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 VHDL-AMS Behavioural Modelling of a CMUT Element Samuel Frew, Hadi Najar and Edmond Cretu University of British Columbia 2009 IEEE International Behavioral Modeling and Simulation Conference 17 September 2009
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 VHDL-AMS Behavioural

Modelling of a CMUT

Element

Samuel Frew, Hadi Najar and Edmond CretuUniversity of British Columbia

2009 IEEE International Behavioral Modeling and Simulation Conference

17 September 2009

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 2

Overview 

Introduction

Background Modelling

Simulation Discussion

Conclusion

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 3

Introduction

Capacitive Micromachined Ultrasonic Transducer (CMUT)

Replacement for piezoelectric transducers in ultrasonicimaging

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 4

Introduction

Ultrasonic imaging

large and growing area of medical imaging

transducer elements emit and receive ultrasonic pressure waves

received echoes are converted to electrical signals and displayed

reflections at tissue boundaries allow imaging of anatomy

delaying signals to and from elements of array allow focusing

Piezoelectric Transducers

fabricated in lead zirconate titanate (PZT)

highly resonant

backing and matching layers used to increase bandwidth

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 5

Introduction

CMUT advantages

wide bandwidth and high sensitivity

high frequency operation

integration with CMOS electronics on IC

Aim of this work

develop behavioural model to aid CMUT design and optimisation

make model compatible with other software platforms to facilitatesimulation in different environments

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 6

Background

Ladabaum et al., 1998 small-signal linearisation of electro-mechanical relations about a

DC bias point mechanical impedance obtained from work of Mason, 1948

Caronti et al., 2002 extended above approach to include damping due to gap layer

Our approach non-linear model of electro-mechanical relations

2nd order system for mechanical-acoustic interactions

implemented in VHDL-AMS

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 7

Modelling 

General CMUT cell cross-section

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 8

Modelling 

Many cells connected in parallel form a CMUT element

Many individual elements form an array Model developed at element level

Two cells of an element

Elements of an array

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 9

Modelling 

Assume piston movement of membrane

Reduces model to 1-DOF: displacement atcentre of membrane

Treat as moveable plate capacitor

Attached to mass-spring-damper system m o – effective mass of membrane

k  – effective spring constant of membrane

B  – damping due to acoustic medium

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 11

Modelling 

Two-port model equations for moveable plate capacitor:

dt 

du xC uv

 xd 

 Aε

i )()( 2

0

0+

=

22

0

0

)(2u

 xd  Aε f  −

−=

 xd 

 Aε

 xC −

=

0

0)(

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 12

Modelling 

Equivalent circuit

Non-linear

Implement in VHDL-AMS

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 13

Modelling 

FEM Model developed using COMSOL Multiphysics 

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 14

Simulation

Designed CMUT compatible with MEMSCAPPolyMUMPs fabrication process

Parameter Value

Membrane material Crystalline silicon

Membrane radius 32 µmMembrane thickness 1.5 µm

Gap thickness 0.75 µm

Insulation material Silicon nitride

Insulation thickness 0.6 µm

No. cells per element 118

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 15

Simulation

Ansoft Simplorer for simulation

allows combination of VHDL-AMS and SPICE components

transmission circuit used for simulations:

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 16

Simulation

Frequency response

90 V DC bias

20 V AC excitation

Air: f res

= 5.78 MHz

Water: BW = 115 MHz

FEM: f res = 5.85 MHz

(Eigenfrequency analysis)

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 17

Simulation

Pull-in phenomenon

Behavioural Model V PI = 230 V

x PI = 0.265 µm

FEM Model V PI = 275 V

x PI = 0.315 µm

Coupling efficiencyincreases near pull-in

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 18

Simulation

FEM model shows membrane modes and shapes

First two harmonic modes Deformation shapes with DC bias voltage

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 19

Simulation

Transmit and receive circuit

Medium imposes time delayand attenuation

20 V input pulse gives 4 µAoutput pulse, delayed by

135µs

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 20

Discussion

Resonant frequency excellent agreement between behavioural and FEM models

very wide bandwidth transmitting into water or tissue

Pull-in phenomenon 16% difference between behavioural and FEM models likely due to assumption of parallel plate capacitance higher DC bias increases coupling efficiency simulations demonstrate non-linear nature of CMUT and model

Transmit and receive demonstrates model bi-directionality simulation time was ~5.8 s on 2 GHz PC (FEM would be hours)

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 21

Conclusion

This work

Developed non-linear behavioural CMUT model in VHDL-AMS

Simplorer simulations of model were compared with FEM

Excellent agreement in resonant frequency

16% error in pull-in voltage and displacement

Future work

modelling of membrane deformation shape

incorporation of membrane-gap interaction comparison of simulation results with experimental results from

fabricated design

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 VHDL-AMS Behavioural Modelling of a

CMUT Element 22

 Acknowledgements & References

Acknowledgements

Natural Sciences and Engineering Research Council of Canada

CMC Microsystems

References Caronti et al., 2002, “An Accurate Model for Capacitive Micromachined

Ultrasonic Transducers,” IEEE Trans. Ultrason., Ferroelectr., Freq.Control , vol. 49, no. 2, pp. 159-168.

Ladabaum et al., 1998, “Surface Micromachined Capacitive UltrasonicTransducers,” IEEE Trans. Ultrason., Ferroelectr., Freq. Control , vol. 45,no. 3, pp. 678-690.