2015 2016 PRODUCT CATALOG - SPS-Europe

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2015‐2016

PRODUCT CATALOG

1975‐2015

Since 1975, H‐Square has been providing tools and equipment of unparalleled excellence to the wafer fabrica on indus‐

try. Our products are the standard against which all others are measured in semiconductor manufacturing facili es

throughout the world.

Our products range from simple vacuum wands for wafer handling and tools for mask handling, to complex micropro‐

cessor controlled automa c systems. Our Custom Products Department will design tailor‐made products for your

unique needs. H‐Square also produces handling tools and devices for the flat panel display (FPD), LED, medical device,

solar, automo ve, and computer hard disk industries.

At H‐Square, our philosophy has always been to provide products of unsurpassed quality developed with the highest

degree of engineering excellence and manufactured with cra sman‐like workmanship. They are available worldwide

through a network of manufacturers' reps and distributors.

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WAFER ALIGNERS 22

WAFER MOVERS 32

WAFER TRANSFERS 34

WAFER PRESENTERS 42

POD OPENERS—FOUP/SMIF/RSP 47

WAFER CASSETTES 50

CASSETTE HANDLES 62

MOCK WAFERS 66

ERGOLIFT TRANSPORT CARTS 68

MECHANICAL WAFER PICKS 70

PHOTOMASK HANDLING 76

FREEDOM WANDS 86

VACUUM WANDS 92

WANDS 96

HOLDERS AND COIL CORDS 101

TIPS 110

DIE & PACKAGE HANDLING 136

MATERIALS 142

CARE & MAINTENANCE 146

SALES & SERVICE REPRESENTATIVES 148

INDEX 154

BERNOULLI HANDLING—BREEZE™ 84

ACCESSORIES 129

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Many of H‐Square’s core products were developed to specifically reduce or eliminate operator manual

handling movements, which can lead to defects on the wafers. The AWM Wafer Mover and the WPR Wafer

Presenter with rota on eliminate the need for a vacuum wand or tweezer. The LCT Low Contact Transfer

sta on takes the operator mo on out of a bulk transfer applica on and eliminates abrasion and par cles

common with slide transfers. The vacuum p with a bump on the backside prevents the operator from

inser ng the vacuum wand in between wafers. H‐Square invites you to review how our exis ng products can

immediately help you reduce defects due to wafer handling errors.

scratch/defect reduction products

AWM WPR

LCT BUMP TIP

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Thinning of an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and, as

an added benefit, the design of smaller form factor devices. H‐Square can build on its extensive experience in

thin wafer handling technology to support its customer's requirements. Thin wafer handling capabili es

generally enable the handling of wafers during and a er backside grinding, where the substrate Thinning of

an IC chip improves the total efficiency, as it allows a more efficient cooling, faster speed and, as an added

benefit, the design of smaller form factor devices.

thin wafer handling

H2BST

LCT

MISC1700

FB20A106

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H‐Square can build on its extensive experience in thin wafer handling technology to support its customer's

requirements. Thin wafer handling capabili es generally enable the handling of wafers during and a er

backside grinding, where the substrate is thinned down to the single digit micrometer scale. H‐Square has

developed thin wafer handling products for every type of substrate. Our unique thin wafer handling transfers,

aligners, vacuum wands, presenters and casse es are in use at our customer sites around the globe.

thin wafer handling

MISC1400-006 MCF THIN

TAIKO HANDLING AFEZ THIN

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H‐Square wafer notch and flat aligners provide an inexpensive and accurate method of batch alignment of

wafers to any angle. They are compa ble with SEMI standard casse es. EZ Guide models are constructed

with advanced ESD safe materials and the open design stage is laminar flow compa ble. H‐Square Custom

Products Department offers a wide range of customizable features for both standard and non standard

substrates

wafer aligners

NF/MF ANF/AF

FFTB1 FFTBAS

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Automa c and manual escalators li wafers incrementally when casse e are placed on the tool. Wafers are lted 25º to

enhance ID readability and an op onal LED light bank is available. Plas c ESD safe construc on makes unit idea for all lot

verifica on—lot integrity applica ons.

wafer escalators

ETAS1

AET FLAT

AET NOTCH

SQ21541

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H‐Square wafer presenta on systems provide an inexpensive and programmable method of removing/

replacing wafers contrac ng other wafers in the casse e or the circuit side of the li ed wafer. Presenta on

systems are designed to allow safe access to wafers for handling lower wafers for inspec on or

Iden fica on purposes, without the need for wafer where scratching and par culate contamina on must be

avoided.

wafer presenters

HL WP

WPR WB5L1

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As the industry moves from one technology genera on to the next in its drive to make smaller, faster and

more func onal chips, H‐Square is always there – providing the leading‐edge technology to help make it

happen. We are the world’s #1 provider of casse e to casse e wafer transfer equipment, offering both

automa c and manual solu ons to state‐of‐the‐art manufacturing customers. Automa c Low Contact

Transfers (LCT) and manual horizontal transfer (WT) are rou nely modified for thin wafer transfer

applica ons. Contact your local H‐Square representa ve for more details.

wafer transfers

LCT1AS12

AVT

AWT

LCT

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Economical, automa c single wafer transfer systems. Engineered for produc on, metrology, R&D, test‐

assembly‐packaging, and applica on labs. H‐Square offers a simple compact design for moving single

wafers between two casse es in a RECIPE or MANUAL mode of opera on. A safe vacuum‐less low contact

end‐effector includes a built‐in wafer mapping sensor which scans each casse e and detects wafers for safe

accurate wafer movements.

wafer mover

AWM

WS300M

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Standard Mechanical Inter Face (SMIF) pods and Front Opening Unified Pod (FOUP) carriers are based on an

Isola on technology developed in the 1980s at Hewle ‐Packard. Today, this system is in used in many

semiconductor wafer fabrica on and cleanroom environments throughout the world for both wafer handling

and photomask re cle handling. H‐Square pod openers provide an inexpensive method of gaining access to a

substrate storage pod carrier. H‐Square has a complete line of both automated and manual stand alone

tools. Units are ideal for any applica on where par culate contamina on must be avoided.

pod openers

SMIFPO

SMIFMAN

AFO

FOMH

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H‐Square is the oldest and most experienced manufacturer of metal wafer casse es in the world. During the

past 40 years H‐Square has manufactured the radically‐simple 2851 and MC1 designs that has proven to

provide the best reliability, performance, service life, and value of all of the compe ve products that have

come and gone in the industry. In addi on to the 2851 series casse e, H‐Square offers a full line of specialty

metal wafer casse es, in both aluminum and stainless steel, for any applica on. Custom casse es can be

manufactured for special substrate sizes and thicknesses.

metal wafer cassettes

SSC MC12

MCF

2851

MC1

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H‐Square offers a full line of specialty plas c wafer casse es for any applica on. Custom casse es can be "PC"

series casse es are precision machined custom casse es for special applica ons where off‐the‐shelf injec on

molded casse e varie es are either unavailable or under‐performing. The majority of H‐Square "PC" casse es

are manufactured from PTFE Teflon® material, however, H‐Square also offers casse es manufactured from a

selec on of advanced high performance plas cs, including an sta c Pomalux, PEEK, and an sta c

polypropylene.

custom PTFE wafer cassettes

PC

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H‐Square’s complete line of photomask handling tools is the result of years of work with semiconductor

companies and mask shops to provide a non‐contamina ng secure means of handling re cles. Mask Picks

can reduce contamina on by elimina ng direct contact of the mask by an operator’s hands. Masks are easily

inserted and extracted from various fixtures and storage containers, and are securely gripped while loaded in

the pick. With the stringent cleanliness requirements for sub‐micron applica ons today, mask picks have

become indispensable. In addi on to mask picks, H‐Square has designs for many support tools for opening

and closing re cle pods

photolithography handling

MASK PICKS

RSP OPENERS BRIGHT

LIGHT

PM NITROGEN CLEAN

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The Breeze™ provides a state‐of‐the‐art touch‐less solu on for manually transferring wafers while introducing

li le to no stress to the substrate. H‐Square’s Breeze™ wand is a non‐contact wafer handling substrates. The

handling tool uses compressed facility gases (typically Nitrogen ‐or‐ CDA ‐ clean dry air), to stream airflow from

a center sparger cap or sparger tube to the perimeter of the wafer. configura on. Custom configura ons are

also available through your local H‐Square representa ve.

breeze Bernoulli handling

H2BST H2B

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H‐Square manufactures an extraordinary number of different types of vacuum ps for many different sizes,

shapes, weights and materials of wafers, substrates, dies and packages and applica ons/equipment, as well

as for a complete range of temperature and chemical environments. H‐Square recommends carbon filled

PEEK ps for most applica ons especially where ESD protec on is a must. Higher temperature requirements

will be met by a range of p materials from Torlon® (polyamide‐imide) and Vespel® (polyimide) plas cs,

aluminum, stainless steel, hybrid quartz with stainless steel/Invar tubes or 100% (all) quartz glass. H‐Square

will design and fabricate vacuum ps to your specifica ons for your special requirements..

vacuum handling

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Self contained vacuum wands allow freedom from a house vacuum line sources. A rechargeable ba ery pack

provides enough power for the FREEDOM WAND™ to operate con nually up to 2 to 5 hours without the need

to recharge. Safe ‐ Low ba ery power warning indicator LED light. Versa le ‐ Accommodates most of H‐

Square’s ps and cups to handle all sizes of wafers and packages. Clean ‐ Filtra on system allows the

FREEDOM WAND™ to be used in Class 1 cleanrooms without the fear of par culate genera on. All models

include Normally OPEN wands; depress bu on to release wafer. Ba ery charger and wand p adapter also

included. Order ps for specific applica ons separately.

Freedom Wands™

FWCR2

FWA3

FWCR3

FWAH

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H‐Square has over 30 years experience providing clean room mechanical handling tools to the

Semiconductor, Automo ve, Photo Lithography and Medical industries. The ODP tool is a fully mechanical

tool, which provides edge only handling of substrates using v‐groove profile grippers or edge clamp

technology. The MCP tool was originally developed for MEMS wafer handling applica ons, however, many

customers have found them to be useful for wafer sampling and removing wafers from a process tool. These

tools are highly customized for specific applica ons and are available for all wafer sizes and thicknesses.

mechanical wafer handling

MCP

ODP 3PT ODP MPS

ODP MPH

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Advanced design, normally closed, mechanical handling tool for large die or small device. Each tool is custom designed for a specific device. Customiza on allow a constant force grip to eliminate edge damage. Base units are made from ESD safe Polypropylene materials. Customized features: Tips can be developed per applica on; color coding available; choice of spring tension; high temperature materials available; chemical resistant materials available. Please contact your local H‐Square representa ve for more informa on on custom H‐Square mechanical handling tools. Minimum order quan es (MOQ) apply.

mechanical handling

ODP MPH HDCP

NU-TWEZER

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Ergoli ™ manual guided transport (MGV) carts provide safe handling of heavy objects around a Ergoli ™

manual guided transport (MGV) carts provide safe handling of heavy objects around a rated up to 200 lbs. (91

kg) of li and allows this versa le tool to pick‐up and place objects and carriers cleanroom area. The ba ery

driven motorized electric lead screw Z‐Axis li and customized end‐effector is on load ports, tables, and

storage racks. The light weigh‐Mobile EZ™ design allows the operator to make precise manual movements

when transpor ng product around a fab area. A demountable remote control, elimina on of Workman's

Compensa on claims contribute to higher profitability for your company.

ergo lift handling carts

FL

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H‐Square Product Videos

h p://www.youtube.com/user/

HSquareVideos

H‐Square Wafer Transfer Videos

AWM Automa c Wafer Mover 4:01

AWT Auto Horizontal Wafer Transfer 1:42

AWT Auto 200mm Horizontal Wafer Transfer 1:24

AVT6 Auto 150mm Ver cal Transfer 2:09

AVT4 Auto 100mm Ver cal Transfer 2:28

AVT8 Auto 200mm Ver cal Transfer Tool 2:45

LCT1AS6 150mm ASM Low Contact Transfer 1:44

LCT1AS6 150mm Varian Low Contact Transfer 1:27

LCT1AS12 Auto 300mm Low Contact Transfer 1:38

LCT1AS4 Auto 100mm Low Contact Transfer 1:19

LCT1AS Low Contact Transfer 2:44

LCTAS12‐AC‐003 Auto 300mm Transfer 1:44

LCT1AS8 Auto Thin Wafer Transfer 1:32

WS300M Automa c 300mm Wafer Mover 1:38

WT Custom Horizontal Clamshell Transfer 0:48

WT300 Manual 300mm Horizontal Transfer 0:42

WT6HAS‐009 Manual Dual Arm Wafer Transfer 1:03

WT6HAS‐017 Selec ve Slot Horizontal Transfer 0:49

WT28HAS Horizontal Transfer System 1:42

WT Odd‐Even Horizontal Transfer 1:40

H‐Square Wafer Aligner Videos

AFEZ Auto 75mm Custom Auto Aligner 0:10

AFEZ Auto 75mm Auto Aligner 0:13

AFEZ6 Auto 150mm Flat Aligner 1:23

ANFEZQ8 Auto 200mm Notch Aligner 1:13

ANFEZQ8‐AC‐005 Wafer Edge Inspec on Aligner 2:07

FFTB1 Manual Flat Aligner 2:14

NFEZQ8 Manual 200mm Notch Aligner 0:58

H‐Square Mechanical Pick Videos

FPD Mechanical Pick 1:02

MCP Mechanical Wafer Picks 1:42

ODP Mechanical Wafer Picks 2:13

Photolithography Mask Handling Picks 3:07

Taiko Thin Wafer Handling 0:20

H‐Square Pod Opener Videos

AFO Auto 300mm FOUP Opener 1:10

RSP200 Manual RSP200 Pod Opener 0:55

SMIFPO8 Automa c RSP200 Opener 0:54

SMIFPO8 Automa c SMIF Pod Casse e Opener 1:13

SMIFMAN8 Manual SMIF Pod Opener 0:59

H‐Square Wafer Presenter Videos

AET Auto 200mm Wafer Aligner/Escalator 1:02

ETAS1 Manual Wafer Escalator 1:10

HL‐4 100mm Manual Single Wafer Presenter 1:36

HL‐6 Manual 150mm Wafer Presenter 1:20

WP Auto 150mm Wafer Presenter 1:56

WP‐4 100mm Automa c Wafer Presenter 1:40

WPR Auto 150mm Wafer Presenter 2:00

WPR8 200mm Auto Wafer Presenter 2:14

H‐Square Vacuum Wand Videos

FWA3AS2 300mm Freedom Wand™ 1:49

FWCR Cordless Freedom Wand™ 1:37

Vacuum Wand 300mm Thin Wafer Handling 0:34

Vacuum Wand 300mm Wafer Handling Tool 1:56

Vacuum Wand Die Handling 1:40

Vacuum Wand Thin Wafer MISC1400 1:02

Vacuum Wand Tips 2:56

Miscellaneous H‐Square Videos

FL‐006 Ergoli ™ 450mm Carrier Transport

FL‐004 Ergoli ™ 450mm Carrier Transport 2:14

FS‐002 Manual 300mm FOUP / FOSB Stand 0:53

MISC2500 Automa c On / Off Bright Light Box 1:10

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EZ Guide™ Notch Aligners

This fully automa c microprocessor controlled notch finder provides for wafer notch alignment with minimal operator

involvement. To align wafer flats the operator places the carrier on the unit and pushes the “RUN” switch. All wafer

notches are automa cally aligned to the bo om, and then relocated to one of the 16 posi ons as set by the operator.

Accuracy is be er than plus or minus one degree. No manual opera on or override is available. All rota on is controlled at

a constant speed for minimal par culate genera on. Final wafer 16‐posi on rotary switch control is located near the RUN

switch. Standard adjustment points are 0°, 2°, 45°, 88°, 90°, 135°, 176°, 178°, 180°, 182°, 184°, 225°, 270°, 272°, 315° and

358° degrees. Open design allows increased laminar airflow and improves cleanliness while minimizing footprint. EZ

GUIDE™ posi oners assure properly posi oned casse es. ESD protected by sta c‐dissipa ve plas cs. Proprietary sta c‐

dissipa ve polyurethane roller withstands more than 2,000,000 cycles with accuracy of be er than ±1°. Compa ble with

most standard plas c wet/dry process casse es, shipping and storage casse es.

Unique quick disconnect roller feature allows mainte‐

nance staff to remove the roller assembly for cleaning or

replacement.

Replacement power supply for all automa c EZ‐Guide™

aligners:

A000‐754‐1 USA (100‐120 VAC)

A000‐754‐2 EUROPE (220‐240 VAC)

A000‐754‐3 UK (220‐240 VAC)

US Patent No. 5,551,829

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A l i g n e r s A U T O M A T I C N O T C H

150mm Notch Aligner—automa c EZ Guide™ ‐ 12 slot

Automa c notch aligner for 150mm wafers in a 12‐slot casse e.

Stage: An sta c Polypropylene Roller: An sta c Polyurethane SQ21733‐8 Entegris 12 slot USA (100‐120 VAC)

SQ21733‐10 ePak 12 slot USA (100‐120 VAC)

Replacement Drive roller: A000‐723

Replacement Notch Roller: A000‐1078

150mm Notch Aligner– automa c EZ Guide™ ‐ 25 slot


Stage: An sta c Polypropylene Roller: An sta c Polyurethane

SQ22143‐3 USA (100‐120 VAC)






ANFEZQ8

Replacement Drive roller: PRA8

Replacement Notch Roller : NFNRQ


Automa c notch aligner for 300mm open bo om casse es (not FOUP

or FOSB).


Contact H‐Square for Ordering Part Numbers

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Ba ery Powered Motorized Top/Bo om Notch Aligners

This ba ery powered notch finder is designed to align SEMI standard notched wafers. Similar in principal to flat finders, it

uses a small diameter, nylon alignment roller to rotate the wafers. When the notch registers over the roller the wafers

cease rota on, leaving the notches aligned at the bo om. This notch finder is compa ble with most standard plas c wet/

dry process carriers and shipping/storage containers. The Bo om‐Motorized Top model allows reloca on of aligned

notches to any posi on. The drive roller consists of an elastomeric PVC (Tygon™) sheath over Acetal (Delrin™). The roller

is a ached to a manual li ing mechanism. A er the notches have been aligned to the bo om using the motor drive, the

operator presses a li bar, which raises the drive roller. The roller li s all wafers away from the notch alignment roller.

The operator then manually rotates the spinner knob to relocate aligned notches to desired posi on. Notch finders are

constructed of hard clear anodized 60621 T‐6 aluminum alloy for dimensional stability and durability. Base plates are

lted for wafer separa on. Models use “D” cell style ba eries.

EZ Guide™ Manual Top/Bo om Notch Aligners

This manual notch aligner provides for top/bo om wafer notch alignments. To align wafer notches the operator places

the carrier on the unit and rotates the manual knob. Unique wafer roller and alignment system gently captures and

posi ons the notches to the bo om of the casse e. Operator can then rotate the roller alignment switch and manually

rotate the wafer notch posi on to any posi on on the radius. Open design allows increased laminar airflow and improves

cleanliness while minimizing footprint. EZ Guide posi oners assure properly posi oned casse es. ESD protected by sta c

‐dissipa ve plas cs. Proprietary sta c‐dissipa ve polyurethane roller withstands more than 2,000,000 cycles with

accuracy of be er than 1° degree. Compa ble with most standard plas c wet/dry process casse es, shipping and

storage casse es.

150mm Top/Bo om Notch Aligner

Ba ery powered manual motorized assist 25‐slot notch aligner for GaAs

and Sapphire notched 150mm wafers.

Stage: Anodized Aluminum Rollers: Tygon / Nylon

SQ22386‐2 150mm notch aligner

Replacement Drive Roller : A000‐988

Replacement Notch Roller: NRA6

200mm Top/Bo om Notch Aligner

Manual Motorized Assist Notch aligner for 200mm notched wafers.

Stage: Anodized Aluminum Rollers: Tygon / Nylon

NFBMT18 200mm notch aligner

Replacement Drive Roller: NFNRM

Replacement Notch Roller: NRA8


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A l i g n e r s M A N U A L N O T C H

150mm Notch Aligner—manual EZ Guide™ ‐ 12 Slot

Manual notch aligner for 150mm wafers in a 12 slot casse e.

Stage: An sta c Polypropylene Roller: An sta c Polyurethane SQ21733‐9 Entegris 12 slot Casse es

SQ21733‐11 ePak EPB‐6/150‐12

150mm Notch Aligner– manual EZ Guide™ ‐ Standard 25 Slot

Manual notch aligner for 150mm wafers in a 25 slot casse e.


SQ22143‐2

Replacement Drive Roller: A000‐723


200mm Notch Aligner ‐manual EZ Guide™

Manual notch aligner for 200mm wafers in a 25 slot casse e. Stage: An sta c Polypropylene Roller: An sta c Polyurethane NFEZQ8

Replacement Drive Roller: PRA8

Replacement Notch Roller: NFNRQ

300mm Notch Aligner (13 and 25 Slot) manual EZ Guide™

Manual notch aligner for 300mm wafer in a non‐standard open

bo om casse e. Custom Product.

Stage: An sta c Polypropylene Roller: An sta c Polyurethane Contact H‐Square for Ordering Part Number(s)

200mm EZ Guide™ Edge Inspec on Notch Aligner

Manual dual knob version of the standard NFEZQ8 manual EZ Guide™ aligner. Dual knob control allows both right and le handed operators to slowly rotate the knob control for perfect edge inspec on of 200mm wafers. ESD safe construc on. Stage: An sta c Polypropylene Roller: An sta c Polyurethane / Nylon NFEZQ8‐005 Manual 200mm Notch, 25 slot

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EZ Guide™ Flat Aligners

This fully automa c microprocessor controlled flat finder provides for wafer flat finding with minimal operator

involvement. To align wafer flats the operator places the carrier on the unit and pushed the “RUN” switch. All wafer

flats are automa cally aligned to the bo om, and then relocated to one of the 16 posi ons as set by the operator.

Accuracy is be er than plus or minus one degree. No manual opera on or override is available. All rota on is

controlled at a constant speed for minimal par culate genera on. Final wafer flat a 16 posi on rotary switch mounted

controls loca on near the RUN switch. Standard adjustment points are 0°, 2°, 45°, 88°, 90°, 135°, 176°, 178°, 180°, 182°,

184°, 225°, 270°, 272°, 315° and 358° degrees. (Custom firmware for other posi on maps is available for an addi onal

charge.) These models are compa ble with most standard 4”, 5”, 6”, and 8” plas c wet/dry process casse es, shipping

and storage containers. Units are NOT compa ble with metal casse es. Custom models are available for metal

casse es, 50mm wafer casse es, 75mm wafer casse es and non‐standard carriers. Open design allows increased

laminar airflow and improves cleanliness while minimizing footprint. EZ GUIDE™ posi oners assure properly posi oned

casse es. ESD protected by sta c‐dissipa ve plas cs. Proprietary sta c‐dissipa ve polyurethane roller withstands

more than 2,000,000 cycles with accuracy of be er than ±1°. Compa ble with most standard plas c wet/dry process

casse es, shipping and storage casse es.

Unique quick disconnect roller feature al‐

lows maintenance staff to remove the roller

assembly for cleaning or replacement.

Replacement power supply for all automa c EZ‐

Guide™ aligners:

A000‐754‐1 USA (100‐120 VAC)

A000‐754‐2 EUROPE (220‐240 VAC)

A000‐754‐3 UK (220‐240 VAC)

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A l i g n e r s A U T O M A T I C F L A T

100mm EZ Guide™ Flat Aligner

Automa c flat aligner for 100mm wafers in a 25 slot casse e. ESD safe design.


AFEZ‐4


75mm EZ Guide™Flat Aligner



AFEZ‐3 UK (220‐240 VAC)


150mm EZ Guide™ Flat Aligner



AFEZ‐6


200mm EZ Guide™Flat Aligner

Automa c flat aligner for 200mm wafer in a standard 25 slot casse e. ESD safe

design.


AFEZ‐8

Replacement Drive roller: A000‐724‐1

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An ‐Sta c Plas c Top/Bo om Manual Flat Finder

The “FFTBAS‐456” model is for use in applica ons where metallic contamina on or chemical a acks are concerns. It is

constructed from black sta c‐dissipa ve polypropylene, which has been custom manufactured to H‐Square specifica ons.

This material has excellent chemical resistance and toughness. Since it is conduc ve, it will not build up sta c charge,

which can lead to circuit damage or act as a par culate magnet. Its proprietary conduc ve polyurethane roller provides a

path from wafers to ground (ground wire included) for ESD protec on. In addi on to the posi ve material a ributes of

this tool, many mechanical features have been incorporated into its simple design. The roller li s out for cleaning and is

reversible for le or right‐handed operators. To minimize fric on and abrasion between moving parts, the roller if li ed

by support pylons from below the base plate. A single rigid li bar is provided for easy access by the operator and for long

‐term dimensional stability. A single screw located beneath the base plate controls sta c roller height and total roller li .

Limi ng total li minimizes abrasion of the carrier slots by the wafers. Four fixed pylons accurately locate the carrier over

the roller. Side plates are unequal length in order to maintain good wafer separa on. All components have been designed

to reduce sharp edges and par cle traps where possible. The footprint of the “FFTBAS‐456” has been minimized while

retaining the durability and rigidly of thick plate material.

This single model is compa ble with most standard 4, 5, and 6‐inch plas c wet/dry process carriers, storage and shipping

containers. Unit is NOT compa ble with metal casse es. Custom models are available for metal casse es and non‐

standard carriers. The “FFTBAS‐456” is a manual, non‐motorized model. All wafer flats are first aligned to the bo om

posi on by rota ng the spinner knob. Pressing the li bar and rota ng the spinner knob may then rotate the aligned flats.

Please specify casse e model number when ordering.

EZ Guide™ Flat Aligners

This manual flat aligner provides for top/bo om wafer flat alignments. To align wafer flats the operator places the carrier

on the unit and rotates the manual knob. Unique wafer roller and alignment system gently captures and posi ons the

flats to the bo om of the casse e. Operator can then rotate the roller alignment switch and manually rotate the wafer

flat posi on to any posi on on the radius. Open design allows increased laminar airflow and improves cleanliness while

minimizing footprint. EZ Guide posi oners assure properly posi oned casse es. ESD protected by sta c‐dissipa ve

plas cs. Proprietary sta c‐dissipa ve polyurethane roller withstands more than 2,000,000 cycles with accuracy of be er

than 1 degree. Compa ble with most standard plas c wet/dry process casse es, shipping and storage casse es.

An sta c Mul ‐Size Flat Aligner

Mul ple size flat finder for 100mm, 125mm, and 150mm wafers.

Manual top/bo om all plas c flat aligner. ESD safe design

construc on.


