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21/12/2006 21/12/2006 Ron Settles MPI-Munich Ron Settles MPI-Munich TUM Dec 2006 -- ILC, LCTPC Des TUM Dec 2006 -- ILC, LCTPC Des ign Issues: R&D Planning ign Issues: R&D Planning 1 Status of the ILC, issues Status of the ILC, issues for the LCTPC design and for the LCTPC design and their feedback to the R&D their feedback to the R&D program program OUTLINE of TALK OUTLINE of TALK Overview ILC Overview ILC LCTPC Design Issues in the DODs LCTPC Design Issues in the DODs Next steps: Next steps: More work with Small Prototypes More work with Small Prototypes (SP) (SP) Build the Large Prototype (LP) Build the Large Prototype (LP) LCTPC LCTPC R&D plans R&D plans
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21/12/2006 Ron Settles MPI-Munich TUM Dec 2006 -- ILC, LCTPC Design Issues: R&D Planning 1 Status of the ILC, issues for the LCTPC design and their feedback.

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Page 1: 21/12/2006 Ron Settles MPI-Munich TUM Dec 2006 -- ILC, LCTPC Design Issues: R&D Planning 1 Status of the ILC, issues for the LCTPC design and their feedback.

21/12/200621/12/2006 Ron Settles MPI-Munich TUM DeRon Settles MPI-Munich TUM Dec 2006 -- ILC, LCTPC Design Issues: R&D Plc 2006 -- ILC, LCTPC Design Issues: R&D Planninganning

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Status of the ILC, issues Status of the ILC, issues for the LCTPC design and for the LCTPC design and their feedback to the R&D their feedback to the R&D

programprogram

OUTLINE of TALKOUTLINE of TALK

•Overview ILC Overview ILC •LCTPC Design Issues in the DODsLCTPC Design Issues in the DODs•Next steps:Next steps:

•More work with Small Prototypes (SP) More work with Small Prototypes (SP) •Build the Large Prototype (LP) Build the Large Prototype (LP)

•LCTPC LCTPC R&D plans R&D plans

OUTLINE of TALKOUTLINE of TALK

•Overview ILC Overview ILC •LCTPC Design Issues in the DODsLCTPC Design Issues in the DODs•Next steps:Next steps:

•More work with Small Prototypes (SP) More work with Small Prototypes (SP) •Build the Large Prototype (LP) Build the Large Prototype (LP)

•LCTPC LCTPC R&D plans R&D plans

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21/12/200621/12/2006 Ron Settles MPI-Munich TUM DeRon Settles MPI-Munich TUM Dec 2006 -- ILC, LCTPC Design Issues: R&D Plc 2006 -- ILC, LCTPC Design Issues: R&D Planninganning

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LDC/GLD/4th Conceptsor

A TPC for a Linear Collider Detector

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The Global Design The Global Design Effort Effort

Formal organization begun at LCWS 05 at Stanfordin March 2005 when Barry became director of the GDE

Technically Driven Schedule

ACFA’07 Beijing:

RDR(+cost), DCR

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International Linear ColliderInternational Linear Collider

Aug 2004: Technology decision: COLD superconducting à la TESLA chosen

Baseline: Baseline: 200 GeV < √s < 500 GeV 200 GeV < √s < 500 GeV Integrated luminosity ~ 500 fbIntegrated luminosity ~ 500 fb-1-1 in 4 years in 4 years80 % e- beam polarisation80 % e- beam polarisationUpgrade to 1TeV, Upgrade to 1TeV, L = 1 abL = 1 ab-1-1 in 3 years in 3 years2 interaction regions2 interaction regionsConcurrent running with the LHC from Concurrent running with the LHC from 20152015

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Physics Overview @ Snowmass’05 by

Peter Zerwas

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e.g.with precision measurements of theHiggs

e.g.with precision measurements of theHiggs

cmE recHM Expt (GeV) Decay

Channel (GeV/c2) ln(1+s/b)

