2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test Factory is driven by Cost, Productivity, and Speed : Reduce factory capital and operating costs per function Enable efficient high-volume production with operational models for high and low product mixes and other business strategies Increase factory and equipment reuse, reliability, and overall efficiency Enable rapid process technology shrinks and wafer size changes Faster delivery of new and volume products to the end customer Si Substrate Mfg Reticle Mfg Increasing cost & Cycle time implications
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2002 Factory Integration Scope Includes Wafer, Chip and Product Manufacturing Wafer Mfg Chip Mfg Product Mfg Distribution The Factory FEOL BEOL Probe/Test.
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2002 Factory Integration Scope IncludesWafer, Chip and Product Manufacturing
WaferMfg
ChipMfg
ProductMfg
Dis
trib
uti
on
The Factory
• FEOL• BEOL
• Probe/Test• Singulation
• Packaging• Test
Factory is driven by Cost, Productivity, and Speed:Reduce factory capital and operating costs per functionEnable efficient high-volume production with operational models for high and
low product mixes and other business strategies Increase factory and equipment reuse, reliability, and overall efficiencyEnable rapid process technology shrinks and wafer size changesFaster delivery of new and volume products to the end customer
Si SubstrateMfg
ReticleMfg
Increasing cost &Cycle time implications
Factory Integration Requirements and Solutions are Expressed through 6 Functional Areas
ProcessEquipment
UI
Material Handling Systems Wafer and Reticle Carriers Automated storage systems Interbay & intrabay transport systems Personnel guided vehicles Internal Software & computers
Production Equipment Process and Metrology equipment Mainframe and process chambers Wafer Handling Robots, Load Ports Internal software & computers
Facilities Cleanroom, Labs, Central Utility Building Facilities Control and Monitoring Systems Power, Plumbing, HVAC, Utilities, Pipes, UPS Life safety systems, waste treatment
AMHSEqpt
(side view)
DB
DocumentManagement
MES
MCS
Network or Bus
DSSStation
Controllers
APC Scheduling +Dispatching
DB
Factory Information & Control Data and Control systems required to run the factory Decision support Process control Plan, Schedule, Dispatch Computers, databases, software outside equipment
Factory Operations Policies and procedures used to
plan, monitor and control production
Direct factory labor
Test Manufacturing Prober, Handler, and Test
Equipment Manufacturing processes to test
wafers and chips
2002 Factory Integration Focus Areas
1. New business requirements driving changes to the factory design Combination of many different industry business models: IDM, Foundry, Joint
Ventures, Collaborations, other Outsourcing, etc
Faster new product delivery to customers [design to receipt]
Integrating the Factory with other parts of the engineering chain (design, reticle mfg…)
2. Implications of 300mm factory sizes reaching 30k-40k wspm on facilities, AMHS, and factory control systems
3. Gaps Factory productivity/Equipment OEE and methods to improve including Equipment Engineering Capabilities (EEC) EEC includes e-diagnostic, fault detection, process control, on-line manuals,
spares management etc.
4. Factory modeling needs and gaps to do design analysis, demand planning, optimization tradeoff analysis, etc.
5. Preparing for more focus in 2003 on Assembly and Test Manufacturing driven by costs & complexities
2002 Difficult Challenges
Managing Complexity Quickly and effectively
integrating rapid changes in semiconductor technologies and market conditions
Need to integrate the entire product development process
Factory Optimization Productivity increases are not
keeping pace with needs
Flexibility, Extendibility, Scalability Ability to quickly convert to new
semiconductor technologies while reusing equipment, facilities, and skills
Post Conventional CMOS Manufacturing Uncertainty Inability to predict factory
requirements associated with different manufacturing requirements
450mm Wafer Size Conversion
Timing and manufacturing paradigm for this wafer size conversion
< 65nm after 2007> 65nm through 2007
Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016
Ability to run different recipes and parameters for each wafer
Partial Yes Yes Yes Yes Yes Yes Yes Yes Yes
Max allowed electrostatic field on wafer and mask surfaces (V/cm)
150 150 100 100 75 75 50 50 25 25
Relative capital cost of production equipment
<1.3x of 200mm
New base
New base
New base
<1.3x of 300 mm
New base
Production Equipment Technical Requirements (2 of 2)
• No significant changes to values
- Progress lacking in OEE improvements, NPW reduction
Material Handling Technical Requirements (1 of 2)
• No significant changes to values• AMHS system throughput numbers include both 20k and 40k wspm factories+ Good progress on AMHS single transport hardware system development
Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016
Material handling equipment installation time (weeks)
<8 <8 <7 <7 <6 <5 <4 <4 <4 <4
System downtime required to extend system capacity when previously planned (minutes)
<180 <90 <90 <60 <30 <30 <15 30 30 30
Material Handling Technical Requirements (2 of 2)
• No significant changes to values• AMHS system throughput numbers include both 20k and 40k wspm factories+ Good progress on AMHS single transport hardware system development
