2019 Media Planner - OpenSystems Mediacloud1.opensystemsmedia.com/insight.tech+2019+Media+Planner.pdf · 2019 Media Planner. A publication of the Intel ® Internet of Things (IoT)

2019 Media Planner

A publication of the Intel® Internet of Things (IoT) Solutions Alliance, insight.tech is the go-to destination for embedded and IoT design ideas, solutions, and trends. @IoT_Editor

Table of Contents

embedded world 2

Sponsorship Packages 3

Webinars 4 Co-Sponsored Webinar Solo Webinar

Online Sponsorships 5 Native Advertising White Paper Posting with Promotion

Custom Content 6

Custom Surveys 7

embedded world is the largest event targeting embedded technologies, security and intelligence and the internet of Things. Each year more than 1,000 exhibitors and 32,000 attendees visit the conference. This is a great opportunity to create awareness, drive traffic to your booth and increase your exposure at this industry leading event.

Internet of Things . 1 video from show floor with insight.tech editor-in-chief Kenton Williston. 1 custom piece of content created and posted on insight.tech during embedded world. 1 native ad promoted on insight.tech’s monthly newsletter. 1 social media post on Twitter (IoT_editor) using hashtags with a bonus push during the week of embedded world Price: $5,000

Check out our sample coverage from embedded world 2018

VIDEO: Congatec Interview: Moving Servers to the Edgehttps://www.insight.tech/industry/moving-servers-to-the-edge 6 Things to See at Embedded World https://www.insight.tech/retail/6-things-to-see-at-embedded-world Congatec Demos Edge Server Tech at embedded world 2018https://www.insight.tech/industry/congatec-demos-edge-server-tech-at-embedded-world-2018

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Sponsorship PackagesSave more than 10% by packaging together.

2019 Co-Sponsored Webinar TopicsFebruary Industrial IoTApril Connected Factories June Machine LearningAugust AIOctober Smart Cities December Medical

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$30,000

$21,000

$14,300

Package Includes Cost

. 2 Co-Sponsored Webinars . 3 White papers with promotion . 3 Native Ads, Industry Survey . 1 Paid Social Push 6x per year on Twitter (5,000 impressions each)

. 1 Co-Sponsored Webinar . 2 White papers . 2 Native ads . 1 Custom Piece of Content Creation, Industry Survey . 1 Paid Social Push 3x per year on Twitter (5,000 impressions each)

. 1 Co-Sponsored Webinar . 2 White paper . 1 Native ad . 1 Custom Piece of Content . 1 Paid Social Push once per year on Twitter (5,000 impressions)

GOLD

SILVER

BRONZE

Webinars

Co-Sponsored Webinar . 6 co-sponsored webinars will be featured throughout the year . Each co-sponsor will receive 10 minutes of presentation time, logo on all promotional material and all leads, promotion on Twitter, coverage on insight.tech site and in newsletter Price: $3,500 per sponsor, 4 slots available per topic

Solo Webinar. Sponsor selects a date and time for a solo hour-long webinar . The webinar will be moderated by an editor. The sponsor receives all leads. Promotion of the webinar includes email campaigns, logo on all promotional material, promotion on Twitter, coverage on insight.tech site and in newsletter Price: $10,650

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Co-Sponsored Webinar CalendarFebruary Industrial IoTApril Connected Factories June Machine LearningAugust AIOctober Smart Cities December Medical

All webinar production is coordinated through OpenSystems Media.

Online Sponsorships

Native Ads . Includes 150-300 words, large hero image, secondary photo and links. 10,000 guaranteed impressions including coverage on Twitter and on insight.tech newsletter for deployment. 3-month campaign Price: $2,000

White Paper Posting with Promotion. Designed for immediate lead generation . A custom HTML email will be deployed to the insight.tech subscriber database . Sponsor selects time and date for deployment Price: $4,000

Read About

Intel Xeon D

Using a common technology for multiple applications

Maximizing compute power

Overcoming sensor fusion challenges

Tackling the mobile server

DEFENSE SOLUTIONS

Intel Xeon D: A Significant Leap Forward in General Purpose Processor (GPP) Technology Across the Spectrum of Defense ApplicationsTE

CH

NO

LOG

Y W

HIT

EPA

PER

C U R T I S S W R I G H T D S . C O M

IntroductionDefense platforms and their associated physically constrained payloads have long been the limiting factor in terms of mission capability. In other words, there is a set power budget available, maximum weight and volume limits, and a fixed ceiling of heat that can be removed dependent on the particular platform-based payload. Whatever processing can be performed in this fixed size, weight and power (SWaP) envelope dictates and limits mission capability associated with the particular function of the payload.

Given the mandate to maximize performance for a given enclosure, the defense industry has largely gravitated towards using a mixture of heterogeneous processing elements with the idea being that developers play to the strengths of these individual elements, applying them to the most appropriate sensor processing stage. Three of the biggest contenders have been FPGAs, GPPs, and GPGPUs. FPGAs and GPGPUs have experienced tremendous strides in terms of processing densities. However, General Purpose Processors (GPPs) have not been experiencing this same rapid gain in functionality, for instance being limited to four cores as with the case of the Intel® Core™ i7 family. That is until now, where the GPP has been propelled forward, with the advent of a new multi-core Intel architecture family, the Xeon® D. This white paper will explore the technology behind the Xeon D’s flexibility and how it can solve a diverse range of military and aerospace challenges.