115 GeV/c2

1 ALEPH 206.7 4-jet 114.3 1.73

2 ALEPH 206.7 4-jet 112.9 1.21

3 ALEPH 206.5 4-jet 110.0 0.64

4 L3 206.4 E-miss 115.0 0.53

5 OPAL 206.6 4-jet 110.7 0.53

6 Delphi 206.7 4-jet 114.3 0.49

7 ALEPH 205.0 Lept 118.1 0.47

8 ALEPH 208.1 Tau 115.4 0.41

9 ALEPH 206.5 4-jet 114.5 0.40

10 OPAL 205.4 4-jet 112.6 0.40

Goal: to revisit the Higgs…Goal: to revisit the Higgs…

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The value of precision measurements…

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Polarization

Multipole expansion

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Where are we with the Higgs? CERN Courier, Nov 2005Where are we with the Higgs? CERN Courier, Nov 2005

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Why do we think these indirect, precision meas. are telling us anything??? CERN Courier, Nov 2005 :

Why do we think these indirect, precision meas. are telling us anything??? CERN Courier, Nov 2005 :

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SUperSYmmetrySUperSYmmetrySymmetry between

Fermions Bosons(Matter) (Force carriers)

...now we have doubled the particle spectrum...

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... BUT solves several SM problems:

♥ Link to gravity

♥ lightest SUSY particle stable

Dark matter candidate

♥ Solves fine tuning problems

♥ Predicts light Higgs

♥ Unification of forces

SupersymmetrySupersymmetry

Energy in GeV

with Supersymmetry

without Supersymmetry

1 TeV

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From my talk at the Arlington LC Workshop January 2003:

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Need highest luminosityPrecision for 1 ab-1 :

%20

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10-3

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1919

2018

2019

2021

2024

+y

2027

+y

25

ILC

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2020

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HISTORY

1992: First discussions on detectors in Garmisch-Partenkirschen (LC92). Silicon? Gas?1996-1997: TESLA Conceptual Design Report. Large wire TPC, 0.7Mchan.1/2001: TESLA Technical Design Report. Micropattern (GEM, Micromegas) as a baseline, 1.5Mchan.5/2001: Kick-off of Detector R&D11/2001: DESY PRC proposal. for TPC R&D(European & North American teams)2002: UCLC/LCRD proposals2004: After ITRP, WWS R&D panelEurope Chris Damerell (Rutherford Lab. UK) Jean-Claude Brient (Ecole Polytechnique, France) Wolfgang Lohmann (DESY-Zeuthen, Germany)

Asia HongJoo Kim (Korean National U.) Tohru Takeshita (Shinsu U., Japan) Yasuhiro Sugimoto (KEK, Japan)

North America Dean Karlen (U Victoria, CAN) Ray Frey (U. of Oregon, USA) Harry Weerts (Fermilab, USA)

GOALGOAL

To design and build an To design and build an ultra-high performance ultra-high performance

Time Projection Time Projection ChamberChamber

……as central tracker for as central tracker for the ILC detector,the ILC detector,

where excellent vertex, where excellent vertex, momentum andmomentum and

jet-energy precision jet-energy precision are requiredare required

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LCTPC/LP Groups (19Sept06)LCTPC/LP Groups (19Sept06) AmericasAmericasCarleton Carleton MontrealMontrealVictoriaVictoriaCornellCornellIndianaIndianaLBNLLBNL

Purdue (observer) Purdue (observer)

EuropeEuropeLAL OrsayLAL Orsay IPN OrsayIPN Orsay

CEA SaclayCEA SaclayAachenAachenBonnBonnDESYDESY

U HamburgU HamburgFreiburgFreiburg

MPI-MunichMPI-MunichTU Munich TU Munich (observer)(observer)

