2005-2014 Microchip Technology Inc. DS20001984G-page 1 MCP73831/2 Features: • Linear Charge Management Controller: - Integrated Pass Transistor - Integrated Current Sense - Reverse Discharge Protection • High Accuracy Preset Voltage Regulation: + 0.75% • Four Voltage Regulation Options: - 4.20V, 4.35V, 4.40V, 4.50V • Programmable Charge Current: 15 mA to 500 mA • Selectable Preconditioning: - 10%, 20%, 40%, or Disable • Selectable End-of-Charge Control: - 5%, 7.5%, 10%, or 20% • Charge Status Output - Tri-State Output - MCP73831 - Open-Drain Output - MCP73832 • Automatic Power-Down • Thermal Regulation • Temperature Range: -40°C to +85°C • Packaging: - 8-Lead, 2 mm x 3 mm DFN - 5-Lead, SOT-23 Applications: • Lithium-Ion/Lithium-Polymer Battery Chargers • Personal Data Assistants • Cellular Telephones • Digital Cameras • MP3 Players • Bluetooth Headsets • USB Chargers Typical Application Description: The MCP73831/2 devices are highly advanced linear charge management controllers for use in space- limited, cost-sensitive applications. The MCP73831/2 are available in an 8-Lead, 2 mm x 3 mm DFN package or a 5-Lead, SOT-23 package. Along with their small physical size, the low number of external components required make the MCP73831/2 ideally suited for portable applications. For applications charging from a USB port, the MCP73831/2 adhere to all the specifications governing the USB power bus. The MCP73831/2 employ a constant-current/constant- voltage charge algorithm with selectable preconditioning and charge termination. The constant voltage regulation is fixed with four available options: 4.20V, 4.35V, 4.40V or 4.50V, to accommodate new, emerging battery charging requirements. The constant current value is set with one external resistor. The MCP73831/2 devices limit the charge current based on die temperature during high power or high ambient conditions. This thermal regulation optimizes the charge cycle time while maintaining device reliability. Several options are available for the preconditioning threshold, preconditioning current value, charge termination value and automatic recharge threshold. The preconditioning value and charge termination value are set as a ratio or percentage of the programmed constant current value. Preconditioning can be disabled. Refer to Section 1.0 “Electrical Characteristics” for available options and the Product Identification System for standard options. The MCP73831/2 devices are fully specified over the ambient temperature range of -40°C to +85°C. Package Types STAT V DD V SS PROG V BAT + - Single Li-Ion Cell 4 MCP73831 5 3 1 500 mA Li-Ion Battery Charger 2 V IN 4.7 F 470 2k 4.7 F V BAT V SS V DD 1 2 3 5 4 PROG STAT MCP73831/2 2×3 DFN* V BAT V DD V BAT NC V SS 1 2 3 4 8 7 6 5 STAT PROG V DD * Includes Exposed Thermal Pad (EP); see Table 3-1. EP 9 MCP73831/2 SOT-23-5 Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers
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2005-2014 Microchip Technology Inc. DS20001984G-page 1MCP73831/2Features: Linear Charge Management Controller:- Integrated Pass Transistor- Integrated Current Sense- Reverse Discharge Protection High Accuracy Preset Voltage Regulation: + 0.75% Four Voltage Regulation Options:- 4.20V, 4.35V, 4.40V, 4.50V Programmable Charge Current: 15 mA to 500 mA Selectable Preconditioning:- 10%, 20%, 40%, or Disable Selectable End-of-Charge Control:- 5%, 7.5%, 10%, or 20% Charge Status Output- Tri-State Output - MCP73831- Open-Drain Output - MCP73832 Automatic Power-Down Thermal Regulation Temperature Range: -40C to +85C Packaging:- 8-Lead, 2 mm x 3 mm DFN- 5-Lead, SOT-23Applications: Lithium-Ion/Lithium-Polymer Battery Chargers Personal Data Assistants Cellular Telephones Digital Cameras MP3 Players Bluetooth Headsets USB ChargersTypical ApplicationDescription:TheMCP73831/2devicesarehighlyadvancedlinearchargemanagementcontrollersforuseinspace-limited,cost-sensitiveapplications.TheMCP73831/2are available in an 8-Lead, 2 mm x 3 mm DFN packageora5-Lead,SOT-23package.Alongwiththeirsmallphysical size, the low number of external componentsrequiredmaketheMCP73831/2ideallysuitedforportable applications. For applications