20038 Page 1 2005/05/29 MOLDFLOW ANALYSIS REPORT CYPRESS CHINA CAE/CAD/CAM TECH CENTER 2005/05/29 David Deng 20038 BATTERY COVER.

20038 Page 1 2005/05/29

MOLDFLOW ANALYSIS REPORT

CYPRESS CHINA CAE/CAD/CAM TECH CENTER

2005/05/29

David Deng

20038

BATTERY COVER

20038 Page 2 2005/05/29



1. Plastic Material Introduction --------------------------------------------------------------- 3

2. Product Model Introduction---------------------------------------------------------- 4

3. Cooling System Design --------------------------------------------------------------- 5

4. Feed System Design ----------------------------------------------------------------6

5. Analysis Indication ---------------------------------------------------7

6. Processing Conditions ---------------------------------------------------------8

7. Analysis Results -------------------------------------------- 9~27

8. Conclusions & Suggestions -------------------------------------------------------------- 28

Contents

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PP POLYPROPYLENES CM1171 Taiwan PP VI(245)84 OCT-08-2002 JUL93

1. Conductivity 0.170000 W/m/ deg.C 8. Ejection temperature 93.000000 deg.C 2. Specific heat 3100.000000 J/kg/ deg.C 9. Min. melt temperature 200.000000 deg.C 3. Melt density 774.7500000 kg/cu.m 10. Max. melt temperature 280.000000 deg.C4. Max. shear stress 0.260000 MPa 11. Min. mold temperature 20.000000 deg.C 5.Max. shear rate 24000.000000 1/s 12. Max. mold temperature 80.000000

deg.C

Material introduction

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210

Product model introduction

Max. contour dimension(mm) Thickness distribution

Thickness distribution is not even. Min. wall thickness is about 0.64mm, Max. wall thickness is about 5.00mm. As shown below the plot, the blue is the thinner region, and the red is the thicker region(include injection and cooling system).

87

51

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Cooling system have 20 circuits. Core have 12 circuits and cavity have 8 circuits.

Cooling System Design

Cooing networkØ10

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Feed System Design

The mold is cold feed system, two cavities, one banana gate. The dimension of the gate is shown in top plot.

9

Gate location

Ø 4.15Ø 8

124

16

Ø 5

2

2.2

Gate

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Moldflow CAE analysis includes Flow,Cooling and Warp

results,aimed to optimize the feed system, the cooling

system of the mold.

Analysis Indication

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Mold temperature: 50.00 deg.C

Melt temperature: 230.00 deg.C

Injection time ﹕ 3.8 sec

Total Volume (cavity): 170.00 cu.cm

Part Volume : 165.00 cu.cm

Sprue/runner/gate volume: 5.00 cu.cm

Total Weight : 137.4 g

Runner Weight ﹕ 3. 5 g

Circuit Inlet Temp : 25.0 deg.C

MPa

30

10 s

Processing Conditions

Filling Conditions:

Cooling Conditions:

Packing profile:

Pressure [MPa] Time [sec]

30 0.0

30 10.0

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Best Gate LocationBest Gate Location

The best gate location lie in the marked region.

It is difficult to design mold, so can’t be accepted in fact.

Gate Analysis Results\

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Flow Analysis Results\ Fill TimeFill Time

Click for animation

Fill time is about 3.8sec, and the filling pattern is satisfied. The marked region is filled last.The below plot is the scene of filling 99%(V/P switch over).

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Fill TimeFill Time

Click for animation

Fill time is about 3.8sec, and the filling pattern is satisfied. The marked region is filled last.The below plot is the scene of filling 99%(V/P switch over).

Flow Analysis Results\

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Injection PressureInjection Pressure

Max. injection pressure is 33 Mpa (V/P switch over).


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Injection PressureInjection Pressure

The pressure drop in runner system is about 24MPa, which is 72.7% of injection pressure.

The below plot is the pressure distribution of filling 99%(V/P switch over).


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Flow Front TemperatureFlow Front Temperature

The flow front temperature is from 221 to 230.6 deg.C, and the distribution is not very uniform. The minimum temperature is shown in the marked region.Pay attention to the weldlines in this area.


Gate

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Weld LinesWeld Lines

Main weld lines are shown as red lines.

Gate

Pay more attention to the weldlines in this area.


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Air TrapsAir Traps

Air traps locations are shown by small pink balls. Most of them lie in the last filling or the interface area, so can be vented easily.

Gate


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Sink IndexSink Index

Pay attention to the Sink Mark in marked region.

Gate


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Clamp Force(Max.=61.3Ton)

Clamp Clamp ForceForce

Variation curve of pressure&clamp force in cycle time shown by above figure.

Clamp Force Centroid locates

in the center of mold.


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Temp difference(Max.=0.23 deg.C)

Coolant Coolant TempTemp

Coolant temp difference is very small,so the number of circuits is enough.

Cool Analysis Results\

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Temp (part)Temp (part)

The distribution of temp is not very uniform.

Pay more attention for the cooling in marked region.

Cool Analysis Results\

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Cool Analysis Results\ Temp (part)Temp (part)


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Click for animation.

Frozen Time(part)Frozen Time(part)Cool Analysis Results\

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The frozen time is non-uniform.

The frozen time of most area is about 23 S, 6.1S in gate area.

Cool Analysis Results\ Frozen Time(part)Frozen Time(part)


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The frozen time of gate is about 6.45S,less than the frozen time of most area in the part,which will do harm to packing.

Design larger gate.

Cool Analysis Results\ Frozen Time(gate)Frozen Time(gate)

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X DeflectionX Deflection

The X direction belongs to natural shrinkage basically.

Warp Analysis Results

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Y DeflectionY Deflection

Deflection in Y direction is shown in the left plot, belongs to natural shrinkage basically.

Warp Analysis Results

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Z DeflectionZ DeflectionWarp Analysis Results

Deflection in Z direction is uniform. 0.58

Gate0.42 0.41

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Conclusions&Suggestions

From the above analysis:

Some weld lines maybe affect the strength of molding part, and air traps are vented easily.

The packing effect is the main cause of sink mark,deflection. Deflection is very uniform,improve packing will get small deflection.

The distribution of temp is not very uniform.

Suggestions:

To use baffle,bubbler and inserts to improve cooling effect.

To design larger gate.

20038 Page 1 2005/05/29 MOLDFLOW ANALYSIS REPORT CYPRESS CHINA CAE/CAD/CAM TECH CENTER 2005/05/29 David Deng 20038 BATTERY COVER.

Documents

analysis indication

gate flow analysis results

center of mold

c material introduction

c melt temperature

c injection time

cooling conditions

battery cover slide