RostockRostockSiegenSiegenNIKHEFNIKHEF

NovosibirskNovosibirskLundLundCERNCERN

AsiaAsiaTsinghuaTsinghua

CDC:CDC:HiroshimaHiroshima

KEKKEKKinki UKinki USaga Saga

KogakuinKogakuinTokyo UA&TTokyo UA&T

U TokyoU TokyoU TsukubaU Tsukuba

Minadano SU-IITMinadano SU-IIT Other groups

MITMITMIT (LCRD)MIT (LCRD)Temple/Wayne State (UCLC)Temple/Wayne State (UCLC)YaleYaleKarlsruheKarlsruheUMM KrakowUMM KrakowBucharest Bucharest

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-5

Large Detector Concept example

3x10-5

.30Particle Flow

(N.B. below are TDR dimensions, which have changed for latest LDC iteration)

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2424GLD

LDC

HCalECal

TPC

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Physics determines Physics determines detector designdetector design

momentum: d(1/p) momentum: d(1/p) ~~ 10 10-4-4/GeV(TPC /GeV(TPC only) only)

~ ~ 0.6x100.6x10-4-4/GeV(w/vertex)/GeV(w/vertex) (1/10xLEP)(1/10xLEP)

ee++ee--ZHZHllllX goal: X goal: MM<0.1x <0.1x

dominated by beamstrahlungdominated by beamstrahlung

tracking efficiency: 99% (overalltracking efficiency: 99% (overall) ) excellent and robust tracking efficiency by excellent and robust tracking efficiency by

combining vertex detector and TPC, each combining vertex detector and TPC, each with excellent tracking efficiencywith excellent tracking efficiency

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Are TPC’s Good for Tracking?

• ZH events

• Standalone TPC reconstruction (LD design)

Dan Peterson, Cornell

Answer: Yes.

Gaseous Tracking R&D

Next questions: what about resolution, ion feedback, track separation resolution, neutron backgrounds?

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Motivation/Goals

• Continuous tracking throughout large volume

• ~98% tracking efficiency in presence of backgrounds

• Timing to 2 ns together with inner silicon layer

• Minimum of X_0 inside Ecal (<3% barrel, <30% endcaps)

• σ_pt ~ 100μm (rφ) and ~ 500μm (rz) @ 3,4T for right gas if diffusion limited

• 2-track resolution <2mm (rφ) and <5-10mm (rz)

• dE/dx resolution <5%

• Full precision/efficiency at 30 x estimated backgrounds

Motivation/Goals

• Continuous tracking throughout large volume

• ~98% tracking efficiency in presence of backgrounds

• Timing to 2 ns together with inner silicon layer

• Minimum of X_0 inside Ecal (<3% barrel, <30% endcaps)

• σ_pt ~ 100μm (rφ) and ~ 500μm (rz) @ 3,4T for right gas if diffusion limited

• 2-track resolution <2mm (rφ) and <5-10mm (rz)

• dE/dx resolution <5%

• Full precision/efficiency at 30 x estimated backgrounds

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R&D program

• gain experience with MPGD-TPCs, compare with wires

• study charge transfer properties, minimize ion feedback

• measure performance with different B fields and gases

• find ways to achieve the desired precision

• investigate Si-readout techniques

• start electronics design for 1-2 million pads

• study design of thin field cage

• study design thin endplate: mechanics, electronics, cooling

• devise methods for robust performance in high backgrounds

• pursue software and simulation developments

R&D program

• gain experience with MPGD-TPCs, compare with wires

• study charge transfer properties, minimize ion feedback

• measure performance with different B fields and gases

• find ways to achieve the desired precision

• investigate Si-readout techniques

• start electronics design for 1-2 million pads

• study design of thin field cage

• study design thin endplate: mechanics, electronics, cooling

• devise methods for robust performance in high backgrounds

• pursue software and simulation developments

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R&D PlanningR&D Planning1) Demonstration phase1) Demonstration phase– Continue work with small prototypes on mapping out Continue work with small prototypes on mapping out

parameter space, understanding resolution, etc, to prove parameter space, understanding resolution, etc, to prove feasibility of an MPGD TPC. For CMOS-based pixel TPC feasibility of an MPGD TPC. For CMOS-based pixel TPC ideas this will include proof-of-principle tests.ideas this will include proof-of-principle tests.

