300mm Wafer Manufacturing in China: Challenges and ...

Zing Semiconductor Corporation Confidential

300mm Wafer Manufacturing in China:Challenges and Opportunities

May 2017


Agenda

Advantages when working in China -Market-Policy

Challenges when working in China- Partners- Localization

A brief introduction to Zing SemiconductorChallenges for next-generation wafers





Zing Semiconductor Corporation Confidential 4

SOURCE:IBS

15.7%

15.0%

14.2%

42.5%

12.6%

15.3%

13.7%

14.5%

44.4%

12.1%

16.4%

12.3%

13.9%

46.7%

10.7%

15.6%

12.7%

20.7%

41.4%

9.6%

15.8%

10.5%

11.3%

51.9%

10.5%

15.6%

10.6%

11.3%

52.5%

10.0%

54.7%

9.3%

10.0%

15.3%

10.7%

56.2%

9.4%

15.0%

10.0%

9.4%

55.8%

9.2%

15.4%

9.8%

9.8%

57.5%

9.2%

14.9%

9.2%

9.2%

59.4%

8.0%

14.9%

8.6%

9.1%

Semiconductor Market Forecast through 2020


SOURCE:IBS

China Semiconductor Consumption vs. Supply from Domestic Suppliers


62 new fabs have been announced as starting operation between 2017 and 2020.

26 of the new fabs are located in China, or 42% of the total.

2017～2020 New Fab Construction


By product type, the forecast for new facilities and lines include:

① 20 foundries (32 percent), ② 13 memory fabs (21 percent), ③ Seven LED (11 percent), ④ Six Power (10 percent) ⑤ Five MEMS (8 percent).

New Facility: Types

Zing Semiconductor Corporation ConfidentialZing Semiconductor Corporation Confidential 8

Chinese 300mm wafer capacity, 2017-2020

Current 300mm demand is from 8 manufacturers, with a combined 460kwpm production. Including test and monitor wafers, total wafer demand is between 500-550Kwpm.

2017

Many fabs are scheduled to come online by 2020, including expansion of existing fabs as well as new players in the industry, including fabs in Hefei, Jinjiang, and Xiamen, among others. Demand for production wafers is expected to increase by 640K wpm, and including test and monitor wafers, demand is expected to increase by over 700K.

By 2020 total wafer demand will be around 1.2M wpm.

2017-2020

Red text above denotes fabs under construction


Advantages: Policy“Made in China 2025”

Elements of Germany’s “Industry 4.0” policy

Increased emphasis on supply chain efficiencies, supply chain communication, smart factories

Collaboration with MNCs; move away from “indigenous innovation” for domestic market only


Made in China 2025

- Financial / Facility support from central, provincial, and local governments

- Focus on high-tech jobs creation, particularly in interior

- Value-added raw materials highly desirable






Challenges: Finding the Right Partners

- Picking the right location

- Subcontractor quality

- When and what to outsource


- China GAAP vs. U.S. GAAP

- Quality bilingual employees

- Language of daily business?

Challenges: Localization






Zing Semiconductor is located in Lingang, a district of Shanghai, with a total area of 100,062㎡. The total built-up area will be 128394.90㎡. As of June 2018, investment will be $325M, with total investment estimated to be $1B at full capacity.

Zing Semiconductor


2017-2022 Roadmap

Phase 1Technology Node：28nmCapacity：150K 300mm wafers per month

Phase 2Technology Node：20nm~14nmCapacity：300K 300mm wafers per month

Phase 3Technology Node：10nm and underCapacity: 600K 300mm wafers per month

2017-2018

2019-2020

2021-2022


To 150K wpm mass production

0102

0304

05

Construction

2015.10~2016.08

R&D Phase

2016.09~2016.12

Certification

2017.1~2017.9

Phase 1 End

2017.10~2018.6

*Complete Engineering Design

*Receive Production and Business Licenses

*Approval of construction permits

*Apply for 20 core patents

* R&D equipment tender* R&D equipment procurement* Complete factory construction

* Complete R & D equipment installation* Complete product technology research and development* Start customer sample manufacturing* Capacity to 10k wafers per month

* Pass 4 to 5 customers product certification* Passed ISO9001 certification* Production capacity of 80k/month* Began wafer foundry services in January 2017

* Production capacity of 150k/month* 6 months of sales of 100K wpm, monthly sales of 70 million RMB* Complete 510 patent applications

02:Construction

01:Planning

03: R&D Phase 04: Certification 05: Phase 1 End

Planning

2014.06~2015.09


Crystal Growing Performance1.8M Single Crystal

Whole Single Crystal

Shoulder100mm

Body1800mm

Tail300mm

Pulling Speed

Ingot Axial Length [mm

]70m

m1800m

m

70mm

~ 1800mm

: Target ±8%

200mm

~ 1800mm

: Target ±4%

1.6M Single Crystal

Shoulder100mm

Body1600mm

Tail300mm

Date : 2016.12.28 Date : 2017.01.16


Date : 2017.02.13

2.0M Single Crystal

Shoulder100mm

Body2000mm

Tail300mm



Crystal Growing Performance

Low COP Quality Summary

☞ Production Date of Test-3 Ingot : 2017.4.01200nm120nm90nm65nm37nm

30

20

10

0

12.6957

2.260870.608696 0.521739 0.478261

Test-3Test-2Test-1

3000

2500

2000

1500

1000

500

0 2.26087

313.889

2707.58

90nm LPDN Trend LPDN Result of Test-3

BOTTOMMIDDLETOP

40

30

20

10

0

13.375 12.7 11.6

37nm LPDN Result per Ingot Position

Zing Semiconductor Corporation ConfidentialZing Semiconductor Corporation Confidential 20

Patent Applications

Zing Semiconductor has applied for 304 patents, for crystal growth, silicon wafer substrate technology, epitaxial material growth, silicon III-V semiconductor material epitaxial growth, SOI wafer substrate preparation and advanced CMOS devices and processes, amongst others. It has received 36 patents, with the remaining patent applications still pending.


Quality Certification Plans

23

Certification\ Time2015 2016 2017

11 12 1 2 3 4 5 6 7 8 9 10 11 12 1 2 3 4 5 6 7 8 9 10 11 12

ISO 9001:2015

ISO 14001:2004

OHSAS 18001:2007

ISO/TS16949:2009

2017/5

2017/9






Challenges for the industry at 14nm and beyond

23

- Growing demand for COP-free, starting withnear-perfect crystal

- Smaller edge exclusions


Challenges for the industry at 14nm and beyond

23

-Thick epi and FD-SOI

SOURCE:Applied Materials

SOURCE:Soitec


25

Zing Semiconductor – Your source for300mm wafers in China

Richard Chang

[email protected]

300mm Wafer Manufacturing in China: Challenges and ...

Documents