charging from aUSBport,theMCP73831/2adheretoallthespecifications governing the USB power bus.The MCP73831/2 employ a constant-current/constant-voltagechargealgorithmwithselectablepreconditioning and charge termination.The constantvoltageregulationisfixedwithfouravailableoptions:4.20V,4.35V,4.40Vor4.50V,toaccommodatenew,emerging battery charging requirements. The constantcurrentvalueissetwithoneexternalresistor.TheMCP73831/2 devices limit the charge current based ondietemperatureduringhighpowerorhighambientconditions.Thisthermalregulationoptimizesthecharge cycle time while maintaining device reliability.Severaloptionsareavailableforthepreconditioningthreshold,preconditioningcurrentvalue,chargeterminationvalueandautomaticrechargethreshold.Thepreconditioningvalueandchargeterminationvaluearesetasaratioorpercentageoftheprogrammedconstantcurrentvalue.Preconditioningcanbedisabled.RefertoSection 1.0ElectricalCharacteristicsforavailableoptionsandtheProduct Identification System for standard options.TheMCP73831/2 devicesarefully specifiedovertheambient temperature range of -40C to +85C.Package TypesSTATVDDVSSPROGVBAT+-SingleLi-IonCell4MCP73831531500 mA Li-Ion Battery Charger2VIN4.7 F470O 2 kO4.7 FVBATVSSVDD12354PROG STATMCP73831/223 DFN*VBATVDDVBATNCVSS12348765 STATPROG VDD* Includes Exposed Thermal Pad (EP); see Table 3-1.EP9MCP73831/2SOT-23-5Miniature Single-Cell, Fully Integrated Li-Ion,Li-Polymer Charge Management ControllersMCP73831/2DS20001984G-page2 2005-2014 Microchip Technology Inc.Functional Block Diagram+-REFERENCEGENERATORVREF(1.22V)VBATVDDSTATPROGVBATG=0.001VSSDIRECTION CONTROL477 kO255 kOUVLO+-+-SHDNDIRECTION CONTROL0.5 APRECONDITION6 A6 A+-TERMINATION+-43.6 kO+-CA3.9 kO111 kO190 kO7 kO15 kO182.3 kO111 kOCHARGE+-+-VA89 kO361 kO100 kO0.5 AVDDMCP73831 ONLY 2005-2014 Microchip Technology Inc. DS20001984G-page 3MCP73831/21.0 ELECTRICAL CHARACTERISTICSAbsolute Maximum RatingsVDD...................................................................................7.0VAll Inputs and Outputs w.r.t. VSS............... -0.3 to (VDD+0.3)VMaximum Junction Temperature, TJ............ Internally LimitedStorage temperature .....................................-65C to +150CESD protection on all pins:Human Body Model (1.5 kO in Series with 100 pF)....... > 4 kVMachine Model (200 pF, No Series Resistance) .............400V Notice: Stresses above those listed under MaximumRatings may cause permanent damage to the device.This is a stress rating only and functional operation ofthe device at those or any other conditions above thoseindicated in the operational listings of this specificationis not implied. Exposure to maximum rating conditionsfor extended periods may affect device reliability.DC CHARACTERISTICSElectrical Specifications: Unless otherwise indicated, all limits apply for VDD= [VREG(typical) + 0.3V] to 6V, TA = -40C to +85C. Typical values are at +25C, VDD = [VREG (typical) + 1.0V] Parameters Sym. Min. Typ. Max. Units ConditionsSupply InputSupply Voltage VDD3.75 6 VSupply Current ISS 510 1500 A Charging 53 200 A Charge Complete,No Battery 25 50 A PROG Floating 1 5 A VDD < (VBAT - 50 mV) 0.1 2 A VDD < VSTOPUVLO Start Threshold VSTART3.3 3.45 3.6 V VDD Low-to-HighUVLO Stop Threshold VSTOP3.2 3.38 3.5 V VDD High-to-LowUVLO Hysteresis VHYS 70 mVVoltage Regulation (Constant-Voltage Mode)Regulated Output Voltage VREG4.168 4.20 4.232 V MCP7383X-24.317 4.35 4.383 V MCP7383X-34.367 4.40 4.433 V MCP7383X-44.466 4.50 4.534 V MCP7383X-5VDD = [VREG(typical)+1V]IOUT = 10 mA TA = -5C to +55CLine Regulation ,(AVBAT/VBAT)/AVDD| 0.09 0.30 %/V VDD = [VREG(typical)+1V] to 6V, IOUT = 10 mALoad Regulation ,AVBAT/VBAT| 0.05 0.30 % IOUT = 10 mA to 50 mAVDD = [VREG(typical)+1V]Supply Ripple Attenuation PSRR 52 - dB IOUT=10 mA, 10Hz to 1 kHz 47 dB IOUT=10 mA, 10Hz to 10 kHz 22 dB IOUT=10 mA, 10Hz to 1 MHzCurrent Regulation (Fast Charge Constant-Current Mode)Fast Charge Current Regulation IREG90 100 110 mA PROG = 10 kO450 505 550 mA PROG = 2.0 kO, Note 112.5 14.5 16.5 mA PROG = 67 kOTA = -5C to +55CNote 1: Not production tested. Ensured by design.MCP73831/2DS20001984G-page4 2005-2014 Microchip Technology Inc.Preconditioning Current