FFTBAS456 Mul ple Size Flat Aligner

Replacement Roller: A000‐379‐2

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A l i g n e r s M A N U A L F L A T

75mm Flat Aligner– EZ Guide™

Manual an sta c flat aligner for 75mm wafers in a 25 slot casse e. ESD safe

design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane

MFEZ3 75mm



Manual an sta c flat aligner for 100mm wafers in a 25 slot casse e. ESD

safe design. Stage: An sta c Polypropylene Roller: An sta c Polyurethane

MFEZ4 100mm





MFEZ6 150mm





MFEZ8 200mm

Replacement Drive Roller: PRA8

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Top/Bo om Metal Flat Aligner

Manual flat aligner for 50mm, 75mm, 100mm, 125mm, 150mm, or 200mm wafers in a 25 slot casse e. Top/Bo om Manual, non‐motorized model. All wafer flats are first aligned to the bo om posi on by rota ng the spinner knob. To relocate the aligned flats to any other posi on, the li lever is depressed, and the spinner knob is rotated again to move the flats to the desired loca on. Stage: Anodized Aluminum Roller: Virgin Polyurethane FFTB1‐2 50mm

FFTB1‐3 75mm

FFTB1‐4 100mm

FFTB1‐5 125mm

FFTB1‐6 150mm

FFTB1‐8 200mm

METALLIC FLAT FINDERS The “FFTB1” model is the base model top/bo om manual flat finders. They provide an efficient method of aligning prima‐ry or secondary wafer flats without removal of wafers from the carrier. They are constructed of precision‐machined, hard clear anodized, 6061 T‐6 aluminum alloy for durability and long‐term dimensional stability. Aluminum also adds mass to the system, which improves stability during use. Motorized versions are available through the Custom Products depart‐ment and u lize industrial quality “D” cells (one per motorized flat finder) and 9‐volt transistor ba eries (one per semi‐automa c flat finder). Several significant improvements have been made to these models, including:

Elastomeric PVC feet have durability, chemical resistance.

Legs are unequal length to force good wafer separa on during flat finding.

Two spinner knobs are provided to more easily allow le /right handed opera on.

Delrin roller and roller extension knob have machined flats for more posi ve locking of spinner knob to roller with set screws.

Fasteners used for legs, li ‐plate hinges and li ‐lever pivot have an added plas c locking patch to resist loosening.

Aluminum parts are hard clear, rather than hard black anodized, for be er abrasion resistance, lower surface porosi‐ty and elimina on of dyes and sealers used with black anodize that could discolor and outgas.

Li ‐lever spacers are precision machined to prevent metal‐to‐metal contact between lever and base plate.

Roller height adjustment requires no tools; a knurled plas c knob allows quick manual adjustment if required.

UHMW wafer supports have a top radius rather than angular support surface to prevent nicking and provide easier casse e loading.

Motor drive system allows a free‐floa ng mo on to reduce motor and ba ery loads.

Roller sheaths on 4, 5 and 6 inch models have been converted to custom molded Polyurethane for be er chemical, sta c and abrasion resistance. Sheaths for 2 and 3 inch models are clear PVC (Tygon) tubing. These models are com‐pa ble with most standard plas c wet/dry process casse es. Please specify casse e model when ordering.

Replacement Polyurethane Roller Sheaths

100mm (FFTB1‐4, FFTB1M‐4, FFTB1MSA‐4) PRS4

125mm (FFTB1‐5, FFTB1M‐5, FFTB1MSA‐5) PRS5/6

150mm (FFTB1‐6, FFTB1M‐6, FFTB1MSA‐6) PRS5/6

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Catalog15‐16.1

A l i g n e r s

Automa c EZ Guide™ Wafer Aligner‐Escalator

This table top space conscious aligner escalator automa cally notch or flat aligns the wafers and then automa cally

escalates the wafers to view for manual ID mark reading. The unit features a joys ck to allow the operator to selected

the perfect lt angle for enhanced ID readability. H‐Square's EZ Guide™ patented alignment mechanisms result in

excep onal aligning accuracy. The user‐friendly simple control panel and mechanical and so ware build in safeguards

make this tool easy to use. The cost‐effec ve design and operator visual reading provides wafer tracking at a frac on

of the cost of fully automated OCR systems. The tool is designed with an ESD safe construc on and is Class 1 cleanroom

compa ble. Each unit can be ordered with an op onal LED light bank lamp with op mizes laser scribe reading without

exposing photoresist.

Automa c EZ Guide™ Wafer Aligner/Escalator

100mm, 150mm or 200mm wafer notch or flat aligners with special wafer

escala on for wafer/lot ID verifica on. An sta c Construc on.

Custom designs features include LED ligh ng , 12 or 13 slot designs, and AET

units with thin wafer li combs. Please contact H‐Square for informa on.

AETWFA4 100mm Flat

AETWFA6 150mm Flat

AETWNA6 150mm Notch

AETWFA8 200mm Flat

AETWNA8 200mm Notch

Special Applica on Aligners

H‐Square Custom Product Department has designed numerous applica on

specific aligners, including: wafer edge inspec on tools, custom non‐SEMI

standard casse e aligners, operator ergonomic solu on aligner tools, special

flat or notch size aligners, wet bench bulk aligner modules, and many more.

Please contact your H‐Square representa ve for more informa on or to

request a quote.

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A W M — W a f e r M o v e r ™ ‐ S i n g l e W a f e r

T r a n s f e r S y s t e m

AWM3 75mm

AWM4 100mm

AWM6 150mm

AWM8 200mm

H‐Square’s Automa c Wafer Mover™ (AWM) is an electromechanical stand‐alone tabletop automa on system designed

to move single wafers between two process casse es. The automa on pla orm is controlled by use of a storable

touchscreen display. The AWM can be ordered from the factory adjusted to handle either 75mm, 100mm, 150mm or

200mm wafers. Each system can be uniquely setup to handle customer specific wafer casse e(s), wafer thickness or

unique wafer a ributes. Wafer Movers are designed to alleviate the need for manual wafer handling methods, reduce

scratching and wafer breakage. An H‐Square Wafer Mover pla orm will effec vely replace the need for a vacuum wand,

wafer tweezers, or an expensive sorter pla orm.

User friendly FPD touch screen so ware allows an operator to easily select Recipe Mode or Manual Mode. Recipe Mode

allows operator to select preprogrammed recipes wafer movements between two carriers. Manual Mode allows opera‐

tor to choose on the screen which wafers to move and where they should be placed. A safe vacuum‐less low contact end‐

effector includes a wafer mapping sensor which maps wafer loca ons in each casse e and detects wafers presence for

safe accurate movements. This system does not offer OCR /alignment capabili es. Facili es—120V/220V power.

Single wafer transfers

Lot split applica ons

Merge applica ons

Fill applica ons

Pitch change applica ons

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Catalog15‐16.1

T r a n s f e r s W A F E R M O V E R ™

3 0 0 m m W a f e r M o v e r ™ ‐ S i n g l e W a f e r F O U P t o F O S B T r a n s f e r

For moving single 300mm wafers between two SEMI standard FOUP, FOSB or H‐Square MC12‐25HC metal bake‐

out casse es. This system does not offer OCR /alignment capabili es. Facili es—120V/220V power.

WS300M 300mm

Dimensions

Height: 48.4” (1229.3mm)

Depth: 35.8” (909.3mm)

Width: 88.6” (2250.4mm)

→ Economical

Targeted for cost sensi ve applica ons: R&D,

Test‐Assembly‐Packaging, & Applica on Labs.

Low Selling Price.

→ Simple

Compact Portable Design for sor ng wafers

between two SEMI standard FOUP, FOSB or Met‐

al Bake‐out Carriers. Operator opens FOUP man‐

ually, rotates into posi on. User‐friendly FPD

touch screen so ware ‐ select recipe or manual

mode to move a single or mul ple wafers be‐

tween carriers.

→ Safe

300mm edge contact grip end‐effector includes

wafer mapping sensor which detects wafers and

checks for double stack & cross slo ng.

Facili es—120V/220V AC Power

Edge grip end effector

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Open‐Casse e Low Contract Transfer System

Low contact transfer machines provide a safe means of mass transferring wafers from casse e to casse e. Wafers are

gently li ed midpoint in the casse e slots before extrac ng or loading them to minimize contact with the casse e which

could cause abrasion, par cula on or wafer edge chipping. Op cal and mechanical sensors combined with so ware logic

guard against opera on errors such as trying to transfer wafers into a casse e which is already loaded with wafers. User‐

friendly fail‐safe opera on features simple one‐bu on actua on. Sturdy construc on assures high reliability and

robustness required in high throughput fabs. Small footprint saves valuable cleanroom space.

FOUP Low Contact Transfer System

300mm and 450m low contact transfer machines provide safe means of mass transferring wafers from carrier to carrier.

Wafers are gently li ed midpoint in the casse e slots before extrac ng or loading to minimize contact with the casse e

which could cause par cula on. Safety sensor detects wafers in the pod. Wafer mapper detects cross slo ed, double

stack and double cross slot wafer posi ons. User‐friendly fail‐safe opera on features include simple one‐bu on reset,

one‐bu on run actua on and EMO switch incase of emergency. The table top small footprint saves valuable cleanroom

space. Sturdy construc on assures high reliability and robustness required in high throughput fabs. Unit is compa ble

with SEMI standard FOUP, FOSB and metal bake casse es. Class 1 cleanroom compa ble. ESD safe construc on.

100mm‐200mm LCT1 Applica ons

Plas c to Plas c, Plas c to Metal, Metal to Plas c, Mass Transfers

Thin wafer transferring

Compound (fragile) wafer transferring

Wafer inver ng (180° reorienta on), H‐Bar up or down

Class 1 transfer applica ons

Transferring between two casse es with different D1 dimensions

300mm‐450mm LCT1 Applica ons

FOSB to FOUP, mass transfers

FOUP to FOUP, mass transfers

FOUP to Metal Casse e, mass transfers

Transfer Rods: EP 316 stainless

steel rods with PVDF (Kynar®)

coa ng.

It is recommended to use LCT1AS12 and AFO (auto

FOUP door opener) together as a set

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Catalog15‐16.1

T r a n s f e r s L O W C O N T A C T

LCT1 Series Low Contact Transfers—

100mm, 150mm, 200mm mass wafer transfer system for

standard, thin wafer and compound semiconductor wafer

handling applica ons.

LCT1AS4 100mm

LCT1AS6 150mm

LCT1AS8 200mm

LCT1 Series Low Contact Transfers—

300mm and 450mm mass wafer transfer systems for FOUP, FOSB and metal casse es transfer applica ons. Special

custom rota ng base models are available.

Standard 300mm

LCT1AS12 300mm

Custom 300mm with Rota ng Base

LCT1AS12‐AC‐003 300mm USA (100‐120 VAC)

LCT1 LCT1 w/ Stage Rota on

Dimensions

Height: 12.0” (304mm)

Depth: 23.0” (584mm)

Width: 10.0” (254mm)

Dimensions

Height: 20.0” (508mm)

Depth: 35.0” (889mm)

Width: 16.0” (406mm)

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AVT—Automa c Ver cal Wafer Transfer System

Table top ver cal transfer machine safely mass transfers wafers between various combina ons of plas c, metal, silicon

carbide and quartz casse es. Small footprint saves valuable cleanroom space. Proprietary wafer li er minimizes

alignment problems. Casse es move, rather than wafers, for safer, cleaner transfer. Absence of comb pivot point above

wafer ensures cleanliness. Single bu on opera on makes unit very user‐friendly. Simple design for reliability and low

maintenance. Class 1 cleanroom compa ble.

Dimensions

Height: 29.4” (748.4mm)

Depth: 17.5” (446.1mm)

Width: 26.4” (672.4mm)

Plas c to Metal

Metal to Plas c

Plas c to Plas c

Plas c to Quartz/SiC

Quartz/SiC to Plas c

AVT4 100mm Wafer

AVT4‐KIT 100mm Casse e and Power

Supply AC, E or UK

AVT6 150mm Wafer

WPR6‐KIT 150mm Casse e and Power

Supply AC, E or UK

AVT8 200mm Wafer

AVT8‐KIT 200mm Casse e and Power

Supply AC, E or UK

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Catalog15‐16.1

T r a n s f e r s

Program 1 LEFT CASSETTE ↑

Program 2 LEFT CASSETTE →

Program 3 LEFT CASSETTE ←

LEFT CASSETTE

RIGHT CASSETTE

RIGHT CASSETTE

v e r t i c a l

© 2015‐2016 H‐Square

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AWT ‐Automa c Horizontal Wafer Transfer System

Automa c wafer transfer machines safely mass transfers wafers between casse es. Small footprint design minimizes

valuable work bench space required for opera on. Color‐coded posi oning dots make correct casse e placement easy for

operators. Heavy‐duty construc on and high‐quality internal components assure long life and con nued accuracy.

Casse e posi on sensors allow opera on only when casse es are properly posi oned to assure safe wafer transfers.

Added safety provided by circuitry which stops transfer when excessive force is detected. ESD safe construc on. Please

specify casse e model number(s) when placing the order. Class 1 cleanroom compa ble. Stage: Natural Polypropylene,

H‐Bar Rails and Transfer Arm: An sta c Polypropylene

AWT2HL4 100mm

AWT2HL6 150mm

AWT4HL8 200mm

Replacement power supply for all automa c AWT transfers:

A000‐754‐1 USA (100‐120 VAC)

A000‐754‐2 EUROPE (220‐240 VAC)

A000‐754‐3 UK (220‐240 VAC)

50mm—150mm Dimensions

Height: 8.2”

Depth: 24.0”

Width: 7.0”

200mm Dimensions

Height: 10.1”

Depth: 26.2”

Width: 9.25”

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T r a n s f e r s H O R I Z O N T A L S L I D E

WT ‐ Manual Horizontal Wafer Transfer System H‐Square’s horizontal wafer transfer machines are a safe and prac cal way to mass transfer wafers from casse e to

casse e. These economical units are designed to transfer wafers between plas c and/or standard high profile H‐Square

metal casse es. Chemical resistant materials and manual opera on make these units ideal for all applica ons, including

wet areas. ESD safe models u lize sta c dissipa ve materials to both protect against damage from sta c electricity and

minimize par cle a rac on. Models are available for HIGH wall to HIGH wall and HIGH wall to LOW wall casse e designs.

Please specify casse e model number(s) when placing the order. Class 10 cleanroom compa ble. Stage: Natural

Polypropylene, Arm: An sta c Polypropylene

WT2HAS 50mm High Wall Casse es Only



WT4HLAS 100mm High Wall and Low Wall Casse es







WT3456AS Mul ‐Size 75mm,100mm,125mm,150mm High Wall Casse es*

* Note that the standard WT3456AS will not accept metal casse es, all other versions will support metal

casse e usage.

50mm—150mm Dimensions

Height: 8.2”

Depth: 24.0”

Width: 7.0”

200mm Dimensions

Height: 10.1”

Depth: 26.2”

Width: 9.25”

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WT Series Custom Horizontal Transfer System—180° Wafer Flipping Applica on A custom version of H‐Square's standard WT horizontal slide transfer with special stage modifica ons to allow for one casse e to be loaded h‐bar DOWN and one casse e to be loaded h‐bar UP (or both UP, or both DOWN). Dimensions are similar to standard WT transfer tools. An sta c construc on.

WT Series Custom Horizontal Transfer System—Odd/Even Split Applica on A custom version of H‐Square's standard WT horizontal slide transfer with special 13 rod transfer arm that allows the operator to switch a cam mechanism aligning the transfer arm to the ODD or EVEN wafers in a 25 wafer casse e. Dimensions are similar to standard WT transfer tools. An sta c construc on.

Please contact your H‐Square representa ve for ordering part numbers and addi onal op ons and informa on.

13 wafers ← ODD → 25 wafers

12 wafers ← EVEN → 25 wafers

1

2

3

↓

↑

23

24

25

← INVERT →

25

24

23

↓

↑

3

2

1


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Catalog15‐16.1

Wa f e r T r a n s f e r s S P E C I A L T Y T R A N S F E R S

WT Series Custom Dual Arm Horizontal Transfer System—Offset D1 Casse e Applica on

A custom dual transfer arm version of H‐Square’s WT horizontal slide transfer for transferring wafer between two

casse es with same pitch but with different D1 dimensions (distance from bo om of h‐bar to first slot). An sta c

construc on.



WT300 Series Custom 300mm Horizontal Transfer

A custom H‐Square WT horizontal slide transfer for transferring 300mm wafers between two open‐bo om process

casse es. Some models feature a transfer bridge. An sta c models available.

© 2015‐2016 H‐Square

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Automa c EZ Guide™ Wafer Aligner‐Escalator

This table top space conscious aligner escalator automa cally notch or flat aligns the wafers and then automa cally

escalates the wafers to view for manual ID mark reading. The unit features a joys ck to allow the operator to selected

the perfect lt angle for enhanced ID readability. H‐Square's EZ Guide™ patented alignment mechanisms result in

excep onal aligning accuracy. The user‐friendly simple control panel and mechanical and so ware build in safeguards

make this tool easy to use. The cost‐effec ve design and operator visual reading provides wafer tracking at a frac on

of the cost of fully automated OCR systems. The tool is designed with an ESD safe construc on and is Class 1 cleanroom

compa ble. Each unit can be ordered with an op onal LED light bank lamp with op mizes laser scribe reading without

exposing photoresist. Custom designs features include LED ligh ng , 12 or 13 slot designs, and AET units with thin wafer

li combs. Please contact H‐Square for informa on.

Custom modified with integrated red LED light bank:

AETWFA6AC‐002 150mm Flat USA (100‐120 VAC)

AETWFA6E‐003 150mm Flat EUROPE (220‐240 VAC)


AETWNA8AC‐001 200mm Notch EUROPE (220‐240 VAC)

AETWNA8E‐003 200mm Notch EUROPE (220‐240 VAC)

AETWNA8UK‐002 200mm Notch UK (220‐240 VAC)

Custom modified for thin wafers (light not included):

AETWFA6AC‐001 150mm Flat USA (100‐120 VAC)


AETWFA6UK‐001 150mm Flat UK (220‐240 VAC)

AETWNA8UK‐001 200mm Notch UK (220‐240 VAC)


AETWNA8AC‐002 200mm Notch USA (100‐120 VAC)

Custom modified for 26 slot casse es (light not included):

AETWNA8AC‐004 200mm Notch USA (100‐120 VAC)


AETWFA4 100mm Flat

AETWFA6 150mm Flat

AETWNA6 150mm Notch

AETWFA8 200mm Flat

AETWNA8 200mm Notch

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Catalog15‐16.1

W A F E R E S C A L A T O R S

ETAS1 Series Manual Wafer Escalator

Manual escalator li s wafers incrementally when casse e is placed on unit.

Wafers are lted 25º to enhance ID readability. Plas c ESD safe construc on

makes unit idea for all applica ons. Construc on materials are ESD safe and

natural polypropylene and a grounding strap is provided.

ETAS1‐3‐001 75mm

ETAS1‐4 100mm

ETAS1‐5 125mm

ETAS1‐6 150mm

ETAS1‐8 200mm

ETAS8‐003 200mm for 26 slot casse es*

ETAS1‐8‐007 200mm with H‐BAR out *

* check casse e compa bility prior to ordering

SQ21541 Series Manual Escalator

SQ21541 is a popular custom product manual wafer escalator line where

the front guide plate is eliminated. Operator slides wafer casse e h‐bar

side against back guide of escalator.

Construc on materials are ESD safe and natural polypropylene.

Contact H‐Squarer’s Custom Product Department for more informa on

about custom wafer escalators, including designs for thin wafers, thick

wafers, wafer backside reading (h‐bar out) or escalators for custom or

unique casse es.

SQ21541‐13 100mm

SQ21541‐2 150mm

SQ21541‐10 200mm

P r e s e n t e r s

© 2015‐2016 H‐Square

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HL Series Manual Wafer Presenter

A manual wafer presenter sta on for removing/replacing wafers to/from a

casse e or for 100% inspec on or iden fica on of individual wafers. Special v

‐groove saddle gently li s wafers without contac ng others in the casse e.

Tool can be used with vacuum wands or outside diameter mechanical edge

picks. Class 10 cleanroom compa ble. Ergonomically designed for ease‐of‐use

and safe wafer handling. Small tabletop footprint saves valuable cleanroom

space. Constructed of plas cs selected to provide ESD safety, chemical

resistance, and clean opera on. Models available to accommodate most SEMI

standard wafer sizes and casse es.

HL‐2 50mm

HL‐3 75mm

HL‐4 100mm

HL‐6 150mm

HL‐8 200mm

WP Series Automa c Wafer Presenter

Programmable semiautoma c presenta on sta on li s wafers out of

casse es. Applica ons include removing/replacing wafers to/from a

casse e or 100% visual inspec on or iden fica on of individual wafers.

Special v‐groove saddle gently li s wafers without contac ng others in

the casse e. Units can be used with vacuum wands or outside diameter

mechanical edge picks. These systems have been tested to 1.2 million

cycles without failure. Basic dimensions of unit are 10”HX 13”W X 13”D

(254mm X 330mm X 330mm). Class 1 cleanroom compa ble.

WP4 100mm

WP6 150mm

WP18 200mm

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Catalog15‐16.1

W A F E R L I F T E R S

WPR Series Automa c Wafer Presenter with Rota on

The WPR wafer presenta on system provides a fully

programmable method for inspec ng and/or removing

and replacing wafers from process casse es with a

vacuum wand or an outside diameter mechanical pick. A

single ESD safe PEEK li blade gently engages the wafer

and li s it fully above casse e without scratching or

contac ng other wafers in the casse e. The operator uses

the touch screen display to either run a preprogrammed

recipe or create a wafer selec on rou ne manually. The

WPR system allows for 360° degrees wafer rota on –

providing for both front and backside macro inspec on by

an operator from a sta onary posi on; or the system can

be programmed to “flip” all or some wafers 180° degrees

in the casse e for special wafer processes. Class 1 Clean

room Compa ble; Models of opera on: Program

Automa c and Manual Selec on Modes. Available for all

dedicated wafer sizes and casse es up to 200mm.

WB5L Series 5‐Wafer Li er

Elevates 5‐wafers simultaneously to allow easy and safe access to wafers with vacuum wand or for wafer inspec on.

Unique posi on indicator provides clear visual iden fica on of which 5 wafers will be elevated. Ergonomically designed

for ease‐of‐use and safe wafer handling. Small tabletop footprint saves valuable cleanroom space. Constructed of plas cs

selected to provide ESD safety, chemical resistance, and clean opera on. Models available to accommodate most SEMI

standard wafer sizes and casse es.

WB5L1‐456 100mm, 125mm, or 150mm (adjusted for one wafer size)

WB5L1‐8 200mm

WPR Base unit

WPR4‐KIT 100mm Casse e and Power Supply AC, E or UK



P r e s e n t e r s

© 2015‐2016 H‐Square

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Casse e Stand

Access to wafers with vacuum wands can be significantly improved with casse e stands. Stands present the wafers in a

lted posi on, thereby reducing the amount of operator wrist rota on and associated discomfort. Room temperature

plas c or metal casse es are compa ble with these stands which are constructed of durable white polypropylene, heat‐

formed to finished shape. Casse es can be placed with wafers in a ver cal posi on, or with H‐bar down. Please contact H

‐Square for addi onal custom product versions.

FOUP / FOSB Stand

Stand alone stainless‐steel floor‐mounted manual FOUP stand provides ergonomic safe means to gain access to wafers off

‐line. Operator‐friendly design aligns FOUP, FOSB, or open bo om 300mm casse e, with the operator’s body and line‐of‐

sight. The 360° degree rota on with posi ve stop points allows any operator to find a comfortable posi on for safely

handling 300mm wafers to/from the specified carrier. The FS‐002 features a telescoping stand for ergonomically adjus ng

the height of the FOUP for tall or short operators. Table‐top designs are also available through H‐Square’s Custom

Products Department. Simple design for reliability and low maintenance.

CS‐6S 100mm, 125mm, or 150mm Single

CS‐8S 200mm Single

FS‐002 300mm FOUP / FOSB Rota ng

© 2015‐2016 H‐Square

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Catalog15‐16.1

P O D O p e n e r s F O U P

AFO ‐ 300mm Automa c FOUP Opener Automa c door opener provides clean and easy access to wafers in a SEMI standard 300mm FOUP. Interlocked load port turntable stage allows for 360 degree FOUP rota on to give operators access to the open FOUP. When open, the FOUP door is kept clean. Simple design for reliability and low maintenance. Unique low profile design ideal for tabletop applica ons and FOUP wash sta ons. Small footprint saves valuable cleanroom space.

AFO Automa c 300mm FOUP Door Opener

FOMH ‐ Manual 300mm / 450mm FOUP Door Opener Manual ergonomic dual‐pistol grip design allows for FOUP doors to easily opened. Unique design allows the removed FOUP door to be propped upright on the table when removed from the FOUP body. This effec vely keeps the inside face of the door clean—unlike the key style FOUP door openers. One pistol grip handle rotates, turning the FOUP door opening mechanism. Simple designs for reliability and low maintenance Handle: Delrin®, Case: Delrin® and Polycarbonate FOMH 300mm FOUP

FOMH450 450mm FOUP

Dimensions

Height: 20.0” (506mm)

Depth: 35.0” (889mm)

Width: 16.0”(406mm)

© 2015‐2016 H‐Square

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SMIFMAN6 150mm Manual Re cle SMIF Pod Opener Tabletop manual swing arm pod opener provides clean, easy access to photomasks in any RSP150 re cle storage single‐mask and mul ‐mask pod casse es. The SMIFMAN6 allows the operator to manually open the 4 lever mechanism on the pod, lowering the base and releasing the lid. This allows access to the inner mask tray. H‐Square’s design features a clean pin raised storage area for the lid to be stored while pod is open. Unit also features a mask pick holder. An sta c materials are used to insure ESD safety and cleanliness. SMIFMAN6 Manual RSP150 Opener

Dimensions

Height: 6.0” (152mm)

Depth: 10.8” (274mm)

Width: 19.0” (482mm)

SMIFPO6 ‐ Automa c 150mm RSP Pod Opener Semi‐automa c SMIF pod opener provides easy access to pho‐tomask storage POD casse es with minimal operator involve‐ment. Units are compa ble with most standard RSP150 and MSP150 SMIF pod designs. Smooth, reliable li automa on for reliability and cleanliness. Class One Cleanroom compa ble. ESD protec on insured by sta c dissipa ve plas cs. SMIFPO6 RSP150 150mm Re cle Pod Opener

© 2015‐2016 H‐Square

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Catalog15‐16.1

P O D O p e n e r s S M I F

SMIFMAN8 ‐ 200mm Manual SMIF Pod Opener An economical means to gain access to the interior of a 200mm SMIF pod process casse e. Units are compa ble with standard M2000 200mm SMIF pod designs. Features pod lid storage pla orm to keep the lid base clean when accessing the pod. ESD safe design. Small tabletop footprint. May also be used to open/close RSP200 re cle SMIF pods. Stage: Aluminum and ESD safe Polypropylene

SMIFMAN8 200mm SMIF and RSP200

SMIFPO8 ‐ Automa c 200mm SMIF Pod Opener Semi‐automa c SMIF pod opener provides easy access to wafer casse es with minimal operator involvement. Units are compa ble with most standard 200mm SMIF pod designs. Smooth, reliable li automa on for reliability and cleanliness. Class One Cleanroom compa ble. ESD protec on insured by sta c dissipa ve plas cs. Designs available for two different wafer casse e orienta ons. SMIFPO8 M2000 200mm Wafer Casse e Pod Opener SMIFPO8‐E‐002 RSP200 Re cle Pod Opener

Dimensions

Height: 26.9” (683.2mm)

Depth: 14.1” (358.1mm)

Width: 12.9” (327.6mm)

Dimensions

Height: 4.0 (101.6mm)

Depth: 10.8” (274.3mm)

Width: 15.5” (393.7mm)

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2851 Series Aluminum Wafer Process Casse es

2851 series casse es are conven onal 25 slot metal casse es used in semiconductor manufacturing opera ons. They are

typically used in areas where wafer posi oning is important or where elevated temperatures cause warpage to other

carriers. 2851 series casse es are direct replacements for many OEM metal carriers used with wafer track/elevator

systems, photo resist bake systems, and robo c loading systems for CVD and etch processes. This series has been

incorporated as the original equipment carrier provided by similar OEM’s. The 2851 series is manufactured from T6063

aluminum alloy for precision and high strength. Slots feature an 8º angle to reduce front and backside wafer contact.

