2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.

STS SEMICON-DUCTOR

2007013265 Moon – jun young

Index

Introduce product Semiconductor product manufacturing process

Wafer backgrindingWafer sawDie attachMoldMarkSorterVisualpacking

Introduce product PKG(TSOP,SOP) Card(sdcard)

wafer

The wafer is cut into pieces called dies.

manufacturing process

Wafer backgrindingFor Uniform thickness of the wafer

manufacturing processWafer saw

○ cutting wafer for assemble the pieces of the wafers(die)

manufacturing process Die attach

attach the die on die pad using epoxy

manufacturing process Mold

the process that cover with device by plastic

manufacturing process Mark

In order to distinguish it from other things, a kind of marker is engraved process

manufacturing process Sorter

manufacturing process Visual

Checking product

manufacturing process

Packing & delivery

Thank You