Year of Production 2001 2002 2003 2004 2005 2006 2007 2010 2013 2016
Mfg (Cleanroom) area/Wafer starts per month (m2/WSPM)
0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34 0.34
Classification of air cleanliness in the manufacturing (cleanroom) area
ISO Class 5
ISO Class 5
ISO Class 5
ISO Class 6
ISO Class 6
ISO Class 6
ISO Class 6
ISO Class 7
ISO Class 8
ISO Class 9
Power utilization (demand/installed) 80% 70% 80%
Gas and chemical purity Discussed in Yield Enhancement Chapter
Power and water consumption Discussed in EHS chapter and Process Equipment sections
Factory construction time (months) from ground break to all facility ready
12 12 12 10 10 10 10 10 10 10
Facility capital cost as a % of total factory cost (includes equipment)
15% 15% 15% 15% 15% 15% 15% 15% 15% 15%
Production equipment install and qual cost as a % of capital cost
10% 8% 8% 6% 6% 6% 6% 6% 8% 6%
Facility operating cost including utilities as a % of total operating cost
13% 13% 13% 13% 13% 13% 13% 13% 13% 13%
Utility cost per total factory operating cost (%)
3% 3% 3% 3% 3% 3% 3% 3% 3% 3%
Maximum allowable electrostatic field on facility surfaces (V/cm)
150 150 100 100 75 75 50 50 25 25
Facilities Technical Requirements
• No significant changes to values
- Facilities momentum needed to reduce cycle time
Key Gaps: 2003 Focus areas for Factory Integration
Technology Gaps that Need Attention Today Integrated intrabay readiness for 300mm Factories Ability to run different process parameters for each wafer Production equipment OEE NPW Reduction Hot Lot and normal cycle times for high mix factories Faster Product delivery Efficient Product development Better modeling capabilities
Future Technology Gaps and Focus Areas Factory software systems to support Direct Transport AMHS Equipment Engineering Capabilities and Standards Engineering Chain Management Systems Impact of 157nm and Next Generation Litho on the Factory Post Conventional CMOS Manufacturing 450mm Wafer Processing
Integrated Solutions are Essential to Meet NeedsIntegrated Solutions
Agile Manufacturing- Equipment Engineering
Capabilities
- Single wafer control
Engineering Chain Mgmt
Process Control- FDC, R2R, W2W control
- IM and M2M matching
Material Handling- Direct Transport for Send
Ahead, monitors, hot lots
- Integrated Sorters, Stockers, Metrology?
Flexible Factory Designs- Quick ramp-up operation
- Extend & Scale quickly
- Convert quickly
Integrated Factory
Technology Requirements
New disruptive process technologies
Next Generation Litho
157nm litho
High K gate stack
Low k dielectrics
Copper processing
+ Improved Productivity
Decreased Factory Cycle Time (QTAT)
Improved Equipment Efficiency
Reduction in non-product (I.e. test) wafer usage
More efficient direct labor
Faster factory conversion at technology nodes
Goal = Meet Factory Challenges and
Technology Requirements
IDM AgeFoundry/FablessAge
Collaboration Age
Fab
Transactions and Interlinkage will be flexible and open.
MarketingIP
Design
Foundry
IT is a must and Speed is most important
Design
Fab
DesignMarketing
FoundryIP ゙
EP/BP
Marketing
Marketing
Design
Industry Business Model Is Changing
Engineering Chain Management Customers want new products delivered faster [design ship] The Engineering Chain integrates the development flow from design specification
to customer delivery for a new product through engineering data exchange Engineering Chain = Design Reticle Process Integration Customer High Volume This is different from supply chain mgmt which focuses on efficient volume production
Engineering chain management ensures customer cycle times are met, while new products are properly integrated with the process
Supply Chain (O2D)
Sales SCP MES
Factory ShippingWO
WIP
Order
Promise
Design
Commerce Data
Engineering Data
Engineering Chain (T2M)
e-Diag
Maintenance
Support
EE Data
EES
APC
Recipe
Eqpt. Configurati
on
Mass Production
Product Development
Process Devmn’t YMSMask
Devmn’t
Eqpt.Devmn’t
Eqpt. Supplier
Translating Factory Operations, Production Equipment, and Facilities Metrics to Reality
Metric Potential Solution it is drivingProduction Equipment Overall Equipment Efficiency (OEE)
a) Equipment Engineering Capabilities including: e-Diagnostics, spares management, fault detection, on-line manuals to improve MTTR
b) Advanced Process Control to improve output
c) Integrated factory scheduling and dispatching capabilities to improve equipment utilization
d) Optimized Wafer movement at equipment
Ability to run different process parameters for each wafer on equipment
a) Implement embedded controller standards
b) MES capabilities to handle standard and non-standard operational scenarios
Non-product wafers as a % of factory wafer starts
a) Techniques to design equipment for reliability
b) Advanced Process Control systems
Hot-Lot and regular lot cycle time per mask layer for the factory
a) Direct transport systems integrated with factory schedulers for tool to tool moves
b) Innovative carrier/wafer level control systems
Translating Material Handling, FICS, and Test Manufacturing Metrics to Reality
Metric Potential Solution it is driving
Number of transport types in the factory
a) Direct tool transport using conveyors
b) Direct tool transport using overhead hoist
AMHS system throughput for interbay and intrabay
a) Electrical, mechanical, and control systems for transport types: OHS, OHT, RGV, AGV, PGV
b) Improved Scheduling/Dispatching for direct tool transport, hot lots, send ahead wafer, etc.
