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Laboratory
Welcome to ChipMOS Quality Laboratory
Laboratory instrument introduction-----1:30~2:00 SAT instrument operation ----------------2:00~3:00 COF defect sample inspection
(OM/Decapsulation/SEM) --------------- 3:00~3:30 COF electrical measurement ----------- 3:30~4:00 COF mechanical test (die strength) --- 4:00~4:30
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Laboratory
XRM Image SAT Picture
SEM Photo
Hot Spot(Defect)
LCM Photo
Failure Analysis Procedure
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Laboratory
12
Scanning Acoustic Tomograph Inspection
• Die Surface Delamination Mode• TSOPII 50L
• Die Crack Mode• mBGA 70B
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Laboratory
COF Defect Location and DecapsulationPeeling from tape• COF (48mm)
- Fuming Nitric Acid (100%)- Room temperature- 30mins
Rinse by acetone
after decapsulation
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Laboratory
Optical Microscope (OM) Inspection after Decapsulation
50X
200X 500X
Stereo OM
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Laboratory
Scanning Electron Microscope (SEM) Inspection and Energy Dispersive X-ray (EDX) Detection
SEM
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Laboratory
Electrical Measurement (COF/Chip)
Short Pass Open
V (v)
I (mA)
V (v)
I (mA)
V (v)
I (mA)
Curve tracer
Probe station
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Laboratory
Mechanical Test (Die Strength)