1 Solar-B EIS Engineering Meeting at MSSL July 27 - 29, 1999 H. Hara (NAOJ)

1

Solar-B EIS Engineering Meeting at MSSL July 27 - 29, 1999

H. Hara (NAOJ)

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EIS/Solar-B

Document Name Date Language

Thermal Design Standard for Solar-B (DRAFT) Feb 12,1999 J

Requirements for Structural Mathematical Models Mar 8,1999 E

Mechanical Design Standard (DRAFT) Mar 8, 1999 J+E

Environmental Conditions for Solar-B (DRAFT) Mar 8, 1999 J+E

Contamination Control Program Plan for Solar-B (DRAFT) Mar 8, 1999 E

Solar-B Electrical Design Standard (DRAFT) Apr 24,1999 J

(DRAFT) July 27,1999 E

Solar-B/Telescope Thermal Interface Condition (DRAFT) June 30, 1999 J+E

Requirements for Interface Thermal Math Model of Solar-B Telescope (DRAFT) June 30, 1999 J+E

Telemetry & Command Design Standard (DRAFT) not yet made

Documents for Subsystem Design

3

EIS/Solar-B Requests from System side to EIS

1. Position of Mounting I/F points. There is inconsistent with the I/F legs. Change the drawing to meet the I/F points before making structure math model.

2. Electrical relationship among ICU, MHC, and FPA. How these are connected by electrical lines ?

3. Ranges of temperature is too narrow. Widen the ranges (relatively urgent).

4. Show disturbance torque of each moving component (urgent issue).

5. 32 W solar power is input in EIS at entrance filter. Is this OK ? How is this energy to be treated ?

6. Number and location of survival heaters when EIS primary power is off. Temperatures for switch-on and switch-off controls should be reported. The survival heaters are controlled by HCE. At present three survival heaters are allocated to EIS by the request of Japanese side, though the usage is uncertain. This issue must be reported to the system side by July 15.

summary report of satellite design meeting on June 30, 1999

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EIS/Solar-B Solar-B system issuessummary report of satellite design meeting on June 30, 1999

Telemetry & Command system: ASTRO-F system was adopted.

Summary of electrical interface related to EIS was shown (see Fig. 1 ).

Satellite structure almost meet the size of fairing envelope. (exception: XRT & EIS. In case of EIS, interface points should be shifted to -Z direction.)

ICU is put at low part of +Y side panel of bus structure (Fig.2).

Weight of EIS: EIS-STR 50.3 kg, EIS-ICU 6.0 kg, EIS-HAR 4.0 kg. Margin of 9 kg is managed by system side in a different level of system issue.

Power: ICU: Wmax = 60 W, Imax = 2.3 A Heater power of 10 W is tentatively allocated to EIS because of no input.

Thermal analysis of optical bench + mounting legs + bus structure was almost finished. Change of optical axes of SOT, XRT, and EIS is only 0.2-0.3 arcsec during the sun-synchronous orbit in the worst case. The infinite rigid body for telescopes is assumedin this analysis.

5

EIS/Solar-B Solar-B system issues

Harness: If there is an electrical harness whose length should be less than 4 m by some reason, we must report it to the system side.

Power savings: Even in the case of sun-synchronous orbit, satellite night comes in some period. System asked all telescope teams if the power saving can be done during the night period or not for power saving.

Bus voltage for SOT, XRT, and EIS is 28 +/- (A) V. (A) will be less than 2.

Structure math model: The schedule of structure analysis was updated (see Fig. 3).

