1 SHIMIZU Grou p ONODA Metallization and molecular dissociation of SnI 4 under pressure f: A.L. Chen, P.Y. Yu, M.P. Pasternak, Phys. Rev. B. 44, 2883 N. Hamaya et al., Phys. Rev. Lett. 79, 4597 (1997)
Jan 20, 2016
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SHIMIZU Group ONODA Suzue
Metallization and molecular dissociation of SnI4 under pressure
Ref: A.L. Chen, P.Y. Yu, M.P. Pasternak, Phys. Rev. B. 44, 2883 (1991) N. Hamaya et al., Phys. Rev. Lett. 79, 4597 (1997)
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Contents
■ Introduction ・ structure of molecular crystal SnI4
・ previous work
・ pressure effect
■ Experimental results and discussion
■ Summary
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Structure of SnI4 at ambient pressure
SnI
M. Pasternak, R. D. Taylor, Phys. Rev. B. 37, 8130 (1988)
■ tetrahedral molecule
■ crystal structure : cubic
(space group Pa3)
■ insulator
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Previous work■ Pressure-induced crystal-to-amorphous transition (by X-ray diffraction)
Y. Fujii et al., J. Phys. C: Solid State Phys., 18, 789(1985)
cubic
amorphous
gradually
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Previous work■ Pressure dependence of electrical resistivity (at room temperature)
Y. Fujii et al., J. Phys. C: Solid State Phys., 18, 789(1985)
SnI4 becomes metallic above 15 GPa
・ 5 ~ 10 GPa ・・・ electrical resistivity drastic decrease
・ around 10 GPa ・・・ the change in slope appear
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Pressure effect
van der Waals force
covalent bond
monatomic crystal
molecular dissociation (分子解離)
pressure
pressure
molecular crystal insulator
molecular metal / insulator
― diatomic molecular crystal ―
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■ determination of the metallization pressure (by measurement of electrical resistance)
■ clarify the structure at high pressure (by X-ray diffraction experiment)
Motivation
pressure 0 10 33 GPa
crystal structure by X-ray diffraction cubic amorphous
To what extent does the amorphous state exist?
electrical property insulator metal?
What is the metallization pressure?
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Experimental result 1
Pressure dependence of electrical resistance (at room temperature)
■ Measurement of electrical resistance
・ The resistance first decreases rapidly, with increasing pressure.・ The change in slope occurs at 12±1 GPa.
increasing pressuredecreasing
consistent with previous work
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Temperature dependence of electrical resistance
・ Above 12 GPa ・・・
T dependence of R is metallic
11.6GPa
12.8GPa
E= 0 metallization can ⇒ be defined
・ Arrhenius' equation
)TkEexp(R BE: carrier activation energy
CTk
1ERln
B
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Experimental result 2■ Synchrotron X-ray diffraction study
・ (a) and (b) ・・・ typical diffraction patterns for cubic (crystal phaseⅠ)
・ new peaks appeared at 7.2 GPa
CP-Ⅰ
CP-Ⅰ+ CP-Ⅱ
・ (c) and (d) ・・・ two phases coexist
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・ Diffraction peaks in (a) and (b) were slightly broadened.
・ Between 24 and 55 GPa, diffraction pattern of amorphous were observed.
・ At 61 GPa, the amorphous state transformed into a fcc (crystalline phase CP-Ⅲ) .
amorphous
fcc
■ X-ray diffraction study (high pressure region)
CP-Ⅰ+ CP-Ⅱ
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DiscussionThe phase diagram of SnI4
electrical property
pressure 0
GPa7.2 ~ 20 61
metalinsulator
molecular crystal
non-molecular crystal
crystal structure metal
fcc cubic amorphousphase Ⅱ
153
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Summary
■ From temperature dependence of the electrical
resistance, metallization occurs around 20 GPa.
■ From X-ray diffraction study ・・・ Molecular dissociation pressure is not uncertain.
SnI4 recrystallize into non-molecular (fcc) phase at 61 GPa. ■ SnI4 show metallization in amorphous state.