Regulation (Trickle Charge Constant-Current Mode)Precondition Current RatioIPREG / IREG7.5 10 12.5 % PROG = 2.0 kO to 10 kO15 20 25 % PROG = 2.0 kO to 10 kO30 40 50 % PROG = 2.0 kO to 10 kO 100 % No PreconditioningTA = -5C to +55CPrecondition Voltage Threshold RatioVPTH / VREG64 66.5 69 % VBAT Low-to-High69 71.5 74 % VBAT Low-to-HighPrecondition Hysteresis VPHYS 110 mV VBAT High-to-LowCharge TerminationCharge Termination Current RatioITERM / IREG3.75 5 6.25 % PROG = 2.0 kO to 10 kO5.6 7.5 9.4 % PROG = 2.0 kO to 10 kO8.5 10 11.5 % PROG = 2.0 kO to 10 kO15 20 25 % PROG = 2.0 kO to 10 kOTA = -5C to +55CAutomatic RechargeRecharge Voltage Threshold RatioVRTH / VREG91.5 94.0 96.5 % VBAT High-to-Low94 96.5 99 % VBAT High-to-LowPass Transistor ON-ResistanceON-Resistance RDSON 350 mO VDD = 3.75V, TJ = 105CBattery DetectionBattery Detection Current IBAT_DET 6 A VBAT Source CurrentNo-Battery-Present ThresholdVNO_BAT VREG + 100 mV V VBAT Voltage VNO_BAT for No Battery conditionNo-Battery-Present ImpedanceZNO_BAT2 MO VBAT Impedance ZNO_BAT for No Battery condition,Note 1Battery Discharge CurrentOutput Reverse Leakage CurrentIDISCHARGE 0.15 2 A PROG Floating 0.25 2 A VDD Floating 0.15 2 A VDD < VSTOP -5.5 -15 A Charge CompleteStatus Indicator STATSink Current ISINK 25 mALow Output Voltage VOL 0.4 1 V ISINK = 4 mASource Current ISOURCE 35 mAHigh Output Voltage VOH VDD-0.4 VDD - 1 V ISOURCE = 4 mA (MCP73831)Input Leakage Current ILK 0.03 1 A High-ImpedancePROG InputCharge Impedance RangeRPROG2 67 kOMinimum Shutdown ImpedanceRPROG70 200 kOAutomatic Power DownAutomatic Power Down Entry ThresholdVPDENTERVDD VPTHIBAT < ITERMCHARGE COMPLETE MODE No Charge CurrentSTAT = HIGH (MCP73831)STAT = High Z (MCP73832)MCP73831/2DS20001984G-page14 2005-2014 Microchip Technology Inc.4.5 Fast Charge Constant-Current ModeDuringtheConstant-Currentmode,theprogrammedchargecurrentissuppliedtothebatteryor load.ThechargecurrentisestablishedusingasingleresistorfromPROGtoVSS.Constant-Currentmodeismaintained until the voltage at the VBAT pin reaches theregulation voltage, VREG.4.6 Constant-Voltage ModeWhenthevoltageattheVBATpinreachestheregulationvoltage,VREG,constantvoltageregulationbegins.Theregulationvoltageisfactorysetto4.2V,4.35V, 4.40V or 4.50V with a tolerance of 0.75%.4.7 Charge TerminationThe charge cycle is terminated when, during Constant-Voltage mode, the average charge current diminishesbelow a percentage of the programmed charge current(established with the value of the resistor connected tothePROGpin).A1 msfiltertimeontheterminationcomparatorensuresthattransientloadconditionsdonotresult in prematurechargecycletermination.Thepercentage or ratio of the current is factory set. Refer toSection 1.0ElectricalCharacteristicsforchargeterminationcurrentoptionsandtheProductIdentification System for standard options.The charge current is latched off and the MCP73831/2enter a Charge Complete mode.4.8 Automatic RechargeThe MCP73831/2 continuously monitor the voltage attheVBATpinintheChargeCompletemode.Ifthevoltagedropsbelowtherechargethreshold,anothercharge cycle begins and current is once again suppliedto the battery or load. The recharge threshold is factoryset. Refer to Section 1.0 Electrical CharacteristicsforrechargethresholdoptionsandtheProductIdentification System for standard options.4.9 Thermal RegulationThe MCP73831/2 limit the charge current based on thedie temperature. The thermal regulation optimizes thechargecycletimewhilemaintainingdevicereliability.Figure 4-2depictsthethermalregulationfortheMCP73831/2.FIGURE 4-2: Thermal Regulation.4.10 Thermal ShutdownThe MCP73831/2 suspend charge if the die tempera-tureexceeds150C.Chargingwillresumewhenthedie temperature has cooled by approximately 10C.0751502253003754505252535455565758595105115125135145155Junction Temperature (C)Charge Current (mA)RPROG = 2 kO 2005-2014 Microchip Technology Inc. DS20001984G-page 15MCP73831/25.0 DETAILED DESCRIPTION5.1 Analog Circuitry5.1.1 BATTERY MANAGEMENT INPUT SUPPLY (VDD)The VDD pin is the input supply pin for the MCP73831/2devices.TheMCP73831/2automaticallyenteraPower-Down mode if the voltage on the VDD input fallsbelow the UVLO voltage (VSTOP). This feature