2) Consolidation phase2) Consolidation phase– Build and operate the Large Prototype (LP), Ø ~ 80cm, Build and operate the Large Prototype (LP), Ø ~ 80cm,

drift ~ 60cm, with EUDET infrastructure as basis, to test drift ~ 60cm, with EUDET infrastructure as basis, to test manufacturing techniques for MPGD endplates, fieldcage manufacturing techniques for MPGD endplates, fieldcage and electronics. LP design is starting and electronics. LP design is starting building and building and testing will take another ~ 3-4 years.testing will take another ~ 3-4 years.

3) Design phase3) Design phase– During phase 2, the decision as to which endplate During phase 2, the decision as to which endplate

technology to use for the LC TPC would be taken and final technology to use for the LC TPC would be taken and final design started.design started.

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What have we been doing in Phase 1 ?

What have we been doing in Phase 1 ?

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Gas-Amplification Systems: Gas-Amplification Systems: Wires & Wires & MPGDsMPGDs

GEM: Two copper foils separated by kapton, multiplication takes place in holes, uses 2 or 3 stages

Micromegas: micromesh sustained by 50μm pillars, multiplication between anode and mesh, one stage

S1

S1/S2 ~ Eamplif / Edrift

P~140 μm

D~60 μm

S2

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Pixel TPC Pixel TPC DevelopmeDevelopme

ntnt

NikhefFreiburg

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Examples of Prototype TPCsExamples of Prototype TPCs

Carleton, Aachen, Cornell/Purdue,Desy(n.s.) for B=0or1T studies

Saclay, Victoria, Desy (fit in 2-5T magnets)

Karlsruhe, MPI/Asia, Aachen built test TPCs for magnets (not shown), other groups built small special-study chambers

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FacilitiesFacilities Saclay 2T magnet, cosmics

Kek 1.2T, 4GeV

hadr.test-b

eam Desy 1T, 6GeV e- test-beam

Desy 5T

magnet,

cosmics, laser

Cern test-beam (not

shown)

EUDET

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TPC R&D summary to date

• Now 4 years of MPGD experience gathered • Gas properties rather well understood• Limit of resolution being understood• Resistive foil charge-spreading demonstrated• CMOS RO demonstrated• Work starting for the Large Prototype

TPC R&D summary to date

• Now 4 years of MPGD experience gathered • Gas properties rather well understood• Limit of resolution being understood• Resistive foil charge-spreading demonstrated• CMOS RO demonstrated• Work starting for the Large Prototype

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Phase 2• Basic Idea: LP should be a prototype LP should be a prototype for the LC TPC design and test as many for the LC TPC design and test as many of the issues as possible (like, e.g., of the issues as possible (like, e.g., TPC90 @ Aleph). This will take at least 2 TPC90 @ Aleph). This will take at least 2 iterations, we call them LP1 and LP2.iterations, we call them LP1 and LP2.

• The Eudet infrastructure gives us a The Eudet infrastructure gives us a starting basis for the LP workstarting basis for the LP work

• The general LCTPC/LP R&D issues and The general LCTPC/LP R&D issues and been divided up into workpackages (WP) been divided up into workpackages (WP) more later…more later…

Phase 2• Basic Idea: LP should be a prototype LP should be a prototype for the LC TPC design and test as many for the LC TPC design and test as many of the issues as possible (like, e.g., of the issues as possible (like, e.g., TPC90 @ Aleph). This will take at least 2 TPC90 @ Aleph). This will take at least 2 iterations, we call them LP1 and LP2.iterations, we call them LP1 and LP2.

• The Eudet infrastructure gives us a The Eudet infrastructure gives us a starting basis for the LP workstarting basis for the LP work

• The general LCTPC/LP R&D issues and The general LCTPC/LP R&D issues and been divided up into workpackages (WP) been divided up into workpackages (WP) more later…more later…

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PerformancePerformance

– Momentum precision needed for overall Momentum precision needed for overall tracking? tracking?