Stainless steel spacer bars and fasteners are used to precisely secure the side plates to each other. Two solid PTFE rods

are used to support the wafers in the slots. Aluminum 2851 series casse es are compa ble with the CH handle.

FOR APPLICATIONS UP TO 250° C

Aluminum Side Plates

PTFE Teflon® Wafer Stops

316 Stainless Steel Spacer Rods and Fasteners

WAFER SIZE

HARD BLACK

ANODIZED

ELECTROLESS

NICKEL PLATED

HARD CLEAR

ANODIZED PFA COATING DIMENSIONS

ORDERING PART NUMBERS HEIGHT WIDTH LENGTH

2” (50mm) 2851‐2B 2851‐2HC 2.52” 2.37” 5.64”

3” (75mm) 2851‐3B 2851‐3EN 2851‐3HC 2851‐3PFA 3.52” 3.75” 5.64”

4” (100mm) 2851‐4B 2851‐4EN 2851‐4HC 2851‐4PFA 4.52” 4.25” 5.64”

5” (125mm) 2851‐5B 2851‐5EN 2851‐5HC 2851‐5PFA 5.51” 5.25” 5.64”

6” (150mm) 2851‐6B 2851‐6EN 2851‐6HC 2851‐6PFA 6.49” 6.25” 5.64”

8” (200mm) 2851‐8B 2851‐8EN 2851‐8HC 2851‐8PFA 8.50” 8.56” 8.00”

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C a s s e e s A L U M I N U M


Aluminum Side and End Wall Plates

PTFE Teflon® Wafer Stops

316 Stainless Steel Spacer Rods and Fasteners

WAFER SIZE

HARD BLACK ANO‐

DIZED

ELECTROLESS

NICKEL PLATED

HARD CLEAR

ANODIZED PFA COATING DIMENSIONS

ORDERING PART NUMBERS HEIGHT WIDTH LENGTH

4” (100mm) MC1‐4B MC1‐4EN MC1‐4HC MC1‐4PFA 4.52” 4.25” 5.64”




MC1 Series Aluminum Wafer Process Casse es

MC1 series casse es are based on the popular 2851 series, but it includes a solid end wall in place of the stainless steel

spacer bars on the end opposite the H‐bar. Six #6‐32 TPI flat head screws secure the end wall. All other features

(including PTFE rod stops) of the 2851 series are incorporated in the MC1 series. The solid end wall is machined from

6061 T‐6 aluminum alloy, and receives the same surface treatment as the carrier side plates. Two stainless steel rods fit

into reliefs machined in the outside face of the plate. The rods provide a mechanical interface for the CHMC, CHMCL,

CHMCDH8 style casse e handles. The solid end wall significantly increases the shock resistance and durability of the

casse e, allowing it to remain ght and in alignment for a longer period of me compared to the spacer bar style. The

end wall also acts as an effec ve par cle shield for the top wafer in applica ons where the casse e is used in an H‐bar

down (wafer horizontal) posi on.

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MC12‐25 / MC18‐25 Aluminum Series Process Casse es

SEMI standard, lightweight (6.2 lbs.) ergonomic casse es for thermal processing of 300mm or 450mm wafers. Unique

design minimizes weight and has proven performance over me and usage. The 300mm MC12 series is made from all

welded aluminum construc on to provide dimensional stability over me and temperature changes. Maximum usable

temperature is 350° C. Features SEMI standard kinema c coupling posi oners and info pad. The casse e is automa on

compa ble with all industry standard FOUPs and FOSB carriers. Casse e features wafer retaining lock‐bar for safe

transporta on. Overhead OHT flange available. 25 standard and 13 slot thin wafer designs are available. The design of

the casse e is only 6.2 lbs. (2.81 Kg) which is lighter weight than a FOUP. A higher temperature all welded stainless steel

version model is also available (SSC300) for thermal applica ons up to 550°C.

The 450mm MC18 series is made from aluminum and stainless steel to provide dimensional stability over me and

temperature changes. Maximum usable temperature is 275° C. Features SEMI standard kinema c coupling posi oners

and info pad. The casse e is automa on compa ble with all industry standard MAC, FOUPs and FOSB carriers. Casse e

features wafer retaining lock‐bar for safe transporta on. Overhead OHT flange is standard.

MODEL SIZE MATERIAL

MC12‐25HC1 300mm Aluminum

MC12‐13HC1 300mm Aluminum

MC18‐25HC 450mm Aluminum / Stainless Steel

SSC300 300mm Stainless Steel

300mm MC12‐25HC1

Weight : 6.2 lbs. (2.8kg)

Height 12.5” (317mm)

Depth 12.0” (304mm)

Width 15.6” (397mm)

450mm MC18‐25HC

Weight 23.0 lbs. (10.4kg)


Depth 18.6” (472mm)

Width 19.4” (492mm)

300mm SSC300

Weight : 19 lbs. (8.6kg)


Depth 12.0” (304mm)

Width 15.6” (397mm)

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C a s s e e s A l u m i n u m / s t a i n l e s s s t e e l

SSC Series Stainless Steel Casse e

For high temperature wafer bake applica ons or specialty applica ons, including megasonic and cleaning processes. All

welded 316SST electro‐polished construc on. Outside dimensions are similar to SEMI standard plas c process carriers.

Transfer and automa on compa ble. Light Weight: Standard SST 200mm casse e ~2.5lbs. Temperature: maximum

recommended con nuous opera ng temperature without causing distor on is 550º Celsius. Corrosion Resistance:

316SST offers be er resistance than 302 and 304 SST; resists many industrial chemicals and solvents including: sodium

and calcium brines, hypo chlorite solu ons, phosphoric acid, sulfite liquors, and sulfurous acids. Standard casse es are

designed for 50mm, 75mm, 100mm, 125mm, 150mm, 200mm, and 300mm wafer configura ons. Standard casse es are

designed for 75mm, 100mm, 125mm, 150mm and 200mm, 25‐slot wafer configura ons. Non standard 10‐slot, 12‐slot,

13‐slot, 26‐slot and 28‐slot casse es, as well as carriers for square substrates and other non‐standard diameters and

wafer thicknesses are available upon request. Please contact our Custom Products Department for more informa on.

MODEL Size Material Type, Features

SSC050‐25‐SSNSS 2” (50mm) Electro‐Polished 316SST 25 Slot, Open Side Walls


SSC100‐25‐SSNSS 4” (100mm) Electro‐Polished 316SST 25 Slot, Shielded Sides

SSC125‐25‐SSNSS 5” (125mm) Electro‐Polished 316SST 25 Slot, Shielded Sides

SSC150‐25‐SSHSS 6” (150mm) Electro‐Polished 316SST 25 Slot, Shielded Sides


SSC150‐13‐CCSSS 6” (150mm) Electro‐Polished 316SST 13 Slot, End Wall Handle

SSC200‐25‐SSHSS 8” (200mm) Electro‐Polished 316SST 25 Slot, Shielded Sides

SSC200‐25‐SSNSS 8” (200mm) Electro‐Polished 316SST 25 Slot, Open Sides

SSC200‐13‐CCSSS 8” (200mm) Electro‐Polished 316SST 13 Slot Thin Wafer, End Wall Handle

SSC200‐25‐SCNSS 8” (200mm) Electro‐Polished 316SST 25 Slot, Open Side Wall, End Wall Handle

SSC300‐25 12” (300mm) Electro‐Polished 316SST 25 Slot, Kinema c Couplings, Side Handles


All Welded 316 Stainless Steel

Construc on

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MCF Series Process Casse es

A popular all metal casse e replacement for plas c casse es. 150mm or 200mm all aluminum solid side wall metal

casse e is designed for use in place of standard process plas c casse es where temperature or dimensional stability of

the plas c casse e is in ques on. SEMI standard MCF casse e features include robo c flanges, aluminum wafer support

combs and vented screws. Construc on is T6061 aluminum with stainless steel screws.

MODEL SIZE MATERIAL TYPE

MCF6EN 6” (150mm) Electro‐less Nickel Plated Aluminum MCF (SQ21140‐2)

MCF6HC 6” (150mm) Hard Clear Anodized Aluminum MCF (SQ21140‐1)

MCF6HV 6” (150mm) High Polished Aluminum High Vacuum MCF (SQ21140‐3)

MCF8EN 8” (200mm) Electro‐less Nickel Plated Aluminum MCF

MCF8HC 8” (200mm) Hard Clear Anodized Aluminum MCF

MCF8HV 8” (200mm) High Polished Aluminum High Vacuum MCF

MODEL SIZE TYPE

SQ22093‐8 6” (150mm) 12 Slot

MCF8EN‐001 8” (200mm) 25 slot, With Side Handles

MCF8EN‐002 8” (200mm) 12 Slot

MCF8EN‐003 8” (200mm) 25 slot, With End Wall Handle

MCF8HC‐005 8” (200mm) 13 slot, DUAL H‐Bar


All Aluminum Construc on

316 Stainless Steel Fasteners

Common Custom Versions

Minimum order quan ty apply

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C a s s e e s A L U M I N U M

SQ22766 Series High Temperature Casse es

This all aluminum construc on casse e is designed for high temperature applica ons (up to 325º C). Aluminum wafer

support cradles wafer from the bo om to prevent the pinching of wafers caused by casse e expansion and contrac on

at high temperatures. The all aluminum plated notched wafer support is available for either open end wall (2851) or

solid end wall designs (MC1). Please contact the Custom Products Department for addi onal SQ22766 wafer casse e

op ons.


Aluminum Side Plates

Aluminum Wafer Stops

316 Stainless Steel Spacer Rods and

Fasteners

2851 Style SQ22766 MC1 Style SQ22766

Notched Aluminum Stops

MODEL SIZE MATERIAL FINISH TYPE

SQ22766‐23HC 3” (75mm) (HC) Hard Clear Anodized 2851

SQ22766‐23EN 3” (75mm) (EN) Electro‐less Nickel Pla ng 2851

SQ22766‐31 3” (75mm) (B) Black Anodized 2851



SQ22766‐39HC 4” (100mm) (HC) Hard Clear Anodized MC1





SQ22766‐26P 6” (150mm) (P) Bare Polished Aluminum 2851

SQ22766‐37HC 6” (150mm) (HC) Hard Clear Anodized MC1

SQ22766‐4E 8” (200mm) (HC) Hard Clear Anodized 2851

SQ22766‐17E 8” (200mm) (EN) Electro‐less Nickel Pla ng 2851

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Custom 2851SL and MC1SL Series Casse es

“SL” Casse es are designed for ver cal mass transferring wafers from a metal casse e. The PFA Teflon® notched wafer

support stop centrally locates the wafers in each slot at 0.187” (3/16”) center posi ons and will aid in precision wafer

presenters/li ers and ver cal mass transfer systems. Wafer support stops are held in posi on with stainless steel screws.

The SL notched wafer support style is available for both open end wall (2851) and solid end wall (MC1) casse es for wafer

sizes at 100mm, 125mm and 150mm. Addi onal wafer sizes are available. Contact H‐Square for more informa on.

Notched PTFE Teflon® Stops

Custom MC1HV Series High Vacuum Aluminum Metal Casse es

For use with Varian M2000 Series 4”,5”,6” and 8” spu ering equipment or other applica ons where metal casse e are to

be used in vacuum chambers. High polished bare aluminum and stainless steel eliminates possible contamina on from

the introduc on of materials used in pla ng and anodizing. Slot cradle wafer stops reduce both wafer vibra on and

wafer pinching during high temperature processing.

Cradle Slo ed Metal Stops

Contact your local H‐Square representa ve for more informa on and ordering part numbers


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C a s s e e s C u s t o m c o n f i g u r a t i o n s

SQ20501 and SQ20206 Series— Long Term Cycle Bake Casse e

SQ20501 Series—All welded open construc on, chem‐cleaned bare aluminum casse e for long term wafer bake

applica ons with laminar flow. 325° C Maximum. For use with AVT—ver cal transfer system.

SQ20206 Series Asher Casse e—Rivet fastened, all 316 stainless steel construc on, (EP) Electro Polished finish, long term

cycle bake wafer casse e. 550° C Maximum. For use with AVT—ver cal transfer system.

Contact your local H‐Square representa ve for more informa on and

ordering part numbers.

SQ20501 Series

Aluminum

SQ20206 Series

Stainless Steel

Customized Metal Casse es

Customers o en ask for special features to be added to an exi ng design. These include custom handles, finish or

coa ngs, unique pitch, or sizing customiza on due to wafer/substrate a ributes. H‐Square’s Custom Product Department

is uniquely qualified to provide engineered solu ons for any casse e requirements. Please contact your local H‐Square

representa ve for more informa on.

Customized 2851 Series—standard H‐Square

aluminum casse e modified with a 12‐slot bi‐pitch

configura on design and side handle bars.

Customized SSC Series—standard H‐Square stainless

steel casse e modified to have only 12‐slots and

include an end‐wall handle.



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Bi‐Pitch 13 slot Thin Wafer Plas c Casse es

An sta c injec on molded Fuji Bakelite plas c casse es—Cyclic Olefin Co‐Polymer material for excellent wear resistance

from sharp wafers as thin as 120µ. Extended slot profile shelves keep wafers flat for storage or produc on purposes.

Storage cases and 25‐slot casse e versions are available. Contact H‐Square for more informa on.

FB15A101H01 150mm 13 slot Thin Wafer with handle

FB15A101H02 150mm 13 slot Thin Wafer no handle

FB20A106H01 200mm 13 slot Thin Wafer with handle

FB20A106H02 290mm 13 slot Thin Wafer no handle

25 and 26 slot Plas c Casse es

An sta c injec on molded Fuji Bakelite plas c casse es—Cyclic Olefin Co‐Polymer material for excellent wear resistance

from sharp wafers as thin as 180µ. Storage cases casse e versions are available. Contact H‐Square for more informa on.

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C a s s e e s T H I N W A F E R / P T F E

PC Series PTFE Teflon® Process and Cleaning Casse es

H‐Square designs and manufactures custom plas c casse es and inserts for use in handling unique substrates, photomask

cleaning applica ons, and wafer/ large die/ components storage and shipping applica ons. Most PC casse e designs

u lize PTFE grade and PFA grade Teflon® parts for excellent chemical and wear resistance. H‐Square also manufactures

custom PC casse es with PEEK, Polypropylene and An sta c Acetal materials. Designs are offered with either fixed or

detachable PTFE handles. Many PTFE casse e designs are SRD and wet‐bench automa on compa ble (flange interface).

H‐Square Custom Product Department designs and manufactures these PC series products for a reasonable cost, lead

me and minimum quan ty order (five pieces per order). Contact your local H‐Square representa ve for more

informa on.

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Process Replacement Casse es

For more than 30 years, H‐Square metal process casse es have been incorporated as the original equipment carrier

provided by many industry leading equipment makers. In addi on to OEM casse es, H‐Square’s Custom Product

Department offers many a ermarket replacement casse es manufactured to original specifica ons, or customized for

today’s unique requirements. Replacement casse es are available for many toolsets including equipment manufactured

by Applied Materials, Novellus, Varian, Tegal, Spu ered Films, Ma son, Yield Engineering, ASM, and many others.

Please contact your local H‐Square representa ve for more informa on.

Tegal Varian Varian

Varian ASM AMAT, Novellus

ASM YES

AMAT, Novellus, Ma son,

Spu ered Films,

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C a s s e e s O E M , C U S T O M A N D I N S E R T S

SQ22758 and FOUPACC Series 300mm FOUP Conversion Kits—US Patent 6,095,335

H‐Square FOUP conversion kits allow customers to process 200mm or 150mm wafers inside an exis ng 300mm FOUP.

Ideal for pilot lines, pre‐produc on and mul ‐wafer size facili es. Quick and easy installa on without damage to the

FOUP. Kit materials, pitch and wafer placement need to specified. Aluminum, PEEK and an sta c Acetal materials are

typical. Please contact your local H‐Square representa ve for more product informa on.

Customer specifies wafer slot pitch

at 0.187”, 0.250”, or 10mm

Exploded view of SQ22758 conversion inset kit—plates and

moun ng hardware prior to installa on.

MISC1700 Series ‐ Thin Wafer FOUP Insert Kits and Stand Alone Thin Wafer Wire Casse es.

Custom FOUP insert kits for suppor ng 300mm thin wafers in a FOUP. Unique all welded stainless steel wire design is

available for several industry standard FOUP carriers. Available with either an sta c PEEK coa ng or PFA Teflon® coa ng.

These thin wafer casse es provide an efficient and economical method of handling thin wafers without damage to the

wafer or to the exis ng carrier. They are constructed of precision welded 316 stainless steel for weight a ributes, cleanli‐

ness, durability and long‐term dimensional stability. The MISC1700 series design is also the basis for H‐Square’s ultra thin

wafer stand alone casse es for 100mm, 150mm and 200mm wafer handling below 180µ. Contact H‐Square for more

informa on.

300mm Thin Wafer FOUP Insert Kit 200mm Thin Wafer Casse e

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Metal Casse e Handles

These tools provide a safe, reliable means to handle hot metal casse es without contact by the operator’s hands. They

are constructed of a plas c handle, type 304 electro‐polished stainless steel plate (except for CHMCLDH8 and

CHMCLDH12 which have hard PPS plates) and stainless steel fasteners.

CH Series—for 285 and 2851 casse es

CH style handles are compa ble with 285 and 2851 style open end wall

casse es and simply engages the upper and lower spacer bar for pick up.

Handle length is 5.8” (147mm). Note that each handle is wafer size specific.

Please specify casse e model number when placing an order. Custom

product versions available for special applica ons.

CH‐2 50mm casse e handle Acetal handle / stainless steel plate






CHMC and CHMCL Series— for MC and MC1 casse es

The CHMC handles are compa ble with MC and MC1 style solid end wall casse es and simply engage with the casse e handle interface loca on on the center of the solid end wall. Handle length is 5.8” (147mm). The CHMCL handle is an upgrade version of CHMC and includes a spring loaded Torlon® latch (normally closed) that posi vely locks the handle in place to the solid end wall of the MC and MC1 style casse e designs. Handle length is 8.1” (205mm). Please specify casse e model number when placing an order. Custom product versions available for special applica ons.

CHMC456 All 100mm, 125mm and 150mm MC or MC1 casse es

Acetal / handle stainless steel plate

CHMCL456 All 100mm, 125mm and 150mm MC or MC1 casse es

Acetal / handle stainless steel plate

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C a s s e e H a n d l e s M E T A L H I G H T E M P E R A T U R E

CHMCLDH8 Series— for MC8 and MC1 –8 200mm casse es

The CHMC handles are compa ble with MC8 and MC1‐8 style solid end wall casse es and simply engage with the casse e handle interface loca on on the center of the solid end wall. The CHMCLDH8 includes a spring loaded PPS latch (normally closed) that posi vely locks the handle in place to the solid end wall of the MC and MC1 style casse e designs. Dual handle pistol grip handle length is 5.6” (142mm). CHMCLDH8 All 200mm MC and MC1 casse es

Natural Polypropylene handle/ PPS plate and trigger

CMAD Series—for SSC stainless steel casse es

Dual pistol grip casse e handles for loading and unloading SSC style casse es from a process tool or oven. Pistol grip

version CMAD handles are natural polypropylene with stainless steel interface plate and fasteners. Custom locking latch

versions are also available. Handle length is 5.8” (147mm). Extended reach CMAD handles are 25” long are all welded

stainless steel with T‐handle end for operator comfort. Note that each handle is wafer size specific. Addi onal custom

product versions are available for special applica ons.

CMAD3‐001 75mm SSC extended reach 25” (635mm) straight handle

CMAD4‐001 100mm SSC extended reach 25”(635mm) straight handle

CMAD4‐002 100mm SSC casse e handle 8” straight handle


CMAD6 150mm SSC casse e handle

CMAD6‐001 150mm SSC casse e handle with locking latch


CMAD8 200mm SSC casse e handle

CMAD8‐001 200mm SSC casse e handle with locking latch

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Plas c Casse e Handles

These tools provide a safe, reliable means to handle plas c casse es without

contact by the operator’s hands. Machined totally from chemical resistant

polypropylene and assembled with PVC fasteners to allow use in aggressive

cleaning applica ons. Most models all securely hold casse es by their robo c

flanges. Please specify plas c casse e model numbers when ordering.

CPA Series

Natural Polypropylene construc on pistol grip handle for holding 150mm plas c

casse es from the end wall flange. Fasteners are PVC screws for chemical

resistance. Please specify casse e model number when placing an order. Custom


CPA6 150mm casse e handle Natural Polypropylene

CPH Series

Natural Polypropylene construc on straight handle for holding 150mm plas c




CPH6 150mm casse e handle Natural Polypropylene

CPV Series

Natural Polypropylene construc on ver cal handle for holding 150mm plas c




CPV6 150mm casse e handle Natural Polypropylene

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Custom Mechanical Plas c Casse e Handles

Custom spring mechanism plas c casse e handles safely secure casse es by side wall flanges or top lip. Please contact

your H‐Square representa ve for more informa on.

CPAD Series

Natural Polypropylene construc on dual pistol grip handle for holding 200mm plas c

casse es from the end wall flange. Compa ble with A192‐80M and A192‐81M

Teflon® casse es with handle. Fasteners are PVC screws for chemical resistance.

Please specify casse e model number when placing an order. Custom product

versions available for special applica ons.

CPAD8 200mm casse e handle Natural Polypropylene

SRD Series

Natural Polypropylene construc on pistol grip handle for holding 150mm or 200mm

plas c casse es from the end wall flange to/from an SRD applica on. Low profile

316 stainless steel li pins allow easy access to a Teflon casse e loaded in a spin

rinse dryer rotor. Fasteners are stainless steel. Please specify casse e model

number when placing an order.

CPA6‐003 150mm SRD casse e handle Natural Polypropylene

CPAD8‐004 200mm SRD casse e handle Natural Polypropylene

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M o c k Wa f e r s

Mock Aluminum Wafers

Used as durable, sha erproof replacements for semiconductor wafers in training, robo c calibra on, par cle

shielding, iden fica on, equipment demonstra on and promo onal applica ons, mock wafers are precision

manufactured from 6061 T‐6 aluminum alloy. Each wafer is chemically etched and heat treated to improve flatness

and surface finish prior to anodiza on. Each wafer is approximately 10%‐15% heavier than a silicon wafer of similar

size and profile. Dimensions of diameters, flats and notches are within SEMI standards. Mock wafers can include silk

screened artwork, engraving, color or other modifica ons on a custom basis.

SEMI STANDARDS

DIAMETER FLAT LENGTH THICKNESS

SIZE MIN MAX MIN MAX MIN MAX

150mm 5.875 " 5.936 " 2.166 " 2.362 " 0.0256 " 0.0275 "

200mm 7.855 " 7.893 " 2.166 " 2.362 " 0.0276 " 0.0295 "

300mm 11.792 " 11.830 " N/A N/A 0.0290 " 0.0300 "

450mm 17.713” 17.720” N/A N/A 0.0354” 0.0374”

125mm 4.902” 4.940” 1.575” 1.771” 0.0237” 0.0255”

100mm 3.918” 3.956” 1.181” 1.377” 0.0237” 0.0255”

3” (76.2mm) 2.795” 3.025” 0.750” 1.000” 0.0140” 0.0160”

2” (50.8mm) 1.985” 2.015” 0.560” 0.690” 0.0100” 0.0120”

MW‐2HC 50mm Flat Hard Clear Anodized

MW‐2NP 50mm Flat Bare Aluminum









MW‐8FHC 200mm Flat Hard Clear Anodized

MW‐8FNP 200mm Flat Bare Aluminum

MW‐8NHC 200mm Notch Hard Clear Anodized

MW‐8NNP 200mm Notch Bare Aluminum





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Ergoli ™ Ba ery Powered Ergonomic Li Carts

Ergoli ™ manual guided transport (MGV) carts provide safe handling of heavy objects around a cleanroom area. The

ba ery driven motorized electric lead screw Z‐Axis li and customized end‐effector is rated up to 200 lbs. (91 kg) of li

and allows this versa le tool to pick‐up and place objects and carriers on load ports, tables, and storage racks. The light

weight‐Mobile EZ™ design allows the operator to make precise manual movements when transpor ng product around a

fab area. A demountable remote control, adjustable height handle bar, foot operated central brake system, mechanical

slip clutch, and integrated travel limit stop make the Ergoli ™ easy for the operator to use without risk of product

damage or operator strain and injury. The use of ergonomic li ers can contribute to lower medical claims, reduced

personnel replacement and lower or eliminate your lost produc on costs. These costs along with the reduc on or

elimina on of Workman's Compensa on claims contribute to higher profitability for your company.

Key Features:

Light weight‐mobile easy opera on, easy movement in all direc ons with full load

Single Li Mast Provides Clear View for safe opera on

Foot operated central brake‐accessible from all sides of the li er

Enclosed Li Screw‐No Pinch Points

Aluminum and stainless steel construc on

Modular construc on design ‐ easily customized for ideal load balance and height li requirements

De‐mountable operator remote control with adjustable height handle bar

Enclosed electric li screw mechanical with slip clutch, adjustable load capacity and current limit travel stop

Rechargeable / exchangeable gel cell power pack

Custom Ergoli s™ Custom Product Department will design custom Ergoli s for any material han‐dling applica on including Semiconduc‐tor, Flat Panel Display and Biomedical cleanroom applica ons. Single mask li ers can be designed to li up to 275 lbs. (includes weight of load and end‐effector). Contact your local H‐Square representa‐ve for more informa on.

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E r g o L i ™ L I F T A S S I S T C A R T

FL Series FOUP transport Cart

Load port compa ble MGV li carts designed for handling SEMI standard FOUP, FOSB, MAC and metal casse es around a

cleanroom. Aluminum and stainless steel versions available. End effectors are designed to interface with overhead

transport flanges. 450mm versions feature a lock pin device for securing the carrier to the Ergoli ™ during transport.