preventsdrainingthebattery packwhentheVDDsupplyisnotpresent.5.1.2 CURRENT REGULATION SET (PROG)Fast charge current regulation can be scaled by placinga programming resistor (RPROG) from the PROG inputtoVSS.Theprogramresistorandthechargecurrentare calculated using the following equation:Thepreconditioningtricklechargecurrentandthechargeterminationcurrentareratiometrictothefastcharge current based on the selected device options.5.1.3 BATTERY CHARGE CONTROL OUTPUT (VBAT)The battery charge control output is the drain terminalofaninternalP-channelMOSFET.TheMCP73831/2provide constant current and voltage regulation to thebattery packby controlling this MOSFET in thelinearregion.Thebatterychargecontroloutputshouldbeconnected to the positive terminal of the battery pack.5.2 Digital Circuitry5.2.1 STATUS INDICATOR (STAT)The charge status output of the MCP73831 has threedifferentstates:High(H),Low(L),andHigh-Impedance(HighZ).ThechargestatusoutputoftheMCP73832isopen-drain.Ithastwodifferentstates:Low (L) and High-Impedance (High Z). The charge sta-tus output can be used to illuminate one, two or tri-colorLEDs. Optionally, the charge status output can be usedas an interface to a host microcontroller.Table 5-1summarizesthestateofthestatusoutputduring a charge cycle.5.2.2 DEVICE DISABLE (PROG)Thecurrentregulationsetinputpin(PROG)canbeusedtoterminateachargeatanytimeduringthechargecycle,aswellastoinitiateachargecycleorinitiate a recharge cycle.Placing a programming resistor from the PROG input toVSSenablesthedevice.AllowingthePROGinputtofloatorby applying a logic-high input signal, disablesthedeviceandterminatesachargecycle.Whendisabled,thedevicessupplycurrentisreducedto25 A, typically.IREG1000VRPROG----------------- =Where:RPROG= kOhmsIREG= milliampereTABLE 5-1: STATUS OUTPUT Charge Cycle State STAT1MCP73831 MCP73832Shutdown High Z High ZNo Battery Present High Z High ZPreconditioning L LConstant-Current Fast ChargeL LConstant Voltage L LCharge Complete StandbyH High ZMCP73831/2DS20001984G-page16 2005-2014 Microchip Technology Inc.NOTES: 2005-2014 Microchip Technology Inc. DS20001984G-page 17MCP73831/26.0 APPLICATIONSTheMCP73831/2aredesignedtooperateinconjunctionwithahostmicrocontrollerorinastand-aloneapplication.TheMCP73831/2providethepreferred charge algorithm for Lithium-Ion and Lithium-Polymercells.Thealgorithmusesaconstantcurrentfollowedbyaconstantvoltagechargingmethod.Figure 6-1depictsatypicalstand-aloneapplicationcircuit,whileFigure 6-2andFigure 6-3depicttheaccompanying charge profile.FIGURE 6-1: Typical Application Circuit.FIGURE 6-2: Typical Charge Profile (180 mAh Battery).FIGURE 6-3: Typical Charge Profile in Thermal Regulation (1000 mAh Battery).6.1 Application Circuit Design Duetothelowefficiencyoflinearcharging,themostimportantfactorsarethermaldesignandcost,whichare a direct function of the input voltage, output currentandthermalimpedancebetweenthebatterychargerand the ambient cooling air. The worst-case situation iswhenthedevicehastransitionedfromthePreconditioningmodetotheConstant-Currentmode.In this situation, the battery charger has to dissipate themaximumpower.Atrade-offmustbemadebetweenthechargecurrent,costandthermalrequirementsofthe charger.6.1.1 COMPONENT SELECTIONSelectionoftheexternalcomponentsinFigure 6-1iscrucialtotheintegrityandreliabilityofthechargingsystem. The following discussion is intended as a guidefor the component selection process.6.1.1.1 Current Programming Resistor (RPROG)The preferred fast charge current for Lithium-Ion cellsis at the 1C rate, with an absolute maximum current atthe 2C rate. For example, a 500 mAh battery pack hasa preferred fast charge current of 500 mA. Charging atthisrateprovidestheshortestchargecycletimeswithout degradation to the battery pack performance orlife.STATVDDVSSPROGVBAT+-Single Li-Ion Cell4MCP73831531CINLi-Ion Battery Charger2RPROGRLEDCOUT REGULATED WALL CUBE LED0.01.02.03.04.05.06.0020406080100120140160180Time (minutes)Battery Voltage (V)020406080100120Charge Current (mA)MCP73831-2AC/IOTVDD = 5.2VRPROG = 10 k0.01.02.03.04.05.06.00306090120150180210240Time (minutes)Battery Voltage (V)0100200300400500600Charge Current (mA)MCP73831-2AC/IOTVDD = 