Time to create industry standards
a) Monthly or Continuous voting cycles to approve
b) Use Internet for balloting/approval
c) Dedicated resources for development
Lead time for solutions to conform with standards
a) Develop standards and applications in parallel
b) Automated test tools for compliance verification
Groundbreaking to first tool move in
a) Standardized design concepts
b) Design tools including e-tools
c) More off-site module construction
Continued Standardization is needed to Reduce Integration Time, Cost, and Complexity
ProcessEquipment
UI
Material Handling SystemsProduction Equipment Interfaces Automation data interfacesFacilities hook-upCarriers
Production EquipmentAMHS interfacesAutomation data interfacesFacilities hook-upESD
Scheduling, Dispatching, and MES integration for Direct Transport AMHS
Additional Industry Standards for Equipment, AMHS, Facilities, and Information/Control Systems
Key Messages1. Improving the Factory’s Cost, Productivity and Speed is essential
2. Business strategies, market demands, and process technology changes continue to make factories difficult to integrate
3. More focus must be spent on new product development and high mix factory cycle times
4. Gaps in Production Equipment OEE, Factory NPW usage, and Factory modeling must be improved.
5. e-Factory concepts are being developed to solve complexity, integration and equipment OEE issues
6. Standards have been very effective in 300mm, but must be implemented more consistently in some areas
7. More focus must be given to Post-Fab manufacturing (Assembly, Test, etc.) to improve productivity
No Significant 2002 Changes to ESD Requirements
Was
Is
Was
Is
Was
Is
Was
Is
Was
IsAbility to run different recipes/parameters for each wafer
Partial Yes Yes Yes Yes Yes Yes Yes Yes Yes
WasMaximum allowable electrostatic field on wafer and mask surfaces (V/cm)
150 150 100 100 75 75 50 50 25 25
IsMaximum allowable electrostatic field on wafer and mask surfaces (V/cm)
WasRelative capital cost [1] of production equipment
<1.3x of 200mm
[2]® ® New base ® ® New base New base
<1.3x of 300 mm
New base
Is
150 150 100 100 75 75 50 50 25 25
Facilities Technology Requirements
Was
Is
Was
I s
Was
I s
Was
I s
Was
I s Utility cost per total factory operating cost (%)
Was Maximum allowable electrostatic field on facility surfaces (V/cm)
150 150 100 100 75 75 5050 25 25
I s Maximum allowable electrostatic field on facility surfaces (V/cm) 200 150 150 100 100 75 75 50 50 25
---- 200 ---- 150 ---- 100 ---- 75---- 50
Test Manufacturing Technology Requirements
WasMaximum allowable electrostatic charge on devices
1-2.5 nC100-250V
1-2.5 nC100-250V
1-2.5 nC100-250V
1.0 nC100V
1.0 nC100V
0.5 nC50V
0.5 nC50V
0.1 nC10V
0.25 nC25V
0.25 nC25V
1-2.5 nC100-250V
1-2.5 nC100-250V
1-2.5 nC100-250V
1.0 nC100V
1.0 nC100V
0.5 nC50V
0.5 nC50V
0.1 nC10V
0.25 nC25V
0.25 nC25VIs
Maximum allowable electrostatic charge on devices
Facility electrostaticlevels stds
The SEMI ESD Task force iscurrently working on a new document to define facility electrostatic levels. First ballot expected March 2003. Change color to blue – under development
Facilities Standards
• No data available to support changing the values in the tables• SEMI ESD Task Force working on a document for electrostatic compatibility in the