– Momentum precision needed for the TPC? Momentum precision needed for the TPC? – Good dE/dx resolution, Vº detectionGood dE/dx resolution, Vº detection– Requirements forRequirements for

2-track resolution (in r2-track resolution (in rφφ and z)? and z)? track-gamma separation (in rtrack-gamma separation (in rφφ and z)? and z)?

– Tolerance on the maximum endplate Tolerance on the maximum endplate thickness? thickness?

– Tracking configurationTracking configurationCalorimeter diameter Calorimeter diameter TPC TPC Other tracking detectors Other tracking detectors

– TPC OD/ID/length TPC OD/ID/length

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LCTPC resolution in the DODsLCTPC resolution in the DODsLCTPC resolution in the DODsLCTPC resolution in the DODs

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Physics determines Physics determines detector designdetector design

Momentum resolution: Momentum resolution: d(1/p) d(1/p) ~~ ????? ?????

ee++ee--ZHZHllllXX couplings, couplings, ??

Redo study at Redo study at s = 220 GeVs = 220 GeV and using vertex and using vertex

constraint!constraint!

BIG IS

SUE!

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Prototype ResultsPrototype Results

Point Point resolution, resolution,

GemGem--Three examples of σ_pt measured for Gems and 2x6mm^2 pads.

--First, in Desy chamber (triple Gem), resolution using “triplet method”.

--Second, in Victoria chamber (double Gem), unbiased method used: track fit twice, with and without padrow in question, σ determined for each case; geometric mean of the two σ’s gives the correct result.

--See next page…30cm

B=4T

Gas:P5

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ACFA8--July2005

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PerformancePerformance

– Momentum precision needed for Momentum precision needed for the TPCthe TPC

– What is the best we can do?What is the best we can do?

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Keisuke Fujii, PRC report

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Momentum resolution Momentum resolution neededneeded……

“Club sandwich” possible in GLD because of large size. We will study performance & feasibility of this option in case the momentum precision is required.

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LC TPC EndcapsLC TPC EndcapsLC TPC EndcapsLC TPC Endcaps

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GLD

GLDAkira Sugiyama

GLDAkira Sugiyama

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Arrangements of detectors on the active area of the end cap (2/2)Trapezoidal shapes assembled in iris shape

Annotations: Px is the type number of PADS boards or frames

Page 2

By rotation of 15° around the axe, these frames are the same

P1

12 sectors (30° each) as super modules are defined

On each, 7 modules are fixedThe sizes of detectors are varying from 180 to 420 mm

P2 P3 P4

P2

P3

P4

These arrangement seems to be the best as only 4 different PADS are necessary

LDCRS/Joel Pouthas/Philippe Rosier

LDCRS/Joel Pouthas/Philippe Rosier

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Aleph endplateAleph endplate

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Some features• Zigzag structure prevented loss of tracks > θ~22°• Sectors mounted from inside using a “handling tool” to minimize the dead space between sectors. This straight-forward operation which was performed at least 30 times during the lifetime of Aleph. • Alu sandwich structure stiff, lightweight to

- contain 7mb overpressure- provide forced-air thermal insulation between electronics and TPC volume

• Water cooling of 1kW electronics/side in addition- 22K channels per side

• Combination water/air cooling blocked all heat to TPC• Overall thickness ~ 25%Xo (average) w/o cables• Bending of endplate

- 20 micrometers due to 7mb overpressure- 5 micrometers due to wire tension

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Design Design

– Gas-amplification technology Gas-amplification technology input from input from R&D projects R&D projects

– Chamber gas candidates: crucial decision! Chamber gas candidates: crucial decision! – Electronics design: Electronics design: LP WPLP WP

Zeroth-order “conventional-RO” design Zeroth-order “conventional-RO” design Is there an optimum pad size for momentum, Is there an optimum pad size for momentum, dE/dx resolution and electronics packaging? dE/dx resolution and electronics packaging? Silicon RO: proof-of-principle Silicon RO: proof-of-principle