5.2VRPROG = 2 kMCP73831/2DS20001984G-page18 2005-2014 Microchip Technology Inc.6.1.1.2 Input Overvoltage Protection (IOVP) Inputovervoltageprotectionmustbeusedwhentheinput power source is hot-pluggable. This includes USBcablesandWall-typepowersupplies.Thecablingofthese supplies acts as an inductor. When the suppliesareconnected/disconnectedfromthesystem,largevoltage transients are created which may damage thesystemcircuitry.Thesetransientsshould besnubbedout.AtranszorbconnectedfromtheV+inputsupplyconnectortothe0Vgroundreferencewillsnubthetransients.6.1.1.3 Thermal ConsiderationsTheworst-casepowerdissipationinthebatterychargeroccurswhentheinputvoltageisatthemaximumandthedevicehastransitionedfromthePreconditioningmodetotheConstant-Currentmode.In this case, the power dissipation is:Power dissipation with a 5V, 10% input voltage sourceis:Thispower dissipation withthe batterycharger intheSOT-23-5 package will cause thermal regulation to beenteredasdepictedinFigure 6-3.Alternatively,the2mm x 3mm DFN package could be utilized to reducecharge cycle times.6.1.1.4 External CapacitorsThe MCP73831/2are stablewith or withoutabatteryload.InordertomaintaingoodACstabilityintheConstant-Voltagemode,aminimumcapacitanceof4.7 F is recommended to bypass the VBAT pin to VSS.This capacitance provides compensation when there isnobatteryload.Inaddition,thebatteryandinterconnections appear inductive at high frequencies.These elements are in the control feedback loop duringConstant-Voltagemode.Therefore,thebypasscapacitance may be necessary to compensate for theinductive nature of the battery pack. Virtually any good quality output filter capacitor can beused,independentofthecapacitorsminimumEffectiveSeriesResistance(ESR)value.Theactualvalueofthecapacitor(anditsassociatedESR)depends on the output load current. A 4.7 F ceramic,tantalumoraluminumelectrolyticcapacitorattheoutput is usually sufficient to ensure stability for outputcurrents up to a 500 mA.6.1.1.5 Reverse-Blocking ProtectionThe MCP73831/2 provide protection from a faulted orshortedinput.Withouttheprotection,afaultedorshorted input would discharge the battery pack throughthe body diode of the internal pass transistor.6.1.1.6 Charge InhibitThecurrentregulationsetinputpin(PROG)canbeusedtoterminateachargeatanytimeduringthechargecycle,aswellastoinitiateachargecycleorinitiate a recharge cycle.Placing a programming resistor from the PROG input toVSSenablesthedevice.AllowingthePROGinputtofloatorby applying a logic-high input signal, disablesthedeviceandterminatesachargecycle.Whendisabled,thedevicessupplycurrentisreducedto25 A, typically.6.1.1.7 Charge Status InterfaceAstatusoutputprovidesinformationonthestateofcharge. The output can be used to illuminate externalLEDsorinterfacetoahostmicrocontroller.RefertoTable 5-1forasummaryofthestateofthestatusoutput during a charge cycle.6.2 PCB Layout IssuesFor optimum voltage regulation, place the battery packas close as possible to the devices VBAT and VSS pins.This is recommended to minimize voltage drops alongthe high current-carrying PCB traces.If the PCB layout is used as a heat sink, adding manyvias in the heat sink pad can help conduct more heat tothePCBbackplane,thusreducingthemaximumjunction temperature. Figure 6-4 and Figure 6-5 depicta typical layout with PCB heatsinking.FIGURE 6-4: Typical Layout (Top).FIGURE 6-5: Typical Layout (Bottom).PowerDi ssi pat ion VDDMAXVPTHMIN ( ) IREGMAX =Where:VDDMAX= the maximum input voltageIREGMAX= the maximum fast charge currentVPTHMIN= the minimum transition threshold voltagePowerDi ssi pat i on 5.5V 2.7V ( ) 550mA 1.54W = =COUTLEDRPROGCNMCP73831RLEDVBATVDDVSSVBATVSSVDD 2005-2014 Microchip Technology Inc. DS20001984G-page 19MCP73831/27.0 PACKAGING INFORMATION7.1 Package Marking InformationExampleAAE73925Device CodeMCP73831T-2ACI/MC AAEMCP73831T-2ATI/MC AAFMCP73831T-2DCI/MC AAGMCP73831T-3ACI/MC AAHMCP73831T-4ADI/MC AAJMCP73831T-5ACI/MC AAKMCP73832T-2ACI/MC AALMCP73832T-2ATI/MC AAMMCP73832T-2DCI/MC AAPMCP73832T-3ACI/MC AAQMCP73832T-4ADI/MC AARMCP73832T-5ACI/MC AASNote: Applies to 8-Lead DFN8-Lead DFN (2x3x0.9 mm)ExampleKD25Device CodeMCP73831T-2ACI/OT KDNNMCP73831T-2ATI/OT KENNMCP73831T-2DCI/OT