1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE THE CABLES FOR CABLES FOR THE THE CBM STS CBM STS FROM FROM UKRAINE UKRAINE June 1 - 4, 2009 June 1 - 4, 2009 Sortavala, Karelia, Russia Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail: [email protected]Session # 2: Session # 2: R&D of essential parts of the R&D of essential parts of the CBM STS CBM STS
15
Embed
1 The 3-rd Work Meeting of the CBM -MPD STS Consortium “Technical challenges of the CBM and MPD Silicon Tracking Systems 2009” THE CABLES FOR THE CABLES.
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
1
The 3-rd Work Meeting of the CBM -MPD STS Consortium
“Technical challenges of the CBM and MPDSilicon Tracking Systems 2009”
THE CABLES THE CABLES FORFOR THE CBM STSTHE CBM STS FROM FROM UKRAINEUKRAINE
June 1 - 4, 2009June 1 - 4, 2009Sortavala, Karelia, Russia
Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail:
Schematic view of the arrangement for the sensor, analog cables and daisy-chain cables.
Double-deckanalog cable
Daisy-chaincable
Double-deckanalog cable
Two analog cables (for each side of sensor) with constant 116 µm pitch are laminated together with a lateral shift of 58 µm (effectively as a cable with 58 µm pitch).
Composition of EM-4370:1. Ultrasonic generator 2. Bonding equipment3. Table for electrical equipment4. Optical head5. Lighter6. Monitor7. Keyboard + manipulator “mouse”
Main parameters of EM-4370automatic wire bonder
– Al wire size: 18-50um;– bonding area: X Axis: 100 mm Y Axis: 200 mm Z Axis: 1.2 mm–placing of bonding objects in bonding position on X,Y, Z axis: moving of positioning table – total bond placement accuracy: 3.0 um– bond force: 5 - 120g– bond time: 1 - 250msec– bond power: 0 - 4W– amount of wires per program: more then 1000– amount of chips per module: no more then 10– ultrasonic frequency: 66kHz– power configuration: 230V, 50Hz– power consumption: 0.8kW– dimensions (W/D/H): 1200mmХ750mmХ1450mm– weight: no more then 400kg
Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 116 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads.
TAB-bonding
(Pitch 116um)
Wire-bonding
(Pitch 50.7um)
Input:Pitch 116um
Pitch-adapter
Sensor
Analog cable
Front-End Board
12
POSSIBLE DESIGN OF A TWO-LAYER CHIP - CABLE FOR THE CHIP N-XYTER