636
+1.8V_AVDD
AC_DET
100R603
0.1uFC644
0.47uFC632
1uFC618
1000pF50V
C651
3 . 3R604
0.01uFC639
0.1uFC615
4.7KR628
4.7KR624
1000pFC621
3 . 3R625
0.1uFC626
+16V_NTP
0.1uFC610
22000pFC625
1000pFC622
1000pFC619
I2S_
SCK
I2S_
WS
3 . 3R626
0.1uFC643
SDA
_Par
t
22000pFC611
DA-8580
EAP38319001
L6072S
1S 1F
2F
SW_RESET
AMP_
MUT
E_HO
TEL
3 . 9R607
3 . 9R609
3 . 9R608
3 . 9R610
3 . 9R622
3 . 9R618
3 . 9R617
3 . 9R621
330uF 35VC666
12505WR-09A00
HOTEL_OPT
P600
1
2
3
4
5
6
7
8
9
10
RT1C3904-T112Q600
E
B
C
RT1C3904-T112Q606
E
B
C
RT1C3904-T112Q607
E
B
C
SMAW250-04
P601
1
2
3
4
1uFC614
+1.8V
+1.8V_AVDD
+1.8V_DVDD
30V
READYD600
6.8KR620
6.8KR619
30V
RE
AD
Y
D6
01
30V
READYD602
30V
RE
AD
Y
D6
03
UBW2012-121FEAM38769505
120OHML606
UBW2012-121F
EAM38769505
120OHML614
UBW2012-121FEAM38769505
120OHML615
0R606
2SA1530A-T112-1RQ608
E
B
C
+3.3V_MST
10K
R6
50
100R651
RT1C3904-T112Q609
HOTEL_OPT
E
B
C
10K
R6
31
HO
TE
L_O
PT
AMP_MUTE_HOTEL
+3.3V
0R605
READY
+3.3V
10K
RE
AD
Y
R6
48
200R632
HOTEL_OPT
UBW2012-121FEAM38769505
L613
UBW2012-121FEAM38769505
L611
UBW2012-121FEAM38769505
L610
UBW2012-121FEAM38769505
L612
33pF50V
C667
READY
33pF50V
C668
READY
4.7uF10V
C669HOTEL_OPT
1N
4148W
10
0V
D6
04
RE
AD
Y1N
4148W
10
0V
D6
05
RE
AD
Y
1N
4148W
10
0V
D6
06
RE
AD
Y
1N
4148W
10
0V
D6
07
RE
AD
Y
15KR616
15KR613
SPK_L-
Chinese Hotel Opt ion
for COMP1
for SIDE R/L
AMP :GAIN X 4
Audio S/W : COMP1 or SIDE L/R
Digital Audio AMP
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
+3.3VDDA
RAM
RAS
RAMCS
I2S_DIN
RAMDQM
JP703
RAM
BA[0
]
0 .1uF50V
C750
4.7KR716
150R728
IPCLK
MX25L1605AM2C-15GIC703
IC703_USB
3WP#
2SO
4GND
1CS#
5 SI
6 SCLK
7 HOLD#
8 VCC
JP702
+1.8VDDC
RAMADD[0-3]
DUPRD0
SFDI
+3.3VDDP
0R7
22
+1.8VDDA
RAM
WE
0R7
23
0 .1uF50V
C732
+1.8VDDCMBW3216-501TF
L715
+3.3VDDP
27R700
100uF16V
C722
SFCLK
SFDO
0.1uFC717
RAM
ADD[
10]
0 .1uFC713
0R740
READY
DEC_656[0]
USB_DN
22pFC745
0.1uF50V
C742
0.1uF50V
C7530.1uF
50V
C748
1KR709
0R741
READY
1/10W
1K
5%
R704
+3.3VDDP
0.1uFC716
0.1uF50V
C752
0R7
25
5pF
50V
C709
RAMRAS
RAMBA[1]
0.1uF50V
C739
SFDO
4.7KR706
1/10W
1K
5%
R705
RAM
BA[1
]
0R7
17
0 .1uF50V
C730
10uF16V
C724
27R701
+3.3VDDP
USB_DN
0R7
20
0 .1uF50V
C729
RAM
DQM
75R737
+3.3VDDP
390R733
15K1%
R726
TX_MPEG
+1.8V
0.1uF50V
C738
RAM
CAS
12MHz
X702
SFCS
+3.3VDDP
+3.3VDDP
27MHzX703
0.1uF50V
C728
0R739
SFCLK
+3.3V_USB
0.1uFC712
0.1uF50V
C726
+1.8VDDA
0.1uF50V
C736
RAMBA[0]
JP701
220K
R732
USB_DP
+3.3VDDA
USB_DP
DUPRD0
0.1uF50V
C731
0R7
19
+3.3VDDP
0.1uF50V
C727
SFDI
75R734
RAMCAS
0.1uFC725
75R736
0.1u
F
50V
C723
SFCS
RAM
CS
RAMADD[11]
0.1uF50V
C747
5.1KREADY
R702
IPCLK
47uF16V