KFNNMCP73831T-3ACI/OT KGNNMCP73831T-4ADI/OT KHNNMCP73831T-5ACI/OT KJNNMCP73832T-2ACI/OT KKNNMCP73832T-2ATI/OT KLNNMCP73832T-2DCI/OT KMNNMCP73832T-3ACI/OT KPNNMCP73832T-4ADI/OT KQNNMCP73832T-5ACI/OT KRNNMCP73832T-2DFI/OT LUNNNote: Applies to 5-Lead SOT-235-Lead SOT-23XXNNLegend: XX...X Customer-specific informationY Year code (last digit of calendar year)YY Year code (last 2 digits of calendar year)WW Week code (week of January 1 is week 01)NNN Alphanumeric traceability code Pb-free Compliant JEDEC designator for Matte Tin (Sn)* This package is Pb-free. The Pb-free JEDEC designator ( )can be found on the outer packaging for this package.Note: In the event the full Microchip part number cannot be marked on one line, it will be carried overtothenextline,thuslimitingthenumberofavailablecharactersforcustomer-specificinformation.3 e3 eMCP73831/2DS20001984G-page20 2005-2014 Microchip Technology Inc.8-Lead PIastic DuaI FIat, No Lead Package (MC) - 2x3x0.9 mm Body [DFN]Notes:1. Pin 1 visual index feature may vary, but must be located within the hatched area.2. Package may have one or more exposed tie bars at ends.3. Package is saw singulated.4. Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.REF: Reference Dimension, usually without tolerance, for information purposes only.Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingUnits MLLMETERSDimension Limits MN NOM MAXNumber of Pins N 8Pitch e 0.50 BSCOverall Height A 0.80 0.90 1.00StandoffA1 0.00 0.02 0.05Contact Thickness A3 0.20 REFOverall Length D 2.00 BSCOverall Width E 3.00 BSCExposed Pad Length D2 1.30 1.55Exposed Pad Width E2 1.50 1.75Contact Width b 0.20 0.25 0.30Contact Length L 0.30 0.40 0.50Contact-to-Exposed Pad K 0.20 DNENOTE 11 2EXPOSED PADNOTE 12 1D2KLE2NebA3 A1ANOTE 2BOTTOM VIEWTOP VIEWMicrochip Technology Drawing C04-123C 2005-2014 Microchip Technology Inc. DS20001984G-page 21MCP73831/2Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingMCP73831/2DS20001984G-page22 2005-2014 Microchip Technology Inc.5-Lead PIastic SmaII OutIine Transistor (OT) [SOT-23]Notes:1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.2. Dimensioning and tolerancing per ASME Y14.5M.BSC: Basic Dimension. Theoretically exact value shown without tolerances.Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingUnits MLLMETERSDimension Limits MN NOM MAXNumber of Pins N 5Lead Pitch e 0.95 BSCOutside Lead Pitch e1 1.90 BSCOverall Height A 0.90 1.45Molded Package Thickness A2 0.89 1.30Standoff A1 0.00 0.15Overall Width E 2.20 3.20Molded Package Width E1 1.30 1.80Overall Length D 2.70 3.10Foot Length L 0.10 0.60Footprint L1 0.35 0.80Foot Angle I 0 30Lead Thickness c 0.08 0.26Lead Width b 0.20 0.51NbEE1D1 2 3ee1AA1A2 cLL1Microchip Technology Drawing C04-091B 2005-2014 Microchip Technology Inc. DS20001984G-page 23MCP73831/2Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packagingMCP73831/2DS20001984G-page24 2005-2014 Microchip Technology Inc.APPENDIX A: REVISION HISTORYRevision G (July 2014)The following is the list of modifications:1. Updated theDC Characteristics table.2. AddedSection 6.1.1.2InputOvervoltageProtection (IOVP).Revision F (June 2013)The following is the list of modifications:3. Updated the Functional Block Diagram.4. AddedtheBatteryDetectionparameterandrelated information in theDC Characteristicstable.5. AddednewsectionSection 4.2BatteryDetection.6. Minor grammatical and spelling corrections.Revision E (September 2008)The following is the list of modifications:1. Package Types: Changed DFN pinout diagram.2. Section 1.0ElectricalCharacteristics:ChangedChargeImpedanceRangefrom20 kO to 67 kO.3. Section 1.0ElectricalCharacteristics:Misc. Formatting changes.4. Section 2.0TypicalPerformanceCurves:Updated Figure 2-4.5. Section 3.0PinDescription:AddedExposedPadpintotableandaddedSection 3.6 Exposed Thermal Pad (EP).6. Updated Appendix A: Revision History7. AddedLandPatternPackageOutlineDrawingfor 2x3 DFN package.Revision D (April 2008)The following is the list of modifications:1. ChangedChargeTerminationCurrentRatioto8.5% minimum and 11.5% maximum.Revision C (October 2007)The following is the list of modifications:1. Numerous edits throughout document.2. AddednotetotheTemperatureSpecificationstable.3. Updated Figure 2-4.Revision B (March 2006)The following is the list of modifications:1. Added MCP73832 through document.Revision A (November 2005)Original Release of this Document. 