FL‐003 300mm Aluminum—legs wrap around load port

FL‐004 450mm Aluminum—legs wrap around load port

FL‐005 450mm Stainless Steel—legs wrap around load port

FL‐006 450mm Stainless Steel, pneuma c vibra on dampening wheels, front docking to load port

Total Li Capacity • Maximum 200‐lbs (includes weight of load and end‐effector) Cer fica on • CE Marked Material • Intermediate Sec on: Aluminum — Anodized • Legs: Steel — Powder Coated or Stainless Steel • Li Mast: Aluminum — Anodized • End‐Effector: Anodized aluminum

3‐posi on wheel direc onal lock system

450mm Casse e

Transport FL‐006

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MCP ‐ Mechanical Edge Grip Picks

These custom‐fit, normally closed, ergonomic, outside diameter wafer edge handling tools are a fully mechanical tool

which provides clean constant ‐ force handling from the edge exclusion zone of a substrate. The using high performance

plas cs and Kalrez® touch pads. These tools are highly customized for specific applica ons and are available for

substrates of all sizes, materials and thicknesses. Please contact H‐Square’s Custom Products Department or inquire

through your local H‐Square sales representa ve.

Ordering informa on to supply to H‐Square Engineering

1. Wafer size (diameter or dimensions)

2. Wafer thickness

3. Edge exclusion area FRONT

4. Edge exclusion area BACK

5. Stage / platen interface considera ons

5a. Chemical considera ons

5b. Thermal temperature considera ons

5c. An sta c considera ons

5d. End‐effector profile (knife edge, angled, extended support)

Minimal backside contact Backside support (thin wafer)

Straight handle profile Angled handle profile

MCP Materials:

An sta c PEEK

Natural PEEK

Natural Polypropylene

An sta c Polypropylene

An sta c Acetal

PTFE Teflon®

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M e c h a n i c a l Wa f e r P i c k s E D G E G R I P

P/N Wafer Diameter Material Front Contact Back Contact

MCP‐2‐002 50mm An sta c PEEK, An sta c Acetal 0.10” (2.5mm) 0.19” (4.8mm)






Recommended MCP

200mm 150mm 100mm 75mm 50mm

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ODP Mechanical Wafer Picks The ODP tool is a fully mechanical tool, which provides edge only handling of substrates using v‐groove profile grippers. These tools are highly customized for specific applica ons and are available for all wafer sizes and thicknesses. Picks are lightweight, economical and easy to use. ESD safe versions available. Custom designs with special angles, customized grippers, locking triggers, custom materials or other non‐standard features are also available Please contact H‐Square’s Custom Products Department or inquire through your local H‐Square sales representa ve.

ODP 3‐PT Style Mechanical Wafer Pick

P/N Wafer Size Gripper Material Gripper Length Locking Latch

ODP‐3‐001 75mm Natural PEEK 2.0” No

ODP‐3‐003 75mm Natural PEEK 2.0” Yes

ODP‐3‐004 75mm ESD‐safe PEEK 2.0” No

ODP‐3‐006 75mm Teflon® PTFE 2.0” No


ODP‐4‐005 100mm ESD‐safe PEEK 2.2” No

ODP‐5‐001 125mm Teflon° PTFE 3.54” No

ODP‐5‐002 125mm Teflon® PTFE 3.54” Yes




ODP‐6‐010 150mm Teflon® PTFE 2.0” No




ODP‐18‐001 450mm ESD safe PEEK 2.0” Yes

P/N Wafer Size Gripper Material Orienta on

ODP‐6‐004 150mm Black Acetal 3.0” Offset

ODP‐6‐012 150mm Natural PEEK 1.7” Offset

ODP‐8‐006 200mm Natural PEEK 1.7” Offset

ODP‐8‐007 200mm ESD safe PEEK 1.7” Offset

ODP‐3 75mm Black Acetal Straight





ODP‐12‐006 300mm Black Acetal Straight

ODP Hoop Style Mechanical Wafer Pick

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M e c h a n i c a l Wa f e r P i c k s O U T S I D E D I A M E T E R

ODP MPH Style Mechanical Wafer Pick P/N Wafer Size Gripper Material Horizontal

Offset

ODP‐3‐005 75mm Natural Polypropylene 3.0”




ODP‐8‐010 200mm Natural PEEK 3.0”


P/N Wafer Size Gripper Material Handle Angle

ODP‐4‐008 100mm Natural PEEK 15°


ODP‐6‐011 150mm ESD safe PEEK 15°

ODP‐8‐001 200mm ESD safe PVDF 15°

ODP‐8‐003 200mm Torlon® 15°


ODP‐8‐011 200mm Natural Polypropylene 15°



ODP MPS Style Mechanical Wafer Pick

ODP Mechanical Pick Holders

Keeps your picks safe, contamina on free and dy. Made from electro‐

polished stainless steel to ensure cleanliness and durability. Available in

three models: Single, Triple or Quadruple. All models can be secured to

bench top. Compa ble with all H‐Square mechanical picks.

HMP1 Single

HMP3 Triple

HMP4 Quadruple

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Nu‐twEZer™ Custom Mechanical Die and Small Device Pick Advanced design, normally closed, mechanical handling tool for large die or small device. Each tool is custom designed for a specific device. Customiza on allow a constant force grip to eliminate edge damage. Base units are made from ESD safe Polypropylene materials. Customized features: Tips can be developed per applica on; color coding available; choice of spring tension; high temperature materials available; chemical resistant materials available. Please contact your local H‐Square representa ve for more informa on on custom Nu‐twEZer tools. Minimum order quan es (MOQ) apply.

Horizontal

Ver cal

Contact your H‐Square representa ve for more informa on and ordering part numbers.

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M e c h a n i c a l Wa f e r P i c k s S M A L L D E V I C E H A N D L I N G

Small Device Custom Mechanical Picks Mechanical picks reduce contamina on by elimina ng direct contact of substrates with hands. Grippers are designed for edge grip contact with minimal contact to front or back sides of device. Picks are lightweight, economical and easy to use. ESD safe versions available. Custom designs with special angles, customized grippers, locking triggers, custom materials or other non‐standard features are also available.

HDCP Style Custom Mechanical Wafer, Op cs, and Small Device Picks HDCP picks reduce contamina on by elimina ng direct contact of substrates with hands. Grippers are designed for edge grip contact with minimal contact to front or back sides of wafer/substrate. Picks are lightweight, economical and easy to use. ESD safe versions available. Custom designs with special angles, customized grippers, locking triggers, custom materials or other non‐standard features are also available.



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Mask Picks

H‐Square’s line of photomask picks is the result of years of work with semiconductor companies and mask shops to

provide a non‐contamina ng secure means of handling photomasks. With the advent of larger and thicker masks, which

make manual handling very difficult, H‐Square picks have become a necessary tool. With the stringent cleanliness

requirements for sub‐micron applica ons today, mask picks have become indispensable.

Features

Tangen al edge‐grip only; no front or back face contact.

Compa ble with most pellicized square re cles and round masks with flats.

Minimal moving parts for simple cleaning and low par cle genera on.

Lightweight, economical and easy‐to‐use with trigger‐type gripping mechanism.

V‐type grippers allow masks with beveled edges to be loaded from flat surfaces.

Various gripper widths and V‐groove depths allow customizing for each applica on.

Mask Picks can reduce contamina on by elimina ng direct contact of mask by operator’s hands. Masks are easily inserted

and extracted from various fixtures and storage containers, and are securely gripped while loaded in the pick.

Custom mask picks are available for applica ons requiring special handle angles, locking triggers, high temperature

grippers or heavier li ing capacity. Contact H‐Square Custom Products department for more informa on.

MPS1‐50‐014 ESD‐safe Polypropylene

SQ21457‐25 ESD‐safe Polypropylene



MPS1‐001 ESD‐safe Polypropylene


P/N Material

5" x 5" x 0.090"

6" x 6" x 0.250"

7" x 7" x 0.120"

7" x 7" x 0.150"

9” x 9” x 0.120”

14” x 14” x 0.189”

Mask Size

An sta c

MPS1 Series Photomask Picks Side Grip

Mask Pick, Side (MPS1) clamp pick tool designed

with a 15° angle handle allows the removal from

and placement into a storage container of a sin‐

gle mask, mask with pellicle or other types of

substrates. The tool is capable of picking up sub‐

strates weighing up to two pounds.

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P h o t o l i t h o g r a p h y M A S K P I C K S

MPH1 Series Photomask Picks Horizontal Grip

Mask Pick, Horizontal (MPH1) is compa ble with

most single and mul ple plate containers, and

many vacuum chucks, microscope stages and other

fixtures. A 90° handle is available for MPH1 models

for special applica ons

Mask Size

5" x 5" x 0.090"

6" x 6" x 0.250"

7" x 7" x 0.120"

7" x 7" x 0.150"

9” x 9” x 0.120”

P/N Material

MPH151DW‐005 ESD‐safe Polypropylene




MPH3‐92‐001 ESD‐safe Polypropylene

An sta c

P/N Material

MPH151DW90‐005 ESD‐safe Polypropylene

MPH163VO90‐001 ESD‐safe Polypropylene



Mask Size

5" x 5" x 0.090"

6" x 6" x 0.250"

7" x 7" x 0.120"

7" x 7" x 0.150"

An sta c

MPH1 90° Series Photomask Picks

Horizontal 90° Grip

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MPV Series Mask Handling Picks ‐ Ver cal Grip

Mask Pick, Ver cal (MPV1) allows easy loading and

unloading of square masks from mul ple plate

casse es and storage boxes for transfer or visual

inspec on purposes. MPV1 models are used almost

exclusively for loading the unloading plates from

mul ple plate carriers. The MPV1 can access any plate

in most carriers; sequen al handling is not usually

required.

P/N Material

MPV1‐5‐002 ESD‐safe Polypropylene


MPV1‐7 Natural Polypropylene



Mask Size

5" x 5" x 0.090"

6" x 6" x 0.250"

7" x 7" x 0.120"

7" x 7" x 0.150"

9” x 9” x 0.120”

MPH ‐ MPC Series Custom Horizontal

Offset Mask Handling Picks

J‐Spring™ Technology

Mask Size

6" x 6" x 0.250"

7" x 7" x 0.120"

9” x 9” x 0.120”

P/N Material Offset *

MPH3‐63AS‐001 ESD‐safe Polypropylene 3.1”

MPH3‐72AS‐001 ESD‐safe Polypropylene 3.1”

MPH3‐92‐001 ESD‐safe Polypropylene 3.1”

An sta c

* Models available from 1.7” to 7.0” offset heights. Contact your local H‐Square representa ve for addi onal

ordering part numbers.

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P h o t o l i t h o g r a p h y M A S K P I C K S

SQ21518 Series Mask Handling Mechanical Picks ‐ Nikon Cartridge Box Mask picks reduce contamina on by elimina ng direct contact of mask with hands. The four gripper horizontal offset SQ21518 mask pick is designed to load and unload masks from a NIKON Stepper mask cartridge or other ght space horizontal offset applica on. Picks are lightweight, economical and easy to use. Designs feature a locking latch trigger to safe guard the premature release of a valuable photomask and all designs are ESD safe. SQ21518‐1 6”x6”x0.250” ESD‐safe Polypropylene (A)4.65” (B)4.96” (C)3.80” (D)4.28”

SQ21518‐16 6”x6”x0.250” ESD‐safe Polypropylene (A)4.70” (B)5.00” (C)4.70” (D)5.19”



Extreme Ultraviolet Lithography Mask Mechanical Picks (EUV) ‐ J‐Spring™ Technology Mask picks specially designed to handle EUV masks from the side using tension to hold the mask—without contact of the bo om tangen al edge. Grippers should be placed at the midpoint of the mask when handling. An sta c Polypropylene and 316 stainless steel construc on with Kalrez® o‐rings. Features advanced316 SST flat J‐Spring™ tensioner. PM Nota on: J‐Spring™ should be replaced every six months. MPS3‐63AS‐002 6”x6”x0.250” ESD‐safe Polypropylene 403387 Replacement Flat J‐Spring, EP 316 SST

OUTSIDE GRIPPER

INSIDE GRIPPER

A

B

C

D

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SQ21408 Series Photo‐mask Inspec on & Cleaning Sta on Mask preven ve maintenance inspec on stand designed to facilitate hands off visual inspec on and Nitrogen or CDA clean‐off applica ons. Operator loads the tool with another mask pick. Two 360° degree theta mo ons allow for easy posi oning of masks under bright light. Smooth opera on makes it easy to scan for and pinpoint par cles. Compact tabletop design saves expensive cleanroom space. Cost efficient alterna ve to automa c/semiautoma c inspec on tools. Made from ESD safe cleanroom materials to insure cleanliness. SQ21408‐1 6”x6”x0.250” ESD‐safe Polypropylene

SQ21408‐3 5”x5”x0.090” ESD‐safe Polypropylene

SQ21408‐10 9”x9”x0.120” ESD‐safe Polypropylene

ISM Series Photo‐mask Inspec on & Cleaning Sta on X, Y and theta movement mask inspec on stand facilitates hands off visual inspec on, Nitrogen or CDA clean off applica ons, or transi on pla orm to change to a second style mask pick. Mul ple size mask supports give an overall compact tabletop design. Cost efficient alterna ve to automa c /semiautoma c inspec on tools. Made from an sta c materials to insure ESD safety and overall cleanliness. ISM567 – X, Y, Tilt and Theta movement for 5”x5”, 6”x6” and 7”x7”

photomasks (any thickness)

IM56‐001 – fixed stage for handling 5”x5” and 6”x6” masks (any

thickness)

Mask Pick Holders

Keeps your mask picks safe, contamina on free and dy. Made from electro‐

polished stainless steel to ensure cleanliness and durability. Available in

three models: Single, Triple or Quadruple. All models can be secured to

bench top. Compa ble with all H‐Square mechanical picks.

HMP1 Single

HMP3 Triple

HMP4 Quadruple

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P h o t o l i t h o g r a p h y M A S K H A N D L I N G T O O L S

PC Series PTFE Teflon® Photomask Cleaning Casse es All PTFE casse es hold photo masks in a ver cal posi on for easy cleaning in various processing baths. Photomask cleaning casse es are available in a variety of sizes and either incorporate a handle or wet bench automa on flanges. Li er blocks can be incorporated to li the mask up to interface with mechanical mask picks.

MISC2500 and SQ20999 Series Mask Casse e Li er Blocks Li er blocks are designed to provide easy access to masks. Masks are li ed out of casse es, providing access to mask edges for removal with the appropriate style mask pick. Mask li er blocks are available in a variety of sizes and materials, many of which are ESD safe. Please contact your local H‐Square representa ve for more informa on on these mask handling products.

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Automa c RSP Re cle SMIF Pod Openers

Semi‐automa c RSP200 and RSP150 re cle SMIF pod opener provide easy

access to photomasks stored inside single and mul ple stack re cle

storage pod casse es with minimal operator involvement. Units are

compa ble with standard RSP200 and RSP150/MSP150 pod designs.

Smooth, reliable li automa on for reliability and cleanliness. Class One

Cleanroom compa ble. ESD protec on insured by sta c dissipa ve

plas cs.

SMIFPO8‐E‐002 RSP200 Automa c Opener

SMIFPO6 RSP150 Automa c Opener

MISC2500 Series Tabletop Macro Bright Light Inspec on Sta on

Table top bright light reflec on containment chamber with a 250 wa halogen full spectrum light source. The system

includes an integrated automa c on/off mo on sensor switch and an oversized aluminum heat sink which keep the lamp

cool without the need of a cooling fan. Substrates are manually placed into the black anodized light absorbing chamber

and viewed under the concentrated light source. The enclosed table‐top design provides the operator with a controlled

macro light inspec on while capturing and diffusing most deflected light. The small, lightweight but sturdy design allows

for placement in an already crowded produc on area. Electrical

power is required. This is a fast and inexpensive way to examine a

surface for par cles, haze, scratches and surface defects.

MISC2500‐007 5x5, 6x6 masks USA (100‐120 VAC)

MISC2500‐018 5x5, 6x6 masks E or UK (220‐240 VAC)

MISC2500‐015 7x7, 9x9, 14x14 masks USA (100‐120 VAC)

MISC2500‐016 7x7, 9x9, 14x14 masks E or UK (220‐240 VAC)

Dimensions

Height: 26.9”(683mm)

Depth: 15.4” (391mm)

Width: 14.0” (355mm)

MISC2500‐007 / ‐018


Depth: 12.0” (304mm)

Width: 12.0” (304mm)

MISC2500‐015 / ‐016


Depth: 24.0” (609mm)

Width: 24.0” (609mm)

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P h o t o l i t h o g r a p h y R E T I C L E P O D O P E N E R S

SMIFMAN6 150mm Manual Re cle SMIF Pod Opener Tabletop manual swing arm pod opener provides clean, easy access to photomasks in any RSP150 re cle storage single‐mask and mul ‐mask pod casse es. The SMIFMAN6 allows the operator to manually open the 4 lever mechanism on the pod, lowering the base and releasing the lid. This allows access to the inner mask tray. H‐Square’s design features a clean pin raised storage area for the lid to be stored while pod is open. Unit also features a mask pick holder. An sta c materials are used to insure ESD safety and cleanliness. SMIFMAN6 Manual RSP150 Opener

SMIFMAN8 200mm Manual Re cle SMIF Pod Opener Tabletop manual swing arm pod opener provides clean, easy access to photomasks in any RSP200 re cle storage single‐mask pod casse es (or 200mm wafer SMIF Pod unit). The SMIFMAN8 allows the operator to manually open the center mechanism on the pod to release the lid and gain access to the inner mask tray. H‐Square’s design features a clean storage area for the lid to be stored while pod is open. An sta c materials are used to insure ESD safety and cleanliness. SMIFMAN8 Manual RSP200 or SMIPOD 200mm Casse e Opener

Dimensions


Depth: 10.8” (274mm)

Width: 20.0” (508mm)

Dimensions


Depth: 10.8” (274mm)

Width: 19.0” (482mm)

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The Breeze™ provides a state‐of‐the‐art touchless solu on for manually transferring wafers while introducing

li le to no stress to the substrate. H‐Square’s Breeze™ wand is a non‐contact wafer handling system that em‐

ploys Bernoulli li ing principles ‐ for wafer handling of thin, warped, thick, SEMI standard, or many other sizes

and shapes of substrates. The handling tool uses compressed facility gases (typically Nitrogen ‐or‐ CDA ‐ clean

dry air), to stream air flow from a center sparger cap or sparger tube to the perimeter of the wafer. Wafers

are manually li ed from a surface, platen, casse e, or shipping container without contact on the top or

bo om surfaces of the wafer. In accordance with Bernoulli's principle pressure differen al , the wafer is

“floated” on the wand apparatus at approximately 200µ (microns) from the surface of the Breeze plate. Corral

pins limit sideway movement of a retained wafer.

H‐Square offers two standard models of Breeze handling systems ‐ the H2B ‐ a 90 degree perpendicular handle

apparatus, and the H2BST ‐ a horizontal offset handle configura on. Custom configura ons are also available

through your local H‐Square representa ve.

H2B‐4 100mm Perpendicular Handle




H2BST‐4 100mm Horizontal Offset Handle




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B e r n o u l l i H a n d l i n g B r e e z e ™

Materials ‐

Handle ‐ Copolymer acetal, sta c dissipa ve

Surface resis vity: E10 –E12 W /sq

Plate: transparent ESD‐safe Polycarbonate

Corral pins: Copolymer acetal, sta c dissipa‐

ve

Trigger/lever: 316 Stainless steel

Connec on ‐

connector for grip and seal connec on to

external OD tubing of 0.250" (6.4mm) +/‐

0.010"

Facility Requirements ‐

Filtered air (CDA) or Nitrogen (N2)

Input ‐ 10‐60 PSI

1.0‐1.5 CFM

A pressure regulator may need to be in‐

stalled at the Breeze connec on point in

order to op mally adjust the amount of gas

(air) flow.

Weight ‐ 0.6lbs (0.28kg)

Table‐Top Holders for Breeze units—

weighted moveable base assembly

HBH‐001 H2B style—horizontal offset handle

H‐H2BST H2BST style—perpendicular handle

HBH‐001 H‐H2BST

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Table Top Freedom Wands™

Heavy‐duty self‐contained portable Freedom Wand™ vacuum system. Allows operators to take a clean vacuum handling

system anywhere in a fab. Systems are compa ble with all H‐Square vacuum ps. Sturdy standard tabletop produc on

unit is designed to provide 22" ‐ 24" Hg vacuum. A smart charger LED illuminates 20 minutes before ba ery is fully

discharged. Class 1 cleanroom compa ble.

Features:

Photo electric sensor ‐ turns off vacuum pump when wand is replaced in holder.

Auto shut‐off conserves ba ery power.

Heavy duty micro‐pumping mechanism.

22”‐24” Hg vacuum strength.

Sturdy base (approx. 2 1/2 lbs.) provides stability for tabletop applica ons.

Small footprint (4 3/8” x 9 1/4”).

Spring reinforced, non‐kinking, 6‐foot reach vacuum cord.

Normally OPEN/vacuum ON wand.

Class 1 cleanroom compa ble.

450mm FWA450AS ESD Safe Portable Freedom Wand™ SGI ‐ Safe Grip Heavy‐duty, self‐contained portable Freedom Wand™ vacuum system. Sturdy custom tabletop produc on unit is de‐signed for portable 450mm wafer handling. Compa ble with all H‐Square vacuum ps up to 450mm. Unit is designed to provide 22" ‐ 24" Hg vacuum for over 2 hours of con nuous opera on. SGI ‐ Safe Grip Indicator light illuminates at 16" Hg to show operator it is safe to li substrate. Two rechargeable and interchangeable NiMH ba ery packs and charger sta‐on are included. Smart charger LED illuminates 20 minutes before discharge, allowing for ba ery change out. Tool is

ESD safe and comes with grounding cord. Class 1 cleanroom compa ble. 450mm vacuum p T450PKA1 included.

FWA450AS

Replacement 10V nickel hydride ba ery: 602526

Class 1

Cleanroom Cer fied


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P o r t a b l e V a c u u m Wa n d s F R E E D O M W A N D S ™

200mm FWAHAS2 ESD Safe Portable Freedom Wand™ SGI ‐ Safe Grip Heavy‐duty self‐contained portable Freedom Wand™ system. System is compa ble with all H‐Square vacuum ps up to 200mm. Sturdy standard tabletop produc on unit is designed to provide 22" ‐ 24" Hg vacuum for over 2 hours of con nu‐ous opera on. Shut‐off holder automa cally turns system off when vacuum wand handle is placed in holder. SGI ‐ Safe Grip Indicator light illuminates at 16" Hg to show operator it is safe to li substrate. Two rechargeable and interchangea‐ble NiMH ba ery packs and charger sta on are included. Smart charger LED illuminates 20 minutes before discharge, allowing for ba ery change out. The FWAHAS2 tool is ESD safe and comes with a grounding cord. Class 1 cleanroom com‐pa ble. Vacuum ps are sold separately.

300mm FWA3AS2 ESD Safe Portable Freedom Wand™ SGI ‐ Safe Grip Heavy‐duty, self‐contained portable Freedom Wand™ vacuum system. Sturdy custom tabletop produc on unit is de‐signed for portable 300mm wafer handling. Compa ble with all H‐Square vacuum ps up to 300mm. Unit is designed to provide 22" ‐ 24" Hg vacuum for over 2 hours of con nuous opera on. SGI ‐ Safe Grip Indicator light illuminates at 16" Hg to show operator it is safe to li substrate. Two rechargeable and interchangeable NiMH ba ery packs and charger sta‐on are included. Smart charger LED illuminates 20 minutes before discharge, allowing for ba ery change out. Tool is

ESD safe and comes with grounding cord. Class 1 cleanroom compa ble. 300mm vacuum p T3PKA1 included.

FWA3AS2


FWAHAS2


Class 1

Cleanroom Cer fied

Class 1

Cleanroom Cer fied



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FWTTA1

Replacement Power Supply/Charger:

A000‐754‐1 USA (100‐120 VAC)

A000‐754‐2 EUROPE (220‐240 VAC)

A000‐754‐3 UK (220‐240 VAC)

FWTTA1 Table Top Portable Freedom Wand™ Auto Shutoff

Heavy‐duty self‐contained portable Freedom Wand™ vacuum system. System is compa ble with all H‐Square vacuum ps

up to 200mm. Sturdy standard tabletop produc on unit is designed to provide 22" ‐ 24" Hg vacuum for over 4 hours of

con nuous opera on. White polypropylene base construc on with press‐fit NOPPF1 wand handle. FWTTA1 features LED

shut‐off holder to automa cally turn system off when the vacuum wand handle is placed in holder. Internal ba ery pack

with "smart" charger system keeps ba ery at full charge when a ached to the power supply. Smart charger LED illumi‐

nates 20 minutes before discharge. Class 1 cleanroom compa ble. Vacuum ps are sold separately.

Class 1

Cleanroom Cer fied

Die and Package Auto Shutoff FWTTA1 Table Top Portable Freedom Wand™

A custom version of the standard FWTTA1 pla orm. The FWTTA1‐AC‐005 has all the standard features of

the FWTTA1 but includes DPNOAS2LA wand, CC‐4SDS coil cord, CTA06 grounding adapter, two (2) bent BCHN

hub needles (BCHN‐16S and BCHN‐18), and two (2) vacuum cups (VCAS125 and MBNCSD‐12) to make a

complete die and package Freedom Wand™ starter package.

FWTTA1‐AC‐005 Die and Package Freedom Wand USA (100‐120 VAC)

Class 1

Cleanroom Cer fied



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SQ22949 Belt Clip Portable Freedom Wand™ Auto Shutoff

Custom heavy‐duty self‐contained portable Freedom Wand™ vacuum system. System is compa ble with all H‐Square

vacuum ps up to 300mm. Wafer rescue opera on belt clip mounted produc on unit is designed to provide 22" ‐ 24" Hg

vacuum for over 4 hours of con nuous opera on. White polypropylene base construc on with press‐fit NO3AS1 300mm

wand handle. FWTTA1 features LED shut‐off holder to automa cally turn system off when the vacuum wand handle is

placed in holder. Internal ba ery pack with "smart" charger system keeps ba ery at full charge when a ached to the

power supply. Smart charger LED illuminates 20 minutes before discharge. Class 1 cleanroom compa ble. 300mm

T3PKAS1 p included. The SQ22949 series has mul ple ordering part numbers. Please contact your H‐Square

representa ve for informa on and op ons on this custom portable vacuum wand.

SQ22949‐XXX

Contact H‐Square for ordering part numbers


A000‐754‐1 USA (100‐120 VAC)

A000‐754‐2 EUROPE (220‐240 VAC)

A000‐754‐3 UK (220‐240 VAC)

Replacement clip on nylon belt: FWCOB

Class 1

Cleanroom Cer fied

300mm Auto Shutoff FWTTA1 Table Top Portable

Freedom Wand™

A popular custom version of the standard FWTTA1

pla orm. The FWTTA1‐AC‐004 has all the standard

features of the FWTTA1 but includes a 300mm shutoff

holder and NO3T3PKAS1 vacuum wand assembly.