Thermal math model: The schedule of thermal analysis was updated (see Fig. 4).

summary report of satellite design meeting on June 30, 1999

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EIS/Solar-B Electrical Interface of EIS

Fig. 1

EIS-STR

HCE

DIST

TCI-B

EIS-ICU

MDP

survival heater#1- #3

PIMDHU

HKU

T-sensor#1 - #7

T-sensor#8 - #9

DC/DC

signal line

primary power on/offCMD+TLM

28V primary power linesecondary power line

bus structure

summary report of satellite design meeting on June 30, 1999

7

EIS/Solar-B Location of EIS-ICU in Bus Structure

EIS-ICU

Fig. 2

summary report of satellite design meeting on June 30, 1999

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EIS/Solar-B Schedule of Structure Analysis

bus subsystem

SOT, XRT, EIS

System side

July Aug. Sep Oct.

math model

math model

Coupled Load Analysiscombine math models to satellite math model

Fig. 3

summary report of satellite design meeting on June 30, 1999

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EIS/Solar-B Schedule of Thermal Analysis

Fig. 4

Flowchart during Phase A study

Thermal design standard

Thermal Interface

Requirements to the telescopethermal math model

Mar. 8

Telescope Team (EIS)

System

Thermal design Information

End of May

Analysis of Bus structure & Optical Bench for deriving temperature distribution temperature of I/F points temperature of boundary

Thermal I/F condition

Thermal model design Instruction

I/F Thermal Math Model

Themal design analysis of EIS Preliminary

Beg. of July

Time

Thermal I/F condition

Thermal model design Instruction Update

System thermal analysis

Phase AThermal DesignAnalysis

Phase A B

End of Oct.

Themal design analysis of EIS Detail

Analysis of thermal distortionEnd of June

End of July

I/F ThermalMathModelUpdate

End of Nov.

End of Dec.

summary report of satellite design meeting on June 30, 1999

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EIS/Solar-B MDP development schedule

Specifications of MDP shall be fixed by the following dates:

hardware related issues: August 31, 1999

software related issues: November 30, 1999

Purpose of PM tests (Feb 1 - Mar 31, 2001) Interface with SOT, XRT, EIS, DHU, TCI-B, HCE, DIST – establishment of hardware interface – establishment of software protocol – establishment of exposure sequence

Confirmation of main processing functions – confirmation of processing command/telemetry – confirmation of processing science data including compression

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EIS/Solar-B PM test plan of MDP

SOT

XRT

EIS

I/F with missioninstrument

commandtransmission

observation tableparameter table

command receipt

satellite bus I/F

satellite bus

MDP

receiveimage data

bitcomp.

imagecomp.

receive status data

telemetry format

primarypower I/F

createsecondarypower

managementsatellite time

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EIS/Solar-B Electrical Interface with MDP

EIS MDPPIM

HKU PIM

DHU

DR

analog data (temperature)S/C bus

image compression

status data

commandEIS table writesoftware patch

science data

table dump

information of timeMDP buffer status power control ・ occurrence of flare

・ flare position

XRT

DIST (power distributor)28 V

TCI-B

COM

uplinkdownlink

PIM

HCE (heater control)

status

tem

p. f

or H

C

command

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EIS/Solar-B Interface lines

differential RS-422 line interface

HS-26C31 HS-26C32

DATACLOCKENABLE

MDP BUFFER STATUS

COMMANDCLOCKENABLE

MDPEIS

low-powerRS-42264 kHz

NormalRS-4221 MHz

‘MDP Buffer Status line is used 1: for safe exchange of ‘input buffer’ in MDP. 2: when post compression buffers become almost full.

All electrical interface lines betweenEIS and MDP are digital interface lines.

hardware command I/F for secondary power on/off

status data interface DATACLOCKENABLE

low-powerRS-42264 kHz

hardware status I/F for secondary power

hardware status I/F for others if required

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EIS/Solar-B Flow of image data processing in MDP

Input Buffer

SOT-A

SOT-B

XRT-A

XRT-B

EIS-A8Mbyes

EIS-B8Mbyes

bitcomp.

buffer A

buffer B

image compression

Post Compression Buffer

output buffer

DHU

EIS can use functions of bit compression & image compression in MDP.