2005-2014 Microchip Technology Inc. DS20001984G-page 25MCP73831/2PRODUCT IDENTIFICATION SYSTEMTo order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. Device: MCP73831: Single-Cell Charge ControllerMCP73831T: Single-Cell Charge Controller(Tape and Reel)MCP73832 Single-Cell Charge ControllerMCP73832T: Single-Cell Charge Controller(Tape and Reel)RegulationVoltage:Code VREG2 =3 =4 =5 =4.20V4.35V4.40V4.50VOptions: * Code IPREG/IREGVPTH/VREGITERM/IREGVRTH/VREGACADATDC10101010066.566.571.5x7.57.5207.596.5949496.5* Consult Factory for Alternative Device OptionsTemperature Range:I =-40C to +85C (Industrial)Package: MC = Dual-Flat, No-Lead (2x3 mm body), 8-LeadOT = Small Outline Transistor (SOT23), 5-LeadExamples: *a) MCP73831-2ACI/OT: 4.20V VREG,Options AC, 5LD SOT23 Pkgb) MCP73831T-2ACI/OT: Tape and Reel,4.20V VREG, Options AC, 5LD SOT23 Pkgc) MCP73832-2ACI/MC: 4.20V VREG,Options AC, 8LD DFN Packaged) MCP73832T-2ACI/MC: Tape and Reel,4.20V VREG, Options AC, 8LD DFN Packagea) MCP73831-2ATI/OT: 4.20V VREG,Options AT, 5LD SOT23 Pkgb) MCP73831T-2ATI/OT: Tape and Reel,4.20V VREG, Options AT, 5LD SOT23 Pkgc) MCP73832-2ATI/MC: 4.20V VREG,Options AT, 8LD DFN Packaged) MCP73832T-2ATI/MC: Tape and Reel,4.20V VREG, Options AT, 8LD DFN Packagea) MCP73831-2DCI/OT: 4.20V VREG,Options DC, 5LD SOT23 Pkgb) MCP73831T-2DCI/OT: Tape and Reel,4.20V VREG, Options DC, 5LD SOT23 Pkgc) MCP73832-2DCI/MC: 4.20V VREG,Options DC, 8LD DFN Packaged) MCP73832T-2DCI/MC: Tape and Reel,4.20V VREG, Options DC, 8LD DFN Packagea) MCP73831-3ACI/OT: 4.35V VREG,Options AC, 5LD SOT23 Pkgb) MCP73831T-3ACI/OT: Tape and Reel,4.35V VREG, Options AC, 5LD SOT23 Pkgc) MCP73832-3ACI/MC: 4.35V VREG,Options AC, 8LD DFN Packaged) MCP73832T-3ACI/MC: Tape and Reel,4.35V VREG, Options AC, 8LD DFN Packagea) MCP73831-4ADI/OT: 4.40V VREG,Options AD, 5LD SOT23 Pkgb) MCP73831T-4ADI/OT: Tape and Reel,4.40V VREG, Options AD, 5LD SOT23 Pkgc) MCP73832-4ADI/MC: 4.40V VREG,Options AD, 8LD DFN Packaged) MCP73832T-4ADI/MC: Tape and Reel,4.40V VREG, Options AD, 8LD DFN Packagea) MCP73831-5ACI/OT: 4.50V VREG,Options AC, 5LD SOT23 Pkgb) MCP73831T-5ACI/OT: Tape and Reel,4.50V VREG, Options AC, 5LD SOT23 Pkgc) MCP73832-5ACI/MC: 4.50V VREG,Options AC, 8LD DFN Packaged) MCP73832T-5ACI/MC: Tape and Reel,4.50V VREG, Options AC, 8LD DFN Package* Consult Factory for Alternate Device OptionsPART NO.DeviceXVREG/XXPackageXXOptionsXTemperatureRangeMCP73831/2DS20001984G-page26 2005-2014 Microchip Technology Inc.NOTES: 2005-2014 Microchip Technology Inc. DS20001984G-page 27Informationcontainedinthispublicationregardingdeviceapplications and the like is provided only for your convenienceand may be superseded by updates. It is your responsibility toensurethatyourapplicationmeetswithyourspecifications.MICROCHIPMAKESNOREPRESENTATIONSORWARRANTIESOFANYKINDWHETHEREXPRESSORIMPLIED,WRITTENORORAL,STATUTORYOROTHERWISE,RELATEDTOTHEINFORMATION,INCLUDINGBUTNOTLIMITEDTOITSCONDITION,QUALITY,PERFORMANCE,MERCHANTABILITYORFITNESSFORPURPOSE.Microchipdisclaimsallliabilityarisingfromthisinformationanditsuse.UseofMicrochipdevicesinlifesupportand/orsafetyapplicationsisentirelyatthe buyers risk, and the buyer agrees to defend, indemnify andholdharmlessMicrochipfromanyandalldamages,claims,suits,orexpensesresultingfromsuchuse.Nolicensesareconveyed,implicitlyorotherwise,underanyMicrochipintellectual property rights.TrademarksThe Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.The Embedded Control Solutions Company and mTouch are registered trademarks of Microchip Technology Incorporated in the U.S.A.Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet, KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. 2005-2014, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-63276-375-4Note the following details of the code protection feature on Microchip devices: Microchip products meet the specification contained in their particular Microchip Data Sheet. Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchips Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. Microchip is willing to work with the customer who is concerned about the integrity of their code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as unbreakable.Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of ourproducts. Attempts to break Microchips code protection feature may be a violation of the Digital Millennium Copyright Act. If such actsallow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Companys quality system processes and procedures are for its PIC MCUs and dsPIC DSCs, KEELOQ code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchips quality system for the design and manufacture of development systems is ISO 9001:2000 certified.QUALITY MANAGEMENTSYSTEM CERTIFIED BY DNV == ISO/TS 16949 == DS20001984G-page28 2005-2014 Microchip Technology Inc.AMERICASCorporate Office2355 West Chandler Blvd.Chandler, AZ 85224-6199Tel: 480-792-7200 Fax: 480-792-7277Technical Support: http://www.microchip.com/supportWeb Address: www.microchip.comAtlantaDuluth, GA Tel: 678-957-9614 Fax: 678-957-1455Austin, TXTel: 512-257-3370 BostonWestborough, MA Tel: 774-760-0087 Fax: 774-760-0088ChicagoItasca, IL Tel: 630-285-0071 Fax: 630-285-0075ClevelandIndependence, OH Tel: 216-447-0464 Fax: 216-447-0643DallasAddison, TX Tel: 972-818-7423 Fax: 972-818-2924DetroitNovi, MI Tel: 248-848-4000Houston, TX Tel: 281-894-5983IndianapolisNoblesville, IN Tel: 317-773-8323Fax: 317-773-5453Los AngelesMission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608New York, NY Tel: 631-435-6000San Jose, CA Tel: 408-735-9110Canada - TorontoTel: 905-673-0699 Fax: 905-673-6509ASIA/PACIFICAsia Pacific OfficeSuites 3707-14, 37th FloorTower 6, The GatewayHarbour City, KowloonHong KongTel: 852-2943-5100Fax: 852-2401-3431Australia - SydneyTel: 61-2-9868-6733Fax: 61-2-9868-6755China - BeijingTel: 86-10-8569-7000 Fax: 86-10-8528-2104China - ChengduTel: 86-28-8665-5511Fax: 86-28-8665-7889China - ChongqingTel: 86-23-8980-9588Fax: 86-23-8980-9500China - HangzhouTel: 86-571-8792-8115 Fax: 86-571-8792-8116China - Hong Kong SARTel: 852-2943-5100 Fax: 852-2401-3431China - NanjingTel: 86-25-8473-2460Fax: 86-25-8473-2470China - QingdaoTel: 86-532-8502-7355Fax: 86-532-8502-7205China - ShanghaiTel: 86-21-5407-5533 Fax: 86-21-5407-5066China - ShenyangTel: 86-24-2334-2829Fax: 86-24-2334-2393China - ShenzhenTel: 86-755-8864-2200 Fax: 86-755-8203-1760China - WuhanTel: 86-27-5980-5300Fax: 86-27-5980-5118China - XianTel: 86-29-8833-7252Fax: 86-29-8833-7256China - XiamenTel: 86-592-2388138 Fax: 86-592-2388130China - ZhuhaiTel: 86-756-3210040 Fax: 86-756-3210049ASIA/PACIFICIndia - BangaloreTel: 91-80-3090-4444 Fax: 91-80-3090-4123India - New DelhiTel: 91-11-4160-8631Fax: 91-11-4160-8632India - PuneTel: 91-20-3019-1500Japan - OsakaTel: 81-6-6152-7160 Fax: 81-6-6152-9310Japan - TokyoTel: 81-3-6880- 3770 Fax: 81-3-6880-3771Korea - DaeguTel: 82-53-744-4301Fax: 82-53-744-4302Korea - SeoulTel: 82-2-554-7200Fax: 82-2-558-5932 or 82-2-558-5934Malaysia - Kuala LumpurTel: 60-3-6201-9857Fax: 60-3-6201-9859Malaysia - PenangTel: 60-4-227-8870Fax: 60-4-227-4068Philippines - ManilaTel: 63-2-634-9065Fax: 63-2-634-9069SingaporeTel: 65-6334-8870Fax: 65-6334-8850Taiwan - Hsin ChuTel: 886-3-5778-366Fax: 886-3-5770-955Taiwan - KaohsiungTel: 886-7-213-7830Taiwan - TaipeiTel: 886-2-2508-8600 Fax: 886-2-2508-0102Thailand - BangkokTel: 66-2-694-1351Fax: 66-2-694-1350EUROPEAustria - WelsTel: 43-7242-2244-39Fax: 43-7242-2244-393Denmark - CopenhagenTel: 45-4450-2828 Fax: 45-4485-2829France - ParisTel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79Germany - DusseldorfTel: 49-2129-3766400Germany - MunichTel: 49-89-627-144-0 Fax: 49-89-627-144-44Germany - PforzheimTel: 49-7231-424750Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781Italy - VeniceTel: 39-049-7625286 Netherlands - DrunenTel: 31-416-690399 Fax: 31-416-690340Poland - WarsawTel: 48-22-3325737 Spain - MadridTel: 34-91-708-08-90Fax: 34-91-708-08-91Sweden - StockholmTel: 46-8-5090-4654UK - WokinghamTel: 44-118-921-5800Fax: 44-118-921-5820Worldwide Sales and Service03/25/14
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