FWTTA1‐AC‐004 300mm Freedom Wand

USA (100‐120 VAC)


A000‐754‐1 USA (100‐120 VAC)

Class 1

Cleanroom Cer fied


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FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable)

Patent # 5,217,273 Self‐contained cordless ba ery powered vacuum wands allows freedom from vacuum lines. 100%

increased run me to 180 minutes. Direct connect to power supply allows use with discharged ba eries. Ergonomically

designed with finger contours for comfort – fits in to palm of operator’s hand. Charger stand safely stores wands out of

the way while recharging the ba ery. Smart charger system keeps ba ery fully charged without worry of damage from

overcharging. Recommended p IS included. Replacement ps may be purchased separately, using part number

“T693PKAS3” for 200mm. Class 1 cleanroom compa ble. Filter replacement kit may be purchased separately using part

number “FWCR2FA”

Features:

Self‐contained cordless ba ery powered vacuum wands allows freedom from vacuum lines.

Run me to 180 minutes.

Direct connect to power supply allows use with discharged ba eries.

Ergonomically designed with finger contours for comfort – fits in to palm of operator’s hand.

Charger stand safely stores wands out of the way while recharging the ba ery.

Smart charger system keeps ba ery fully charged without worry of damage from overcharging.

Recommended p IS included.

Replacement ps may be purchased separately, using part number “T693PKAS3” for 200mm FWCR2 and “T3PK1” for

300mm FWCR3.

Class 1 cleanroom compa ble.


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200mm FWCR Portable Cordless Freedom Wand™

Compact (Rechargeable) ‐ for Wafer Rescue

Ships with: T693PKAS3 PEEK vacuum p, FWCR base unit,

charging stand, power supply/cord.

FWCR2‐AC USA (100‐120 VAC)

FWCR2‐E EUROPE (220‐240 VAC)

FWCR2‐UK UK (220‐240 VAC)

Replacement Filter Assembly: FWCR2FA

300mm FWCR Portable Cordless Freedom Wand™

Compact (Rechargeable) ‐ for Wafer Rescue

Ships with: T3PK1 PEEK vacuum p, FWCR base unit, charging

stand, power supply/cord.

FWCR3


Die and Package FWCR Portable Cordless Freedom Wand™

Compact (Rechargeable)

Ships with: AASPFLLHNF Luer‐adapter, FWCR base unit,

charging stand, power supply/cord, BCHN‐16 hub needle,

SCHN‐16 hub needle, VCC‐020 Vespel p, VCAS125 and

VCAS246 vinyl vacuum cups.

FWCR‐4

Class 1

Cleanroom Cer fied

Class 1

Cleanroom Cer fied

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H‐Square vacuum wands provide a safe means of handling wafers, die and packages. They are designed to operate at 22‐

24” hg of vacuum*. We are o en asked to recommend a complete setup for Wafer Handling. Below are the most up‐to‐

date sets for these applica ons. These sets incorporate our newest products and materials. They are ESD protected to

ensure wafer and component safety while elimina ng par cle a rac on due to sta c changes. Tips are made off ESD safe

peek and wands are made from chemical resistant conduc ve PVDF.

*Vacuum flow at 22” Hg is approximately 0.5cfm (0.24 liters/sec) for the standard size wand with tubing, no p.


450mm Wafer Handling

T450PKAS1 TIP

NO3AS1 HANDLE

CC11SDS CORD

HSU3PT HOLDER

CTA12 GROUND


T3PKAS1 TIP

NO3AS1 HANDLE

CC11SDS CORD

HSU3 HOLDER

CTA12 GROUND

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V a c u u m Wa n d s R E C O M M E N D A T I O N S

200mm / 150mm Wafer Handling

T693PKAS3 TIP

NOASPF2 HANDLE

CC11SDS CORD

HSU HOLDER

CTA12 GROUND

150mm / 125mm Wafer Handling

T694PKAS TIP

NOASPF2 HANDLE

CC11SDS CORD

HSU HOLDER

CTA12 GROUND


T691PKAS TIP

NOASPF2 HANDLE

CC9SDS CORD

HSU HOLDER

CTA12 GROUND

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www.h‐square.com US Patent No. 5,511,840

High Temperature Wafer Handling

(Size Variable) TIP

NOASQ2 HANDLE

CC11SDS CORD

HSU HOLDER

CTA12 GROUND

50mm / 75mm Wafers

T75035PKAS TIP

NOASQ2 HANDLE

CC9SDS CORD

HSU HOLDER

CTA12 GROUND

Die and Package Devices

(Size variable) CUP/TIP

(Size Variable) HUB NEEDLE

DPNOAS2LA HANDLE

CC4SDS CORD

HSU HOLDER

CTA06 GROUND

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V a c u u m Wa n d s R E C O M M E N D A T I O N S

200mm / 150mm Thin or Compound Semi*

T693PKAS3‐001 TIP

NOASPF2 HANDLE

CC11SDS CORD

HSU HOLDER

CTA12 GROUND

*GaAs, Ge, SiGe, InP, etc.


T794PKAS TIP

NOASPF2 HANDLE

CC9SDS CORD

HSU HOLDER

CTA12 GROUND



T791PKAS TIP

NOASPF2 HANDLE

CC9SDS CORD

HSU HOLDER

CTA12 GROUND


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Press Fit Vacuum Wand Handle

The latest and most popular model vacuum wand handle. Designed to be used with ESD safe PEEK molded press‐fit

vacuum ps. The design allows the operator to adjust the PEEK p at any angle for comfort and control. The conduc ve

PVDF versions provide safety from ESD events and eliminate par cle a rac on caused by sta c charges.

Quick Lock Vacuum Wand Handle

The latest design handle for handling stainless steel tubing mount vacuum ps. The Quick‐Lock handle incorporates the

latest materials and locking mechanism to securely hold all specialty vacuum ps. The conduc ve PVDF versions provide

safety from ESD events and eliminate par cle a rac on caused by sta c charges.


MODEL MATERIAL VALVE SPECIAL

NOASPF2 ANTISTATIC PVDF NORMALLY OPEN

NOPPF1 PEEK NORMALLY OPEN

NOSPPF1 PEEK NORMALLY OPEN SLIDE SWITCH

NCASPF2 ANTISTATIC PVDF NORMALLY CLOSED

NCPPF1 PEEK NORMALLY CLOSED


NOASQ2 ANTISTATIC PVDF NORMALLY OPEN

NOSASQ2 ANTISTATIC PVDF NORMALLY OPEN SLIDE SWITCH

NOPQ1 PEEK NORMALLY OPEN

NOSPQ1 PEEK NORMALLY OPEN SLIDE SWITCH

NCASQ2 ANTISTATIC PVDF NORMALLY CLOSED

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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Conven onal Vacuum Wand Handle

H‐Square’s original design which Acetal versions have been enhanced with a slightly longer body, improved vacuum valve

and Quick‐Lock feature. Teflon versions remain shorter. NOTE: Acetal and Teflon® wand handles are not an sta c.

Acetal wands are not chemical resistant.

Down‐Size Vacuum Wand Handle

A design with a smaller diameter handle grip to reduce wand mass for more delicate opera ons. Down‐sized diameter is

some mes more suitable for smaller hands in many opera ons. Acetal wand handles are not an sta c or chemical

resistant.


NOQ1 DELRIN® ACETAL NORMALLY OPEN

NOSQ1 DELRIN® ACETAL NORMALLY OPEN SLIDE SWITCH

NOTQ PTFE TEFLON® NORMALLY OPEN

NOSTQ PTFE TEFLON® NORMALLY OPEN SLIDE SWITCH

NCTQ PTFE TEFLON® NORMALLY CLOSED


DSNOQ1 DELRIN® ACETAL NORMALLY OPEN

DSNOSQ1 DELRIN® ACETAL NORMALLY OPEN SLIDE SWITCH

DSNCQ1 DELRIN® ACETAL NORMALLY CLOSED

Heavy Substrate Vacuum Wand Handle

These products are specially designed to be used with heavy substrates including photo plates, flat panel displays and

read/write head disks. Tips are substan ally thicker and more rigid than common wafer handling ps. Tubes are 3/16”

diameter electro polished stainless steel (ST19xx series), and are twice the size of standard tubes. Wands are specially

modified to accept the 3/16” diameter tubes and have a set screw to secure connec on. Wands are available in ESD safe

PVDF and natural PEEK materials.

MODEL MATERIAL VALVE

SQ21557‐3 ANTISTATIC PVDF NORMALLY OPEN

NOP191 PEEK NORMALLY OPEN

NCP191 PEEK NORMALLY CLOSED

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300mm& 450mm Vacuum Wand Handles

Larger diameter wand handle for general handling of 300mm and 450mm wafers from casse es, single wafer compacts

and tool fixtures and stages. Interfaces with most 300mm and 450mm vacuum ps. For straight assemblies, unique press‐

fit p/wand adapters allow the vacuum p to be posi oned at 0°,90°,180° and 270° degrees for maximum convenience

for right or le handed operators. Wands also accommodates standard press‐fit PEEK ps for smaller wafers and

substrates.

MODEL MATERIAL PROFILE ASSEMBLY

NO3AS1 ANTISTATIC PVDF N/A WAND HANDLE ONLY

NO31 DELRIN® ACETAL N/A WAND HANDLE ONLY

NO3T3PKAS1 ANTISATIC PVDF / ANTISTATIC PEEK STRAIGHT INCLUDES T3PKAS1 TIP

NO3T3PK1 DELRIN® ACETAL / NATURAL PEEK STRAIGHT INCLUDES T3PK1 TIP

NO3T3PKAS‐005 ANTISATIC PVDF / ANTISTATIC PEEK OFFSET INCLUDES MODIFIED T3PKAS1 TIP

NO3T3PK‐001 DELRIN® ACETAL / NATURAL PEEK OFFSET INCLUDES MODIFIED T3PK1 TIP

NO3T3PKASU‐001 ANTISATIC PVDF / ANTISTATIC PEEK OFFSET INCLUDES UHMW MODIFIED T3PKAS1 TIP

NO3T3PKAS‐008 ANTISATIC PVDF / ANTISTATIC PEEK OFFSET INCLUDES THIN WAFER MODIFIED T3PKAS1 TIP

NOP191‐003 PEEK / STAINESS STEEL / QUARTZ OFFSET INCLUDES ADAPTER AND QUARTZ TIP

NO3T450PKAS1 ANTISTATIC PVDF / ANTISTATIC PEEK STRAIGHT IINCLUDES NCLUDES T450PKAS1 TIP

NO3T450PK1 ANTISTATIC PVDF / NATURAL PEEK STRAIGHT INCLUDES NCLUDES T450PK1 TIP

NOP191‐006 PEEK / STAINESS STEEL / QUARTZ STRAIGHT INCLUDES ADAPTER AND QUARTZ TIP

300mm / 450mm (Handle Only)—NO3AS / NO3

450mm— NO3T450PKAS1 / NO3T450PK1

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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NO3T3PKAS1 / NO3T3PK1—300mm Standard Vacuum Wand Assembly

NO3T3PKAS‐005 (ESD PEEK) / NO3T3PK‐001 (Natl’ PEEK) / NO3T3PKASU‐001 (UHMW)/ NO3T3PKAS‐008 (Thin) ‐ 300mm

(vacuum pocket can be mounted UP or DOWN)

300mm NOP191‐003 (Offset) / NOP191‐006 (Straight) RTP Quartz 300mm Vacuum Wand Assembly

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Pistol Grip Vacuum Wand Handle

Ergonomically designed pistol grip style vacuum wands allow for maximum comfort during extended wafer handling

sessions or for handling heavy substrates. This design is compa ble with H‐Square 300mm, 450mm and common 200mm

PEEK Press‐Fit design vacuum ps. Conduc ve PVDF material provides for ESD safety. Recommended shut off holder

HSU3‐002 should be installed at the leading edge of the operators worksta on.


NO3AS‐001 ANTISTATIC PVDF NORMALLY OPEN

NO3T3PKAS‐001 ANTISTATIC PVDF NORMALLY OPEN

ASSEMBLY

WAND HANDLE ONLY

INCLUDES 300mm T3PKAS1 TIP

NO3AS‐001

NO3T3PKAS‐001 NO3AS‐001 shown with 200mm T693PKAS3 p

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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HSU3 WHITE POLYPROPYLENE NORMALLY OPEN

HSU3PT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY OPEN

STYLE

WALL / MACHINE MOUNT

TABLE TOP PEDESTAL

300mm / 450mm Normally Open Wand Shutoff Holders

Table mount and table top vacuum wand holders depress the normally open valve bu on during wand inser on, thus

automa cally shu ng off the vacuum and providing for a clean and safe storage of the vacuum wand installa on. HSU3

models can be directly mounted to horizontal or ver cal surfaces using two #6 flat head fasteners. The material is white

polypropylene. They are shipped with a double sided cleanroom tape to aid in ini al installa on. The weighted HSU3PT

models are designed to be table top and can be easily moved to a comfortable posi on on the work surface. The pedestal

is white polypropylene and the table base is white epoxy coated steel with press‐fit silicone elastomer O‐ring feet to keep

is stable and prevent sliding on work surfaces.

COMPATIBLE WAND HANDLES

NO3AS1

NO31

NO3T3PKAS1

NO3T3PK1

NO3T450PKAS1

NO3T450PK1


HSU3‐002 BLACK ABS NORMALLY OPEN

HSU3PT‐001 BLACK ABS / WHITE EPOXY COATED STEEL NORMALLY OPEN

Pistol Grip Vacuum Wand Holder

Table mount and table edge vacuum wand holders for NO3AS‐001 pistol grip vacuum wand handles. The pistol grip

normally open valve is depressed during wand inser on.


NO3AS1‐001

HSU3

HSU3PT

HSU3‐002

HSU3PT‐001

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HSU WHITE POLYPROPYLENE NORMALLY OPEN

HSUPT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY OPEN

HSUL WHITE POLYPROPYLENE / 316 STAINLESS STEEL NORMALLY OPEN


NOASPF2

NOSASPF2

NOASQ2

NOSASQ2

NOPPF1

NOSPPF1

NOPQ1

NOSPQ1

NOQ1

NOSQ1

NOTQ

NOSTQ

NOP191

SQ21557‐3

HSU Series Normally Open Universal Wand Shutoff Holders

Table mount and table top vacuum wand holders depress the normally open valve bu on during wand inser on, thus

automa cally shu ng off the vacuum and providing for a clean and safe storage of the vacuum wand installa on. HSU

models can be directly mounted to horizontal or ver cal surfaces using two #6 flat head fasteners. The material is white

polypropylene. They are shipped with a double sided cleanroom tape to aid in ini al installa on. The weighted HSUPT

models are designed to be table top and can be easily moved to a comfortable posi on on the work surface. The pedestal

is white polypropylene and the table base is white epoxy coated steel with press‐fit silicone elastomer O‐ring feet to keep

is stable and prevent sliding on work surfaces. The HSUL combines the “HSU” holder with a table‐L‐bracket.

HSU

HSUL

HSUPT

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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HAW Series Non Shut‐Off Holder

Table mount and table top vacuum wand holders accommodate all wands except Teflon. It is designed primarily for

Normally Closed (NC) wands and those with shut‐off side switches. Vacuum wand holders provide for a clean and safe

storage of the vacuum wand installa on. HAW models can be directly mounted to horizontal or ver cal surfaces using

two #6 flat head fasteners. The material is white polypropylene. They are shipped with a double sided cleanroom tape to

aid in ini al installa on. The weighted HAWPT models are designed to be table top and can be easily moved to a

comfortable posi on on the work surface. The pedestal is white polypropylene and the table base is white epoxy coated

steel with press‐fit silicone elastomer O‐ring feet to keep is stable and prevent sliding on work surfaces. The HAWL

combines the HAW holder with a stainless steel table‐L‐bracket.


HAW WHITE POLYPROPYLENE NORMALLY CLOSED / SHUT OFF SWITCH

HAWPT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY CLOSED / SHUT OFF SWITCH

HAWL WHITE POLYPROPYLENE / 316 STAINLESS STEEL NORMALLY CLOSED / SHUT OFF SWITCH

HAW

HAWL HAWPT


NOSPPF1

NCASPF2

NCPPF1

NOSASQ2

NOSPQ1

NCASQ2

NOSQ1

NCP191

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HSD WHITE POLYPROPYLENE NORMALLY OPEN

HSDPT WHITE POLYPROPYLENE / EPOXY COATED STEEL NORMALLY OPEN

HSDL WHITE POLYPROPYLENE / 316 STAINLESS STEEL NORMALLY OPEN

HSD Series Normally Open Down Size Wand Shutoff Holders

Table mount and table top vacuum wand holders depress the down size normally open valve bu on during wand

inser on, thus automa cally shu ng off the vacuum and providing for a clean and safe storage of the vacuum wand

installa on.

HSD HSDL HSDPT


DSNOQ1

DSNOSQ1

Holder Accessory—RP Pedestals

Loose pedestal base holders that can be mounted to HRM

rack mounts. HRMP8 is suggested when choosing RP units.

HSDRP HSD Series Shutoff Holder

HSURP HSU Series Shutoff Holder

HAWRP HAW Series Non Shutoff Holder

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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Holder Accessory—TLB Series Table‐L‐Bracket

This product allows many H‐Square holders to be mounted from the underside of a

bench top such that wand ps will be at or below, the level of the bench top. This

reduces the risk of damage and contamina on that can result from inadvertent contact

by operators. It is constructed of 16 gauge, electro‐polished type 316 stainless steel,

and includes 3 sets of pre‐drilled moun ng holes for user provided #10 screws. The

front side is drilled and tapped (#6‐32 TPI) to accept “HSU”, “HSD” and “HAW” holders.

Jam nuts are recommended to prevent loosening of holder a achment.

TLB Stainless Steel L Bracket

Holder Accessory—TC Series Table Clamp

These products allow the installa on of many H‐Square holders

without need for bench modifica ons (e.g., drilled & tapped holes).

They consist of a hard clear anodized 6061 T‐6 aluminum alloy

channel drilled and tapped to accept H‐Square holders. TC‐2N and TC‐

3N have a single thumbscrew. TC clamps are compa ble with HSD,

HAW, HSU, and HSU3 wand holders.

TC‐2N 1.5” Width Range: 0.38”‐1.5” table

TC‐3N 1.5” Width Range: 1.38”‐2.5” table

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Vacuum Coil Cords and Vacuum Tubing Vacuum wands need some form of connec ve vacuum tubing. Coiled vacuum cords offer a combina on of operator com‐fort, installa on ease and durability. Coil cords help to prevent tubing from res ng on bench tops and floors. Coil cords are compa ble with suspension applica ons. H‐Square coil cords are manufactured from tough, resilient, chemical re‐sistant polyurethane, which can be used over a broad temperature range of ‐65° F to +210°F. Although designed primarily for vacuum, H‐Square cords can be applied in pressure applica ons and are compa ble with many fluids including air, nitrogen, oil and water. Maximum recommended vacuum ra ng is 27 in Hg; maximum pressure ra ng is 80 P.S.I. A variety of coil cords are available to fill user requirements for inside/outside diameter, total length and pull back ten‐sion. Sta c dissipa ve cords are available for sta c sensi ve applica ons. For special applica ons, H‐Square offers the heavy‐duty standard and an ‐sta c Polyurethane tubing in straight bulk form. All coil cords are designed to fit on typical barbed hose fi ngs used on H‐Square wands. Heavy‐duty cords and tubing are o en used in pressure applica ons in con‐

CC4SDS A small diameter wire embedded an ‐sta c coil cord for use with die and package handling vacuum wands.

CC‐6 A lightweight, low tension coil cord recommended for Down‐Sized wands and other precision applica ons.

CC‐7 A heavy‐duty coil cord used for general vacuum wand handling, suspension and pressure applica ons

CC‐9 A lightweight, low tension coil cord recommended for Down‐Sized wands and other precision applica ons.

CC‐9AS2 Similar to the CC‐9, but with sta c dissipa ve characteris cs

CC9AS2S Similar to the CC‐9AS2, but with a stainless steel spring inserted to prevent kinking.

CC9ESD Similar to CC9AS2S but with integrated CTA12 grounding cord and vacuum wand handle fi ng

CC9SDS Similar to the CC‐9AS2, but with a wire embedded in cord to enhance conduc vity.

CC‐11 A heavy duty coil cord used for general vacuum wand handling, suspension and pressure applica ons

CC‐11AS2 An ‐sta c, heavy duty coil used for general vacuum wand handling, suspension and pressure applica ons.

CC11AS2S Similar to the CC‐11AS2, but with a stainless steel spring inserted to prevent kinking

CC11ESD Similar to CC11AS2S but with integrated CTA12 grounding cord and vacuum wand handle fi ng

CC11SDS Similar to the CC‐11AS2, but with a wire embedded in cord to enhance conduc vity.

PT A heavy‐duty straight tubing used for vacuum and pressure applica ons, sold per foot

PTAS2502 Sta c dissipa ve, heavy‐duty straight tubing used for vacuum and pressure applica ons, sold per foot

TT A clear, heavy wall elastomeric Tygon tubing used for vacuum and pressure applica ons, sold per foot

PTAS1322 A sta c dissipa ve, small diameter straight tubing for use with Die and Package handling vacuum wands

SRTAS A lightweight, highly flexible straight silicone rubber tubing. Includes spring throughout length and O.D.

sheath to prevent crimping. ESD protec on. Includes integrated grounding adapter CTA12

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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V a c u u m Wa n d C o m p o n e n t s C O I L C O R D S

Grounding Adapter CTA06

Conduc ve nickel plated brass inline adapter with lug for grounding

wire. Adapts .13”‐.16” I.D. tubing to .06” I.D. For use with “CC‐4AS2”

or “PTAS1322”.



wire. Adapts .13”‐.16” I.D. tubing for 1/8” I.D. tubing. Use with “CC‐

CC‐xx and CC‐xxAS2

CCxxSDS

CCxxAS2S

CCxxESD

SRTAS

CUT STRAIGHT TUBING —ORDERED PER FOOT

PT, PTAS2502, TT,

PTAS1322

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MODEL WORKING

LENGTH

MAX

EXT

INSIDE

DIAM

OUTSIDE

DIAM

COIL

OD

COIL

LENGTH

TOTAL

WEIGHT

MATERIAL COLOR

CC4SDS 9”‐36” 54” 0.06” 0.13” 0.8” 3.4” 0.5oz POLYURETHANE DARK GRAY

CC‐6 11”‐60” 72” 0.13” 0.20” 1.2” 5.6” 1.3oz POLYURETHANE BLACK

CC‐7 12”‐48” 60” 0.14” 0.25” 1.3” 7.0” 2.0oz POLYURETHANE WHITE

CC‐9 14”‐96” 120” 0.13” 0.20” 1.1” 8.4” 2.9oz POLYURETHANE BLACK

CC‐9AS2 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE GRAY

CC‐9AS2S 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE GRAY

CC9ESD 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE GRAY

CC9SDS 14”‐96” 120” 0.13” 0.23” 1.1” 8.1” 2.5oz POLYURETHANE DARK GREY

CC‐11 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE WHITE

CC‐11AS2 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE GRAY

CC‐11AS2S 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE GRAY

CC11ESD 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE GRAY

CC11SDS 16”‐72” 96” 0.14” 0.25” 1.3” 10.5” 2.7oz POLYURETHANE DARK GRAY

PT N/A N/A 0.14” 0.25” N/A PER/FT N/A POLYURETHANE WHITE

PTAS1322 9”‐36” N/A 0.06” 0.13” N/A PER/FT N/A POLYURETHANE GRAY

PTAS2502 N/A N/A 0.14” 0.25” N/A PER/FT N/A POLYURETHANE GRAY

TT N/A N/A 0.16” 0.28” N/A PER/FT N/A TYGON CLEAR

SRTAS 72” N/A 0.10” 0.19” N/A N/A N/A SILICONE CLEAR

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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V a c u u m Wa n d C o m p o n e n t s C O I L C O R D s

Vacuum Wand Installa on Techniques

Correctly installed vacuum coil cords are designed make vacuum wand installa ons less dangerous in the work area

(operators can easily trip on the Tygon straight tubing as it drapes on to the floor around their wafer handling work‐

sta ons). Coil cords will also keep the cord tubing off the ground keeping the fab and work area cleaner. Vacuum coil

cords should be installed within the first 3” of the front of the worksta on. Facili es personnel should run a vacuum

line all the way to the front of the worksta on where the coil cord is then installed. By design, the short 6” length

tubing should be installed towards the facili es connec on and the 16” length towards the wand handle. This will

make the vacuum wand installa on hang straight down at the edge of the worksta on. It will then allow the vacuum

wand to be free of ge ng caught on operators, carts, chairs and will make the vacuum wand a one handed tool for

the operator to use—increasing operator control and dexterity. Installing the vacuum coil cord too far underneath

the worksta on or backwards, will force the operator to use two hands to use the vacuum wand installa on.

ESD Safety – The use of Tygon straight tubing eliminates the ground path poten al for the vacuum wand. By design, a

PEEK vacuum p should be paired with an ESD safe vacuum wand handle (like NOASPF2 or NOASQ2) and a conduc ve

or dissipa ve coil cord of the an sta c design (CC11SDS or CC9SDS are recommended). Vacuum wand coil cords

should then be connected to a ground source. Introduc on of a properly grounded vacuum wand installa on will

provide ESD safety and make the vacuum wand a ract less par cles (which keeps it cleaner).

Quick‐Disconnect assembly for connec ng coil cord or straight tubing to house vacuum lines. Automa c shut‐off mechanism is in the “CQDM” por‐on of the quick‐disconnect.

CQDM Quick Disconnect coupling, metal, female connec on

HBQDM Quick Disconnect hose barb, metal, male connec on

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T691PKAS

Thin, one‐piece molded Press‐Fit ps for general handling of up to

4” wafers. Molded from rigid Carbon‐filled PEEK for strength and

ESD protec on. Designed for Press‐Fit wand handles like NOASPF2.

P/N: T691PKAS (straight)

T691PKAS2R (Right handed operator)

T691PKAS2L (Le handed operator)

T691PKAS‐S (with stops)

T691PKAS1U (10° up bend)

T691PKAS1D (10° down bend)

T691PKAS‐001 (20°down bend)


T691PKAS3D (30 down)

T692PKAS

Thin, one‐piece molded Press‐Fit ps for general handling of up to

6” wafers. Molded from rigid Carbon‐filled PEEK for strength and

ESD protec on. Designed for Press‐Fit wand handles like NOASPF2.









An sta c PEEK

An sta c PEEK

Example : Bent Angle Version ↓


VACUUM WAND

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V a c u u m Wa n d C o m p o n e n t s V A C U U M T I P S

T694PKAS

Thin, one‐piece molded Press‐Fit ps for general handling of up to 6”

wafers. Molded from rigid carbon filled PEEK for strength and ESD pro‐

tec on. May be used directly with Universal PEEK and An ‐Sta c, Press‐

Fit wands or with the appropriate adapter on all Quick‐Lock wands. 3°

bend allows vacuum area of p to hold closer to the center of large wa‐

fers for be er leverage and increased holding strength.