DPCM

JPEG

buffer A

buffer B

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EIS/Solar-B Data lines

・ Data line: normal differential RS-422 line, 1Mbps ・ Science data (spectrum or image) ・ Status data ( ~1 sec interval; Report of shutter & scan mirror motions will be required.) ・ Dump data of EIS observation table ・ Dump data of EIS compression table MDP knows kind of data by looking at the header part after the data are transferred. 12 bits data flow in this data line. maximum transfer speed: 1 Mbps (TBD)・ EIS Input Buffer in MDP: 1. double buffer system 2. buffer size: 8 Mbytes/buffer

EIS MDP

・ Concept of Data Format: fixed-length header + variable-length data maximum image size in a single packet = 256 kpixel science data: header + 12 bits CCD image data The number of pixels in the image data is a multiple of 8. Is this OK ? other data : header + 12 bit data (Upper 4 bits are all 0. Is this OK ?)

EIS can send data to MDP at any time when a status of MDP buffer status line is READY.

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EIS/Solar-B Recommended status line interface

status data interface DATACLOCKENABLE

low-powerRS-42264 kHz

HS-26C31 HS-26C32

DATA1 DATA2 DATA3 DATA4 DATA N

Data format

8 bits 8 bits 8 bits 8bits 8bits

REQUIREMENTS

Request of sending status data is informed from MDP via command line, and EIS shall send status data to MDP within 0.5 sec.

Data format is consistentwith requirement of PIM.

status request commandfrom MDP via command I/F

status datato MDP via status I/F

< 0.5 sec

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EIS/Solar-B Data Compression

CCD buffer DHU

DR 2.4 Gbits

14 bit →12 bit bit compression

inputbuffer

EIS MDPbit comp.

image comp.

post comp. buffer

2 Mbps (TBD) line for SOT, XRT & EIS1 Mbps line 12 bits data

for EIS

JPEG

EIS can use 2 Mbps line nominally for 0.5 s every 6 seconds.

max. 167 kbps, but DR for EIS will become full in a short time.

DPCM

(selectable) (selectable)

header

Capacity of DR will be ~3 Gbits, but only downlink 2.4 Gbits during the KSC/DSN contacts.

Header includes information ofdata compression in MDP.

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EIS/Solar-B Command Lines

MDP contractors would like to know: 1. list of commands required for EIS operation 2. how ICU reads commands from MDP (Please explain it.) 3. response time for a command 4. size of buffer ? 5. whether there is some restriction for the data format or not.

Command line: low-power differential RS-422 line, 64 kbps

Command answer back: receipt of command put the command data into status data for confirmation.

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EIS/Solar-B Hardware command interface

Purpose: Irrespective of MDP CPU status, the secondary power on/off commands and others are sent via hardware command interface.

HS-26C31 HS-26C32

+

-

100Ω±10 ％

100Ω±10 ％

4.7KΩ±10 ％

4.7KΩ±10 ％

driver receiver

Driver device ： HS-26C31

Receiver device ： HS-26C32

1 line/component

No resistance

MDP EIS

EISSTROBE

DATA4DATA3DATA2DATA1DATA0

MDP

STROBE

DATA

a b c

reference: Solar-B Electrical Design Standards §8-(8)

t

31.25 msec (min)

command command

minimum interval of command transmission

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EIS/Solar-B Hardware status interface for secondary power

Purpose: ON/OFF status of EIS secondary power relay is periodically monitored by a hardware logic circuits.

EISMDP

status 0

status 1

status N

MDP EIS

U1

C1

R1R2

ＶＤＤ

VDD : +5V ±　 TBD VU1 : CMOS 4049/4050

C1 : 220pF ± TBD ％R1 : 27KΩ± TBD ％R2 : 10KΩ± TBD ％

Circuit type: TB-E-R Circuit type: TB-E-T

+

- MUX

+5V 2.5KΩ

Input impedance ： more than 1MΩ

Logic 1 ： open (more than 1MΩ)Logic 0： close (10Ω)

or

reference: Solar-B Electrical Design Standards §8-(6) or (7)

MDP

EIS

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EIS/Solar-B Hardware status interface for important bi-level status

+

-

100Ω±10 ％

100Ω±10 ％

4.7KΩ±10 ％

4.7KΩ±10 ％

driver receiver

Driver device ： HS-26C31

Receiver device ： HS-26C32

1 line/component

No resistance

MDP EIS

EISMDP

reference: Solar-B Electrical Design Standards §8-(8)

Purpose: Important bi-level status data are periodically monitored by a hardware logic circuit.

