le centre collectif de l’industrie technologique belge μPrinting Day @ Sirris (15 th October 2012) μPrinting : change your paradigm - some cases @ Sirris SMALL LAB team @ Sirris : carl Emerecht, Denis Vandormael, Eric Beeckman, Guy Lagaeyes, Laurent Seronveaux, Olivier Gramacia, Stephane Louis Presented by Laurent Seronveaux Research and Project Engineer
The Sirris Microfabrication AppLication Lab (SMALL) at Sirris is active in the field of micro deposition and printed electronics by Aerosol Jet Printing technology (AJP). This new technology is very interesting in terms of material deposition on many types of substrates.
In order to gather ideas supported by industrial companies and to help industry innovate, Sirris and its SMALL laboratory equipped with AJP technology, invited people from industry to this workshop at the Sirris’ 'µPrinting Day'.
During this event, experts in Aerosol Jet printing technologies from OPTOMEC, a recognized leader in the field of additive manufacturing, were present.
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Transcript
le centre collectif de l’industrie technologique belge
µPrinting Day @ Sirris (15th October 2012)
µPrinting : change your paradigm - some cases @ Sirris
SMALL LAB team @ Sirris : carl Emerecht, Denis Vandormael, Eric Beeckman, Guy Lagaeyes, Laurent Seronveaux, Olivier Gramacia, Stephane Louis
Presented by Laurent Seronveaux Research and Project Engineer
Due to the absorption effect, in the current paradigm, porous material are skipped when sensor have to be printed on. Since Sirris apply a specific method to avoid the absorption effect, then new paradigm to consider is that “Sensor could be printed on porous material”.
Absorption effect is lasting when the ink stays liquid. The idea is to reduce the liquid as soon as the ink is in contact with porous material. The idea is to work with HOT substrate (ideally at curing temperature)
Even with porous material and hot platen, the precision of printing could reach a very fine precision of printing by track with about 20µm Here is a example of inter-digitated sensor used for Ultra Sonic detection and (NDT field).
The conductivity textile are commonly reached by adding a conductive fibber inside the textile. This “additional” part isn’t necessary by using selective deposition as shown here after
The new paradigm is to adapt the shape of the line in relation with substrate. Textile is flexible and globally rough. Then the shape of the line is to adapt to provide withstanding to the flexibility of the conductive track with the flexibility of textile.
Once again, in the past, sensors have been considered as an additional part to integrated in the textile. The new paradigm is to consider that, as done for the conductive track, the sensor cold also be directly printed on textile as shown in the following example
Results of the printed sensor shows the sensibility of the deposition to tensile load induced in the textile. We use a CNT ink which allow us to measure the load induced in the textile.
Understanding sintering temperature need to understand what is the ink material compounded. Commercial inks could be nano particle composed. In case of nano particle, we have to consider that the sintering temperature is reduced due to the nano effect. Example : Silver ink could be sintered at 120-150°C (nano particle size about 1 30 nm). Compared to the bulk material sintering temperature at T° > 700°C, the reduction of the sintering temperature is considerably reduced !
Heat oven sintering Laser Sintering Flash or photonic Sintering
Complete Substrate have to withstand to sintering temperature
The sintering temperature is done at room temperature. Only the very localised surface under the deposited ink track will be submitted to high temperature for a very short time. Then, this technology is suitable for low temperature substrate