C714
RAMADD[4-9]
I2S_WS_IN
+1.8VDDC
0R7
24
DEC_656_CLK
5.1KREADY
R703
0.1uF50V
C744
0R7
21
+1.8VDDA
0.1uF50V
C749
MPEG_RESET
RAMDAT[8-15]
+5V_USB
SFCLK
0R7
18
RAMWE
SFDI
I2S_CLK_IN
0.1uF50V
C751
RAMADD[0-11]
75R735
22pFC746
0.1uF50V
C743
+3.3VDDA
RAMDAT[0-7]
0.1uF50V
C734
JP700
DEC_656[0-7]
0.1uF50V
C7370.1uF
50V
C741
1/10W
0
5%
R738
0.1uF50V
C740
+3.3V_SDRAM
0.1uF50V
C735
RX_MPEG
RAMDAT[0-15]
1/1
0W
56
5%
R707
22uF16V
C710
22uF16V
C711
22uF
16V
C715
ZR
36966P
QC
G-X
D
IC
70
7
USB
1 2 3 4 5 6 7 8 9 10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
5051
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
10
0
10
1
10
2
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
HY57V641620FTP
IC704
26
A3
27
VD
D3
28
VS
S1
29
A4
30
A5
31
A6
32
A7
33
A8
34
A9
35
A11
36
NC
1
37
CK
E
38
CL
K
39
UD
QM
40
NC
2
41
VS
S2
42
DQ
8
43
VD
DQ
3
44
DQ
9
45
DQ
10
46
VS
SQ
3
47
DQ
11
48
DQ
12
49
VD
DQ
4
50
DQ
13
17
CA
S
3VD
DQ1
6V
SS
Q1
16
WE
15
LD
QM
14
VD
D2
13
DQ
7
12
VS
SQ
2
11
DQ
6
10
DQ
5
9V
DD
Q2
8D
Q4
7D
Q3
4DQ
15
DQ2
25
A2
24
A1
23
A0
2DQ
0
22
A1
0/A
P
21
BA
1
1VD
D1
20
BA
0
19
CS
18
RA
S
51
DQ
14
52
VS
SQ
4
53
DQ
15
54
VS
S3
USB
DO
WN
ST
RE
AMK
JA-U
B-4
-000
4
P701
USB
12
34
5
+3.3VDDP4.7K
READYR742
OPT
L716
READY
4.7KREADY
R743
+5V_MULTI
12505WS-04A00JK700
1
2
3
4
5
6.19KR715
OCP_EN
22R7
44
OCP_EN
FLASH_WP_ZORAN
+3.3VDDP
10K
R710
180R708
10nF50V
C754
READY
1KR727
18pFC72018pFC719
200R729
READY
MIC2009YM6-TR IC705
3ENABLE
2GND
4FAULT/
1VIN
6VOUT
5ILIMIT
120OHM
UBW2012-121F
L711
120OHM
UBW2012-121F
L712
120OHM
UBW2012-121F
L713
120OHM
UBW2012-121F
L714
120OHM
UBW2012-121F
READYL717
120OHM
UBW2012-121F
L718
MLF2012A2R7JT000
L719
READY 220pF50V
C755
READY
75R712
75R711
75R714
75R713
RAMADD[6]
DE
C_
65
6[5
]
RAMADD[1]
RAM
ADD[
8]
RAMDAT[7]
RAMADD[2]
DE
C_
65
6[3
]
RAM
DAT[
6]
RAMADD[3]
RAMDAT[0]
RAM
ADD[
9]
RAMDAT[12]
RAM
DAT[
5]
RAMADD[8]
DE
C_
65
6[2
]
RAMDAT[10]
RAM
DAT[
2]
RAMDAT[4]
RAMADD[9]
RAM
DAT[
11]
RAMDAT[14]
DE
C_
65
6[6
]
RAM
DAT[
7]
DE
C_
65
6[4
]
RAM
DAT[
14]
RAMDAT[1]
RAM
DAT[
0]
RAMADD[11]
RAM
DAT[
13]
RAMDAT[13]
RAM
DAT[
4]
RAMDAT[8]
RAM
DAT[
10]
RAMDAT[3]
RAM
DAT[
12]
RAM
ADD[
2]RA
MAD
D[6]
DE
C_
65
6[0
]
RAMADD[0]
RAMADD[5]
RAM
ADD[
3]
RAM
DAT[
8]
RAMDAT[15]
RAMADD[7]
RAMADD[4]
RAM
ADD[
4]
RAM
ADD[
5]
RAMDAT[9]
DE
C_
65
6[1
]
RAM
ADD[
1]
RAM
ADD[
0]RA
MAD
D[7]
RAMDAT[5]
RAM
DAT[
15]
RAM
DAT[
9]
RAMDAT[2]
RAM
DAT[
1]
RAMADD[10]
RAMDAT[6]
RAMDAT[11]
DE
C_
65
6[7
]
RAM
DAT[
3]
* * 1A Des ign* R732 Video Ou tpu t Leve l Re fe rence
C709 :EMI Solu t ion
p l a c e d a s c l o s e t o C o n n e c t o r a s p o s s i b l e .