– Endplate design Endplate design LP WPLP WPMechanics Mechanics Minimize thicknessMinimize thicknessCoolingCooling

– Field cage design Field cage design LP WPLP WP

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Backgrounds/alignment/distortion-Backgrounds/alignment/distortion-

correctioncorrection

– Revisit expected backgroundsRevisit expected backgrounds– Maximum positive-ion buildup tolerableMaximum positive-ion buildup tolerable– Maximum occupancy tolerableMaximum occupancy tolerable– Effect of positive-ion backdrift: gating planeEffect of positive-ion backdrift: gating plane

– Tools for correcting inhomogeneous B-field Tools for correcting inhomogeneous B-field

or space charge effects in bad backgroundsor space charge effects in bad backgrounds

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LC TPC Chamber gasLC TPC Chamber gas(b) Ion buildup(b) Ion buildup

LC TPC Chamber gasLC TPC Chamber gas(b) Ion buildup(b) Ion buildup

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LC TPC Chamber gasLC TPC Chamber gas(c) ion backdrift/gating(c) ion backdrift/gatingLC TPC Chamber gasLC TPC Chamber gas

(c) ion backdrift/gating(c) ion backdrift/gating

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LC TPC ElectronicsLC TPC ElectronicsLC TPC ElectronicsLC TPC Electronics

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LC TPC BackgroundsLC TPC BackgroundsLC TPC BackgroundsLC TPC Backgrounds

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This is for infrastructure for detector R&D, but not yet the R&D itself, to which all of the TPC R&D groups will have to

contribute if the LP is going to be successful.

This will provide a basis for the LC TPC groups to help get funding for the LP and other LC TPC work.

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Work Packages for the LCTPC/LPWork Packages for the LCTPC/LP 0) Workpackage:0) Workpackage: TPC R&D program/performance goalsTPC R&D program/performance goals

To be worked out by the LCTPC collaborationTo be worked out by the LCTPC collaboration

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Work Packages for the LCTPC/LPWork Packages for the LCTPC/LP 1) Workpackage1) Workpackage MECHANICSMECHANICS

Groups expressing interest to date(others?)Groups expressing interest to date(others?)

a) LP design (incl. endplate structure) Cornell, Desy, IPNOrsay, MPI,a) LP design (incl. endplate structure) Cornell, Desy, IPNOrsay, MPI, +contribution from Eudet +contribution from Eudet

b) Fieldcage, laser, gas Aachen, Desy, St.Petersburg, b) Fieldcage, laser, gas Aachen, Desy, St.Petersburg,

+contribution from Eudet +contribution from Eudet c) GEM panels for endplate Aachen, Carleton, Cornell, c) GEM panels for endplate Aachen, Carleton, Cornell,

Desy/HH,Desy/HH, Karlsruhe, Kek/XCDC, Novosibirsk, Karlsruhe, Kek/XCDC, Novosibirsk,

Victoria Victoria d) Micromegas panels for endplate Carleton, Cornell, Kek/XCDC, d) Micromegas panels for endplate Carleton, Cornell, Kek/XCDC,

Saclay/Orsay Saclay/Orsay e) Pixel panels for endplate Cern,Freiburg,Nikhef,Saclay,Kek/XCDC, e) Pixel panels for endplate Cern,Freiburg,Nikhef,Saclay,Kek/XCDC,

+contribution from Eudet +contribution from Eudet f) Resistive foil for endplate Carleton, Kek/XCDC, Saclay/Orsay f) Resistive foil for endplate Carleton, Kek/XCDC, Saclay/Orsay

Ron Settles

Dan Peterson

Ties Behnke

Akira Sugiyama

Paul Colas

Jan Timmermans

Madhu Dixit

convener inwhite color

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Work Packages for the LCTPC/LPWork Packages for the LCTPC/LP 2) Workpackage2) Workpackage ELECTRONICSELECTRONICS

