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1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen February 28, March 1 & 2, 2013
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1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen February 28, March 1 & 2, 2013.

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Page 1: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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IIC-China: BIG on EducationConferences ▪ Technical Application Courses

Shenzhen February 28, March 1 & 2, 2013

Page 2: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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The world has seen BIG technological breakthroughs in the past few years

What is next in the future of electronics design?

Page 3: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Engineers need your technology to innovate & design the next BIG thing

Page 4: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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They attend IIC-China to find new technology and learn the latest trends

*Reasons why engineers attend IIC-China (Source: IIC-China 2012 visitor survey)

Page 5: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Influence technology selection in an authoritative environment

IIC-China’s educational program helps improve my design skills. The panel discussion featuring industry experts is very insightful and thought provoking.

- Yue Jie, Purchasing Manager, Osee Digital Technology Ltd. ““ ””

5,174 engineers attended 61 educational sessions in 2012

5,174 engineers attended 61 educational sessions in 2012

Page 6: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Shape the future of China’s electronics industry at the Conference

Conference

•Join other experts to discuss new trends and emerging technologies in China’s electronics industry

•Position your brand with the influential, editor-led conferences before, during and after the event

•Be part of the panel of experts as you address engineers’ design challenges

•Session time: 40 min presentation + seat at the panel discussion at the end of the day

•US$6,000 per session

Page 7: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Smart Technologies. Smart World.

2013 themes:

•“Connecting Worlds” for Connectivity Conference Cloud computing, HD data transmission, NFC, RFID, HDMI, HML, WLAN, USB, Rapid IO, High-speed Interfaces, Security control

•“Switched On!” for Power Conference AC/DC, DC/DC, LDO, Wireless charge, MOSFET, IGBT, GaN, SiC, Digital Power, LED lighting, LED Dimming, smart meter

•“Smart, Secure Solutions” for Security and Smart Home ConferenceGesture identifying; Sensor, Amplifier, MCU, DSP, Processor, Networking, Smart TV solution, Media/Data Center, Remote control (Zigbee, bluetooth), STB, home security monitoring, video image processing, video data transmission, embedded OS

Page 8: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Smart Technologies. Smart World.

• “Mobility Rules” for Smartphone and Tablet Design Conference - Hardware and Software trackMemory, MEMS Sensor, 4G/LTE, processor, PA, OS, IP core, Mobile Internet, Clock

• “Competing Views” for Smartphone and Tablet Design Conference - Display Technology trackMulti-touch controller, HD, 3D, AMOLED Driver, latest display panel

• “Testing Grounds” for Test & Measurement ConferenceOscilloscope, Signal source generator, thermal test, RF/Microwave test, Virtual instrument, optical network test, portable instrument

• “Building on Your Ideas” for IC Supply Chain ConferenceEDA tools, PCB design tools, Mixed-signal EDA tools, verification workflow, 3D manufacturing technology, MEMS chips manufacturing

Page 9: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Instruct engineers on latest solutions at the Technical Application Courses

Technical Application Courses (TAC)

•Train China’s engineers on your technology, how it’s applied, and how it makes a difference to their design work

•Address technologies essential to engineers in their future design

•Session time: 50 minutes

•US$3,500 per session

*Refer to the latest matrix for time slots

Page 10: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Educate and build thought leadership at IIC-China’s Conference Program

Conference TAC

Session duration 40 min presentation+ seat at the panel discussion

50 min presentation

Expected attendance 80-100 50-80

Sound system, video projection system & screen

Complimentary invitation materials

Full editorial support to define talking points -

Brand buildingWebsite,

relevant print ads & eDM WebsitePre-event promotion

Onsite promotion • Signboard at the conference room• Logo on backdrop• Invitation cards

• Invitation cards

Lead generation

Attendee list using scannerOnsite name card

collectionAccess to the attendee list

Rates US$6,000 US$3,500

Page 11: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Conference themes suggested topics

Page 12: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Connecting Worlds

Connectivity Conference: Connecting WorldsKeynote Cloud computing: How to connect the ‘clouds’ over the China sky?Roundtable Prospects & competitive analysis of new connectivity technologiesSuggested topics 

• Network design for the cloud • EMI protection strategy for HSDI• Implementation of near field communication (NFC)• Application of Serial Rapid IO in high performance embedded system

interconnect• Using chips to ensure data transmission security• Prospects of NFC in mobile payment • Overcoming the challenges of HD data transmission • 802.11ac solutions• HDMI designs• Cloud computing: Its requirements for next-generation memory

technologies • How can high-speed connection technology meet needs of cloud

computing? • High-speed interconnect technology for data centers• HD data transmission solutions for portable devices• New breakthroughs in high-speed optical connection• Connectivity: Optimization and innovation for the Internet of Things

Page 13: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Switched On!