External F/W Download
Capaci tors on VBUSA should be
For In i t i a l Download
DEC_656[0] : DUPTD0
* Analog Video Opt ion
ZORAN I2C strobe ready
DUPTD0
* R715 Recommendat ion is 6 .19k 1%
Orig ina l ly 392 ohm 1%
DEBUG TEST OPTION
* R732 Video Ou tpu t Leve l Re fe re nc
to mee t USB2 .0 HS ce r t
ZORAN SRAM Board F/W Download
I t s p o s s i b e l t o 2 7 ~ 4 7 o h m
Connec t t o Ma in IC(CCIR656 In t e r f ace )
TOP SIDE!
USB/MPEG DEC
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes
C 2008 LGE Internal Use Only
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
MADR[4]
0.1uFC903
MADR[1]
MADR[11]
MADR[9]
SBA0
MADR[2]
150READY R903
LDQM
CKE
MADR[2]
MADR[3]
MDATA[0-15]
MADR[9]
MCLK
MADR[7]
MADR[5]
1000pFC907
MADR[6]
0.1uFC904
+2.5V_VDDM_MST
0.1uFC906
0.1uFC909
WEZ
+2.5V_VDDM_MST
UDQM
0.1uFC905
MADR[0]
CASZ
DQS1
1KR906
MADR[3]
MADR[0-11]
MADR[4]
MADR[8]
150R905
MADR[0]
MADR[1]
1KR909
MCLKZ
0.1uFC901
SBA1
MADR[8]
MADR[6]
DQS0
RASZ
0.1uFC908
MADR[11]
MADR[10]
MADR[7]
0.1uFC902
MADR[5]
MADR[10]
0.1uFC900
1/16W56AR903
1/16W56AR902
1/16W56AR901
1/16W56AR900
HYB25DC256163CE-4IC900
26BA0
27BA1
28A10/AP
29A0
30A1
31A2
32A3
33VDD_3
34VSS_1
35A4
36A5
37A6
38A7
39A8
40A9
41A11
42A12/NC_5
43NC_6
44CKE
45CK
46CK
47UDM
48VSS_2
49VREF
50NC_7
17A13/NC_2
3VDDQ_1
6VSSQ_1
16LDQS
15VDDQ_3
14NC_1
13DQ7
12VSSQ_2
11DQ6
10DQ5
9VDDQ_2
8DQ4
7DQ3
4DQ1
5DQ2
25NC_4
24CS
23RAS
2DQ0
22CAS
21WE
1VDD_1
20LDM
19NC_3
18VDD_2
51UDQS
52VSSQ_3
53NC_8
54DQ8
55VDDQ_4
56DQ9
57DQ10
58VSSQ_4
59DQ11
60DQ12
61VDDQ_5
62DQ13
63DQ14
64VSSQ_5
65DQ15
66VSS_3
MDATA[12]
MADR[4]
MADR[4]
MDATA[11]
MADR[0-11]
MADR[9]
MADR[8]
MADR[11]
MADR[11]
MADR[2]
MD
AT
A[0
-15
]
MDATA[0-15]
MDATA[1]
MDATA[2]
MDATA[14]
MDATA[0]
MADR[5]
MADR[0]
MADR[6]
MADR[0]
MADR[8]
MADR[10]
MADR[7]
MADR[7]
MADR[10]
MADR[9]
MADR[3]
MDATA[15]
MDATA[5]
MDATA[7]
MDATA[10]
MADR[1]
MADR[6]
MDATA[9] MDATA[6]
MADR[5]
MADR[1]
MADR[2]
MADR[3]
MDATA[3]
MDATA[4]
MDATA[8]
MDATA[13]
DDR
**MULTI ITEM
SUB - HYNIX : EAN31729202MAIN - QIMONDA : EAN41788501
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.