1 Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting R&D ON MICRO-CABLES FOR R&D ON MICRO-CABLES FOR BABY SENSOR RADIATION BABY SENSOR RADIATION TEST MODULE TEST MODULE October 13 - 18, 2008 October 13 - 18, 2008 JINR, Dubna, Russia Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail: [email protected]
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1 Physics of Compressed Baryonic Matter 12 th CBM Collaboration Meeting R&D ON MICRO-CABLES FOR BABY SENSOR RADIATION TEST MODULE October 13 - 18, 2008.
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Physics of Compressed Baryonic Matter12th CBM Collaboration Meeting
R&D ON MICRO-CABLES R&D ON MICRO-CABLES
FOR BABY SENSOR FOR BABY SENSOR
RADIATION TEST RADIATION TEST
MODULEMODULE
October 13 - 18, 2008October 13 - 18, 2008JINR, Dubna, Russia
Scientific Research Technological Institute of Instrument Engineering Kharkov, Ukraine e-mail: [email protected]
The Sensor cable design provided 100% automatically test (shorts, traces breaks) before assembly with applying of a standard contact device for testing Contact device
Three types of wedges (Gaiser Tool )for single-point TAB bonding:- Cables to sensor – GT1183-01710B;- Cables to board – GT1183-02205B;- Flex-mounts to board – GT1183-04010B.
Bonding of Cable to Sensor (N-side)
Bonding of Cable to Sensor (P-side)
Bonding of Cable to Flexible-rigid board
Pool strength:- Cables to sensor (N-side): 6-7 gram ;- Cables to sensor (P-side): 7-8 gram ;- Cables to board: 10-11 gram.
Bonds quality
02468
101214
1 1,5 2 2,5 3 3,5 4 4,5 5 5,5 6Power
Po
ol
stre
ng
th,
gra
m
T=10
T=20
T=30
T=40
T=50
T=60
T=70
T=80
T=90
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TEST MODULE FOR CBM01B2 BABY-SENSOR RADIATION TEST
We hope, that the experience, acquired by us, at development of a design, improvement of assembling technique and manufacture of test module on the basis of flexible-rigid boards will be useful for collaboration in the future for next investigations of baby sensors for CBM and NICA.
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ACTIVITY ON THE DEMONSTRATOR Nr.1SELECTION OF VARIANT
In our opinion, from the point of view of usage the flexible aluminium – polyimide cables and manufacturability of Modules & Ladders assemblies, most reasonable looks Option 3 “Flat Tiling”- with flat arrangement of sensors with overlapping, but without a bend of a cable.
Limitations for Option 3:
- The gap between sensors for the safe passing of a cables: The gap offered on the drawing 0,5 mm is reasonable.
- The gap between sensors and frame: The gap offered on the drawing also is reasonable (minimum gap 2mm at placing one cable; maximum gaps of 5,2 mm and 4,4 mm at placing seven cables).
-The gap between sensors for in Module : The gap offered on the drawing 0,5 mm. For determination of gap between sensors in Module (the connection of sensors by daisy-chain cables) it is necessary to select variant of strip arrangement in a sensor (for both sides).
From the point of view of further assembly of sensors in modules, the optimal variant would be changing of strip rotation: from 15 on Р-side and 0 on N-side to 7,5 on both sides .Thus width of bonding contact pads is necessary to reduce from 80um up to 60um, that will allow to arrange bonding contact pads in parallel to sides of a sensor. It considerably will simplify further assembly, and also will allow to utilize identical cables for N- and P-sides with straight lines. In case of arrangement of contact pads with angles 0 and 15 will be necessary to use one cable with straight lines and second - with
rotated lines 15(that not manufacturability at pitch of lines 50-60um .
Besides the adjustment of cables with a sensor on rotated pads is more difficult than on pads which are placed parallel to sensor side.
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Kind of connections of Daisy-chain cables to sensor (Demonstrator Nr.1)
Kind of connection with using of pitch-adapter will ensure fan-in of Analog cable traces pitch from 120 microns to chip pads pitch 50 microns. In this case the Analog cable can be TAB-bonded to pitch-adapter pads; and the chips can be wire-bonded to pitch-adapter pads.