Power Conference: Switched On!Keynote Optimizing power efficiency of portable devicesRoundtable New approaches to improving efficiencySuggested topics 

Digital power: easy design even for a novice engineer Optimizing LED lighting design Lowering noise of switch-mode DC-DC convertors Challenges & breakthroughs in conversion efficiency for wireless

charging technology Improve standby power management of smart terminals (cell phones,

tablets) Low-power design solutions for smart terminals Latest battery technologies Breakthroughs and application prospects of new GaN 、 SiC power

devices How can power MOSFETs and IGBTs improve efficiency? Advanced technologies to improve device efficiency New methods to improve efficiency of linear and switching power

devices Energy-saving solutions for data centers High-efficiency, high-integration power modules Next-generation smart meter design

Page 14: 1 IIC-China: BIG on Education Conferences ▪ Technical Application Courses Shenzhen  February 28, March 1 & 2, 2013.

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Smart, Secure Solutions

Security and Smart Home Conference: Smart, Secure SolutionsKeynote Smart home with multiscreen interaction: when will it be a reality? Roundtable Who will win the smart home battle - TV, cell phone or PC manufacturers? Suggested topics               

Three HD video surveillance solutions (IP surveillance, SD-HDI surveillance, 960H analog surveillance)

SoC chip applications for high-definition IP cameras and video imaging enhancement technologies

Next-generation image sensor technologies Solutions for real-time, secure video transmission Cloud computing and video data storage solutions 3G/4G LTE video surveillance solutions The future of 3D gesture recognition Home wireless controls with Zigbee technology DSP solutions for smart video analysis devices MEMS applications in smart TVs Embedded software platforms for smart home control panels Smart home applications based on wireless sensor networks

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Mobility Rules

Smartphone & Tablet Design Conference -- Hardware & Software track: Mobility Rules

Keynote Smartphones: How many CPU cores do we really need?Roundtable Striking a balance between features and costsSuggested topics

What advantages do multi-core CPUs bring to your applications? Multi-core GPUs for next generation smart devices Has the era of x86-based multi-core processors arrived? MEMS applications in portable devices Applying eMCP and eMMC in smart devices HD audio adds value to smart devices Speech enhancement in noisy environment RF design of multi-mode, multi-band LTE/4G smartphones Will ARM+Win8 tablets replace notebooks? How can China's OS seize the opportunity in mobile Internet? MEMS gyroscopes and gravity accelerometers (inclinometers) Prospects of mobile payment in China Comparison of various embedded operating systems Breaking the bottleneck of large-scale commercial use of MEMS clocks Latest IP cores improve performance of cell phones and tablets Optimization of memory performance

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Competing Views

Smartphone & Tablet Design Conference: Display Technology track: Competing Views

Keynote What display technologies will lead next-generation mobile terminals?Roundtable 3D display technology: the next flash point in smartphone market?Suggested topics

HD display design: Design challenges Penetration of 3D display technologies into the smartphone market Will 720p become a standard feature in high-end smartphones? Augmented reality technology injects new life to smartphones Will >300ppi pixel density go mainstream in Smartphones Flexible screens: The ideals and the reality New trends in UI enabled by multi-touch technology Supply and demand trends for small and medium OLED panels Smartphone boom to drive innovation in tablet display technology Trends of efficient backlight technology Latest solutions in touch tech Realize display differentiation through AMOLED Optimizing display technology

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Testing Grounds

Test & Measurement Conference: Testing GroundsKeynote Test technology for the 4G eraRoundtable How will the T&M industry meet challenges of new applications?Suggested topics      

• High-speed, high-precision oscilloscopes

• Test technology for next-generation wireless communication

• Test technologies for high-speed interfaces (Thunderbolt, Displayport1.2)

• Testing energy-efficient computing devices

• Testing near-field detection systems (e.g. NFC)

• Measuring technologies for new applications (e.g. LED driver, electric car)

• New trends in oscilloscopes

• Breakthroughs in signal generators

• Realizing manufacturing automation with virtual instrumentation

• RF/microwave measurement: break through the performance bottleneck

• Improving reliability of portable devices

• Enhancing the accuracy of thermal test analysis

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Building on Your Ideas

IC Supply Chain Conference: Building on Your IdeasKeynote Improving and optimizing production yieldRoundtable The new roles of Foundry & EDA vendors in China’s nanometer eraSuggested topics      

• Analog process meeting the needs of China Fabless

• HV Analog process improves yield

• Finding right approach to manufacture MEMS chips

• 3D manufacturing technology

• Selecting a right foundry to achieve quick TTM

• EDA tools meet mass production requirements

• Creating new features for Mixed-signal EDA tools

• PCB design tool to improve SI performance

• Emulator speeds up verification workflow

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IIC-China: BIG on EducationConferences ▪ Technical Application Courses