Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS production at ELTOS 1 Production of THGEM at ELTOS Production of THGEM at ELTOS S.p.A. S.p.A. Company profile Production procedures Small size THGEM prototypes Large area THGEM photon detector The production of the first set of 600 x 600 mm 2 THGEM prototypes Fulvio Tessarotto
37
Embed
1 Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS Production of THGEM at ELTOS S.p.A. Company profile Production procedures.
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 11
Production of THGEM at ELTOS Production of THGEM at ELTOS S.p.A.S.p.A.
Company profile
Production procedures
Small size THGEM prototypes
Large area THGEM photon detector
The production of the first set of 600 x 600 mm2 THGEM prototypes
Fulvio Tessarotto
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 22
Company profile (seen from a Company profile (seen from a client)client)
For the production of THGEMs by industry Rui de Oliveira suggested
us to contact an Italian pcb producer: the company ELTOS S.p.A.
Founded in 1980 by Dr. Riccardo Pinamonti, in Arezzo (Tuscany),
a place with centuries long tradition in gold handcraft
PRIMA FORATURA ( SOLO FORI DI SERVIZIO)AGGIUNGERE LA SCRITTA C3 SUL BORDO
STAMPA ESTERNI INCISIONE INDIRETTAAGGIUNGERE LA SCRITTA C3 SUI CS
SECONDA GALVANICA ( SOLO STAGNO )STRIPPAGGIO RISTON
INCISIONE AMONIACALE RAME 35µ
NON STRIPPARE STAGNO
FORATURA PASSANTE ( DIAMETRO 0.4 )
INCISIONE AMONIACALE RAME 35µINCIDERE USANDO LA VELOCITA ADEGUATA IN MODO DA CREARE UN ISOLAMENTO DI 50µ
INTORNO ALLA CORONA DEL FORO
STRIPPARE STAGNO
SCONTORNATURA
LAVAGGIO CIRCUITI AD ULTRASUONI IN ACQUA DEMINERALIZZATA
IMBALLO E SPEDIZIONE
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 66
Raw material
Image transfer and etching
Drilling
Stripping
Resist covering
Original “Weizmann” THGEM production process
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 77
Raw material
Drilling
Sn stripping
“10 μm” rim
Galvanic Sn
ELTOS “small rim” production process similar to CERN one, presented by Rui de Oliveira (CERN RD51 Worshop, Sep. 10-11, 2007)
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 88
example of “small rim” (25μm) production
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 99
Raw material
Photo-resist
“100 μm” etching
Image transfer
Drilling
ELTOS “large rim” production process
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1010
example of “large rim” etching production
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1111
Raw material
Drilling
Global etching (no protection)
ELTOS “global etching” production process
proposed by Dr. Riccardo Pinamonti and used for some of the prototypes
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1212
example of 10 μm “global etching” production
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1313
pure drilling production process
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1414
double drilling production process
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1515
Vmax (= discharge limit in pure N2)For the characterization of the small prototypes, listen to Elena Rocco and Jaroslav Polak talks tomorrow
different production techniques different behaviors
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1616
The second series of small size The second series of small size piecespieces
NAME RIM (mm) THICKNESS (mm) Ø (mm) PITCH (mm)
M2.1 0.4 0.3 0.8
M2.2 0.4 0.2 0.8
M2.3 0.4 0.3 1.2
M2.4 0.6 0.4 0.8
M2.5 0.6 0.3 0.8
M2.6 0.6 0.4 1
M2.7 0.6 0.3 1
M2.10 0.8 0.4 0.8
M2.11 0.8 0.3 0.8
M2.12 0.8 0.4 1
M2.13 0.8 0.3 1
C2.1 0.002 0.6 0.3 1
C2.2 0.005 0.6 0.3 1
C2.3 0.010 0.6 0.3 1
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1717
th. 0.8, diam. 0.4, no rimth. 0.8, diam. 0.4, no rim
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1818
th. 0.6, diam. 0.3, “5 th. 0.6, diam. 0.3, “5 μμm global etching m global etching rim”rim”
The Cu layer thickness is reduced from 35 μm to 30 μm
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 1919
The prototypes from this second set are presently being characterized, and a third set will probably be ordered.