Status N+1Status N+2

Status N+M

HS-26C31 HS-26C32

N: Number of “secondary power status”

M: Number of “H/W status”

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EIS/Solar-B Counter-plan for Errors

・ When some error happens in EIS-CPU due to SEU,

does EIS side request anything to MDP ? or does EIS side deal with the error by itself ?

・ When some error happens in MDP due to SEU,

does EIS side request anything to MDP backup system for safety ? or does EIS side deal with the error by itself ?

MDP realizes stop of EIS CPU by the following procedure.

• MDP sends a status request command and waits for 0.5 sec. • When the same procedure is done three times in a condition that status data do not come to MDP, MDP judges that EIS CPU is down.

<This is effective only when the status line is independent of science data line.>

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EIS/Solar-B Management Plan of Time

EIS MDP DHU

clock generator

clock line incommand line

clock counter

PIM

5 4 3 2 1

clock counter・ obtaining count c1 at a start of exposure・ obtaining count c2 at a start of data transfer.

1: header2: count c1 at start of exposure3: count c2 at start of data transfer4: image parameter5:image data

・ obtaining c3 at start of data receipt・ obtaining c4 at start of receiving PIM time.

PIMtime

These counts are added to compressed image data.

These counts are added to image data.

A: CCSDS packet headerB: count c3 at start of receiving image dataC: PIM timeD: count c4 at start of receiving PIM timeE: compressed image data

E 4 D C B 3 2 1 A

data line for image data

In case of data except for science data, EIS only put counter value at start of data transfer.

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EIS/Solar-B Flare Detection

The following is a baseline of flare detection.

・ Detection of flares is done by XRT.・ 8×8 on-chip summation image covering the whole XRT field of view will be used for flare patrol.・ The flare patrol image will be taken every ～ 30 sec (TBD).・ Information on flare detection is sent to EIS by MDP. 1. Flare detection 2. Flare location in XRT CCD coordinate; X=0-255, Y=0-255 (TBD)・ Duration of flare mode TBD

timeflarepatrolimage

～ 30 s

time for XRTdata analysis (TBD)

Flare!

flare mode

flare observationwith EIS

time for change of EIS FOV

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EIS/Solar-B Command to MDP

Type Classification Command Types

Command Block Type Discrete Command (DC)Block Command (DC+BC+...+ BC)

Command Grouping Individual CommandOrganized Command (OG)

Operation TypeReal-time commandTime-tagged commandOperation Program (OP)Onboard-triggered command

OP and Onboard-triggered command support only OG to execute.

< ASTRO-F type command system (similar to Yohkoh system) >

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EIS/Solar-B Command System Block Diagram

TLMCMD

DHU/DR

ground

PIM

MDP

EIS-EObservationtable for EIS

SOTFPP-E

XRT

status

science data

command

com

man

d

s tat

us

data

com

man

d

s tat

us

data

com

man

d

s tat

us

data

observation table for XRT

observation table for SOT

Real-time commandreal OG executionOP/OG uploadtime-tagged command

OP/OG

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EIS/Solar-B Data length of Command

Command Block Type Maximum data length (bytes)

DC 1

DC+BC+…..+BC real time 1 + 252 OP/OG 1 + 13 time-tagged 1 + 8

DC is used for single task such as ON/OFF, START/STOP and ENA/DIS.

BC is used for data transmission such as program load, table upload, and so on.

Real-time commands are sent from the ground and are immediately executed.

Time-tagged commands are stored in DHU and executed at a specified time ina resolution of about 1 sec. 32 commands can be stored in DHU.