Infocurtisswrightds.com

Email [email protected] Figure 1: Example of board-level architectural options

(e.g. Curtiss-Wright Defense Solutions CHAMP™-XD family)

TPMPABS

IntelXeon D

8/12/16-CoreSoC

XMC

Pn6

P2Expansion PlaneX24s+X8d+X12d

Core Func.FPGA

DDR48/16 GB

x32 PCIe3Switch2 NTBs

x4 PCIe3

x16 PCIe3

LPC

BIOS

SPI

SDD Flash16/32 GB

2x RS-2324x DIO

B P1 AData Plane

2x 10GBase-KRor

2x 1GBase-KX

GigENIC

IPMIFPGA

Pn5

PowerSupplies

Jumpers

Vs3 (5V)3.3V_AUX

PCIe

IPMBA/B

SATA

2133 MHz

DDR48/16 GB 2133 MHz

NVRAM

SPI

P1

2xU

SB2,

1xU

SB3.

0

Build Option (Mode 4, 5, 7, D or J)

2xSA

TA3

4x DIO

1x USB 2.01x SATA

3.0

1xU

SB2.

0,1x

SATA

3

2x RS-422

2x SATA4x DIO

2x SATA2x USB 2.0

4x DIO1x SATA2x USB 2.0

2x RS-4222x USB 2.04

5

7

D

J4x DIO1x RS-4221x USB 3.0

P1

2x 10GBase-KR

x8 PCIe3

1000Base-T

x4 PCIe3

Flash

MAG

Base-T

Flash

SPI

16 MBSRAM

PCH PCIe2

or x8 PCIe

USB

SATA

PABS

Intel Xeon D

16-Core SoCXMC

Pn5 Pn6

x8 PCIe3

XMC I/O VITA 46.9

Core Func. FPGAXilinx

UltraScale DDR4 64 GB

DDR4 64 GB

2133 MHz

2133 MHz

Phy

PCIe

x80 PCIe3 Switch2 NTBs

16 MB BIOS SPI

SSD Flash32 GB

SATA

1000BASE-KXor 10GBASE-KR

422/485 Serial

16 x GPIO

232 Serial

P1Data Plane

CX-3 40 Gb

CX-3 40 Gb

x8 PCIe3 x8 PCIe3

x16 PCIe3

x16 PCIe3x16 PCIe3

P5P2

TPM

IPMI

I2C

4 x EIA-232

2 x EIA-422/485

16 x GPIO

Front Panel Connectors

VPX Backplane Connectors

232 Serial

1000 -BASE-T

LPCSPI

PowerSupplies

x8 PCIe3

USB

USBUSB

SATA SATA

PABS

Intel Xeon D

8/12/16-Core SoC

XMC

Pn5

Pn6

x8 PCIe3

XMC I/O VITA 46.9

Core Func. FPGAXilinx

UltraScale

DDR4 8/16 GB

DDR4 8/16 GB

2133 MHz

2133 MHz

Phy

PCIe G1

x96 PCIe3 Switch2 NTBs

16 MB BIOS SPI

SSD Flash

16/32 GBSATA

1000BASE-KXor 10GBASE-KR

422 Serial

16x GPIO

232/422 Serial

P1Data Plane

Intel Xeon D

8/12/16-Core SoC

DDR4 8/16 GB

DDR4 8/16 GB

2133 MHz

2133 MHz

CX-3 40Gb

CX-3 40Gb

x8 PCIe3 x8 PCIe3

x16 PCIe3 x16 PCIe3

x16 PCIe3x16 PCIe3

SPI

SATA

P5P2

TPM

PABS

16 MB BIOS

SSD Flash

16/32 GB

TPM

IPMI

I2C

4 x EIA-232

2 x EIA-422/485

16x GPIO

Front Panel Connectors

VPX Backplane Connectors

232/422 Serial

1000 BASE-T

LPCSPI SPI

LPCx8

CPLD

POWER RESET

PowerSupplies

CHAMP-XD1

High Memory 128G DDR4

High Compute 2 Xeon D’s

CHAMP-XD2MCHAMP-XD2

SWaP Compact

Briefing Document - IoT _______________________________________________________________________________________

I B A S E T e c h n o l o g y I n c .

Page 1

Internet of Things Solutions for Railways FOUR key design requirements for electronic equipment on board trains Prepared by IBASE Technology, October 2017

Sample Native Ad

Sample White Paper

Sample White Paper Email Campaign

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Custom Content

Do you need help creating dynamic content? We have a team of writers who can author compelling on any application in the IoT space. Once the content is created we can create an email campaign to drive leads.White Paper (1,500 words). Price: $2,500

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Content creation is coordinated through OpenSystems Media.

Custom Surveys

Surveys are great opportunities to drive leads and keep the pulse on the engineering community. Each survey includes 8 questions, a giveaway, an outbound email campaign and a paid social media push to our audience on Twitter (more than 5,000 impressions).

Survey topics may include: IoT, IIoT, AI, Machine Learning, Smart Cities, Medical, Connected Factory, Predictive Maintenance, or any topic you wish to use.

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Do you have a custom project you would like to brainstorm with our team? We are happy to help. Contact: Patrick Hopper at [email protected]