T694PKAS‐001 (30° down bend)

T694PKAS‐002 (20° right bend)


T693PKAS3

Thin, one‐piece molded Press‐Fit ps for general handling of up to 8”

wafers. Molded from rigid carbon filled PEEK for strength and ESD pro‐

tec on. 3 bend allows vacuum area of p to hold closer to the center of

large wafers for be er leverage and increased holding strength.


T693PKAS3 (straight with 3° bend)‐ recommended






T693PKAS‐001 (20°down bend)

T693PKAS‐003 (30° up bend)

T693PKAS‐002 (30° down)

An sta c PEEK

An sta c PEEK



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T792PKAS—Thin Wafer Handling / Compound Semi Wafers

Thin, one‐piece molded Press‐Fit ps for general handling. Thin sub‐

strates (0.005” ‐ .015” thick) with medium diameters, e.g., 4”‐6”.

Molded from rigid carbon filled PEEK for strength and ESD protec on.

Recommended vacuum wand handle is NOASPF2. Tip is designed for

thin wafer handling or fragile substrates like GaAs, SiGe, Ge, InP and

other Compound Semiconductor substrates.



T792PKAS2R (20° right bend)




strates (0.005” ‐ .015” thick) with smaller diameters, e.g., 2”‐3”. Molded

from rigid carbon filled PEEK for strength and ESD protec on. Tip is de‐

signed for thin wafer handling or fragile substrates like GaAs, SiGe, Ge,

InP and other Compound Semiconductor substrates.


T791PKAS‐001 (30° down bend)





T791PKAS2R (20° right bend)

An sta c PEEK

An sta c PEEK



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V a c u u m Wa n d C o m p o n e n t s T H I N V A C U U M T I P S



strates (0.005” ‐ .015”) with large diameters, e.g., 4”‐6”. Molded

from rigid carbon filled PEEK for strength and ESD protec on. Rec‐

ommended vacuum wand handle is NOASPF2. Tip is designed for

thin wafer handling or fragile substrates like GaAs, SiGe, Ge, InP and

other Compound Semiconductor substrates.


T794PKAS3D‐001 (30° down bend)

T693PKAS3‐001—Thin Wafer Handling / Compound Semi Wafers

Thin, one‐piece molded Press‐Fit ps for general handling. Thin or

Compound Semiconductor substrates (0.005” ‐ .030”) with large di‐

ameters, e.g., 6”‐8”. Molded from rigid carbon filled PEEK for

strength and ESD protec on. Recommended vacuum wand handle is

NOASPF2. Tip is designed for thin wafer handling or fragile sub‐

strates like GaAs, SiGe, Ge, InP and other Compound Semiconductor

substrates.

P/N: T693PKAS3‐001 (straight)



An sta c PEEK

An sta c PEEK



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Inser on Preven on PEEK ps

One‐piece molded Press‐Fit ps for general handling. Same as

T693PKAS3 but includes bump on the backside of the p to

prevent operators from inser ng ps between wafers in a

standard pitch casse e. Molded from rigid carbon filled PEEK

for strength and ESD protec on. Recommended vacuum wand

handle is NOASPF2.

. P/N: T693PKAS3‐007 (T693PKAS3 with bump)

SQ20870‐1 (T693PKAS with bump)

T692PKAS‐006 (T692PKAS with bump)

T693PKAS2D‐006 (T693PKAS2D with bump

20° degrees DOWN)

SQ21203‐5—Extended Reach 200mm PEEK Tips

Thin, one‐piece molded Press‐Fit ps for general handling.

Same as T693PKAS3 but extended from 4.6” to longer

lengths. Molded from rigid carbon filled PEEK for strength

and ESD protec on. Recommended vacuum wand handle

is NOASPF2.

P/N: SQ21203‐5 (straight 6.3”)

T693PKAS3‐008 (straight 8.3”)

T693PKAS2D‐005 (20° bent down 6.4”)

Contact H‐Square for addi onal lengths

An sta c PEEK

An sta c PEEK

T590PKAS

Thin, one‐piece molded Press‐Fit ps for general handling of 2” to 3”

wafers and small light‐weight pieces of wafers or small substrates.

Molded from rigid carbon filled PEEK for strength and ESD protec‐

on.

P/N: T590PKAS

An sta c PEEK

SQ21203‐5

T693PKAS3‐007

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T695PKAS

Similar to T693PKAS3, but with larger surface area for increased se‐

curity. Thin, one‐piece molded Press‐Fit ps for general handling of

up to 8” wafers. Molded from rigid carbon filled PEEK for strength

and ESD protec on. May be used directly with Universal PEEK and

An ‐Sta c, Press‐Fit wands or with the appropriate adapter on all

Quick‐Lock Wands.




T695PKAS45D‐001 (45°down bend)


T695PKAS3U‐001 (30° up bend)

An sta c PEEK


An sta c PEEK / Natural PEEK

T3PKAS1—300mm

General handling vacuum ps for 300mm wafers. Machined from rigid PEEK for strength and ESD protec on (on an sta c

“AS” carbon loaded version). Some models are available as a wand/ p assembly—see page 86‐87.

P/N: T3PKAS1 (An sta c PEEK Standard)

T3PKAS1‐001 (An sta c Thin Wafer)

T3PK1 (Natural PEEK Standard)

T3PKASU (An sta c PEEK with UHMW Tape Surface)

T3PKU (Natural PEEK with UHMW Tape Surface)

T3PKASU / T3PKU with UHMW Tape T3PKAS1 / T3PK1 Standard

T3PKAS1‐001 Thin Wafer

402724 Replacement Universal

Tip Adapter—ESD safe PVDF

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MISC1400 Series Thin Wafer Hoop Tip Vacuum Wand Assemblies

Custom product an sta c normally open, hoop style vacuum wand assemblies for handling of thin wafers to / from

backend wafer handling opera ons including wafer pack‐out jar shipper loading and unloading. Thin wafers are support‐

ed by unique extended wafer support p. Most assemblies ship with p, adapter, wand handle, coil cord and shutoff

holder complete. Please contact your H‐Square representa ve for more informa on.

MISC1400‐004

Thin Wafer Packout vacuum wand "hoop" assem‐bly, 300mm and 200mm complete set; horizontal offset design. Hardened aluminum end effector with PFA Teflon coa ng. Tip, adapter, wand (NO3AS1), coil cord (CC11SDS) and holder (HSU3PT) included. Outside hoop diameter—6.0” (152.4mm)

MISC1400‐006

200mm Thin wafer packout vacuum wand "hoop" assembly, straight. Hardened aluminum end effec‐tor with PFA Teflon coa ng. Wand (NOASPF2 modi‐fied), p and adapter; (HSUPT holder and CC11SDSD coil cord sold separate) straight version. Outside hoop diameter—6.0” (152.4mm)

MISC1400‐008

200mm Thin Wafer Packout vacuum wand "hoop" assembly, horizontal offset. Hardened aluminum end effector with PFA Teflon coa ng. Wand (NOASPF2 modified), p and adapter; (HSUPT holder and CC11SDSD coil cord sold separate) straight version. Outside hoop diameter—6.0” (152.4mm)

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NO3T3‐001 Series Thin Wafer U Shaped 300mm Vacuum Wand Assembly

Custom Product an sta c normally open, custom “U” shaped vacuum wand assembly for handling of thin 300mm wafers.

Thin wafers are supported underneath by unique anodized aluminum wafer support p. Assembly ships with p, adapt‐

er, wand handle, coil cord and shutoff holder complete. Please contact your H‐Square representa ve for more infor‐

ma on.

V a c u u m Wa n d A s s e m b l i e s T h i n W A F E R H A N D L I N G

MISC1400‐005

Thin wafer packout vacuum wand "hoop" assembly, 200mm and 150mm complete set; horizontal offset design. Hardened aluminum end effector with PFA Teflon coa ng. Tip, adapter, wand (NO3AS1), coil cord (CC11SDS) and holder (HSU3PT) included. Outside hoop diameter—5.0” (127mm)

MISC1400‐011

Thin wafer packout vacuum wand "hoop" assembly, 300mm and 200mm complete set; horizontal offset design. Hardened aluminum end effector with PFA Teflon coa ng. Tip, adapter, wand (NO3AS1), coil cord (CC11SDS) and holder (HSU3PT) included. Outside hoop diameter—6.0” (152.4mm)

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T691PK—UHMW Contact Pad PEEK Tip

Thin, one‐piece molded Press‐Fit ps for general wafer han‐

dling of 75mm‐100mm wafers. Same as T691PKAS but with

added UHMW Polyethylene vacuum pocket. Thin laser cut

UHMW pad is bonded to PEEK with cleanroom approved adhe‐

sive. UMHM surface reduces scratching and contamina on as

process contamina on does not adhere to the surface. Excel‐

lent for double sided polished wafer handling applica ons.

Molded from rigid carbon filled PEEK for strength and ESD pro‐

tec on. Recommended vacuum wand handle is NOASPF2.

.P/N: T691PK‐002 (straight)

T691PK‐001 (20° down bend)

T696PK—UHMW Contact Pad PEEK Tip

Thin, one‐piece molded Press‐Fit ps for general wafer handling of

100mm‐200mm wafers. Same as T693PKAS3 but with added UHMW

Polyethylene vacuum pocket. Thin laser cut UHMW pad is bonded to

PEEK with cleanroom approved adhesive. UMHM surface reduces

scratching and contamina on as process contamina on does not

adhere to the surface. Excellent for double sided polished wafer

handling applica ons. Molded from rigid carbon filled PEEK for


NOASPF2.

P/N: T696PK (straight)

T696PK‐001 (30° down bend)

An sta c PEEK / UHMW

An sta c PEEK / UHMW



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T75072PKAS

A special applica on p for general handling of fragile wafers, such as Gallium Arse‐

nide, of up to 4”. Grooved pocket provides excellent adhesion to wafers with mini‐

mum distor on. Knife‐edge p allows removal of wafer from flat surfaces such as plat‐

ens and susceptors. Machined from rigid carbon filled PEEK for strength and ESD pro‐

tec on. Recommended vacuum wand handle is NOASQ2.

P/N: T75072PKAS

An sta c PEEK

T75010PKAS

A popular p for general handling of up to 5” wafers. Machined from rigid carbon

filled PEEK for strength and ESD protec on. Recommended vacuum wand handle is

NOASQ2.

P/N: T75010PKAS

An sta c PEEK

T75083PKAS

A popular open pocket p for general handling of up to 6” wafers. Can be used

in some applica ons to separate wafers from adjacent surface. Secondary angle

allows posi ve handling in the event of front edge damage. Machined from

rigid carbon filled PEEK for strength and ESD protec on. Recommended

vacuum wand handle is NOASQ2.

P/N: T75083PKAS

An sta c PEEK

T75028PK

Popular p for general handling of up to 6” wafers. Grooved pocket

provides excellent adhesion to wafer with minimum distor on. Less

contact area than T75026, but slightly be er wafer adhesion due to

shape. Machined from rigid natural PEEK for strength and durability.

Recommended vacuum wand handle is NOPQ1.

P/N: T75028PK

Natural PEEK

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An sta c PEEK

TLP25PKAS

A thin circular p (2.5” diameter) designed for maximum rota onal

holding power. Compared to other ps of comparable size, this p

reduces the rota onal slippage by a factor of 2.5 to 3 mes. The

thin leading edge (0.065”) allows easy access between casse es

held wafers. Recommended for use on 8” and larger wafers. Ma‐

chined from rigid carbon filled PEEK for strength and ESD protec‐

on. Recommended vacuum wand handle is NOASQ2.

P/N: TLP25PKAS

An sta c PEEK

T75050PKAS

A very rigid p for general handling of up to 8” wafers. Large support

area minimizes vacuum induced distor on. Shallow pocket allows

fast, posi ve pick up. Can be used in some applica ons to separate

wafers from adjacent surface. Secondary angle allows posi ve han‐

dling in the event of front edge damage. Consider Full Hard tube for

larger wafers. Machined from rigid carbon filled PEEK for strength and

ESD protec on. Recommended vacuum wand handle is NOASQ2.

P/N: T75050PKAS

T75051PKAS

A rigid, knife‐edged p for loading/unloading of wafers up to 8” from

platens and susceptors. Large support area minimizes vacuum induced

distor on. Shallow pocket allows fast posi ve pick up. Consider Full Hard

tube for larger wafers. Machined from rigid carbon filled PEEK for


NOASQ2.

P/N: T75051PKAS

An sta c PEEK

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T75025Q

For general handling of up to 5” wafers. 25° angle knife

edge. Larger vacuum pocket as compared to T75024Q.

Includes combina on Invar/stainless steel tube cemented

to p. Recommended for use with Quick‐Lock wands.

P/N: T75025Q

Quartz

T75069Q

Special applica on p for use with Eaton‐Axcelis

robo c handing systems such as those used in

rapid thermal processing. Based on “T75037” p.

Center tube conducts vacuum to p; outer rods

maintain alignment. Provides clean, reliable han‐

dling of hot wafers.

P/N: T75069Q

Quartz— Robo c End Effector

T75082Q

A quartz p for handling 5” to 8” wafers in higher tempera‐

ture applica ons. Large support area minimizes vacuum

distor on. Invar/Stainless steel tube. Recommended for use

with Quick‐Lock wands.

P/N: T75082Q

Quartz

T75033QV

Designed for high temperature applica ons. Wafer holding

area is made of quartz, which is con nuously usable to

1425°C. Vespel® pick up withstands 480°C on a short‐term

basis. Vespel® surrounds quartz to protect it from damage.

Knife‐edged spatula facili es pick up of wafers from flat

surfaces. Ideal for removing wafers from epitaxial reactors

and other high temperature processes. Recommended for

use with Quick‐Lock wands.

P/N: T75033QV (Length 3.9”)

Quartz / Vespel®

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Vespel®

Vespel®

Vespel®

Vespel®

T37505V

Long, narrow p popular for general handling of up to 4” wafers. Rec‐

ommended for use with Quick‐Lock wands.

P/N: T37505V

T75070V

A narrow, knife‐edged p for loading/unloading wafers up to 4” from

stages offering limited access. Vacuum pocket side has minimal angle to

allow wand to remain rela vely parallel to wafer and stage. Recom‐

mended for use with Quick‐Lock wands.

P/N: T75070V

T75096V

A broad, knife‐edged p for leading/unloading of wafers up to 4” for

platens and susceptors. Recommended for use with Quick‐Lock wands.

P/N: T75096V

T75071V

A narrow, knife‐edged p for loading/unloading wafers up to 6” from

stages offering limited access. Vacuum pocket side has minimal angle

to allow wand to remain rela vely parallel to wafer and stage. Rec‐

ommended for use with Quick‐Lock wands.

P/N: T75071V

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Vespel®

Vespel®

Vespel®

T75048V

For general handling of wafers up to 3” especially thin of fragile types

such as gallium arsenide. Grooved pocket provides excellent adhesion to

wafers with minimum distor on. Recommended for use with Quick‐Lock

wands.

P/N: T75048V

T75072V

A special applica on p for general handling of fragile wafers, such as Gallium

Arsenide, of up to 4”. Grooved pocket provides excellent adhesion to wafers with

minimum distor on. Knife‐edge p allows removal of wafer from flat surfaces

such as platens and susceptors. Recommended for use with Quick‐Lock wands.

P/N: T75072V

T75044V

Very rigid, durable, knife‐edged p for loading/unloading of wafers up to

6” from platens and susceptors. Recommended for use with Quick‐Lock

wands.

P/N: T75044V

Vespel®

T75049V

A knife‐edged p for loading/unloading of wafers up to 4” from platens and sus‐

ceptors. Recommended for use with Quick‐Lock wands.

P/N: T75049V

T75055V

A knife‐edged p for loading/unloading of wafers up to 6” from platens

and susceptors. Slightly thicker and more durable than T75049.

P/N: T75055V

Vespel®

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Vespel®

Vespel®

T75096V

A broad, knife‐edged p for leading/unloading of wafers up to 4” for platens and

susceptors. Recommended for use with Quick‐Lock wands.

P/N: T75096V

Vespel®

T75010V

A popular p for general handling of up to 5” wafers. Recommended for use with

Quick‐Lock wands.

P/N: T75010V

T75065V

A broad, knife‐edged p for loading/unloading of up to 6” wafers from

platens and susceptors. Recommended for use with Quick‐Lock wands.

P/N: T75065V

Vespel®

T75040V

A popular open pocket p for general handling of up to 6” wafers. Can

be used in some applica ons to separate wafers from adjacent surface.

Secondary angle allows posi ve handling in the event of front edge

damage.

P/N: T75040V

Vespel®

T75042V

Popular open pocket p for general handling of up to 8” wafers. Consid‐

er Full Hard tube for larger wafers.

P/N: T75042V

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Vespel®

Vespel®

T75026V


provides excellent adhesion to wafer with minimum distor on.

P/N: T75026V

T75028V




shape.

P/N: T75028V

Vespel®

Vespel®

T75050V

A very rigid p for general handling of up to 8” wafers. Large support

area minimizes vacuum induced distor on. Shallow pocket allows

fast, posi ve pick up. Can be used in some applica ons to separate

wafers from adjacent surface. Secondary angle allows posi ve han‐

dling in the event of front edge damage. Consider Full Hard tube for

larger wafers.

P/N: T75050V

T75051V


platens and susceptors. Large support area minimizes vacuum in‐

duced distor on. Shallow pocket allows fast posi ve pick up. Consid‐

er Full Hard tube for larger wafers.

P/N: T75051V

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Torlon®

Torlon®

T75048TOR

For general handling of wafers up to 3” especially thin of fragile types such as

gallium arsenide. Grooved pocket provides excellent adhesion to wafers with

minimum distor on. Recommended for use with Quick‐Lock wands. Machined

from Torlon® for high temperature and dimensional stability.

P/N: T75048TOR

T75072TOR

A special applica on p for general handling of fragile wafers, such as Gallium

Arsenide, of up to 4”. Grooved pocket provides excellent adhesion to wafers with

minimum distor on. Knife‐edge p allows removal of wafer from flat surfaces

such as platens and susceptors. Recommended for use with Quick‐Lock wands.

Machined from Torlon® for high temperature and dimensional stability.

P/N: T75072TOR

Torlon®

T75010TOR

A popular p for general handling of up to 5” wafers. Recommended for use

with Quick‐Lock wands. Machined from Torlon® for high temperature and di‐

mensional stability.

P/N: T75010TOR

Torlon®

T37504TOR

Long, narrow p for general handling of up to 4” wafers. Backside relief to reduce

thickness. Recommended for use with Quick‐Lock wands. Machined from Torlon®

for high temperature and dimensional stability.

P/N: T37504TOR

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Torlon®

T75049TOR

A knife‐edged p for loading/unloading of wafers up to 4” from platens and

susceptors. Recommended for use with Quick‐Lock wands. Machined from

Torlon® for high temperature and dimensional stability.

P/N: T75049TOR

Torlon®

Torlon®

T75028TOR




shape.

P/N: T75028TOR

T75040TOR

A popular open pocket p for general handling of up to 6” wafers. Can

be used in some applica ons to separate wafers from adjacent sur‐

face. Secondary angle allows posi ve handling in the event of front

edge damage.

P/N: T75040TOR

Torlon®

T75051TOR


platens and susceptors. Large support area minimizes vacuum induced

distor on. Shallow pocket allows fast posi ve pick up. Consider Full

Hard tube for larger wafers. Recommended for use with Quick‐Lock

wands. Machined from Torlon® for high temperature and dimensional

stability.

P/N: T75051TOR

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SQ22902‐2

A popular heavy substrate handling p for handling of 150mm

and 200mm aluminum titanium carbide wafers . Also can be used in some heavy sapphire or glass handling applica ons. Material is

sta c dissipa ve at 106‐109 surface resis vity. Compa ble with

Heavy Substrate 3/16” tubing and Heavy Substrate NOP191 se‐

ries wand handle.

P/N: SQ22902‐2

Semitron 420®

Heavy Substrate Vacuum Wand Handle

These products are specially designed to be used with heavy substrates including photo plates, flat panel displays and

read/write head disks. Tips are substan ally thicker and more rigid than common wafer handling ps. Tubes are 3/16”

diameter electro polished stainless steel (ST19xx series), and are twice the size of standard tubes. Wands are specially

modified to accept the 3/16” diameter tubes and have a set screw to secure connec on. Wands are available in ESD safe

PVDF and natural PEEK materials.


SQ21557‐3 ANTISTATIC PVDF NORMALLY OPEN

NOP191 PEEK NORMALLY OPEN

NCP191 PEEK NORMALLY CLOSED

Heavy Substrate Vacuum Wand Tubing Tubes are 3/16” diameter electro‐polished stainless steel, and are twice the size of standard tubes. Wands are specially modified to accept the 3/16” diameter tubes. Note: These ps/tubes are not compa ble with standard H‐Square vacuum wands with .094” tubes, nor with Press‐Fit wands and adapters. See heavy substrate handling wands NOP191 on Page 84. ST191 1” offset 3/16” tubing for NOP191

ST192 1.5” offset 3/16” tubing for NOP191

ST193 straight 2.9” x 3/16” tubing for NOP191


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SP‐X Susceptor Pencil A useful aid loading/unloading wafer from barrel‐type susceptors, which feature annular reliefs in the inner circumfer‐ence of he pocket. Handle is Delrin®, outrigger is stainless steel tube. Tips are high temperature plas c and must be or‐dered separately from pencil in packages of four. SP (Pencil handle, no outrigger) SP‐3 (Pencil with outrigger for 3” wafers, no ps) SP‐4 (Pencil with outrigger for 4” wafer, no ps) SP‐6 (Pencil with outrigger for 6” wafers, no ps) SPT‐TOR (Tips—four (4) Torlon®) SPT‐V (Tips—four (4) Vespel® Tips)

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AT090

A Delrin® adapter required to a ach “SCHN”, “BCHN”,

“SNHN”, “BNHD” hub needles to standard .094” diame‐

ter stainless steel wand tubes. One end has a 2° degree

taper for the hub needle. The opposite end presses on‐

to .094” diameter tubing.

AH375Q and AHAS716Q Adapter for Conven onal and Down‐Sized Quick‐Lock wands. These screw on adapters are required to a ach SCHN”, “BCHN”, “BNHN”, and “BNHD” hub needles. Mate‐rial matches wand types being used: AH375Q is Delrin®; AHAS716Q is an sta c PVDF

AST26Q

A Delrin® adapter required to a ach 100% Quartz ps

and molded plas c ps that feature .26”diameter tubes

to any Conven onal or Down‐Sized Quick‐Lock wand.

One end features two internal Viton® O‐rings similar to

Press‐Fit wands.

AAS26Q2

Converts Quick‐Lock wand to Press‐Fit wand.

Compa ble with PEEK (NOPQ1, NOSPQ1) & an ‐sta c

(NOSASQ2, NOASQ2, NCASQ2) wands. For use with all

molded PEEK Press‐Fit ps and all 100% quartz

ps. Material is conduc ve PVDF with 7/16‐28

UNEF threads on opposite end.

AASPFST

Adapter used on NCASPF2 and NOASPF2 wand. Converts a Press‐Fit wand to .094” diameter stainless steel tubing used for conven onal vacuum wand ps. Material is con‐

AASPFLLHNF

Adapter which combines the Luer‐Lock (LLHNF) with the AASPFST. This adapter converts all Press‐Fit wands to accommodate all hub needles for Die & Package

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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V a c u u m Wa n d C o m p o n e n t s A C C E S O R I E S

THF

Fi ng connects vacuum wands to coil cords. Nickel‐plated

Brass. Used on all wands (except Teflon wands).

THF‐P

Fi ng connects vacuum wand to coil cord. Plas c

(Polypropylene). Used on Teflon wands

NST

Nickel‐plated brass Used on Die & Package Handling

Wands.

LLHNF

Luer‐Lock fi ng. Chrome over nickel‐plated brass.

Used on Die & Package Handling wands.

A060

This nickel‐plated brass adapter reduces the internal

thread of all Conven onal and Down‐Sized wands from

1/16‐27 NPT to #10‐32TPI. It must replace the standard

“THF” barbed house fi ng in any of these wand models

when “HB06”, “HB12”, “SHB”, or “SHB‐90” op onal

fi ngs are installed.

HB06

A nickel‐plated barbed hose fi ng compa ble with

1/16” I.D. resilient tubing such as “PTAS1322”, “CC‐4”,

AND “CC‐4AS2” coil cords. Threaded end is #10‐32.

Requires replacement of “THF” fi ng with “A060” all

Conven onal and Down‐Sized wands

HB12

A nickel‐plated barbed hose fi ng compa ble with 1/8” I.D.

resilient tubing. Threaded end is #10‐32. Requires replace‐

ment of “THF” fi ng with “A060” in all Conven onal and

Down‐Sized wands. May be used with “PTAS2502”, “CC‐6”,

“CC‐7”, “CC‐9”, “CC‐9AS2”, “CC‐11”, and “CC‐11AS2” coil

cords.

SHB

A brass swivel fi ng for use with 1/8” I.D. resilient tub‐

ing. Helps to prevent cord fouling in applica ons where

wand rota on occurs. Threaded end is #10‐32. Requires

replacement of “THF” fi ng with “A060” in all Conven‐

onal and Down‐Sized wands. May be used with “CC‐

6”,“CC‐7”, “CC‐9”, “CC‐9AS2”, “CC‐11”, and “CC‐11AS2”

coil cords.

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Vacuum Wand System Metal Quick Disconnect

Quick‐Disconnect assembly for connec ng coil cord or straight

tubing to house vacuum lines. Automa c shut‐off mechanism

is in the “CQDM” por on of the quick‐disconnect. An sta c

conduc ve.

HBQDM Metal Quick Disconnect, Male

CQDM Metal Quick Disconnect, Female



wire. Adapts .13”‐.16” I.D. tubing to .06” I.D. For use with “CC‐4x” or

“PTAS1322”. 6” grounding wire included.

CTA06 Grounding Adapter/ Size Change



wire. Adapts .13”‐.16” I.D. tubing to .13”‐.16 tubing. Use with “CC‐9x”,

“CC‐11x” and “PTAS2502” tubing. 6” grounding wire included.

CTA12 Grounding Adapter

Flex Coupling Vacuum Wand Tubing Assembly Flexible couplings are installed between Conven onal wand ps using .094” diameter tubing and Quick‐Lock or Slip‐Fit wands. May also be used with Universal PEEK Press‐Fit wands by using an “AASPFST” adapter. A short Polyurethane tube provides a resilient coupling. Flex couplings can aid in rapid pick up of wafers, especially for new operators, as it helps the p to self‐align with the wafer surface. Offset couplings are useful for applica ons where wafers are being removed from

a flat platen or susceptor with knife‐edged wand p, allowing the wand to remain separated from platen while giving the operator a “spatula‐like” feel to get between wafer and plate. May be requested as a special order basis for quartz and stainless steel ps featuring .094” diameter tubing. FCOQ Offset Angle FCQ Straight

FCQ

FCOQ

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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Replacement 0.094” Diameter Stainless Steel Wand Tubing

Standard tubing provided with Conven onal and Quick‐Lock wands is 2.5 inches long, .094” diameter with .016” wall,

annealed, type 316 stainless steel. Annealed tubing is so to allow operators to easily form it to desired opera ng angles.