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EIS/Solar-B OP & OG

OP: Operation Program; a group of time-line commands consisting of OG. 512 (TBD) time-line slots are prepared for OP. Each time line is executed at a time defined by time interval between consecutive two time lines. The unit of time interval is TBD sec. OP is started at a Kagoshima contact pass. OG: OrGanized command; One OG has 16 (TBD) command slots. Discrete command or block command data is included in each slot. 256 (TBD) OG can be stored in DHU. Time interval between two slots in an OG is 62.5 msec.

Example of OP:

CE #OG Interval00 0 121 NOP01 3 32 KSC LOS02 22 85 DSN AOS

……

129 255 OP STOP

Example of OG:

00: 03-DC-11 08: 05-DC-4201: 09: 05-BC-1202: 03-DC-23 10: 05-BC-4503: 11: 05-BC-3204: 12:05: 13:06: 14:07: 15: 03-DC-44

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Shock from Launch Vehicle Solar Array Release

Door Release

1. 2. 3.

3. 4. 5. 6.

Quasi-Static Load Test Thermal Deformation Test Random Vibration Test

Shock Test Release Shock Test Acoustic Test Vibration TransmissibilityTest

System MTM System MTM System MTM

Subsystem MTM

System MTM

Subsystem MTM

System MTM

Subsystem MTM

System MTM

Subsystem MTM

System MTM

Subsystem MTM

:Fixture:Mission telescope MTM :System MTM :Alignment check

MTM Test Flow

EIS/Solar-B MTM Test (May 15 - Aug 31, 2001)

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EIS/Solar-B Mechanism & Operation

Mechanism: purpose frequency direction angle of rotation or shiftoutside observation:

DOR: protect inside from dirty environment once/year ar. Y-axis 180deg/ 10 sec LOK: increase of stiffness once/mission ar. X-axis ~30 deg GRA: focus adjustment once/year ± Z-axis ±0.5 mm/10sec CLM: opening of vacuum enclosure once/mission ar. Y-axis 90 deg/10 sec SLI : focus adjustment once/mission? ± Z-axis ±0.5 mm/10sec change slit/slot once/hour ? ar. X-axis 90 deg/10 sec MIR: change field of view once/day ? ± X-axis ±5arcmin/10sec

during observation:

MIR: scan for raster observation once/ 1 sec ar. Y-axis 1 arcsec/ 0.5 sec reset to start position once/5-10 min ar. Y-axis 8 arcmin/ 5 sec SHU: adjust exposure duration once/ 1 sec ar. Z-axis ~60 deg/0.1 sec (SLI: change slit/slot once/ hour ar. X-axis 90 deg/10 sec )

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EIS/Solar-B Disturbance Torque (order of estimation)

momentum of inertia estimated by CMB

unit (g cm2) scan mirror: Iy = 4.89e4 shutter : Iz = 36.7slit : Ix = 44.3

Disturbance torque during a motion: T = d (I )/ dt ~ I (dt)-2

scan mirror:[raster step] = 1 arcsec, dt = 0.5 sec

T = 4.9e4 • 10-7 • 4.8e-6 •0.5-2 = 9.4e-8 (N m)

[motion to home position] = 4 arcmin, dt = 5 sec

T = 4.9e4 • 10-7 • 4.8e-6 • 240• 5-2 = 2.3e-7 (N m)

t

0.5 s

shutter:

= 30 deg, dt = 0.1 sec

T = 36.7 • 10-7 • 4.8e-6 • 3600 • 30• 0.1-2

= 1.9e-4 (N m)

slit:

= 90 deg, dt = 10 sec

T = 44.3• 10-7 • 4.8e-6 • 3600 • 90• 10-2

= 1.9e-4 (N m) = 6.9e-8 (N m)

6.9e-6 (N m) for dt = 1 sec

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EIS/Solar-B Acceptable Level of Disturbance Torque

from handouts distributed in satellite design meeting held on June 30, 1999