Groups expressing interest to Groups expressing interest to date(others?)date(others?)

a)"Standard" RO/DAQ for LP: Aachen, Desy/HH, Cern, Lund, a)"Standard" RO/DAQ for LP: Aachen, Desy/HH, Cern, Lund, Rostock, Montreal, Tsinghua, Rostock, Montreal, Tsinghua,

+contribution from Eudet +contribution from Eudet

b) CMOS RO electronics: Freiburg, Cern, Nikhef, Saclay, b) CMOS RO electronics: Freiburg, Cern, Nikhef, Saclay, +contribution from Eudet +contribution from Eudet

c) Electr.,powerswitching,cooling Aachen, Desy/HH, Cern, Lund, c) Electr.,powerswitching,cooling Aachen, Desy/HH, Cern, Lund, for LC TPC: Rostock, Montreal, St.Petersburg, for LC TPC: Rostock, Montreal, St.Petersburg,

Tsinghua,Tsinghua, +contribution from Eudet +contribution from Eudet

Leif Joennson

Leif Joennson + ?

Harry van der Graaf

Luciano Musa

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Work Packages for the LCTPC/LPWork Packages for the LCTPC/LP

3) Workpackage3) Workpackage SOFTWARESOFTWARE

Groups expressing interest to Groups expressing interest to date(others?)date(others?)

a) LP SW+simul./reconstr.framework: Desy/HH,Cern,Freiburg, Carleton, a) LP SW+simul./reconstr.framework: Desy/HH,Cern,Freiburg, Carleton, Victoria, +contribution from Victoria, +contribution from

Eudet Eudet

b) TPC simulation, backgrounds Aachen, Carleton, Cornell, b) TPC simulation, backgrounds Aachen, Carleton, Cornell, Desy/HH,Desy/HH,

Kek/XCDC, St.Petersburg,Victoria Kek/XCDC, St.Petersburg,Victoria

c) Full detector simulation Desy/HH, Kek/XCDC, LBNL c) Full detector simulation Desy/HH, Kek/XCDC, LBNL

Peter Wienemann

Peter Wienemann

Stefan Roth

Keisuke Fujii

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Work Packages for the LCTPC/LPWork Packages for the LCTPC/LP 4) Workpackage4) Workpackage CALIBRATIONCALIBRATION

Groups expressing interest to date(others?)Groups expressing interest to date(others?)

a) Fieldmap Cern, a) Fieldmap Cern, +contribution from Eudet +contribution from Eudet

b) Alignment Kek/XCDC b) Alignment Kek/XCDC

c) Distortion correction Victoriac) Distortion correction Victoria

d) Rad.hardness of material St.Petersburg d) Rad.hardness of material St.Petersburg

e) Gas/HV/Infrastructure Desy, Victoria, e) Gas/HV/Infrastructure Desy, Victoria, +contribution from Eudet +contribution from Eudet

Dean Karlen

Lucie Linssen

Takeshi Matsuda

Dean Karlen

Anatoliy Krivchitch

Desy Postdoc

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Here are some ideas for the evolution up to the Design Phase

3(under discussion with the collab.)

• 2006-09: SP (small prototype) tests, LP1 = two endplates: Gem+pixel, Microm.+pixel adiabatic developm. LP1->LP1.5->LP2• 2010: LP2 = real LCTPC prototype endplate: Gem or μMegas + carbon-fibre sandwich, gating grid, sector/panel shape, LCTPC electronics, gas, etc

Here are some ideas for the evolution up to the Design Phase

3(under discussion with the collab.)