Standard tubing for Conven onal Quick‐Lock wands and Teflon Slip‐Fit wands is knurled. Specify wand type when order‐

ing. Order tube models are available for special applica ons. “FH” full hard tubing is .094” diameter with .010” wall, type

316 stainless steel tubing that has been heat‐treated. Significantly more force is required to bend this tubing. It is used

where tubes should remain straight, or where they will be formed coated with PFA. Encapsula on can reduce metallic

material transfer to wafers in the event of tubing contact.

ST‐2.5KQ 2.5” length standard tubing

ST2.5KQC PFA Teflon® coated ST‐2.5KQ

ST‐2.5KFH Full hard version of ST‐2.5KQ

ST‐2.5KFHC PFA Teflon® coated ST‐2.5KFH

ST‐4KQ Annealed, 4” long w/knurl

ST‐6KFH Full hard, 6” w/knurl





Heavy Substrate Vacuum Wand Tubing Tubes are 3/16” diameter electro‐polished stainless steel, and are twice the size of standard tubes. Wands are specially modified to accept the 3/16” diameter tubes. Note: These ps/tubes are not compa ble with standard H‐Square vacuum wands with .094” tubes, nor with Press‐Fit wands and adapters. See heavy substrate handling wands NOP191 on Page 84. ST191 1” offset 3/16” tubing for NOP191

ST192 1.5” offset 3/16” tubing for NOP191



Available extended lengths at 4”, 6”, 9”, 12” and 18” use

the exis ng wand handle and fi ngs. Custom lengths and

bent angle versions are available through your H‐Square

representa ve.

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SCR‐KEY Allen Wrench for Vacuum Tips

A black oxide coated, hardened steel set screw key for #2‐56 hex

head set screws commonly used in vacuum wand ps. The key

is .035” across the flats.

SCR‐KEY Tool

VTG– Vacuum Test Gauge

This mul ple func on tool provides a fast, accurate means to

measure system vacuum level, vacuum wand leakage and p

leakage for ps up to 200mm in size (for 300mm, see VTG‐001).

It incorporates a vacuum gauge, Delrin housing and tubing

adapter stored within the gauge. (Use included adapter to test

Press‐Fit wands).

VTG‐001 300mm version

VTG‐002 450mm version

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

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Wand Handle Replacement

Bu on, Valve and Spring

(Assembly)

Replacement

Vacuum Line Connec on

Fi ng

Replacement

Lock Ferrell

Replacement

SST Tubing

NOPQ1 BPVPNO THF LFP ST‐2.5KQ

NOSPQ1 BPVPNO THF LFP ST‐2.5KQ

NCPPF1 BPVPNC THF

NOPPF1 BPVPNO THF

NOSPPF1 BPVPNO THF

NCP191 BPVPNC THF ST19x Series

NOP191 BPVPNO THF ST19x Series

NCASQ2 BPVPASNC THF ST‐2.5KQ

NOASQ2 BPVPASNO THF ST‐2.5KQ

NOSASQ2 BPVPASNO THF

NCASPF2 BPVPASNC THF

NOASPF2 BPVPASNO THF

NOSASPF2 BPVPASNO THF

NCQ1 BPVPNC THF LF ST‐2.5KQ

NOQ1 BPVPNO THF LF ST‐2.5KQ

NOSQ1 BPVPNO THF LF ST‐2.5KQ

NCTQ THF‐P LFT ST‐2.5KQ

NOTQ THF‐P LFT ST‐2.5KQ

NOSTQ THF‐P LFT ST‐2.5KQ

DSNCQ1 BDSVNC THF LF ST‐2.5KQ

DSNOQ1 BDSVNO THF LF ST‐2.5KQ

DSNOSQ1 BDSVNO THF LF ST‐2.5KQ

DPNOAS2LA BPVPASNO A060, HB06

DPNOAS2NA BPVPASNO A060, HB06

DPNOAS2LB BPVPASNO A060, HB12

DPNOAS2NB BPVPASNO A060, HB12

DPNOSAS2LA BPVPASNO A060, HB06

DPNOSAS2NA BPVPASNO A060, HB06

DPNOSAS2LB BPVPASNO A060, HB12

DPNOSAS2NB BPVPASNO A060, HB12

NO31 BPVPNO3 THF

NO3AS1 BPVPNO3AS THF

Replacement Vacuum Wand Handle Parts

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Sta c Dissipa ve Vacuum Wand Die and Package Systems The below “EXAMPLE” drawing reflects a complete system for die and package handling that will not require a resistor to be installed in the vacuum wands or coil cord tubing, or p. The wand handle is a carbon filled PVDF. The sta c dissipa ve vacuum cups have a resistance of 10^8 to 10^10 ohms. The coil cord has a stainless steel wire inserted throughout its length to provide a path to ground. The balance of the system is metal and only at the end of the coil cord is a ground required. The charge decay meets the requirements in Method 4046 Federal Test Method Standard 101B, and MIL‐B81705B. NOTE: All wands, hub needles, cups, adapters, holders, and cords must be ordered separately. H‐Square die and package wands and portable Freedom Wands are available with normally open (NO) valves. Wand types are available with vacuum slide switches to turn the vacuum off when not in use or more tradi onally a shut off holder is used to turn off the vacuum when not in use (see HSU series wand holders –page 90).

Recommended Die and Package Devices

(Size variable) CUP/TIP

(Size Variable) HUB NEEDLE

DPNOAS2LA HANDLE

CC4SDS CORD

HSU HOLDER

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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D i e a n d P a c k a g e H a n d l i n g V A C U U M W A N D S

NST Series Die and Package Wand Handle

(pictured with HB06 small 1/16” hose barb)

Luer Lock Series Die and Package Wand Handle

(pictured with HB12 large 1/4” hose barb)

Die and Package Vacuum Wand Handle

The latest and most popular die and package vacuum wand handles. Designed to be used with hub needles and ps or

cups. The NST design allows the operator to adjust the hub needle at any angle for comfort and control. The Luer‐Lock

design locks the hub needle mo onless in one of four angles. The conduc ve PVDF versions provide safety from ESD

events and eliminate par cle a rac on caused by sta c charges.

MODEL MATERIAL VALVE NEEDLE FITTING

DPNOAS2LA ANTISTATIC PVDF NORMALLY OPEN LUER LOCK

DPNOAS2LB ANTISTATIC PVDF NORMALLY OPEN LUER LOCK

DPNOSA2LA ANTISTATIC PVDF NORMALLY OPEN LUER LOCK

DPNOSAS2LB ANTISTATIC PVDF NORMALLY OPEN LUER LOCK

DPNOAS2NA ANTISTATIC PVDF NORMALLY OPEN NST

COIL CORD FITTING

HB06 1/16” (CC‐4xx Coil)





DPNOAS2NB ANTISTATIC PVDF NORMALLY OPEN NST HB12 1/4” (CC‐9xx Coil)

DPNOSAS2NA ANTISTATIC PVDF NORMALLY OPEN NST HB06 1/16” (CC‐4xx Coil)

DPNOSAS2NB ANTISTATIC PVDF NORMALLY OPEN NST HB12 1/4” (CC‐9xx Coil)

Slide Switch

YES

YES

YES

YES

Small Device Die and Package Pick and Place Vacuum

Wand Handle (SDPPS)

Designed for pick and place of small chips and

components. Separate p and vacuum actuator enables

user to operate vacuum ON/OFF switch with one hand

while keeping pick‐up hand steady. Pencil‐style p holder

designed for a comfortable and natural feel. Sta c

dissipa ve system made completely from ESD‐safe

materials to protect devices. Suitable for use with Gel‐Pak®

carrier systems and other small component trays. Use

sta c –dissipa ve cups and hub needles (see next page) to

ensure ESD protec on.

SDPPS Die handling two‐handed vacuum wand assembly

(cups, ps and hub needles sold separately)

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Die and Package Auto Shutoff FWTTA1 Table Top Portable Freedom Wand™

A custom version of the standard FWTTA1 pla orm. The FWTTA1‐AC‐005 has all the standard features of

the FWTTA1 but includes DPNOAS2LA wand, CC‐4SDS coil cord, CTA06 grounding adapter, two (2) bent BCHN

hub needles (BCHN‐16S and BCHN‐18), and two (2) vacuum cups (VCAS125 and MBNCSD‐12) to make a

complete die and package Freedom Wand™ starter package.

FWTTA1‐AC‐005 Die and Package Freedom Wand USA (100‐120 VAC)

Die and Package FWCR Portable Cordless Freedom Wand™ Compact (Rechargeable)

Ships with: AASPFLLHNF Luer‐adapter, FWCR base unit, charging stand, power supply/cord, BCHN‐16 hub needle, SCHN‐

16 hub needle, VCC‐020 Vespel p, VCAS125 and VCAS246 vinyl vacuum cups.

FWCR4‐AC USA (100‐120 VAC)

FWCR4‐E EUROPE (220‐240 VAC)

FWCR4‐UK UK (220‐240 VAC)




Class 1

Cleanroom Cer fied

Class 1

Cleanroom Cer fied

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D i e a n d P a c k a g e H a n d l i n g P O R T A B L E V A C U U M W A N D S

PAW‐AS An sta c Portable Vacuum Pump

FEATURES: Includes metal hub needle (BCHN‐16) large vacuum bulb (red PVC), 2.00” dia. Vacuum 5” – 8” hg. (varies with

cup size). APPLICATIONS Vacuum pick‐up of small to large I.C.’s, substrates and surface mount devices, etc. Size of

devices .200 to 3.00 sq. inches. Operator should use ground strap to insure sta c discharge.

PAW‐AS Portable Die Handling Bulb with Hub Needle (Vacuum cups ordered separately)

MINIPAW‐AS An sta c Small Portable Vacuum Pick Up

Luer Lock Series Die and Package FEATURES: An ‐sta c polypropylene adapter. Includes metal hub needle (BCHN‐16).

Black neoprene vacuum bulb, 3/8” diameter. Vacuum 3” – 6” hg. (varies with cup size). APPLICATIONS: Vacuum pick‐up of

small to large I.C.’s, substrates and surface mount devices, etc. Size of devices .200 to 3.00 sq. inches. Operator should use

ground strap to insure sta c discharge. NOTE: H‐Square silicon rubber cup series “SRC‐X” can also be used for non‐an ‐

sta c applica ons.

MINIPAW‐AS Portable Die Handling Bulb with Hub Needle (vacuum cups ordered separately)

Freedom Wand Pencil™ An ‐Sta c Self‐Contained Vacuum Pencil

Aluminum and sta c‐dissipa ve plas c body. Includes two sta c‐dissipa ve vacuum cups (BNCSD‐25 and BNCSD‐38).

Includes two short hub needles (NOT sold separately) Weighs less than one ounce. Easily picks up 50 grams (varies with

cup size) APPLICATIONS: Vacuum pick‐up of small to large I.C.’s Size of devices .200 to 3.00 sq. inches. Operator should

use ground strap to insure sta c discharge.

FWP Portable Die Handling Bulb Pen (with hub needles and cups included)

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MODEL MATERIAL DIA. "D" HEIGHT "H" Compa ble Hub Needle(s)

VCC‐010 An ‐Sta c Vespel .010” (0.25mm) .60” *BCHN‐16(S0, *SCHN‐16(S)




VCC‐060 An ‐Sta c Vespel .060 (1.52mm) .50” *BCHN‐16(S0, *SCHN‐16(S)






VCAS125 An ‐Sta c Vinyl .125” (3.17mm) .20” *BCHN‐16(S0, *SCHN‐16(S)







VCAS44 An ‐Sta c Vinyl .44” (11.17mm) .50” NST direct connect—No hub needle used

VCAS58 An ‐Sta c Vinyl .58” (14.73mm) .50” NST direct connect—No hub needle used

MPCSD‐06 Polyurethane .06” (1.52mm) .15” BCHN‐21, SCHN‐21

MBNCSD‐12 Nitrile (Buna "N") .12” (3.04mm) .12” BCHN‐18, BCHN‐18S, SCHN‐18

BNCSD‐25 Nitrile (Buna "N") .25” (6.35mm) .31” BCHN‐18, BCHN‐18S, SCHN‐18


BNCSD‐50 Nitrile (Buna "N") .50“ (12.70mm) .31” BCHN‐18, BCHN‐18S, SCHN‐18



Conduc ve Vacuum Cups and Tips

Non‐Conduc ve Vacuum Cups and Tips

MODEL MATERIAL DIA. "D" HEIGHT "H" Compa ble Hub Needle(s)

MSRC‐12 SILICONE RUBBER .12" (3.04mm) .12" BCHN‐18S, BCHN‐18, SCHN‐18

SRC‐25 SILICONE RUBBER .25" (6.35mm) .31" BCHN‐16S, BCHN‐16, SCHN‐16 BNHN‐15, SNHN‐15

SRC‐38 SILICONE RUBBER .38" (9.65mm) .31" BCHN‐16S, BCHN‐16, SCHN‐16, BNHN‐15, SNHN‐16

TC‐19 TEFLON .19" (4.82mm) .37" BNHN‐15, SNHN‐15






BNHD‐19 TEFLON .043” (1.09mm) .62” PRE‐MOUNTED ON PLASTIC HUB NEEDLE

BNHD‐24 TEFLON .024” (0.60mm) .62” PRE‐MOUNTED ON PLASTIC HUB NEEDLE

VACUUM WAND

HANDLES

PAGE 96‐100

VACUUM WAND

HOLDERS

PAGE 101‐105

VACUUM WAND

CORDS

PAGE 106‐109

VACUUM WAND

TIPS

PAGE 110‐128

VACUUM WAND

ACCESSORIES

PAGE 129‐135

DIE HANDLING

PRODUCTS

PAGE 136‐141

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D i e a n d P a c k a g e H a n d l i n g H u b N e e d l e s T i p s & C u p s

VCC Series Die Handling An sta c Tips

Precision machined conduc ve and high temperature Ves‐

pel® rigid vacuum ps for handling of small devices. Note

that the VCC ps should always be used with a vacuum

source which is supplying CFM as the VCC does not conform

to the part like a elastomer cup.

VCAS Series Die Handling An sta c Cups

Precision molded an sta c vinyl so elastomer vacuum

cups for handling of small devices. An sta c vinyl cups are

long las ng and low outgassing.

BNCSD Series Die Handling An sta c Cups

Precision molded an sta c nitrile Buna‐N so elastomer vacuum cups for handling of small devices. An sta c nitrile pro‐

vides an sta c protec on at an economical price.

BNHD and TC Series Die Handling Tips

Precision machined high temperature and chemical re‐

sistant PTFE Teflon® rigid vacuum ps for handling of small

devices. Note that the TC ps should always be used with a

vacuum source which is supplying CFM as the TC does not

conform to the part like a elastomer cup. BNHD ps are

Teflon® ps mounted on plas c hub needles.

MSRC and SRC Series Die Handling Cups

Precision molded high temperature (250° C) Silicone® rubber so elastomer vacuum cups for handling of small devices.

An sta c nitrile provides an sta c protec on at an economical price.

Hub Needles

Metal and plas c hub needles. Luer lock or NST fi ng compa ble. Bent angle and straight versions available.

All Metal An sta c Hub Needles Plas c Hub Needles (for TC Series)

Standard Bent Standard Straight Short Bent Short Straight Plas c Straight Plas c Bent

TC‐25

16 Gauge 0.065” OD 0.045” ID

18 Gauge 0.050” OD 0.033” ID

21 Gauge 0.032” OD 0.020” ID

BCHN‐16 , SCHN‐16, BCHN‐18S, SCHN‐16S

BCHN‐18, SCHN‐18

BCHN‐21, SCHN‐21

15 Gauge 0.072” OD 0.052” ID BNHN‐15, SNHN‐15

BNHN = Bent

SNHN = Straight

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Metals and minerals commonly used in H‐Square products:

Aluminum Type 6063: used for metal casse e side plates

Maximum con nuous usable temperature: 450°C (842°F). Recommended not to exceed 350° C.

Aluminum Type 6061: used for vacuum ps, metal casse e side plates, mock wafers, machined parts and table clamps.

Maximum con nuous usable temperature: 450°C (842°F). Recommended not to exceed 350° C.

Brass: used for vacuum fi ngs and nickel‐plated thumb screws.

Maximum con nuous temperature: 800°C (1472°F).

Cold Rolled Steel Type 1018: used for table bases.

Maximum con nuous temperature: 840° (1544°F).

Copper: used for wire, pla ng and brazing compounds.


Invar: FeNi36 (64FeNi) used for quartz ps and stainless steel tubing interface.


Quartz (Op cal Quality): used for quartz ps.


Sauereisen® : high temperature cement: used to bond Invar/stainless steel tubes to hybrid quartz ps.


Silver Solder: Used for bonding Invar to stainless steel tubing, flex‐coupling assemblies, fixed ferrules and stainless ps.


Stainless Steel Type 302 & 304: used for fasteners, fi ngs, tubing and springs.


Stainless Steel Type 303: used for machined ps and precision sha ing.


Stainless Steel Type 316: used for metal casse es, vacuum wand/ p tubing, mask pick bars and mechanical plas c casse e handles.


Stainless Steel Type 321: used for nonstandard tubing applica ons.


Stainless Steel Type 440C: used for heat treated rods for notch aligner and robo c ps.


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A p p e n d i x A M A T E R I A L S

Plas cs and fibers commonly used in H‐Square products

ABS (Acrylonitril‐Butadiene‐Styrene): used for aligner adjustment knobs, vacuum wand holders


Conduc ve PEEK (Polyetheretherketone): Carbon fiber (CF) filled PEEK used for conduc ve an ‐sta c molded and machined ps and machined parts. NOT COMPATABLE WITH FUMING NITRIC AND SULPHURIC ACIDS


Delrin® (Homopolymer Acetal): Used for stages, vacuum wand handles, pick handles, vacuum ps, susceptor pencils, flat‐finder roller cores and mechanical parts. Not compa ble with: acidic and basic reagents with ph> 10.


EPR (Ethylene Propylene Elastomer): Used for o‐rings.

Service Temperature range: ‐35° to 140°C (‐31° to 284°F).

Kalrez® :perfluoroelastomer o‐ring material. Used for MCP and mask handling applica ons. Excep onal cleanliness,

chemical and heat resistance.

Service Temperature: 327° C

Kevlar® (Aramid Fiber): Used as reinforcing agent for automa c flat‐finders, WP, WPP drive belts. Not compa ble

with ultraviolet light.

Maximum con nuous temperature: Use base plas c matrix material temperature ra ng.

Lexan® (Polycarbonate): Used for vacuum wand ps, side shields, casse e side walls. Not compa ble with: Acids, bases, solvents and hydrocarbons.


Neoprene (Chloroprene Elastomer): Used for rubber vacuum cups and o‐rings.

Service Temperature range: ‐55°C to 140°C (‐67° to 284°F).

Nitrile (Buna “N”): Used for ESD protected vacuum cups. Resistant to most non‐aroma c petroleum‐based fluids and gases.

Service Temperature range: 54° to 107°C (‐65° to +225°F).

Nylon (Polyamide): Used for tapered hubs for vacuum cup needle ps, Flat‐Finder reduc on gears and for assembly spacers. Not compa ble with: acidic and basic reagents with ph> 4, ultraviolet light, or phenols.


PEEK (Polyetheretherketone): Used for vacuum wands, ps, adapters, grippers, casse e side walls


PE (Polyethylene): Used for flexible hub needle ps, vacuum ps, casse e side walls and storage bags.

Maximum con nuous temperature: 120° (250°F).

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PP (Polypropylene): Used for vacuum wand holders, fi ngs, mask pick handles and casse e stands. conduc ve pol‐ypropylene contains carbon fibers and is used for conduc ve handles, plas c flat‐finders, transfers, grippers, pre‐senters, escalators, and stages.


PPS (Polyvinylene Sulfide): Used for heavy substrate ps and horizontal wafer transfer machine parts.

Maximum con nuous usable temperature: 220°C (425°F). Good chemical resistance.

PS (Polystyrene, High Impact): Used for Flat‐Finder and Notch‐Finder motor enclosures. Not compa ble with: Ali‐pha c, chlorinated or aroma c hydrocarbons, or their deriva ves or ultraviolet light.


PTE (Polyolefin Thermoplas c Elastomer): Used for “heat‐shrink” tubing on notch aligner rods, wiring harnesses, conduc ve vacuum wands and plas c storage bags. Not compa ble with: Halocarbons and nonpolar hydrocarbons.


PVC (PolyVinylChloride): Used for coil cord holders, molded wand holders and vacuum cords. Not compa ble with: Chlorinated or aroma c hydrocarbons or acids with ph> 4.

PVDF (Polyvinylidene Fluoride): Used for wand handles, transfer rods and other an ‐sta c applica ons.

Maximum con nuous usable temperature: 140°C (285°F).

SEMITRON ESD 225® (Polyoxymethylene Copolymer – POM): Used for wand handles and other an ‐sta c appli‐cants. Mechanical performance to 107°C (225°F). Resis vity in 10^10 – 10^12 range. Good chemical resistance.

Mel ng point: 160° to 170° (320° to 342°F).

Silicon Rubber (Silicone Elastomers): Used for Rubber Cups, O‐rings and Bellow Cups.

Service Temperature range: ‐75° to 250°C (‐103° to 482°F).

Teflon® PTFE (Polytetrafluoroethylene): Used for casse es, vacuum wands, slide switches, spatula p adapters and wafer supports for aligners and metal casse es.


Torlon® (Polyamide‐imide): Used for vacuum wand ps, susceptor pencil ps and special high temperature mechan‐ical parts.


Tygon® (Flexible PVC Polyvinylchloride): Different Colors are used for Port‐A‐Wand (PAW) bulb (blue), vacuum tub‐ing (clear), WP, WPP and Flat‐Finder feet (black). Not compa ble with: Chlorinated or aroma c hydrocarbons or acids with a ph>4.

Service temperature range: ‐45° to 74°C (‐49° to 165°F).

UHMW (Ultra High Molecular Weight Polyethylene): Used as bearing material in horizontal wafer transfer ma‐chines, vacuum wand ps, casse e side walls. Good chemical resistance.

Maximum con nuous usable temperature: 93°C (200°F)

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Urethane (Polyurethane Elastomer): Used for vacuum coil cords and tubing, flex‐couplings, flat‐finder roller sheaths and drive belts.


Vespel ® (Polyimide): Used for vacuum wand ps, susceptor pencil ps, special stops and grippers for mechanical picks, li blades and metal casse e stops. Conduc ve Vespel contains graphite powder and is used for Conduc ve Cups.


Short exposure temperature (in free oxygen environment): 482°C (900°F).

Vinyl (Sta c‐Dissipa ve Compound): Used for sta c‐dissipa ve vacuum cups. Resis vity in 10^8 – 10^9 range.

Service temperature range: 21° to 49°C (70° to 120°F).

Viton® (Fluorocarbon Elastomer): Used for O‐rings.


Pla ng and finishes commonly found on H‐Square products

Anodize, Hard Black/ Anodize, Hard Clear: used on casse es, aligners, stages, picks, casse e handles, mock alumi‐num wafers and machined aluminum parts.

Maximum con nuous usable temperature: Depends on base aluminum temperature ra ng; however, tem‐peratures above 230°C (446°F) or atmospheres containing chlorine or ammonia may cause color changes.

Anodize (Sulfuric): Used on colored mock aluminum wafers

Maximum con nuous usable temperature: Depends on base aluminum temperature ra ng; however, tem‐peratures above 230°C (446°F) or atmospheres containing chlorine or ammonia may cause color changes.

Chrome Type 1 – Class 2 (Spec #: QQ‐C‐320B): used on stainless steel spatula vacuum wand ps.


Electro‐less Nickel Class 1 (Spec #: MIL‐C‐26074C): used on metal casse es.

Maximum con nuous usable temperature: lower of base material or 200°C (392°F).

Electro polishing: Used on stainless steel vacuum wand ps, casse e handle plates, mask pick bars, suspension hold‐er tubes.

Maximum con nuous usable temperature: depends upon base material temperature ra ng.

Teflon®‐P (PFA PerFluoroAlkoxy) Teflon® plas c coa ng: used on stainless steel vacuum wand ps and metal cas‐se es.


Short exposure temperature: 300°C (575°F).

Flouropolymer Plas c Coa ng: used on vacuum wand tubes and coated steel table bases.

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Periodic cleaning of your H‐Square product is highly recommended. Frequency of cleaning requirement is dependent upon usage. INSPECTION: Aligner rollers: Check roller for marks, cuts, par cles and contamina on. Damaged rollers should be immediately replaced. See owners manual or contact H‐Square for replacement rollers. EZ Guide aligner models feature a quick disconnect roller assembly for ease of cleaning or roller replacement. Vacuum ps: Check vacuum p surface for marks, cuts, par cles and contamina on. Vacuum ps are a consumable and should be replaced on a periodic basis or when the surface of the p has been scratched or damaged. A vacuum test gauge (VTG‐001; figure 1 below) should be used to check vacuum wand installa ons performance issues. 22”‐24” Hg vacuum level at the p is recommended in most wafer handling applica ons. Other H‐Square products: Check product surface for damage, par cles or contamina on. Clean as required. CLEANING: General Cleaning (all H‐Square products): Cleaning should be done with either DI water or with a suitable cleanroom

solvent like a small percentage mixture of DI and IPA. Isopropyl Alcohol (IPA or (CH3)2 CHOH ) with polyester clean room

wipe, or similar, is commonly used in associa on with the wipe‐down and cleaning of the tool / system and all its

exterior components. This should be done on an as required basis to keep the tool clean.

For more thorough cleaning, some H‐Square products can be disassembled and the wafer contact surfaces, can be ultrasonic cleaned, either in DI water or with a cleaning surfactant, immediately followed by a DI water rinse. It is always recommended to air dry parts a er cleaning (example: under a laminar flow hood in a maintenance bay/area). Note: Always follow fab safety protocol when handling chemicals. Refer directly to the MSDS in an emergency situa on.

VTG vacuum test gauge for PM of vacuum wand installa ons

Figure 1:

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IPA WIPE DOWN METHODS: In general, cleaning should be done from the cleanest area to the dir est area. To minimize cross contamina on, cleaning should also be done from top to bo om. Surfaces within arm’s reach can be cleaned using wipers and solu ons (such as 70% isopropyl alcohol (IPA) or a disinfectant) appropriate to the environment. Wipers should be “low‐lin ng” — that is, wipers should not leave par cles and fibers behind when they are used to clean surfaces. In an ISO Class 5 area, a non‐woven polyester/cellulose wiper can be used. However, in areas where a more stringent environment is necessary, a knit polyester wiper is suggested. Wipers can be purchased either pre‐we ed with 70% IPA or they can be we ed at the me of use with the solu on of choice. Be sure wipers are not dripping with solu on — an overly wet wiper can disperse contaminants, can increase the chances of the solu on itself becoming a contamina on source, or poten ally short out electro‐mechanical devices. Wipers should be folded so that the en re surface of the wiper can be used. Typically wipers are quarter folded, and then refolded a er every wipe of the surface, to contain and remove the contamina on. In this manner, there are eight different surfaces of the wiper exposed and able to be used for wiping. Wiping should be done in overlapping linear strokes from clean to dirty or dry to wet. A er all eight surfaces have been used, the wiper (and its captured contamina on) should be discarded in an appropriate container. Swabs we ed with a cleaning solu on, IPA, or sterile water can be used to address very ght areas.