Several tests have been performed with prototype detectors having double and triple THGEM layers.
UV photon detection by CsI coated THGEMS is also currently being studied.
These items will be covered in the talks by E. Rocco and J. Polak.
All pieces were providing readable signals.
None has ever beeen damaged, despite large discharges.
We wish to investigate the problems related to large area detector construction, in particular the production of larger area THGEMs
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2020
CERN produced 100 x 100 mm2 THGEM
thickness: 0.2 mm diameter: 0.2 mm pitch: 0.5 mm rim: ~ 10 μm
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2121
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2222
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2323
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2424
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2525
0.2 mm
0.5 mm
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2626
Toward larger Toward larger areas:areas:
Prototipes:Prototipes:
Small, active area 30 x 30 mm2
Medium, active area 100 x 100 mm2
Large, active area 576 x 576 mm2
Next step: many engineering problems
to be faced build a first tentative
prototype box for addressing one by one
the problems; start with a large THGEM
with “standard” parameters 0.6, 0.4, 0.8
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2727
600 mm
600 mm
THGEMsStesalite frames
Al frame
Anode pads
Structure of Structure of the large the large
areaareaprototype prototype detectordetector
Al frame
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2828
The aluminium frames and the stesalite frames have been produced to allow assembling one prototype detector.
The anode consists in a multi-layer pcb of 3.6 mm thickness, 600 x 600 mm2, segmented in 2304 pads of 1.2 x 1.2 cm2 in the internal side, and 288 connectors for direct mounting of electronic boards on the external side.
Two such pcb’s have been produced for us by ELTOS S.p.A.
The uniformity of the pad surface is guaranteed by using a
recently developed technology: “Cu viafill” used for filling
blind microvias
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 2929
Cu viafill technology
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3030
anode pcbanode pcb
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3131
anode pcb padsanode pcb pads
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3232
We ordered 3 large THGEMs with 576 x 576 mm2 active area.
The geometrical parameters are: thickness = 0.6 mm, hole diameter = 0.4 mm, pitch = 0.8 mm, rim = 5 μm.
They have been produced by ELTOS S.p.A. using single spindle machine, and single piece drilling (for small size prototypes stacking of two pcb’s during drilling was used).
There are about 600,000 holes per piece. The drilling took about 30 h / piece, but pieces were produced in parallel. Tools are replaced after 2000 holes.
The reference price for drilling is 1€ for 1000 holes. The other production operations (~5μm rim, Ni-Au, …) add a similar amount to the final price.
Production of 600 x 600 mmProduction of 600 x 600 mm22 THGEMSTHGEMS
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3333
Pluritec Multistation Evolution at ELTOS
180,000 turns/min
20,000 holes/hour
Storage: 840 tools
Controlled diam.,
depth and run-out
Working area:
630 x 765 mm2
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3434
600 x 600 mm2 THGEM protoypes
~600,000 holes/piece
(very large gerber file)
Ø: 0.4, p.: 0.8, th.: 0.6 mm
rim: 5 μm (micro-etching)
Ni-Au coating
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3535
THGEM
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3636
600 x 600 mm2
THGEMs
Fulvio TESSAROTTO RD51 meeting, Paris, 14/10/2008 THGEM production at ELTOSRD51 meeting, Paris, 14/10/2008 THGEM production at ELTOS 3737
ConclusionsConclusionsThe ELTOS S.p.A. Company in Italy has recently gained significant experience in the production of THGEM prototypes of many different types.
In order to optimize the procedures for THGEM production it is very important to know the production details and to correlate them to the performances of the prototypes.
This work has started with a large set of 30 x 30 mm2 THGEMS which have been delivered and tested.
The first set of 600 x 600 mm2 THGEMs has been produced and delivered last week.
Industrial production of THGEMs may be close to become real.