1. Introduction of Photonics 21 2. IMEC: Electronics ICT report Chee Wee Liu, Department of EE, NTU.

1. Introduction of Photonics21

2. IMEC: Electronics

ICT report

Chee Wee Liu, Department of EE, NTU

Photonics21 Work Groups•Photoncis21 is a European Technology Platform found in2005.•The members of Photonics21 are representative of European photonics industry, research institutions and colleges.•With 1400 members in 49 countries.•7 Work Groups (WGs): 4WGs are application-oriented, 3WGs focus on cross-disciplinary issues.

WG1Information & CommunicationWG2Industrial Manufacturing and Quality WG3Life Science & Health

WG4Lighting & Display

WG6Novel Optical Components & SystemsWG7Research, Education& Training

WG5Security, Metrology&Sensors

Application Cross Section Issue

Energy-Efficient Lighting•Toward Low-Carbon Economy-High efficient White LED (>180lm/W).-Low cost LED manufacturing.-Standardised LED light engines.

•Main application-Illumination and Displays.

LED lighting

Sodium lamps

Renewable Energy Generation •Demand- 12% market share of EU electricity demand for photovoltaics in 2020. (EPIA)- 20% reduction in carbon dioxide emissions by 2020.

•Expected Efficiency in 2020- Improve solar cell efficiency by 30%.- Achieve costs < €0.1per kWh for electricity.

• Using Laser systems to improve the solar cell’s quality and performance.

EPIA: EUROPEAN PHOTOVOLTAIC INDUSTRY ASSOCIATION

Information & Communication•Demand- Network bit rates will be as high as 40Gbps andtotal transmission capacity per carrier will be in the 100 Tbps range by 2015. (from OIDA’s report)

•Large optical network system- Faster data communication (broad bandwidth access).

•On-chip optical interconnect- Si-based optical interconnect is a promising solution for a faster on-chip interconnect.- A novel technology used to replace old Cu metal contact.- Short-term application: inter-chip communication.- Long-term application: large optical integrated circuits (including optical logic devices).

Intel‘s optical interconnect

OIDA: Optoelectronics Industry Development Association

Life Science & Health•Cancer-Laser surgery (Less invasive). -A faster and reliable cancer detection method (CARS, SRS).

•Eye cure-Cellular resolution image from within the retina (OCT).

•Preclinical research-High speed detection (real time 3D image).-High resolution image (angstrom-scale).-High precision.

UnderWhite light

UnderFluorescent light

Optical tomography

CARS: Coherent anti-Stokes Raman Scattering microscopySRS: Stimulated Raman Scattering

OCT: optical coherence tomography

IMEC Research Programs CMOS Scaling ─ focus on (sub-)22nm technology nodes – Lithography, 3D integration, Emerging devices, Logic DRAM devices, Flash

memories, Interconnects

CMOS-based heterogeneous integration (CMORE)– SiGe MEMS, GaN power electronics and LEDs, Silicon photonics, Power devices, and

mixed-signal technologies Human++ ─ healthcare domain– Wearable and implantable body area networks, with low-power components, radios

and sensors, life sciences

Energy― Photovoltaics and GaN power electronics

Smart Systems– Power-efficient green radios, large-area electronics, wireless autonomous

transducer systems, innovative visualization systems

Lithography ― Water based ArF immersion lithography with double patterning― Extreme ultra-violet (EUV) lithography (13.5nm wavelength).

Logic/DRAM Devices― High-mobility channel devices (Ge & III/V)― Logic and dynamic RAM― Scaling to 22 and 15nm nodes for bulk planar and MuG FETs― Gate-first/gate-last HKMG (EOT scaling, single or dual dielectric)

22nm Interconnect technology (Cu/low-K)― Scaling of the dielectric constant & Pitch― Advanced barrier, seed, copper resistivity and copper contacts ― Barrier and dielectric reliability

3D integration ― through-silicon vias (TSV) Flesh ― floating-gate and nitride-based technology Emerging devices ― Resistive RAM (RRAM), Floating-body RAM (FBRAM)

IMEC COMS Scaling

TSV

Power devices and mixed-signal technologies ― High voltage Si-based power devices ― High-speed SiGe:C BiCMOS

SiGe MEMS technology platform and design platform ― MEMS packaging― Testing and Reliability of MEMS

Silicon photonics GaN

― GaN epitaxial layer growth― GaN for RF power amplification and high power conversion― GaN light-emitting diodes

Vision systems ― Hybrid backside illuminated imagers― Hyperspectral imaging

CMOS-based heterogeneous integration (CMORE)

More-than-Moore R&D A platform to turn novel concepts into products

SOI waveguide

Wearable and implantable body area networks ― Wireless Sensors and actuators ― Ultralow-power analog interfaces― Ultralow-power radio― Micropower generation and storage― Integration technology for wearable and implantable applications― Integrated wearable systems

Life sciences― Functional nanosystems― In-vitro bioelectronic systems― In-vivo bioelectronic systems― Biosensors― Micro total analysis systems

Human++

wireless autonomous sensor system

Photovoltaics (Solar+)― Crystalline Si solar cells― High-efficiency PV stacks for terrestrial concentrators (III-V cells)― Thermovoltaic (TPV) systems for electricity co-generation (Low-bandgap cells)― Organic photovoltaics

GaN ― GaN epitaxial layer growth― GaN for RF power amplification and high power conversion― GaN light-emitting diodes

Energy

high-efficiency photovoltaic stack

Power efficient green radio― Cognitive radio: opening new horizons in wireless communication― 60GHz wireless communication: boosting high-data-rate short-range connectivity― Ultralow power wireless: getting mega-performance from micro-Watts

Vision systems ― Hyperspectral imaging ― Adaptive resilient embedded systems (ARES)― MultiView

Large-area electronics and systems-in-foil ― Organic light-emitting devices ― Organic photovoltaics ― Organic and oxide electronics

Smart Systems

Wafer with organic RFID