• 2006-09: SP (small prototype) tests, LP1 = two endplates: Gem+pixel, Microm.+pixel adiabatic developm. LP1->LP1.5->LP2• 2010: LP2 = real LCTPC prototype endplate: Gem or μMegas + carbon-fibre sandwich, gating grid, sector/panel shape, LCTPC electronics, gas, etc

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TPC R&D breakdown (prel.)• Gem, Micromegas, Pixel LP1@Desy

• Large, small, odd-shaped panels LP1@Desy

• Endplate alignment and stability LP1,LP2@Desy

• Fieldcage LP1@Desy

• Sandwich structure SP/LP2

• Gating/max. space charge SP/LP2

ion feedback rate

• Point/2-track resolution LP1@Desy

• Momentum meas. in inhomog. B-field LP1@Desy

• dE/dx measurement LP1@Desy

• Gas studies SP

• Pad shapes SimulationLP1,LP2

• Jet environment SP@Cern/FermiLab • Beams

• 1-6 GeV/c electrons LP1@Desy

• 1-20 GeV/c hadrons (+dE/dx) LP2@Cern/FermiL • 100 GeV hadrons (+jets) LP2@Cern/FermiL

TPC R&D breakdown (prel.)• Gem, Micromegas, Pixel LP1@Desy

• Large, small, odd-shaped panels LP1@Desy

• Endplate alignment and stability LP1,LP2@Desy

• Fieldcage LP1@Desy

• Sandwich structure SP/LP2

• Gating/max. space charge SP/LP2

ion feedback rate

• Point/2-track resolution LP1@Desy

• Momentum meas. in inhomog. B-field LP1@Desy

• dE/dx measurement LP1@Desy

• Gas studies SP

• Pad shapes SimulationLP1,LP2

• Jet environment SP@Cern/FermiLab • Beams

• 1-6 GeV/c electrons LP1@Desy

• 1-20 GeV/c hadrons (+dE/dx) LP2@Cern/FermiL • 100 GeV hadrons (+jets) LP2@Cern/FermiL

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Some of the topics discussed at Some of the topics discussed at WP bi-weekly phonemeetings…WP bi-weekly phonemeetings…

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AGENDAAGENDA

-Fieldcage for the LP (Ties Behnke, Peter Schade)-Fieldcage for the LP (Ties Behnke, Peter Schade)

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FC length ~ 60-80 cm

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Madhu Dixit proposes for the LCTPC electronics:

-preamp 25ns Trise (10%-90%)-no shaper-integrator-25MHz 10to12-bit FADC

(2-track resolution can benefit from the somewhat faster Trise if the noise is still acceptable)

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EndplateEndplate

Dan Peterson

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Geometry details Geometry details by Dan Petersonby Dan Peterson

File:EndplateFieldCageGeometry5

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TPC milestonesTPC milestones

2006-2010 Continue LCTPC R&D via small-prototypes

and LP tests

2010 Decide on all parameters

2011 Final design of the LCTPC

2015 Four years construction

2016 Commission/Install TPC in the LC Detector

2006-2010 Continue LCTPC R&D via small-prototypes

and LP tests

2010 Decide on all parameters

2011 Final design of the LCTPC

2015 Four years construction

2016 Commission/Install TPC in the LC Detector

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No conclusions…No conclusions…Backup slides…Backup slides…

No conclusions…No conclusions…Backup slides…Backup slides…

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Two other LC-TPC features

will be compensated by good design…

• ~ 50 μs drift time integrates over 150 BX

design for very large granularity: ~ 2 – 20 x 109 voxels

(two orders of magnitude more if CMOS pixel version)

• ~ end caps with large density of electronics (several million

pads) are a fair amount of material

design for smallest amount: ~ 30%X0 or less is feasible

• design for full precision/efficiency at 30 x estimated backgrounds

Two other LC-TPC features

will be compensated by good design…

• ~ 50 μs drift time integrates over 150 BX

design for very large granularity: ~ 2 – 20 x 109 voxels

(two orders of magnitude more if CMOS pixel version)

• ~ end caps with large density of electronics (several million

pads) are a fair amount of material

design for smallest amount: ~ 30%X0 or less is feasible

• design for full precision/efficiency at 30 x estimated backgrounds

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Keisuke Fujii, Takeshi Matsuda, WP mtg#2