LUBRICATION: Some mechanical assemblies use lubrica on on an occasional basis. It is recommended that on a quarterly basis the linear guide rails be thoroughly cleaned with IPA and lubricated with a very light applica on of linear bearing oil, a synthe c Teflon® lubricant, or Krytox® clean room lubricant. The system should be mechanically cycled a few mes to distribute the lubricant. Any excess lubricant should be wiped off with a dry clean room wipe. Note: Do not apply lubrica on to motors, drive belts, aligner rollers, any surface that could come in contact with a substrate. It is also recommended that you do not lubricate the bearings/ slider sha s on an H‐Square WT series wafer transfer. The UWMW bearings are self lubrica ng.

FACTORY SERVICE, ADVICE AND REPAIRS:

For specific cleaning recommenda ons, spare part ordering, or troubleshoo ng an H‐Square product, please contact

your local H‐Square representa ve or email the factory at:

info@h‐square.com

Note: products should not be send to H‐Square without an RMA tracking number.

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At H‐Square, mee ng your expecta ons is never enough. Our mission is to exceed expecta ons in all areas of customer responsiveness. Our commitment to excellence begins the first me we speak with you and that commitment never changes. Let H‐Square's knowledgeable team show you first‐hand why we're turning total customer sa sfac on into long term customer loyalty.

California

Nevada

Canada

Mexico

South America

H‐SQUARE CORPORATION

3100 Patrick Henry Dr

Santa Clara, CA 95054

(408) 982‐9108

(408) 982‐9183 Fax

h p://www.h‐square.com/

Bre Hofmann

Bud Barclay

bhofmann@h‐square.com

bbarclay@h‐square.com

(East) New York

New Jersey

Vermont

Connec cut

HARRINGTON PURE E&S 88 Dove Street Albany, NY 12210 (518) 573‐3239 www.es‐technologies.com/

John Pirozzi jpirozzi@es‐technologies.com

Massachuse s

New Hampshire

Rhode Island

Maine

HARRINGTON PURE E&S

180 Middlesex St

Chelmsford, MA 01863

(978) 453‐2323

(978) 453‐1166 Fax

www.es‐technologies.com/

Marc Savoie

Don Emden

msavoie@es‐technologies.com

demden@es‐technologies.com

North Carolina

Florida

Virginia

South Carolina

Alabama

Mississippi

Tennessee

Georgia

HARRINGTON PURE E&S

112 Kellyridge Drive

Apex, NC 27502

(919) 665‐7997

(978) 453‐1166 Fax


Dave Freedman dfreedman@es‐technologies.com

A m e r i c a s

Pennsylvania

Delaware

(West) New York

Maryland

Washington DC

New Jersey

HARRINGTON PURE E&S

4029 South Warner Road

Lafaye e Hill, PA 19444

(610) 730‐0920


Jay Conway jconway@es‐technologies.com

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A p p e n d i x C S A L E S A N D S E R V I C E

Idaho

Utah

Montana

Colorado

BALD MOUNTAIN SALES

137 Sioux Drive

Hailey, Idaho 83333

(208) 315‐1993

Ron Barclay

Denise DeCoster

[email protected]

[email protected]

Minnesota Wisconsin

Iowa

North Dakota

South Dakota

PETERSON‐NORA SALES 625 5th Street North S llwater, MN 55082 (651) 351‐9040 (651) 351‐9050 Fax

Marty Nora [email protected]

Illinois

Indiana

Kentucky

Ohio

Michigan

Missouri

H‐SQUARE CORPORATION

3100 Patrick Henry Dr

Santa Clara, CA 95054

(408) 982‐9108

(408) 982‐9183 Fax

h p://www.h‐square.com/

Bre Hofmann

Bud Barclay

bhofmann@h‐square.com

bbarclay@h‐square.com

Arizona

New Mexico

JACK KRIEGEL & ASSOCIATES

1374 W. Seashore Drive

Gilbert, AZ 85233‐6154

(480) 813‐4600

(480) 813‐4607 Fax

Jack Kriegel [email protected]

North Texas

Arkansas

Louisiana

Oklahoma

NETMERCURY

13438 Floyd Circle

Dallas, TX 75243

(972) 783‐1501

(972) 783‐1574 Fax

Ed Dahir [email protected]

South Texas

NETMERCURY

3912 Ga s School Rd

Round Rock, TX 78644

(512) 989‐0600

(512) 989‐0622 Fax

Mark Lariviere [email protected]

Oregon

Washington

INNERSKIL

11880 SW Riverview Ln

Wilsonville, OR 97070

(503) 863‐6270

(503) 582‐1909 Fax

Rick O’Malley [email protected]

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Taiwan EVER TEAM INTERNATIONAL

15F‐1, No. 287, Sec. 2

Kuang Fu Road

Hsin‐Chu City, 300

Taiwan, R.O.C.

886‐3‐572‐9545

886‐3‐572‐8726 Fax

h p://www.everteam.com.tw/

Hunter Lin

Mike Hung

[email protected]

[email protected]

China & Hong Kong

R&D Centers

Universi es

CROSS‐TECH EQUIPMENT CO. LTD Suite 902, No. 3, Magnolia Green Square, Lane 251 SongHuaJiang Road, Shanghai, 200093, China Mobile: 1391685 5175 Tel: 021‐5603 5615 h p://www.crosstech.com.cn

Nick Zhang

[email protected]

South Korea K‐PROSS

#931 Charmant Officetel

1165 Pungdukchon Dong

Youngin City

Gyeonggi‐Do 448‐515 Korea

82‐31‐262‐8405

82‐31‐262‐8404 Fax

Steve Ha steveha@k‐pross.co.kr

Japan NAGASE Techno‐Engineering Co.

887 Nippa‐cho, Kouhoku‐ku,

Yokohama Kanagawa 223‐0057

Japan

81‐45‐541‐0208

81‐45‐541‐0237 Fax

h p://www.nagase‐nte.co.jp/

Hitomi Watanabe

[email protected]

Malaysia (North) EVER TEAM TECHNOLOGIES 17‐1‐3, Bayan Point Medan Kampong Relau 11900 Bayan Lepas, Penang Malaysia 604‐644‐5302 604‐644‐5108 Fax

Tock Yit Choong [email protected]

A s i a

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China EVER TEAM INTERNATIONAL

Room#2203, Building 1

Tianshan Commercial Bldg,

Tianshan Road, No.789

Chang Ning District,

Shanghai, China 200051

86‐21‐6252‐0638

86‐21‐6252‐4809 Fax

Alex Tseng

Jimmy Guo

Mark Tang

[email protected]

[email protected]

[email protected]


Philippines PULSE INTEGRATED TECHNOLOGY

601 Common Goal Tower

Industry St., Cor Finance St.

Madrigal Business Park

Alabang, Mun nlupa City,

Philippines

63‐2‐809‐3716

63‐2‐809‐3121 Fax

h p://www.pulse‐technology.com/

Verna Montano

Aaron Mercado

verna@pulse‐technology.com

aaron.mercado@pulse‐technology.com

Singapore

Thailand

Malaysia (South)

POWER TEAM TECHNOLOGIES

Blk 5004 Ang Mo Kio Ave 5

#2 TECHplace II Singapore 569872

65‐6348‐6380

65‐6348‐6381 Fax

h p://www.p .com.sg/

KC Chong kcchong@p .com.sg

China SHANGHAI XIYU ELECTRONICS

Room 309, No. 333 Jinxiang Rd

Pudong New Zone

Shanghai 201206 China

86‐24‐2536‐2266, x613

86‐24‐2581‐6079 Fax

Li Jianfeng [email protected]

Australia

New Zealand

M.M.R.C. PTY LTD.

Suite 126 19 ‐29 Milton Parade

Malvern, Vic, 3144 Australia

Postal Address:

P.O. Box 4 Ashburton, Vic

3147 Australia

(613) 9885‐1752

(613) 9885‐2603 Fax

h p://mmrc.com.au/

Michael Young [email protected]

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Belgium

Portugal

Spain

S.P.S. bvba

Steenweg op Withof 5

2960 Sint Job In't Goor

Belgium

32‐344‐00895

32‐344‐05181 Fax

www.sps‐europe.com

Eric Jager eric.jager@sps‐europe.com

France S.P.S. FRANCE ZAC du Pont a Lune es 9, rue du Pont a Lune es F‐69390 Vourles France 33‐4‐72‐31‐78‐35 33‐4‐78‐05‐13‐45 Fax www.sps‐europe.com

Eric Puchois

Pierrick Four

eric.puchois@sps‐europe.com pierrick.four@sps‐europe.com

The Netherlands

Norway

Northern Germany

Sweden

Greece

Turkey

Russia

Denmark

Finland

Poland

S.P.S. B.V.

Midden Engweg 41

3882 TS Pu en

The Netherlands

31‐341‐360‐590

31‐341‐360‐589 Fax


Rein de Groot

Jola Hilhorst

Cor Rozema

Cris an de Groot

info@sps‐europe.com

Germany

Austria

Switzerland

Czech Republic

Slovakia

Croa a

Hungary

Romania

Bulgaria

S.P.S. VERTRIEBS GmbH Weisbergerstr. 3 85053 Ingolstadt Germany 49‐841‐37053‐0 49‐841‐37053‐22 Fax www.sps‐europe.com

Roland Scheuerer

Michael Eckel

roland.scheuerer@sps‐europe.com michael.eckel@sps‐europe.com

E u r o p e

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Italy S.P.S.

Via Verdi 18/b

27021 Bereguardo (PV)

Italy

39‐0382‐920739

39‐0382‐920738 Fax


Massimo Gambini massimo.gambini@sps‐europe.com


Israel M.Y.G. TECH. CO., LTD.

22/1, Yitsak Rabin St.

Modiin 71700

Israel

972‐8‐9760620

972‐8‐9760621 Fax

h p://www.myg‐tech.co.il/

Moshe Gabai

mosheg@myg‐tech.co.il

United Kingdom

Ireland

India

Dubai

S.P.S. LTD.

Aghmhor Annex

Whitmuir Selkirk

TD7 4PZ

United Kingdom

44‐1750‐725712

44‐1750‐21401 Fax


Peter Summers peter.summers@sps‐europe.com

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402724 page 115

2851‐2B page 50

2851‐2HC page 50

2851‐3B page 50

2851‐3EN page 50

2851‐3HC page 50

2851‐3PFA page 50

2851‐4B page 50

2851‐4EN page 50

2851‐4HC page 50

2851‐4PFA page 50

2851‐5B page 50

2851‐5EN page 50

2851‐5HC page 50

2851‐5PFA page 50

2851‐6B page 50

2851‐6EN page 50

2851‐6HC page 50

2851‐6PFA page 50

2851‐8B page 50

2851‐8EN page 50

2851‐8HC page 50

2851‐8PFA page 50

A000‐1078 page 23

A000‐723 page 23, 27

A000‐754‐1 page 22,26

A000‐754‐2 page 22.26

A000‐754‐3 page 22,26

A060 page 131

AAS26Q2 page 130

AASPFLLHNF page 130

AASPFST page 130

AETWFA4AC page 42

AETWFA6 page 42

AETWFA6AC‐002 page 42

AETWFA8 page 42

AETWNA6 page 42

AETWNA8 page 42

AETWNA8AC‐001 page 42

AFEZ‐3 page 27

AFEZ‐4 page 27

AFEZ‐5 page 27

AFEZ‐6 page 27

AFEZ‐8 page 27

AFO page 47

AH375Q page 130

AHAS716Q page 130

ANFEZQ6 SQ22143‐3 page 23

ANFEZQ8 page 23

ANFEZQ8AC‐005 page 31

AST26Q page 130

AT090 page 130

AVT4 (base unit)* page 36



AVTKIT‐4 page 36

AVTKIT‐6 page 36

AVTKIT‐8 page 36

AWM3 page 32

AWM4 page 32

AWM6 page 32

AWM8 page 32

AWT2HL4 page 38

AWT2HL6 page 38

AWT4HL8 page 38

BCHN‐16 page 141

BCHN‐16S page 141

BCHN‐18 page 141

BCHN‐18S page 141

BCHN‐21 page 141

BDSVNC page 135

BDSVNO page 135

BDVNC page 135

BDVNO page 135

BNCSD‐25 page 140

BNCSD‐38 page 140

BNCSD‐50 page 140

BNCSD‐62 page 140

BNCSD‐75 page 140

BNHD‐19 page 141

BNHD‐24 page 141

BNHN‐15 page 141

BPVPASNC page 135

BPVPASNO page 135

BPVPNC page 135

BPVPNO page 135

BPVPNO3AS page 135

CA page 108

CC‐11 page 108

CC‐11AS2 page 108

CC11AS2S page 108

CC11ESD page 108

CC11ESD1 page 108

CC11SDS page 108

CC4SDS page 108

CC‐6 page 108

CC‐7 page 108

CC‐9 page 108

CC‐9AS2 page 108

CC9AS2S page 108

CC9ESD page 108

CC9ESD1 page 108

CC9SDS page 108

CH‐2 page 62

CH‐3 page 62

CH‐4 page 62

CH‐5 page 62

CH‐6 page 62

CH‐8 page 62

CHMC456 page 62

CHMCL456 page 62

CHMCLDH8 page 63

CMAD3‐001 page 63

CMAD4‐001 page 63

CMAD5‐001 page 63

CMAD6 page 63

CMAD6‐001 page 63

CMAD6‐004 page 63

CMAD8 page 63

CMAD8‐001 page 63

CMAD8‐003 page 63

CPA6 page 64

CPA6‐003 page 64

CPAD8 page 64

CPAD8‐004 page 64

CPH6 page 64

CPV6 page 64

CQDM page 109, 132

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CS‐6S page 46

CS‐8S page 46

CTA06 page 107

CTA12 page 107

DPNOAS2LA page 137

DPNOAS2LB page 137

DPNOAS2NA page 137

DPNOAS2NB page 137

DPNOSAS2LA page 137

DPNOSAS2LB page 137

DPNOSAS2NA page 137

DPNOSAS2NB page 137

DSNCQ1 page 97

DSNOQ1 page 97

DSNOSQ1 page 97

ETAS1‐3‐001 page 43

ETAS1‐4 page 43

ETAS1‐5 page 43

ETAS1‐6 page 43

ETAS1‐8 page 43

ETAS1‐8‐007 page 43

ETAS8‐003 page 43

FCOQ page 132

FCQ page 132

FFTB1‐2 page 30

FFTB1‐3 page 30

FFTB1‐4 page 30

FFTB1‐5 page 30

FFTB1‐6 page 30

FFTB1‐8 page 30

FFTBAS‐456 page 28

FOMH page 47

FOMH450 page 47

FS‐002 page 46

FWA3AS2 page 87

FWA450AS page 86

FWAHAS2 page 87

FWCR2 page 91

FWCR2FA page 91

FWCR3 page 91

FWCR‐4 page 91, 138

FWP page 139

FWTTA1 page 88

FWTTA1‐AC‐004 page 88, 138

FWTTA1‐AC‐005 page 89

H2B‐12 page 84

H2B‐4 page 84

H2B‐6 page 84

H2B‐8 page 84

H2BST‐12 page 84

H2BST‐4 page 84

H2BST‐6 page 84

H2BST‐8 page 84

HAW page 103

HAWL page 103

HAWPT page 103

HAWRP page 104

HB06 page 131

HB12 page 131

HBH‐001 page 85

HBQDM page 109, 132

H‐H2BST page 85

HL‐2 page 44

HL‐3 page 44

HL‐4 page 44

HL‐6 page 44

HL‐8 page 44

HMP1 page 73,80

HMP3 page 73, 80

HMP4 page 73, 80

HSD page 104

HSDL page 104

HSDPT page 104

HSDRP page 104

HSU page 102

HSU3 page 101

HSU3‐002 page 101

HSU3PT page 101

HSU3PT‐001 page 101

HSUL page 102

HSUPT page 102

HSURP page 104

ISM56‐001 page 80

ISM567 page 80

LCT1AS12 page 35

LCT1AS12‐AC‐003 page 35

LCT1AS4 page 35

LCT1AS6 page 35

LCT1AS8 page 35

LF page 135

LFP page 135

LFT page 135

LLHNF page 131

LN page 135

LNP page 135

LNT page 135

MBNCSD‐12 page 140

MC12‐13HC page 52

MC12‐25EN1 page 52

MC12‐25HC1 page 52

MC1‐4B page 51

MC1‐4EN page 51

MC1‐4HC page 51

MC1‐4PFA page 51

MC1‐5B page 51

MC1‐5EN page 51

MC1‐5HC page 51

MC1‐5PFA page 51

MC1‐6B page 51

MC1‐6EN page 51

MC1‐6HC page 51

MC1‐6PFA page 51

MC18‐25HC page 52

MC1‐8B page 51

MC1‐8EN page 51

MC1‐8HC page 51

MC1‐8PFA page 51

MC1HV4 page 56

MC1HV6 page 56

MCF6EN (SQ21140‐2) page 54

MCF6HC (SQ21140‐1) page 54

MCF8B page 54

MCF8EN page 54

MCF8EN‐001 page 54



MCF8HC page 54

MCF8HV page 54

MCF8PFA page 54

MCP‐12‐001 page 71

MCP‐2‐002 page 71

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MFEZ3 page 29

MFEZ4 page 29

MFEZ6 page 29

MFEZ6‐001 page 29

MFEZ8 page 29

MINIPAW‐AS page 139

MISC1400‐004 page 116

MISC1400‐005 page 117

MISC1400‐006 page 116

MISC1400‐008 page 116

MISC1400‐011 page 117

MISC2500‐007 page 82

MISC2500‐015 page 82

MPCSD‐06 page 140

MPH151DW‐005 page 77

MPH151DW90‐005 page 77

MPH163VO90‐001 page 77

MPH172DW‐003 page 77

MPH172DW90‐001 page 77

MPH3‐63AS‐001 page 78

MPH3‐72AS‐001 page 78

MPH3‐92‐001 page 78

MPS1‐001 page 76

MPS1‐002 page 76

MPS1‐14‐001 page 76

MPS1‐50‐014 page 76

MPS1‐71‐001 page 76

MPS3‐63AS‐002 page 79

MPV1‐005 page 78

MPV1‐5‐002 page 78

MSRC‐12 page 140

MW‐12‐NHC page 66

MW‐12‐NNP page 66

MW‐18‐HC page 66

MW‐18NNP page 66

MW‐2HC page 66

MW‐2NP page 66

MW‐3HC page 66

MW‐3NP page 66

MW‐4HC page 66

MW‐4NP page 66

MW‐5HC page 66

MW‐5NP page 66

MW‐6HC page 66

MW‐6NP page 66

MW‐8‐FHC page 66

MW‐8‐FNP page 66

MW‐8‐NHC page 66

MW‐8‐NNP page 66

NCASPF2 page 96

NCASQ2 page 96

NCP191 page 97,128

NCPPF1 page 96

NCQ1 page 97

NCTQ page 97

NFBMT18 page 24

NFEZQ6 (SQ22143‐2) page 25

NFEZQ6‐002 page 25

NFEZQ8 page 25



NFNRM page 24

NFNRQ page 25

NO31 page 98

NO3AS‐001 page 100

NO3AS1 page 98

NO3T3‐001 page 117

NO3T3PK‐001 page 98

NO3T3PK1 page 98

NO3T3PKAS‐001 page 98



NO3T3PKAS1 page 98

NO3T3PKASU‐001 page 98

NO3T450PK1 page 98

NO3T450PKAS1 page 98

NOASPF2 page 96

NOASQ2 page 96

NOP191 page 97

NOP191‐003 page 98

NOP191‐006 page 98

NOPPF1 page 96

NOPQ1 page 96

NOQ1 page 97

NOSASPF2 page 96

NOSASQ2 page 96

NOSPPF1 page 96

NOSPQ1 page 96

NOSQ1 page 97

NOSTQ page 97

NOTQ page 97

NRA6 page 24

NRA8 page 24

NST page 131

ODP‐12‐001 page 72

ODP‐12‐003 page 73

ODP‐18‐001 page 72

ODP‐3 page 72

ODP‐3‐001 page 72





ODP‐4 page 72





ODP‐5 page 72



ODP‐6 page 72









ODP‐8 page 72











© 2015‐2016 H‐Square

157

Catalog15‐16.1

I n d e x


PAW page 139

PAW‐AS page 139

PRA8 page 30

PRS4 page 30

PRS5/6 page 30

PT page 108

PTAS1322 page 108

PTAS2502 page 108

SCHN‐16 page 141

SCHN‐16S page 141

SCHN‐18 page 141

SCHN‐21 page 141

SCR‐KEY page 134

SDPPS page 137

SHB page 131

SMIFMAN6 page 48,83

SMIFMAN8 page 49,83

SMIFPO8 page 49

SMIFPO6 page 48,82

SMIFPO8‐E‐002 page 49,82

SNHN‐15 page 141

SP page 129

SP‐3 page 129

SP‐4 page 129

SP‐6 page 129

SPT‐TOR page 129

SPT‐V page 129

SQ20870‐1 page 114

SQ21203‐5 page 114

SQ21408‐1 page 80

SQ21408‐10 page 80

SQ21408‐3 page 80

SQ21457‐25 page 76

SQ21457‐4 page 78

SQ21457‐6 page 77

SQ21457‐9 page 76

SQ21518‐1 page 79

SQ21518‐16 page 79

SQ21518‐32 page 79

SQ21518‐40 page 70

SQ21541‐10 page 43

SQ21541‐13 page 43

SQ21541‐2 page 43

SQ21557‐3 page 128

SQ21733‐10 page 23

SQ21733‐11 page 25

SQ21733‐8 page 23

SQ21733‐9 page 25

SQ22143‐2 page 25

SQ22143‐3 page 23

SQ22386‐2 page 24

SQ22758‐1 page 61

SQ22766‐17E page 55

SQ22766‐1HC page 55

SQ22766‐23EN page 55






SQ22766‐26P page 55


SQ22766‐31 page 55



SQ22766‐4E page 55

SQ22902‐2 page 128

SQ22949‐1 page 89

SQ22949‐16 page 89

SQ22949‐2 page 89

SQ22949‐3 page 89

SQ22949‐4 page 89

SRC‐25 page 140

SRC‐38 page 140

SRTAS page 108

SSC100 page 53

SSC125 page 53

SSC150 page 53

SSC150‐001 page 53

SSC200 page 53

SSC200‐004 page 53

SSC200‐008 page 53

SSC300 page 53

SSC50‐001 page 53

SSC75‐002 page 53

ST‐12KQ page 133

ST‐18KQ page 133

ST191 page 128

ST192 page 128, 133

ST193 page 128, 133

ST194 page 128, 133

ST‐2.5KFH page 133

ST‐2.5KFHC page 133

ST‐2.5KQ page 133

ST‐2.5KQC page 133

ST‐2.5LFSS page 133

ST‐4KQ page 133

ST‐6KFH page 133

ST‐6KQ page 133

ST‐9KQ page 133

T37504TOR page 126

T37505V page 122

T3PK1 page 115

T3PKAS1 page 115

T450PK1 page 98

T450PKAS1 page 98

T590PKAS page 114

T691PK‐002 page 118

T691PKAS page 110

T691PKAS1D page 110

T691PKAS1U page 110

T691PKAS2D page 110

T691PKAS2L page 110

T691PKAS2R page 110

T691PKAS3D page 110

T691PKAS3U page 110

T691PKAS‐S page 110

T692PKAS page 110

T692PKAS‐006 page 114

T692PKAS1D page 110

T692PKAS1U page 110

T692PKAS2L page 110

T692PKAS2R page 110

T692PKAS3D page 110

T692PKAS3U page 110


T693PKAS page 111



T693PKAS1D page 111

T693PKAS1U page 111

T693PKAS2D page 111

© 2015‐2016 H‐Square

158


T693PKAS2D‐001 page 113



T693PKAS2L page 111

T693PKAS2R page 111

T693PKAS2U page 111

T693PKAS3 page 111

T693PKAS3‐001 page 113




T693PKAS3S page 111


T694PKAS page 111



T694PKAS3U page 111


T695PKAS page 115




T695PKAS3U‐001 page 115


T696PK page 118

T696PK‐001 page 118

T75010PKAS page 119

T75010TOR page 126

T75010V page 124

T75025Q page 121

T75026V page 125

T75028PK page 119

T75028TOR page 127

T75028V page 125

T75033QV page 121

T75040TOR page 127

T75040V page 124

T75042V page 124

T75044V page 123

T75048TOR page 126

T75049TOR page 127

T75049V page 123

T75050PKAS page 120

T75050V page 125

T75051PKAS page 120

T75051TOR page 127

T75051V page 125

T75055V page 123

T75065V page 124

T75069Q page 121

T75070V page 122

T75071V page 122

T75072PKAS page 119

T75072TOR page 126

T75072V page 123

T75082Q page 121

T75083PKAS page 119

T75096V page 122

T791PKAS page 112


T791PKAS1D page 112

T791PKAS2D page 112

T791PKAS2R page 112

T791PKAS3D page 112

T791PKAS3U page 112

T792PKAS page 112

T792PKAS2D page 112

T792PKAS2R page 112

T792PKAS3D page 112

T794PKAS page 113


TC‐19 page 140

TC‐25 page 140

TC‐2N page 105

TC‐31 page 140

TC‐38 page 140

TC‐3N page 105

TC‐44 page 140

TC‐50 page 140

THF page 131

THF‐P page 131

TLB page 105

TLP25PKAS page 120

TT page 106

VCAS125 page 140

VCAS160 page 140

VCAS196 page 140

VCAS199 page 140

VCAS246 page 140

VCAS260 page 140

VCAS39 page 140

VCAS44 page 140

VCAS58 page 140

VCC‐010 page 140

VCC‐015 page 140

VCC‐020 page 140

VCC‐040 page 140

VCC‐060 page 140

VCC‐12 page 140

VCC‐19 page 140

VCC‐25 page 140

VCC‐31 page 140

VCC‐38 page 140

VTG‐001 page 134

VTG‐002 page 134

WB5L1‐456 page 45

WB5L1‐8 page 45

WP18 page 44

WP4 page 44

WP5 page 44

WP6 page 44

WPR page 45

WPR4‐KIT page 45

WPR6‐KIT page 45

WPR8‐KIT page 45

WS300M page 33

WT28HAS page 39

WT28HLAS page 39

WT2HAS (WT2HAS‐001) page 39

WT3456AS page 39

WT3HAS page 39

WT4HAS page 39

WT4HLAS page 39

WT5HAS page 39

WT5HLAS page 39

WT6HAS page 39

WT6HLAS page 39

2015 2016 PRODUCT CATALOG - SPS-Europe

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